CN117316891B - ESD packaging structure with electrostatic protection - Google Patents

ESD packaging structure with electrostatic protection Download PDF

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Publication number
CN117316891B
CN117316891B CN202311463875.0A CN202311463875A CN117316891B CN 117316891 B CN117316891 B CN 117316891B CN 202311463875 A CN202311463875 A CN 202311463875A CN 117316891 B CN117316891 B CN 117316891B
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China
Prior art keywords
heat
block
plate
packaging table
chip
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CN202311463875.0A
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Chinese (zh)
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CN117316891A (en
Inventor
秦志方
薛嘉文
杜家旺
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Meitai High Tech Shanghai Microelectronics Co ltd
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Meitai High Tech Shanghai Microelectronics Co ltd
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Priority to CN202311463875.0A priority Critical patent/CN117316891B/en
Publication of CN117316891A publication Critical patent/CN117316891A/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The invention discloses an electrostatic protection ESD packaging structure which comprises a packaging table, an electrostatic protection cover and a heat conduction mechanism, wherein the packaging table is connected with a sealing plate through a rotating connecting piece, a bump is connected to the bottom of one side of the sealing plate far away from the rotating connecting piece, the bump is clamped in a top groove, the top groove is formed in the packaging table, and a turnover opening and closing mechanism is connected to the side wall of the packaging table. This ESD packaging structure of static protection, the heat-conducting plate can rely on self good heat conductivility to produce heat transfer to self with the chip during operation on, the heat dissipation stick that its front and back both sides are connected will be through the advantage that heat radiating area is big help the heat-conducting plate quick heat dissipation, heat on the heat-conducting plate passes through the heat conducting strip to heating panel department simultaneously, thereby can utilize the heating panel of naked distribution in the device outside to dispel the heat in step, thereby can improve the radiating efficiency of device under the circumstances of guaranteeing the device is sealed, and avoid chip overheat fault with this, and then be convenient for prolong the life of device.

Description

ESD packaging structure with electrostatic protection
Technical Field
The invention relates to the technical field of packaging structures, in particular to an electrostatic protection ESD packaging structure.
Background
Packaging is the process of assembling an integrated circuit into a chip end product, namely, simply placing an integrated circuit bare chip produced by a foundry on a substrate with a bearing function, leading out pins, then fixedly packaging the integrated circuit bare chip into a whole, and exposing the integrated circuit bare chip to electrostatic discharge impact, namely, ESD, in the whole life cycle of the integrated circuit packaged by the chip, from manufacturing, packaging, transporting and assembling, even in the finished IC product, when static charges accumulated in the external environment of the chip or the inside of the chip flow into or flow out of the inside of the chip through the pins of the chip, the integrated circuit is damaged by instant generated current or voltage, so that the chip is disabled, and the ESD refers to charge transfer caused by mutual approaching or direct contact of objects with different electrostatic potentials.
Through retrieval, a packaging structure which is typical in the packaging structure in the prior art, such as a packaging structure of a publication number CN218975434U and a chip packaging structure, relates to the field of chip packaging; the package structure includes: the first packaging piece, the second packaging piece and the substrate; the first package includes a first top wall and a first end disposed away from the first top wall; the second package includes a second top wall and a second end disposed away from the second top wall; the first end portion is connected with the second end portion in a sealing manner so as to form a target accommodating space formed by the first top wall and the second top wall; the substrate is arranged in the target accommodating space and is used for bearing a target chip and communicating the first packaging piece and the second packaging piece. The chip packaging structure is mainly characterized in that through the arrangement of the target accommodating space and the inner substrate, the chip packaging structure can adapt to the trend of increasing the number of chips and reducing the size of the chips, has good air tightness and improves the reliability of the chips.
To sum up, the existing packaging structure mostly adopts the siliceous material to seal and shelter for preventing electrostatic impact, but the siliceous material has poor heat dissipation effect, is inconvenient to detach, install and overhaul, and needs to improve the existing equipment for the above problems.
Disclosure of Invention
The invention aims to provide an ESD packaging structure with electrostatic protection, which solves the problems that the prior packaging structure proposed in the background art mostly adopts siliceous materials for sealing shielding in order to prevent electrostatic impact, and the siliceous materials have poor heat dissipation effect and are inconvenient to detach, install and overhaul.
In order to achieve the above purpose, the present invention provides the following technical solutions: an ESD packaging structure with electrostatic protection comprises a packaging table, an electrostatic protection cover and a heat conduction mechanism,
The packaging table is connected with the sealing plate through the rotating connecting piece, a bump is connected to the bottom of one side, away from the rotating connecting piece, of the sealing plate, the bump is clamped in the top groove, the top groove is formed in the packaging table, the side wall of the packaging table is connected with the overturning opening and closing mechanism, the electrostatic protection cover is arranged in the packaging table, the base is arranged on the inner side of the electrostatic protection cover, the mounting block is clamped in the base, the mounting block is fixedly connected to the bottom of the chip, a gasket is arranged between the base and the chip, the chip is connected with one side wall of the conducting block through a bonding wire, and the other side wall of the conducting block is fixedly connected with the pin;
The heat conduction mechanism contacts with the top of the chip, and the heat conduction mechanism is connected with the packaging table and the sealing plate, the heat conduction mechanism comprises a heat conduction plate, a heat conduction sheet, a heat dissipation plate and a heat dissipation rod, one side surface of the heat conduction plate, far away from the chip, is connected with the heat dissipation plate through the heat conduction sheet, the heat dissipation plate is arranged in the heat dissipation groove, and the heat dissipation groove is formed in the top of the sealing plate.
Preferably, the turnover opening and closing mechanism comprises a fastener, a rotary drum, a turnover block, an adjusting rod and an adjusting block, wherein the fastener is connected with one end of the rotary drum, the turnover block is connected to the side wall of the rotary drum, and the rotary drum is connected with the adjusting block through the adjusting rod.
Preferably, the turnover block is rotatably connected in the side wall of the packaging table, and the turnover block is in contact with the sealing plate.
Preferably, one end of the adjusting rod is slidably connected to the inside of the rotary cylinder, and the adjusting rod and the rotary cylinder are rotatably connected to the inside of the side wall of the packaging table.
Preferably, the adjusting block is connected in a clamping manner in the accommodating groove, and the accommodating groove is correspondingly formed in the outer wall of one side of the packaging table.
Preferably, the conducting block is slidably connected with the bonding wire, and the conducting block is fixedly connected with the pin, and meanwhile the pin is connected to the packaging table in a penetrating manner.
Preferably, the conducting block is connected with the clamping block through an elastic strap, the clamping block is connected in the clamping groove in a clamping mode, and meanwhile the clamping groove is formed in the inner bottom of the packaging table.
Preferably, the top of the conduction block is provided with a first discharge sharp angle, the first discharge sharp angle and the second discharge sharp angle are correspondingly arranged, and meanwhile, the second discharge sharp angle is connected with the side wall of the packaging table through a discharge wire.
Preferably, the pins are distributed on the conductive block at equal intervals, and a sealing gasket is arranged at the joint of the pins and the packaging table.
Preferably, the heat conducting fins are distributed between the heat conducting plate and the heat radiating plate at equal intervals, the front side wall and the rear side wall of the heat conducting plate are connected with heat radiating rods, and meanwhile the heat radiating rods are connected to the front side wall and the rear side wall of the packaging table in a penetrating manner.
