CN117337390A - 基板测量装置以及基板测量方法 - Google Patents
基板测量装置以及基板测量方法 Download PDFInfo
- Publication number
- CN117337390A CN117337390A CN202180098132.0A CN202180098132A CN117337390A CN 117337390 A CN117337390 A CN 117337390A CN 202180098132 A CN202180098132 A CN 202180098132A CN 117337390 A CN117337390 A CN 117337390A
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- CN
- China
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- substrate
- imaging
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- error correction
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- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 324
- 238000000034 method Methods 0.000 title description 33
- 238000003384 imaging method Methods 0.000 claims abstract description 394
- 238000012937 correction Methods 0.000 claims abstract description 290
- 238000012545 processing Methods 0.000 claims abstract description 197
- 238000005259 measurement Methods 0.000 claims abstract description 170
- 230000001133 acceleration Effects 0.000 claims abstract description 115
- 238000004364 calculation method Methods 0.000 claims abstract description 95
- 230000003068 static effect Effects 0.000 claims description 55
- 238000000691 measurement method Methods 0.000 claims description 13
- 230000008859 change Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 description 29
- 238000010586 diagram Methods 0.000 description 25
- 230000014509 gene expression Effects 0.000 description 18
- 238000013500 data storage Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000003708 edge detection Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 239000013598 vector Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000005070 sampling Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/954—Inspecting the inner surface of hollow bodies, e.g. bores
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8861—Determining coordinates of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
- G01N2201/127—Calibration; base line adjustment; drift compensation
Landscapes
- Engineering & Computer Science (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Operations Research (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/018651 WO2022244074A1 (ja) | 2021-05-17 | 2021-05-17 | 基板計測装置及び基板計測方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117337390A true CN117337390A (zh) | 2024-01-02 |
Family
ID=83188062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180098132.0A Pending CN117337390A (zh) | 2021-05-17 | 2021-05-17 | 基板测量装置以及基板测量方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7131716B1 (ja) |
| KR (1) | KR20230169222A (ja) |
| CN (1) | CN117337390A (ja) |
| WO (1) | WO2022244074A1 (ja) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002181733A (ja) | 2000-12-15 | 2002-06-26 | Hitachi Via Mechanics Ltd | プリント基板検査装置 |
| WO2007129733A1 (ja) * | 2006-05-09 | 2007-11-15 | Tokyo Electron Limited | 撮像位置補正方法、撮像方法、及び基板撮像装置 |
| JP5152567B2 (ja) * | 2008-01-10 | 2013-02-27 | 株式会社島津製作所 | Ｔｆｔアレイ検査装置 |
| JP5418490B2 (ja) * | 2010-12-27 | 2014-02-19 | 三菱電機株式会社 | 位置決め制御装置およびこれを備えた位置決め装置 |
| ES2638597T3 (es) * | 2012-01-02 | 2017-10-23 | Mutracx International B.V. | Sistema de inyección de tinta para la impresión de un circuito impreso |
| US8772731B2 (en) * | 2012-04-15 | 2014-07-08 | Kla-Tencor Corporation | Apparatus and method for synchronizing sample stage motion with a time delay integration charge-couple device in a semiconductor inspection tool |
| JP2015190826A (ja) * | 2014-03-28 | 2015-11-02 | 東レエンジニアリング株式会社 | 基板検査装置 |
| JP6475552B2 (ja) * | 2015-04-14 | 2019-02-27 | 株式会社ミツトヨ | 画像測定装置、画像測定方法、情報処理装置、情報処理方法、及びプログラム |
-
2021
- 2021-05-17 WO PCT/JP2021/018651 patent/WO2022244074A1/ja active Application Filing
- 2021-05-17 KR KR1020237038477A patent/KR20230169222A/ko unknown
- 2021-05-17 JP JP2021563154A patent/JP7131716B1/ja active Active
- 2021-05-17 CN CN202180098132.0A patent/CN117337390A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230169222A (ko) | 2023-12-15 |
| WO2022244074A1 (ja) | 2022-11-24 |
| JP7131716B1 (ja) | 2022-09-06 |
| JPWO2022244074A1 (ja) | 2022-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |