WO2024001173A1

WO2024001173A1 - Circuit board module, preparation method and electronic device

Info

Publication number: WO2024001173A1
Application number: PCT/CN2023/072943
Authority: WO
Inventors: 张星祎; 孟祥华; 谢浩; 周亭飞; 牛万里; 徐小兵; 胡飞; 朱祥兰
Original assignee: 中兴通讯股份有限公司
Priority date: 2022-06-30
Filing date: 2023-01-18
Publication date: 2024-01-04
Also published as: CN117377257A

Abstract

The present disclosure provides a circuit board module, a preparation method and an electronic device. The circuit board module comprises: a heat sink, the heat sink being provided with a positioning and mounting part; a circuit board, wherein the circuit board and the heat sink are arranged spaced apart, and a first limiting part is arranged on the side of the circuit board close to the heat sink; a liner, arranged on the side of the circuit board distant from the heat sink, wherein the liner is provided with a connecting piece, and once the liner is fixedly matched with the circuit board, the connecting piece abuts against the circuit board, so that the liner and the circuit board are spaced apart; a supporting piece, comprising a first end and a second end which are opposite to each other, wherein a supporting face is formed at the first end, a second limiting part is arranged at the second end, the supporting piece is arranged between the circuit board and the heat sink, and the supporting piece abuts against the heat sink by means of the supporting face, and forms, by means of the second limiting part, a limiting fit with the first limiting part formed on the circuit board; and a fixing piece, which fixes the heat sink and the circuit board to the connecting piece of the liner by means of the positioning and mounting part.

Description

Circuit board module, preparation method and electronic device

Cross-references to related applications

This disclosure claims priority to Chinese patent application CN202210762887.2 titled "Circuit Board Module, Preparation Method and Electronic Equipment" filed on June 30, 2022, the entire content of which is incorporated into this disclosure by reference.

Technical field

The present disclosure relates to the field of communication technology, and in particular, to a circuit board module, a preparation method and an electronic device.

Background technique

IC chip is the core of computing in electronic equipment and one of the main heating components of electronic equipment. The heat dissipation problem of circuit boards mainly relies on air-cooling heat dissipation technology, and radiators are the key technology for air-cooling heat dissipation. The radiators currently used in the industry are riveted structures. However, the overall stiffness of the riveted radiator is relatively large, and there is a technical problem of large mechanical stress generated during the assembly process.

Contents of the invention

The present disclosure provides a circuit board module, a preparation method and an electronic device, aiming to solve the technical problem of how to reduce the stress risk of the circuit board module.

In a first aspect, the present disclosure provides a circuit board module, including: a radiator, the radiator is provided with a positioning installation portion; a circuit board, the circuit board is spaced apart from the radiator, and a first side of the circuit board is provided close to the radiator. Limiting part; lining plate, the lining plate is arranged on the side of the circuit board away from the radiator, and the lining plate is provided with a connecting piece. After the lining plate and the circuit board are fixedly adapted, the connecting piece resists the circuit board so that the lining plate Spaced apart from the circuit board; a support member, the support member includes an opposite first end and a second end, and the first end is formed with a support surface, and the second end is provided with a second limiting portion, and the support member is provided on the circuit board and heat dissipation between the devices, and the support member is in contact with the radiator through the support surface, and forms a limiting fit with the first limiting part formed on the circuit board through the second limiting part; and the fixing part, the fixing part secures the The heat sink and circuit board are fixed to the connector of the liner.

In a second aspect, the present disclosure also provides a method for preparing a circuit board module, including: providing a circuit board, and setting a first limiting portion on the circuit board; providing a support member, the support member including an opposite first end and a third There are two ends, and the first end forms a supporting surface, and the second end is provided with a second limiting part; the second limiting part of the support is mounted to the first limiting part of the circuit board through surface mounting technology, so that The first limiting part and the second limiting part are limited and adapted; a lining plate, a radiator and a fixing part are provided, wherein the lining plate is provided A connector is provided, and the radiator is provided with a positioning installation part; the fixing part is used to fix the radiator and the circuit board to the lining plate through the positioning installation part. After the radiator, circuit board and lining plate are fixed and adapted, the support part The supporting surface is in contact with the radiator, and the connector is in contact with the circuit board, so that the radiator and the circuit board are spaced apart, and the circuit board and the liner are spaced apart.