Compared with the prior art, the invention has the beneficial effects that: the ESD package structure of the electrostatic protection,
(1) According to the invention, the problem that the prior packaging structure is mostly sealed and shielded by adopting siliceous materials for preventing electrostatic impact and the heat dissipation effect of the siliceous materials is poor is effectively solved by the matched use of the heat conducting plate, the heat conducting plate can transfer heat generated by the chip during working to the heat conducting plate by virtue of good heat conduction property, meanwhile, the heat dissipation rods connected on the front side and the rear side of the heat conducting plate can help the heat conducting plate to quickly dissipate heat through the advantage of large heat dissipation area, and meanwhile, the heat on the heat conducting plate is transferred to the heat dissipation plate through the heat conducting plate, so that the heat dissipation can be synchronously carried out by using the heat dissipation plates which are exposed and distributed on the outer side of the device, the heat dissipation efficiency of the device can be improved under the condition of ensuring the sealing of the device, the overheat fault of the chip can be avoided, and the service life of the device can be prolonged conveniently;
(2) According to the invention, the problem that disassembly, assembly and maintenance are inconvenient is effectively solved through the cooperation of the overturning opening and closing mechanism, the rotating connecting piece and the sealing plate, when the chip packaged on the inner side of the packaging table and the rotating connecting piece needs to be maintained, a worker can pull the adjusting rod to pull the adjusting block out of the storage groove, then manually rotate the adjusting block, the adjusting block drives the rotating cylinder to rotate through the adjusting rod, the rotating cylinder is driven to rotate in the rotating process to drive one side of the sealing plate which is clamped and connected on the top of the packaging table to jack up upwards to be separated from the packaging table, and then the worker can manually overturn and open the sealing plate under the cooperation of the rotating connecting piece, so that the chip in the packaging table and the sealing plate can be overhauled and maintained, and compared with the traditional method of disassembling multiple groups of connecting pieces and manually pulling out, the chip packaging table is more convenient and labor-saving;
(3) According to the application, the problem that the protection effect is poor because the traditional packaging structure can effectively prevent electrostatic impact by only using a single sealing structure through the electrostatic protection cover, the first discharge sharp angle, the discharge wire and the second discharge sharp angle are matched, and on one hand, the electrostatic protection cover formed by the acrylic plate and the polycarbonate plate protection material can effectively prevent static from generating, and on the other hand, when the electrostatic voltage difference is generated in the device, the point discharge occurs between the first discharge sharp angle and the second discharge sharp angle, so that electrostatic charges are transferred and discharged through a plurality of groups of pins, the purpose of electrostatic protection of a chip is achieved.
Drawings
FIG. 1 is a schematic view of a front view in cross section;
FIG. 2 is a schematic diagram of the overall structure of the present invention;
FIG. 3 is a schematic view of the overall structure of the connection relationship between the heat conducting fin and the heat dissipating rod and the heat conducting plate according to the present invention;
FIG. 4 is an enlarged schematic view of the structure of FIG. 1A according to the present invention;
Fig. 5 is an enlarged schematic view of the structure of fig. 1 at B according to the present invention.
In the figure: 1. a packaging table; 2. rotating the connecting piece; 3. a sealing plate; 4. a bump; 5. a top groove; 6. a turnover opening and closing mechanism; 601. a fastener; 602. a rotary drum; 603. a turnover block; 604. an adjusting rod; 605. an adjusting block; 7. a storage groove; 8. an electrostatic shield; 9. welding wires; 10. a conductive block; 11. pins; 12. a sealing gasket; 13. an elastic tie; 14. a first discharge tip; 15. discharging wire; 16. a second discharge tip; 17. a mounting block; 18. a base; 19. a gasket; 20. a clamping block; 21. a heat conduction mechanism; 2101. a heat conductive plate; 2102. a heat conductive sheet; 2103. a heat dissipation plate; 2104. a heat radiation rod; 22. a heat sink; 23. a clamping groove; 24. and a chip.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, the present invention provides a technical solution: an ESD packaging structure with electrostatic protection,
Examples
As shown in fig. 1, fig. 2, fig. 4 and fig. 5, the packaging table 1 is connected with the sealing plate 3 through the rotating connecting piece 2, the bottom of one side of the sealing plate 3 far away from the rotating connecting piece 2 is connected with a bump 4, the bump 4 is clamped in the top groove 5, the top groove 5 is arranged on the packaging table 1, the side wall of the packaging table 1 is connected with the turnover opening and closing mechanism 6, the electrostatic protection cover 8 is arranged in the packaging table 1, the inner side of the electrostatic protection cover 8 is provided with a base 18, the inner side of the base 18 is clamped with a mounting block 17, the mounting block 17 is fixedly connected to the bottom of the chip 24, meanwhile, a gasket 19 is arranged between the base 18 and the chip 24, the chip 24 is connected with one side wall of the conducting block 10 through a bonding wire 9, and the other side wall of the conducting block 10 is fixedly connected with the pin 11;
In a further embodiment, the conductive block 10 is slidably connected to the bonding wire 9, and the conductive block 10 is fixedly connected to the lead 11, while the lead 11 is connected to the package table 1.
