CN117355053A - Method for avoiding deep hole burrs of soft and hard combined plate - Google Patents
Method for avoiding deep hole burrs of soft and hard combined plate Download PDFInfo
- Publication number
- CN117355053A CN117355053A CN202311458774.4A CN202311458774A CN117355053A CN 117355053 A CN117355053 A CN 117355053A CN 202311458774 A CN202311458774 A CN 202311458774A CN 117355053 A CN117355053 A CN 117355053A
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- board
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- prepreg
- copper foil
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- 238000000034 method Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 239000011889 copper foil Substances 0.000 claims abstract description 63
- 238000003825 pressing Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000013039 cover film Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a method for avoiding deep hole burrs of a rigid-flex circuit board, which comprises the following specific steps: s1, preparing a soft board layer, a hard board layer, a prepreg and a copper foil; the soft board layer comprises a PI board and a covering film, wherein soft board copper foils are arranged on the upper surface and the lower surface of the PI board; the hard board layer comprises a hard board insulating FR4 board, and the upper surface and the lower surface of the hard board insulating FR4 board are provided with hard board layer copper foils; s2, the flexible board copper foil comprises a flexible area and a rigid area, circuit patterns are manufactured on the flexible area and the rigid area, after the manufactured circuit patterns are cleaned, covering films are respectively attached to the flexible area to protect the flexible board circuit, and the attaching precision of the covering films is 0.1mm; s3, forming burr-preventing holes in the PI plate and the soft plate copper foil in advance at positions of the soft plate layers, which correspond to the positions below the control deep holes, of the soft and hard plate finished products, wherein the diameter ratio of the burr-preventing holes to the control deep holes is not less than 0.2mm. When the deep control hole is manufactured, the PI plate at the corresponding position is removed in advance, so that burrs of the deep control hole caused by the PI plate can be avoided.
Description
Technical Field
The invention belongs to the technical field of printed circuit board processing technology, and relates to a method for avoiding deep hole burrs of a rigid-flex circuit board.
Background
Along with the development of technology, social progress and improvement of living standard, the development trend of electronic products requires the development of printed circuit boards along the directions of light, thin, short, small and multifunction, while the rigid-flex board has the advantages of small size, light weight, capability of avoiding connection errors, increasing assembly flexibility, realizing three-dimensional assembly and the like, and is applied to deep control holes such as countersunk holes, counter bores, countersinks, back drilling holes and the like in design for further reducing assembly space and signal transmission. The rigid circuit board is relatively consistent in material, burrs and burrs are not generated basically when the deep hole D is produced, and the soft and hard combined board is softer in material of the rigid circuit board because the soft and hard combined board contains a special PI board, so that defects of burrs and burrs are generated frequently when the deep hole D is produced, and the aperture of the deep hole D, conduction among layers of the circuit board, assembly of components and the like are affected.
Disclosure of Invention
The invention aims to provide a method for avoiding burrs of a deep hole of a rigid-flex circuit board, which can solve the problems and avoid burrs of a deep hole D caused by a PI board.
According to the technical scheme provided by the invention: a method for avoiding deep hole burrs of a rigid-flex circuit board comprises the following specific steps: s1, preparing a soft board layer, a hard board layer, a prepreg and a copper foil; the soft board layer comprises a PI board and a covering film, wherein soft board copper foils are arranged on the upper surface and the lower surface of the PI board; the hard board layer comprises a hard board insulating FR4 board, and the upper surface and the lower surface of the hard board insulating FR4 board are provided with hard board layer copper foils;
s2, the flexible board copper foil comprises a flexible area and a rigid area, circuit patterns are manufactured on the flexible area and the rigid area, after the manufactured circuit patterns are cleaned, covering films are respectively attached to the flexible area to protect the flexible board circuit, and the attaching precision of the covering films is 0.1mm;
s3, forming anti-burr holes on the PI plate and the soft plate copper foil in advance at positions of the soft plate layer, which correspond to the positions below the control deep holes, of the soft and hard combined plate finished product, wherein the diameter ratio of the anti-burr holes to the control deep holes is not less than 0.2mm, and the hole position precision of the anti-burr holes is 0.025-0.05mm;
s4, manufacturing a pattern circuit on the copper foil of the hard board layer, cleaning the manufactured circuit pattern, cleaning the circuit pattern by using a pickling and alkaline washing mode, and then carrying out browning treatment;
s5, in the sequence from bottom to top: the method comprises the steps of superposing and laminating copper foils, prepregs, hard board layers, prepregs, soft board layers, prepregs, hard board layers, prepregs and copper foils, aligning the superposition in a Pin-lam mode, setting the alignment precision of each layer to be 0.1-0.125mm, setting the lamination temperature to be 190-195 ℃ and the lamination time of a high-temperature section to be 90-100 minutes, setting the pressure to be 450-480PSI, and filling burr-preventing holes in the laminated prepregs;
s6, drilling, electroplating, outer-layer circuit and welding prevention flow are completed;
s7, manufacturing a deep control hole, controlling the depth H of the deep control hole, and controlling the thickness H1 between the uppermost copper foil and the PI plate of the soft board layer to be H=H21+/-0.15 mm, wherein the hole position accuracy is controlled to be 0.075-0.1mm.