In a third aspect, the present disclosure also provides an electronic device. The electronic device includes the aforementioned circuit board module, or a circuit board module prepared by the aforementioned method for preparing a circuit board module.

Description of drawings

In order to explain the technical solutions of the present disclosure more clearly, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present disclosure. For ordinary people in the art For technical personnel, other drawings can also be obtained based on these drawings without exerting creative work.

Figure 1 is a schematic plan view of a circuit board module provided by the present disclosure;

Figure 2 is a schematic diagram of the exploded structure of a circuit board module provided by the present disclosure;

Figure 3 is a schematic structural diagram of the adaptation of the circuit board and the support member of a circuit board module provided by the present disclosure;

Figure 4 is a step flow chart of a method for preparing a circuit board module provided by the present disclosure;

Figure 5 is a schematic diagram of state changes during the preparation process of a circuit board module provided by the present disclosure;

FIG. 6 is a schematic structural block diagram of an electronic device provided by the present disclosure.

Detailed ways

The technical solutions in this disclosure will be clearly and completely described below with reference to the accompanying drawings in this disclosure. Obviously, the described embodiments are part of the embodiments of this disclosure, rather than all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this disclosure.

The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all contents and operations/steps, nor are they necessarily performed in the order described. For example, some operations/steps can also be decomposed, combined or partially merged, so the actual order of execution may change according to actual conditions.

It should be understood that the terminology used in the description of the disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a,""an," and "the" are intended to include the plural forms unless the context clearly dictates otherwise.

At present, IC chips are the core of computing in electronic equipment and one of the main heating components of electronic equipment. With the development of 5G communication technology, communication products are pursuing large capacity and high performance. Some multi-functional IC chips on circuit boards are becoming more and more integrated, causing the power consumption and heat flow density of circuit boards to continue to rise, posing severe challenges to heat dissipation technology.

At present, liquid cooling technology is not yet mature, and the heat dissipation problem of circuit boards mainly relies on air cooling technology to solve, and radiators are the key technology for air cooling heat dissipation. The radiators currently used in the industry have a riveting structure, that is, the support is combined with the body of the radiator through a riveting process, so that the radiator has a support structure, and then the radiator with the support structure is aligned with the circuit board. position and assemble to form a circuit board module. However, the overall stiffness of the riveted radiator is relatively large, and the mechanical stress generated during the assembly process is relatively large. When affected by the ambient temperature, it is easy to cause at least one of the contact parts between the radiator body and the circuit board and the support to break. It affects the long-term reliability of circuit board modules and ultimately affects the service life of electronic products.

Based on this, the present disclosure provides a circuit board module, a preparation method and an electronic device, aiming to reduce the stress risk of the circuit board module and improve the service life of the circuit board module.

Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The following embodiments and features in the embodiments may be combined with each other without conflict.

Please refer to Figures 1 and 2. Figure 1 is a schematic plan view of a circuit board module provided by the present disclosure, and Figure 2 is a schematic exploded structure view of a circuit board module provided by the present disclosure.

As shown in FIGS. 1 and 2 , the circuit board module 100 includes a heat sink 10 , a circuit board 20 , a liner 30 , a support member 40 and a fixing member 50 . The heat sink 10 is provided with a positioning and mounting part 103, and the fixing member 50 fixes the heat sink 10 to other components, such as the circuit board 20 and the liner 30 through the positioning and mounting part 103. The circuit board 20 is spaced apart from the radiator 10, and a first limiting portion 201 is provided on the side of the circuit board 20 close to the radiator 10; the lining plate 30 is provided on the side of the circuit board 20 away from the radiator 10, and the lining plate 30 is provided with a The connecting piece 301, after the lining plate 30 and the circuit board 20 are fixedly adapted, the connecting piece 301 resists the circuit board 20 so that the lining plate 30 and the circuit board 20 are spaced apart; the supporting piece 40 includes an opposite first end and a third There are two ends, and the first end is formed with a supporting surface 401, and the second end is provided with a second limiting portion 402. The supporting member 40 is arranged between the circuit board 20 and the heat sink 10, and contacts the heat sink 10 through the supporting surface 401. , and the second limiting part 402 forms a limiting fit with the first limiting part 201 formed on the circuit board 20; and the fixing part 50, the fixing part 50 fixes the heat sink 10 and the circuit board 20 to the radiator 10 through the positioning installation part 103. Connector 301 of liner 30 .