In a further embodiment, the conductive block 10 is connected with the clamping block 20 through the elastic strap 13, and the clamping block 20 is in clamping connection with the inside of the clamping groove 23, and meanwhile, the clamping groove 23 is opened at the inner bottom of the packaging table 1.
In a further embodiment, the top of the conductive block 10 is provided with a first discharge tip 14, and the first discharge tip 14 is disposed corresponding to a second discharge tip 16, while the second discharge tip 16 is connected to the side wall of the package table 1 through a discharge wire 15.
In a further embodiment, the pins 11 are equally spaced on the conductive block 10, and a sealing pad 12 is disposed at the connection between the pins 11 and the package table 1.
As shown in fig. 1,2 and 3, the heat conducting mechanism 21 is in contact with the top of the chip 24, and the heat conducting mechanism 21 is connected with the package table 1 and the sealing plate 3, the heat conducting mechanism 21 includes a heat conducting plate 2101, a heat conducting sheet 2102, a heat dissipating plate 2103 and a heat dissipating rod 2104, and a side surface of the heat conducting plate 2101 away from the chip 24 is connected with the heat dissipating plate 2103 through the heat conducting sheet 2102, the heat dissipating plate 2103 is mounted inside the heat dissipating groove 22, and the heat dissipating groove 22 is opened at the top of the sealing plate 3.
In a further embodiment, the heat conductive fins 2102 are equally spaced between the heat conductive plate 2101 and the heat dissipation plate 2103, and heat dissipation bars 2104 are connected to the front and rear side walls of the heat conductive plate 2101, and the heat dissipation bars 2104 are connected to the front and rear side walls of the package table 1 in a penetrating manner.
Specifically, in the actual working process, a worker can connect the chip 24 with the mounting block 17 by using adhesive, then clamp the mounting block 17 into the base 18, at the moment, the bonding wires 9 are connected with the conducting block 10, then the worker turns over the sealing plate 3 until the bump 4 at the bottom of the sealing plate is clamped into the top groove 5, at the moment, the heat conducting plate 2101 connected to the sealing plate 3 is contacted with the chip 24, so that heat generated by the chip 24 in working can be conducted onto the heat conducting plate 2101, the heat conducting plate 2101 can transfer heat generated by the chip 24 in working onto the heat conducting plate 2101 by virtue of excellent heat conducting performance, meanwhile, the heat radiating rods 2104 connected to the front side and the rear side of the heat conducting plate can help the heat conducting plate 2101 to radiate rapidly by virtue of large heat radiating area, and meanwhile, the heat on the heat conducting plate 2101 is transferred to the heat radiating plate 2103 by the heat conducting plate 2102, so that the heat radiating plate 2103 which is distributed outside the device can be utilized for synchronous radiation;
On the other hand, the electrostatic protection cover 8 plays a role in preventing the ESD from being disturbed to the external element to work, meanwhile, the ESD generated during the operation of the chip 24 can shunt the electrostatic charge to the pin 11 through the first discharge sharp corner 14 and the second discharge sharp corner 16 on the discharge wire 15 and flow out through the pin 11, and the chip 24 is prevented from being short-circuited due to the ESD fault, so that the chip 24 is protected conveniently.
Example two
This embodiment is a further description of the above embodiment, and it should be understood that this embodiment includes all the foregoing technical features and is further specifically described.
As shown in fig. 1 and 4, in a further embodiment, the turning-over and opening mechanism 6 includes a fastening member 601, a rotary cylinder 602, a turning block 603, an adjusting rod 604 and an adjusting block 605, and the fastening member 601 is connected to one end of the rotary cylinder 602, the turning block 603 is connected to a side wall of the rotary cylinder 602, and the rotary cylinder 602 is connected to the adjusting block 605 through the adjusting rod 604.
In a further embodiment, the flip block 603 is rotatably connected in a side wall of the encapsulation table 1, and the flip block 603 is in contact with the sealing plate 3.