As a further improvement of the present invention, in step S3: processing the PI plate and the soft plate copper foil in advance by using a laser cutting mode, wherein the diameter of the burr-proof hole is 0.2mm larger than that of the deep control hole, and the hole position precision of the burr-proof hole is 0.05mm.
As a further improvement of the present invention, in step S5: in the order from bottom to top: copper foil, prepreg, hard board layer, prepreg, soft board layer, prepreg, hard board layer, prepreg and copper foil are overlapped and pressed, the overlapped layers are aligned in a Pin-lam mode, the alignment precision of each layer is 0.1mm, the pressing temperature is set to 190 ℃, the pressing time of a high temperature section is set to 90 minutes, the pressure is set to 450PSI, and the prepreg fills the burr-preventing holes after pressing.
As a further improvement of the present invention, in step S7: and (3) manufacturing a deep control hole, controlling the depth H of the deep hole, and controlling the thickness H1 between the copper foil on the outermost layer and the PI plate on the soft board layer to be H1-0.15mm, wherein the hole position accuracy is controlled to be 0.075mm.
As a further improvement of the present invention, in step S3: the PI plate and the soft plate copper foil are removed in advance by using a CCD punching mode, the diameter of the anti-burr hole is 0.25mm larger than that of the deep control hole, and the hole position precision of the anti-burr hole is 0.025mm.
As a further improvement of the present invention, in step S5: in the order from bottom to top: copper foil, prepreg, hard board layer, prepreg, soft board layer, prepreg, hard board layer, prepreg and copper foil are overlapped and pressed, the overlapped layers are aligned in a Pin-lam mode, the alignment precision of each layer is 0.125mm, the pressing temperature is set to 195 ℃, the pressing time in a high temperature section is set to 100 minutes, the pressure is set to 480PSI, and the prepreg fills the burr-preventing holes after pressing.
As a further improvement of the present invention, in step S7: and (3) manufacturing a deep control hole, controlling the depth H of the deep hole, and controlling the thickness H1 between the uppermost copper foil and the PI plate to be 0.1mm, wherein H=H2+0.15 mm, and the hole position precision is controlled to be 0.1mm.
The positive progress effect of this application lies in:
when the deep control hole D is manufactured, the PI plate at the corresponding position is removed in advance, so that burrs of the deep control hole D caused by the PI plate can be avoided.
Drawings
Fig. 1 is a schematic structural diagram of the present invention S2.
Fig. 2 is a schematic structural diagram of the present invention S3.
Fig. 3 is a schematic structural diagram of the present invention S4.
Fig. 4 is a schematic structural diagram of the present invention S5.
Fig. 5 is a schematic structural diagram of the present invention S6.
Fig. 6 is a schematic structural diagram of the present invention S7.
Fig. 7 is a schematic structural diagram of S5 in embodiment 2 of the present invention.
Fig. 8 is a schematic structural diagram of S7 in embodiment 2 of the present invention.
Fig. 9 is a schematic structural diagram of S5 in embodiment 3 of the present invention.
Fig. 10 is a schematic diagram of the structure of S7 in embodiment 3 of the present invention.
In fig. 1 to 10, the flexible printed circuit board comprises a flexible printed circuit board layer 1, a PI board material 1-1, a flexible printed circuit board copper foil 1-2, a cover film 1-3, a hard printed circuit board layer 2, a hard printed circuit board insulating FR4 board material 2-1, a hard printed circuit board layer copper foil 2-2, a prepreg 3, a copper foil 4 and the like.