In the present disclosure, the support member 40 and the heat sink 10 are assembled separately, that is, the first limiting part 201 is provided on the circuit board 20, and the support member 40 is provided with a limiting adapter adapted to the first limiting part 201. When the circuit board module 100 is assembled, the support member 40 can be relatively fixed on the circuit board 20 by using the limited cooperation between the first limiting portion 201 and the second limiting portion 402, which facilitates The support member 40 and the circuit board 20 are welded and fixed, for example, the support member 40 is fixed to the circuit board 20 through surface mounting technology SMT. After the support member 40 and the circuit board 20 are assembled, the heat sink 10 and the support member are then assembled. The parts 40 are adapted to ensure that the heat sink 10 is firmly connected to the circuit board 20 through the support parts 40 while avoiding the interference assembly between the support parts 40 and the heat sink 10, effectively reducing the overall stiffness of the heat sink 10 and reducing the The mechanical stress caused by the interference fit between the support and the heat sink 10 during the assembly process is eliminated, thereby improving the service life of the circuit board module 100.

In addition, the support member 40 is provided with a support surface 401, and when the heat sink 10 is assembled with the circuit board 20, the support surface 401 is in contact with the surface of the heat sink 10, and the support member 40 and the heat sink 10 are in surface contact, which can effectively reduce The local stress exerted by the support member 40 on the heat sink 10 prolongs the service life of the heat sink 10 .

At the same time, the spacing between the lining plate 30 and the circuit board 20 is beneficial to the heat dissipation of the circuit board 20 and can effectively improve the heat dissipation effect of the circuit board module 100 .

As shown in FIG. 2 , in some embodiments, the heat sink 10 includes a base plate 101 and fins 102 disposed on a side of the base plate 101 away from the support member 40 and connected to the base plate 101 , wherein a plurality of positioning mounting portions 103 are arranged at intervals. Bottom plate 101. The heat sink 10 can increase the contact area with the air by providing a plurality of fins 102 to enhance the heat dissipation effect. The positioning mounting portions 103 are arranged at intervals on the bottom plate 101 to improve the positioning effect of the heat sink 10 .

As shown in Figure 2, in some embodiments, the first limiting part 201 is a plurality of spaced limiting grooves, and the second limiting part 402 is a limiting protrusion adapted to the limiting grooves, wherein the The limiting groove can be a circular, polygonal or special-shaped structure. There is no limitation here. It is only necessary that the first limiting portion 201 and the second limiting portion 402 can form a limiting fit to ensure that the support member 40 and the circuit board 20 It can be assembled with precise alignment. For example, the limit grooves are polygonal structures such as triangles, quadrilaterals, and hexagons.

In an exemplary embodiment, there is a height difference h1 between the bottom of the limiting groove and the surface of the circuit board 20 on the side close to the heat sink 10 , and the height difference h1 and the thickness T of the circuit board 20 satisfy: 1/4*T ≤ h1 ≤ 1/3*T. In order to ensure the positioning strength of the circuit board 20 to the support 40 and the strength of the circuit board 20 itself, the depth of the limit groove opened on the circuit board 20 must meet the corresponding depth requirements.

In some embodiments, after the support member 40 is limited and adapted to the circuit board 20, it is fixed to the circuit board 20 by welding. In an exemplary embodiment, the outer surface of the first limiting part 201 and the second limiting part The outer surface of 402 is provided with a metal coating, and the support member 40 is welded to the first limiting portion 201 of the circuit board 20 through the second limiting portion 402 . By providing a metal coating on the surface of the first limiting part 201 and the second limiting part 402, the support 40 is conveniently installed on the circuit board 20 through welding. For example, the metal coating includes but is not limited to chromium coating or nickel coating. layer.