Detailed Description
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the invention herein. Furthermore, the terms "include" and "have," and the like, mean that other content not already listed may be "included" and "provided" in addition to those already listed in "include" and "provided; for example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements not expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Due to the drawing angle problem, some parts may not be drawn, but the positions and connection relations of the parts may be understood according to the text expression part.
As shown in FIG. 1, the invention relates to a method for avoiding deep hole burrs of a rigid-flex circuit board, which comprises the following specific steps:
s1, preparing a soft board layer 1, a hard board layer 2, a prepreg 3 and a copper foil 4; wherein, the flexible board layer 1 comprises a PI board 1-1 and a covering film 1-3, and flexible board copper foils 1-2 are arranged on the upper surface and the lower surface of the PI board 1-1; the hard board layer 2 comprises a hard board insulation FR4 board 2-1, and hard board layer copper foils 2-2 are arranged on the upper surface and the lower surface of the hard board insulation FR4 board 2-1;
s2, as shown in FIG. 1, the flexible copper foil 1-2 comprises a flexible area and a rigid area, circuit patterns are manufactured on the flexible area and the rigid area, after the manufactured circuit patterns are cleaned, the flexible area is respectively attached with a cover film 1-3 to protect the flexible circuit, and the attaching precision of the cover film 1-3 is 0.1mm;
s3, as shown in FIG. 2, forming anti-burr holes D1 on the PI plate 1-1 and the soft plate copper foil 1-2 in advance at the position of the soft plate layer 1 corresponding to the position below the control deep hole D required to be manufactured by the soft and hard combined plate finished product, wherein the diameter ratio of the anti-burr holes D1 is not less than 0.2mm, and the hole position precision of the anti-burr holes D1 is 0.025-0.05mm;
s4, as shown in FIG. 3, making a pattern circuit on the copper foil 2-2 of the hard board layer, cleaning the circuit pattern by using a pickling and alkaline washing mode, and then carrying out browning treatment;
s5, as shown in FIG. 4, the following steps are performed in the order from bottom to top: the copper foil 4, the prepreg 3, the hard board layer 2, the prepreg 3, the soft board layer 1, the prepreg 3, the hard board layer 2, the prepreg 3 and the copper foil 4 are overlapped and pressed, the overlapped layers are aligned in a Pin-lam mode, the alignment precision of each layer is 0.1-0.125mm, the pressing temperature is set to 190-195 ℃, the pressing time in a high-temperature section is set to 90-100 minutes, the pressure is set to 450-480PSI, and the anti-burr hole D1 is filled with the pressed prepreg 3;
s6, as shown in FIG. 5, drilling, electroplating, outer-layer circuit and anti-welding processes are completed;
s7, as shown in FIG. 6, a deep hole D is manufactured, the depth H of the deep hole D is controlled, the thickness H1 between the uppermost copper foil 4 and the soft board PI board 1-1 is H=H21 +/-0.15mm, and the hole position accuracy is controlled to be 0.075-0.1mm.
In embodiment 1, a method for avoiding deep hole burrs of a rigid-flex circuit board according to the embodiment comprises the following specific steps:
s3, as shown in FIG. 2, processing a burr-preventing hole D1 on the PI plate 1-1 and the soft plate copper foil 1-2 in advance by using a laser cutting mode at the position of the soft plate layer 1 corresponding to the position below the control deep hole D required to be manufactured by the soft and hard combined plate finished product, wherein the diameter of the burr-preventing hole D1 is 0.2mm larger than that of the control deep hole D, and the hole position precision of the burr-preventing hole D1 is 0.05mm;
s5, as shown in FIG. 4, the following steps are performed in the order from bottom to top: the copper foil 4, the prepreg 3, the hard board layer 2, the prepreg 3, the soft board layer 1, the prepreg 3, the hard board layer 2, the prepreg 3 and the copper foil 4 are overlapped and pressed, the overlapped layers are aligned in a Pin-lam mode, the alignment precision of each layer is 0.1mm, the pressing temperature is set to 190 ℃, the pressing time in a high-temperature section is set to 90 minutes, the pressure is set to 450PSI, and the anti-burr hole D1 is filled with the pressed prepreg 3;
s7, as shown in FIG. 6, a deep hole D is manufactured, the depth H of the deep hole D is controlled, the thickness H1 between the uppermost copper foil 4 and the soft board PI plate 1-1 is H=H21-0.15 mm, and the hole position accuracy is controlled to be 0.075mm.