As shown in FIGS. 1 and 2 , in some embodiments, the positioning installation part 103 includes a positioning hole 1031 , the circuit board 20 is provided with a first through hole 202 penetrating the circuit board 20 , and the support member 40 is provided with a first through hole 202 that passes through the support member 40 . the second through hole 403, and the first limiting part 201 is provided on the peripheral side of the first through hole 202, and the second limiting part 402 is provided on the peripheral side of the second through hole 403, wherein the fixing member 50 passes through the positioning hole 1031. The first through hole 202 and the second through hole 403 are connected to the connector 301 provided on the lining plate 30 to fix the heat sink 10 and the circuit board 20 to the lining plate 30 .

Please refer to Figure 3. In some embodiments, the diameter of the first through hole 202 is D, the diameter of the first limiting part 201 is d1, and the diameter of the metal coating provided on the outer surface of the second limiting part 402 is d3. Preferably, in order to ensure the welding quality of the support member 40 and the circuit board 20, d3 is greater than 5 mm.

In an exemplary embodiment, d1=(D+0.6)-1/2*(D1+D2), where D1 is the outer diameter of the support member 40 and D2 is the diameter of the second through hole 403 .

In order to ensure the stability of the fit between the support member 40 and the circuit board 20, preferably, D1≥d1+2, d3≥D1+3, d1 is at least 0.6mm larger than D, and D1 is at least 2mm larger than d1.

In some embodiments, the way in which the fixing part 50 is connected to the connecting part 301 may be that the connecting part 301 is provided with a first thread, the fixing part 50 is provided with a second thread, and the fixing part 50 is connected to the connecting part 301 through the second thread. First threaded adapter connection.

It can be understood that the connection method between the fixing part 50 and the connecting part 301 can also be welding, or the connecting part 301 is provided with an engaging structure, and the connection is achieved by engaging the engaging structure with the fixing part 50 structure, which is not limited here.

In some embodiments, the positioning and mounting part 103 further includes a positioning groove (not shown), and the positioning groove is provided on the side of the heat sink 10 close to the circuit board 20 . The positioning groove is provided on the peripheral side of the positioning hole, and the first end of the support member 40 is received in the positioning groove and abuts against the heat sink 10 . By providing positioning grooves, precise alignment of the radiator 10 and the support member 40 is facilitated.

Please refer to FIG. 4 . FIG. 4 illustrates a circuit board module preparation method provided by the present disclosure, which is used to prepare the circuit board module 20 described above. The method includes steps S1 to S5.

Step S1: Provide a circuit board 20, and set a first limiting portion 201 on the circuit board 20. Step S2: Provide a support member 40. The support member 40 includes an opposite first end and a second end. The first end forms a support surface 401, and the second end is provided with a second limiting portion 402. Step S3: Mount the second limiting part 402 of the support member 40 to the first limiting part 201 of the circuit board 20 using surface mounting technology, so that the first limiting part 201 and the second limiting part 402 are limited. adaptation. Step S4: Provide the lining plate 30, the radiator 10 and the fixing part 40, wherein the lining plate 30 is provided with the connecting part 301, and the radiator 10 is provided with the positioning and mounting part 103. Step S5: Use the fixing part 40 to fix the radiator 10 and the circuit board 20 to the connecting part 301 of the lining plate 30 through the positioning and mounting part 103. After the radiator 10, the circuit board 20 and the lining plate 30 are fixedly adapted, the supporting part 40 The supporting surface 401 is in contact with the heat sink 10, and the connector 301 is in contact with the circuit board 20, so that the heat sink 10 and the circuit board 20 are spaced apart, and the circuit board 20 and the liner 30 are spaced apart.

In some embodiments, the method further includes: after the first limiting part 201 and the second limiting part 402 are limited and adapted, welding the support 40 that is limited and adapted to the circuit board 20 so that the support The component 40 is fixed to the circuit board 20.

In some embodiments, the method further includes: before the first limiting part 201 and the second limiting part 402 are limited and adapted, The surfaces of the first limiting part 201 and the second limiting part 402 are coated with a metal layer.

Referring to FIG. 5 , in an exemplary embodiment, a circuit board 20 is provided, and a first limiting portion 201 is formed on the circuit board 20 . The shape and depth of the first limiting portion 201 can be set as needed. In an exemplary embodiment, there are multiple first limiting parts 201 and they are spaced apart on the circuit board 20 .