In embodiment 2, a method for avoiding deep hole burrs of a rigid-flex circuit board according to the embodiment comprises the following specific steps:
s3, the position of the soft board layer 1 corresponding to the lower part of the control deep hole D is required to be manufactured on the soft and hard combined board finished product, the PI board 1-1 and the soft board copper foil 1-2 are removed in advance by using a CCD punching mode, the diameter of the anti-burr hole D1 is 0.25mm larger than that of the control deep hole D, and the hole position precision of the anti-burr hole D1 is 0.025mm;
s5, as shown in FIG. 7, the following steps are performed in the order from bottom to top: the copper foil 4, the prepreg 3, the hard board layer 2, the prepreg 3, the soft board layer 1, the prepreg 3, the hard board layer 2, the prepreg 3 and the copper foil 4 are overlapped and pressed, the overlapped layers are aligned in a Pin-lam mode, the alignment precision of each layer is 0.125mm, the pressing temperature is set to 195 ℃, the pressing time of a high temperature section is set to 100 minutes, the pressure is set to 480PSI, and the anti-burr hole D1 is filled with the pressed prepreg 3;
s7, as shown in FIG. 8, a deep hole D is manufactured, the depth H of the deep hole D is controlled, the thickness H1 between the uppermost copper foil 4 and the soft board PI plate 1-1 is H=H2, and the hole position accuracy is controlled to be 0.1mm.
Embodiment 3, a method for avoiding deep hole burrs of a rigid-flex circuit board according to the embodiment specifically includes the following steps:
s3, a soft board layer 1 corresponding to the position below the control deep hole D is required to be manufactured on a soft and hard combined board finished product, the PI board 1-1 and the soft board copper foil 1-2 are removed in advance in a CCD punching mode, the diameter of the anti-burr hole D1 is 0.3mm larger than that of the control deep hole D, and the hole position precision of the anti-burr hole D1 is 0.02mm;
s5, as shown in FIG. 9, the following steps are performed in the order from bottom to top: the copper foil 4, the prepreg 3, the hard board layer 2, the prepreg 3, the soft board layer 1, the prepreg 3, the hard board layer 2, the prepreg 3 and the copper foil 4 are overlapped and pressed, the overlapped layers are aligned in a Pin-lam mode after fusion, the alignment precision of each layer is 0.12mm, the pressing temperature is set to 193 ℃, the pressing time in a high temperature section is set to 95 minutes, the pressure is set to 470PSI, and the anti-burr holes D1 are filled in the prepreg 3 after pressing;
s7, as shown in FIG. 10, a deep hole D is manufactured, the depth H of the deep hole D is controlled, the thickness H1 between the uppermost copper foil 4 and the soft board PI plate 1-1 is H=H2+0.15mm, and the hole position accuracy is controlled to be 0.09mm.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (7)
1. A method for avoiding deep hole burrs of a rigid-flex circuit board is characterized by comprising the following specific steps: s1, preparing a soft board layer (1), a hard board layer (2), a prepreg (3) and a copper foil (4); wherein, the soft board layer (1) comprises a PI board (1-1) and a covering film (1-3), and soft board copper foils (1-2) are arranged on the upper surface and the lower surface of the PI board (1-1); the hard board layer (2) comprises a hard board insulating FR4 board (2-1), and hard board layer copper foils (2-2) are arranged on the upper surface and the lower surface of the hard board insulating FR4 board (2-1);
s2, the flexible board copper foil (1-2) comprises a flexible area and a rigid area, circuit patterns are manufactured on the flexible area and the rigid area, after the circuit patterns are cleaned, the flexible area is respectively adhered with a covering film (1-3) to protect the flexible board circuit, and the adhering precision of the covering film (1-3) is 0.1mm;
s3, forming anti-burr holes (D1) on the PI plate (1-1) and the soft plate copper foil (1-2) in advance at positions of the soft plate layer (1) corresponding to the lower part of the control deep hole (D) required to be manufactured on the soft and hard combined plate finished product, wherein the diameter ratio of the anti-burr holes (D1) to the control deep hole (D) is not less than 0.2mm, and the hole position precision of the anti-burr holes (D1) is 0.025-0.05mm;
s4, manufacturing a pattern circuit on the copper foil (2-2) of the hard board layer, cleaning the manufactured circuit pattern, cleaning the circuit pattern by using a pickling and alkaline washing mode, and then carrying out browning treatment;
s5, in the sequence from bottom to top: the method comprises the steps of superposing and laminating copper foil (4), prepreg (3), hard board layer (2), prepreg (3), soft board layer (1), prepreg (3), hard board layer (2), prepreg (3) and copper foil (4), aligning the superposition in a Pin-lam mode, setting the alignment precision of each layer to be 0.1-0.125mm, setting the lamination temperature to be 190-195 ℃ and the lamination time of a high-temperature section to be 90-100 minutes, setting the pressure to be 450-480PSI, and filling anti-burr holes (D1) in the prepreg (3) after lamination;
s6, drilling, electroplating, outer-layer circuit and welding prevention flow are completed;
s7, manufacturing a deep control hole (D), controlling the depth H of the deep control hole (D), controlling the thickness H1 between the uppermost copper foil (4) and the soft board layer PI board (1-1), wherein H=H2+/-0.15 mm, and controlling the hole position accuracy by 0.075-0.1mm.