A support member 40 is provided. The support member 40 includes an opposite first end and a second end. The first end forms a support surface 401 and the second end is provided with a second limiting portion 402 . Coat at least one of the first limiting part 201 and the second limiting part 402 with solder paste, and mount the second limiting part 402 of the support 40 to the The first limiting part 201 of the circuit board 20 is so that the first limiting part 201 and the second limiting part 402 are limited and adapted, and the support 40 that is limited and adapted to the circuit board 20 is welded, so as to The support member 40 is fixed to the circuit board 20 to facilitate subsequent relative fixed connection of the heat sink with the circuit board 20 through the support member 40 .

A lining plate 30, a heat sink 10 and a fixing part 40 are provided. The lining plate 30 is provided with a connecting piece 301, and the radiator 10 is provided with a positioning installation part 103. The fixing part 40 is used to connect the radiator 10 and the circuit board through the positioning installation part 103. 20 is fixed to the connecting piece 301 of the lining plate 30. After the heat sink 10, the circuit board 20 and the lining plate 30 are fixedly adapted, the supporting surface 401 of the supporting member 40 abuts the heat sink 10, and the connecting piece 301 abuts the circuit board. 20, so that the heat sink 10 and the circuit board 20 are spaced apart, and the circuit board 20 and the liner 30 are spaced apart.

Please refer to FIG. 6 , which is a schematic structural block diagram of an electronic device 200 provided by the present disclosure.

As shown in Figure 6, the electronic device 200 includes a processor 201, a memory 202 and a circuit board module 100. The processor 201 and the memory 202 are connected through a bus 203, such as an I2C (Inter-integrated Circuit) bus, where the memory 202 can be installed on the circuit board 20 of the circuit board module 100 .

In an exemplary embodiment, the processor 201 is used to provide computing and control capabilities to support the operation of the entire routing device. The processor 201 can be a central processing unit (Central Processing Unit, CPU). The processor 201 can also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC). ), Field-Programmable Gate Array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general processor may be a microprocessor or the processor may be any conventional processor.

The memory 202 can be a Flash chip, a read-only memory (ROM, Read-Only Memory) disk, an optical disk, a U disk or a mobile hard disk, etc.

The electronic device 200 includes but is not limited to a base station, a server, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, a wearable device, etc.

The present disclosure provides a circuit board module, a preparation method and electronic equipment. The circuit board module includes a radiator, and the radiator is provided with a positioning installation part; the circuit board is spaced apart from the radiator, and the circuit board is close to the radiator. A first limiting portion is provided on the side; a lining plate, the lining plate is arranged on the side of the circuit board away from the radiator, and the lining plate is provided with a connecting piece. After the lining plate and the circuit board are fixedly adapted, the connecting piece resists the circuit board. , so that the lining board and the circuit board are spaced apart; the support member includes an opposite first end and a second end, and the first end is formed with a support surface, and the second end is provided with a second limiting portion, and the support member is provided with between the circuit board and the radiator, and the support member contacts the radiator through the support surface, and forms a limiting fit with the first limiting portion formed on the circuit board through the second limiting portion; and a fixing piece, a fixing piece The connector that fixes the radiator and circuit board to the liner through the positioning mounting part. In this disclosure, the support and the radiator are assembled separately, and a first limiting part is provided on the circuit board, and a second limiting part adapted to the first limiting part is provided on the support. When the circuit board module is assembled, the support member can be relatively fixed on the circuit board by utilizing the limited cooperation between the first limiter part and the second limiter part, and the support member is provided with a support surface through which it abuts against the radiator. , avoid interference assembly between the support and the radiator, effectively reduce the overall stiffness of the radiator, reduce the mechanical stress during the assembly process, and improve the service life of the circuit board module.