2. The method for avoiding deep hole burrs of a rigid-flex circuit board according to claim 1, wherein in step S3: processing burr-proof holes (D1) on the PI plate (1-1) and the soft plate copper foil (1-2) in advance in a laser cutting mode, wherein the diameters of the burr-proof holes (D1) are 0.2mm larger than those of the deep control holes (D), and the hole site precision of the burr-proof holes (D1) is 0.05mm.
3. The method for avoiding deep hole burrs of a rigid-flex circuit board according to claim 1, wherein in step S5: in the order from bottom to top: copper foil (4), prepreg (3), hard board layer (2), prepreg (3), soft board layer (1), prepreg (3), hard board layer (2), prepreg (3), copper foil (4) carry out the coincide, and the coincide adopts Pin-lam mode to counterpoint, and the counterpoint precision of each layer is 0.1mm, and the pressfitting temperature sets for 190 ℃ and high temperature section pressfitting time sets for 90 minutes, and pressure setting 450PSI, and burr-proof hole (D1) is filled to prepreg (3) after the pressfitting.
4. The method for avoiding deep hole burrs of a rigid-flex circuit board according to claim 1, wherein in step S7: and (3) manufacturing a deep control hole (D), controlling the depth H of the deep hole (D), and controlling the thickness H1 between the copper foil (4) on the outermost layer and the PI plate (1-1) on the soft plate layer to be H1-0.15mm, wherein the hole position accuracy is controlled to be 0.075mm.
5. The method for avoiding deep hole burrs of a rigid-flex circuit board according to claim 1, wherein in step S3: the PI plate (1-1) and the soft plate copper foil (1-2) are removed in advance by using a CCD punching mode, the diameter of the anti-burr hole (D1) is 0.25mm larger than that of the deep control hole (D), and the hole position precision of the anti-burr hole (D1) is 0.025mm.
6. The method for avoiding deep hole burrs of a rigid-flex circuit board according to claim 1, wherein in step S5: in the order from bottom to top: copper foil (4), prepreg (3), hard board layer (2), prepreg (3), soft board layer (1), prepreg (3), hard board layer (2), prepreg (3), copper foil (4) are laminated and pressed, pin-lam mode alignment is adopted for lamination, the alignment precision of each layer is 0.125mm, the pressing temperature is set to 195 ℃, the pressing time of a high temperature section is set to 100 minutes, the pressure is set to 480PSI, and after pressing, the prepreg (3) fills the burr-proof hole (D1).
7. The method for avoiding deep hole burrs of a rigid-flex circuit board according to claim 1, wherein in step S7: and (3) manufacturing a deep control hole (D), wherein the depth H of the deep control hole (D) is controlled, the thickness H1 between the uppermost copper foil (4) and the PI plate (1-1) is H=H2+0.15mm, and the hole position accuracy is controlled to be 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311458774.4A CN117355053A (en) | 2023-11-03 | 2023-11-03 | Method for avoiding deep hole burrs of soft and hard combined plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311458774.4A CN117355053A (en) | 2023-11-03 | 2023-11-03 | Method for avoiding deep hole burrs of soft and hard combined plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117355053A true CN117355053A (en) | 2024-01-05 |
Family
ID=89369196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311458774.4A Pending CN117355053A (en) | 2023-11-03 | 2023-11-03 | Method for avoiding deep hole burrs of soft and hard combined plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117355053A (en) |
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2023
- 2023-11-03 CN CN202311458774.4A patent/CN117355053A/en active Pending
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