It will be understood that the term "and/or" as used in this disclosure and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items. It should be noted that, as used herein, the terms "include", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article or system that includes a list of elements not only includes those elements, but It also includes other elements not expressly listed or that are inherent to the process, method, article or system. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

The above serial numbers of the present disclosure are only for description and do not represent the advantages and disadvantages of the embodiments. The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person familiar with the technical field can easily think of various equivalent methods within the technical scope disclosed in the present disclosure. Modifications or substitutions, these modifications or substitutions should be covered by the protection scope of this disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

A circuit board module including:

A radiator, the radiator is provided with a positioning mounting portion;

A circuit board, the circuit board is spaced apart from the radiator, and a first limiting portion is provided on the side of the circuit board close to the radiator;

Lining plate, the lining plate is arranged on the side of the circuit board away from the radiator, and the lining plate is provided with a connecting piece. After the lining plate and the circuit board are fixedly adapted, the connecting piece Resist against the circuit board so that the liner and the circuit board are spaced apart;

A support member, the support member includes an opposite first end and a second end, and the first end is formed with a support surface, and the second end is provided with a second limiting portion, and the support member is provided on the between the circuit board and the heat sink, and the support member contacts the heat sink through the support surface, and contacts the first limit formed on the circuit board through the second limiting part. The parts form a limiting fit; and

A fixing part that fixes the heat sink and the circuit board to the connecting part of the liner through the positioning and mounting part.
The circuit board module according to claim 1, wherein the first limiting portion is a plurality of limiting grooves arranged at intervals, and the second limiting portion is a limiting portion adapted to the limiting grooves. bulge.
The circuit board module according to claim 2, wherein there is a height difference h1 between the bottom of the limiting groove and the surface of the circuit board close to the heat sink, and the height difference h1 is different from the height difference h1. The thickness T of the above circuit board satisfies: 1/4*T≤h1≤1/3*T.
The circuit board module according to claim 1, wherein the outer surface of the first limiting part and the outer surface of the second limiting part are both provided with a metal coating, and the support member passes through the The second limiting part is welded to the first limiting part of the circuit board.
The circuit board module according to any one of claims 1 to 4, wherein the positioning installation part includes a positioning hole, the circuit board is provided with a first through hole penetrating the circuit board, and the support member is provided with There is a second through hole penetrating the support member, and the first limiting part is provided on the peripheral side of the first through hole, and the second limiting part is provided on the peripheral side of the second through hole. ,

Wherein, the fixing member passes through the positioning hole, the first through hole and the second through hole and is connected to the connecting member provided on the liner to connect the radiator and the The circuit board is fixed to the backing board.
The circuit board module according to claim 5, wherein the connecting member is provided with a first thread, the fixing member is provided with a second thread, and the fixing member is connected to the connecting member through the second thread. First threaded adapter connection.
The circuit board module according to claim 5, wherein the positioning and mounting part further includes a positioning groove, the positioning groove is provided on the side of the heat sink close to the circuit board;

Wherein, the positioning groove is provided on the peripheral side of the positioning hole, and the first end of the support member is received in the positioning groove and abuts against the heat sink.
The circuit board module according to any one of claims 1 to 4, wherein the heat sink includes a base plate and fins disposed on a side of the base plate away from the support member and connected to the base plate, wherein, A plurality of the positioning mounting parts are arranged at intervals on the bottom plate.
A method for preparing a circuit board module, including:

Provide a circuit board and provide a first limiting portion on the circuit board;

Provide a support member, the support member includes an opposite first end and a second end, and the first end forms a support surface, and the second end is provided with a second limiting portion;

The second limiting part of the support member is mounted to the first limiting part of the circuit board through surface mounting technology, so that the first limiting part and the second limiting part are appropriately limited. match;

A lining plate, a radiator and a fixing piece are provided, wherein the lining plate is provided with a connecting piece, and the radiator is provided with a positioning mounting part;

The fixing piece is used to fix the radiator and the circuit board to the connecting piece of the lining plate through the positioning and mounting portion, and when the radiator, the circuit board and the lining plate are fixed, After assembly, the supporting surface of the support member abuts the heat sink, and the connecting member abuts the circuit board, so that the heat sink and the circuit board are spaced apart, and the circuit board and the circuit board are spaced apart. The lining plates are spaced apart.
An electronic device, comprising the circuit board module according to any one of claims 1 to 8, or the electronic device comprising a circuit board prepared by using the circuit board module preparation method according to claim 9 Mods.