In a further embodiment, one end of the adjusting lever 604 is slidably connected inside the rotary cylinder 602, and the adjusting lever 604 and the rotary cylinder 602 are rotatably connected in the side wall of the encapsulation table 1.
In a further embodiment, the adjusting block 605 is connected in a snap-fit manner inside the accommodating groove 7, and the accommodating groove 7 is correspondingly opened on one side outer wall of the packaging table 1.
Specifically, when the chip 24 inside the packaging structure needs to be maintained, the operator can pull the adjusting block 605 out of the storage groove 7, pull the adjusting rod 604 to move in the rotating cylinder 602 while pulling out, then the operator can manually rotate the adjusting block 605, the adjusting block 605 drives the rotating cylinder 602 and the turning block 603 to rotate through the adjusting rod 604 in the rotating process, and the turning block 603 can push one side of the sealing plate 3 connected to the top of the packaging table 1 to jack up upwards in the rotating process so that the protruding block 4 is separated from the jack-up groove 5, so that one side of the sealing plate 3 is separated from the packaging table 1, and then the sealing plate 3 can be turned open manually, so that the chip 24 packaged inside the sealing plate can be maintained.
Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present invention.

Claims (5)

1. The utility model provides an ESD packaging structure of electrostatic protection, includes encapsulation platform (1), electrostatic protection casing (8) and heat conduction mechanism (21), its characterized in that:
The packaging table (1) is connected with the sealing plate (3) through the rotating connecting piece (2), one side bottom of the sealing plate (3) far away from the rotating connecting piece (2) is connected with the protruding block (4), the protruding block (4) is clamped in the top groove (5), the top groove (5) is formed in the packaging table (1), the side wall of the packaging table (1) is connected with the overturning opening and closing mechanism (6), the static protective cover (8) is arranged in the packaging table (1), the base (18) is arranged on the inner side of the static protective cover (8), the mounting block (17) is clamped in the base (18), the mounting block (17) is fixedly connected to the bottom of the chip (24), meanwhile, a gasket (19) is arranged between the base (18) and the chip (24), the chip (24) is connected with one side wall of the conducting block (10) through the elastic binding band (13), the other side wall of the conducting block (10) is fixedly connected with the pin (11), and the conducting block (10) is connected with the clamping block (20) through the elastic binding band (13), and the clamping block (20) is clamped in the inner bottom of the clamping block (23) and the clamping block (23) is formed in the packaging table (23);
The heat conduction mechanism (21) is in contact with the top of the chip (24), the heat conduction mechanism (21) is connected with the packaging table (1) and the sealing plate (3), the heat conduction mechanism (21) comprises a heat conduction plate (2101), a heat conduction plate (2102), a heat dissipation plate (2103) and a heat dissipation rod (2104), one side surface of the heat conduction plate (2101), far away from the chip (24), is connected with the heat dissipation plate (2103) through the heat conduction plate (2102), the heat dissipation plate (2103) is installed in the heat dissipation groove (22), the heat dissipation groove (22) is formed in the top of the sealing plate (3), the overturning opening and closing mechanism (6) comprises a fastener (601), a rotary cylinder (602), an overturning block (603), an adjusting rod (604) and an adjusting block (605), one end of the fastener (601) is connected with one end of the rotary cylinder (602), the overturning block (603) is connected with the adjusting block (605) through the adjusting rod (604), the overturning block (603) is rotationally connected in the side wall of the packaging table (1), the overturning block (603) is in contact with one end of the rotary cylinder (604) in the rotary cylinder (602), and adjust pole (604) and rotary drum (602) rotate and connect in the lateral wall of encapsulation platform (1), regulating block (605) block connect in the inside of accomodating groove (7), and accomodate groove (7) and correspondingly offer on the outer wall of one side of encapsulation platform (1).
2. An ESD package structure for electrostatic protection as defined in claim 1, wherein: the conducting block (10) is in sliding connection with the bonding wire (9), the conducting block (10) is fixedly connected with the pins (11), and meanwhile the pins (11) are connected to the packaging table (1) in a penetrating mode.
3. An ESD package structure for electrostatic protection as defined in claim 1, wherein: the top of conduction block (10) is provided with first closed angle (14) that discharges, and first closed angle (14) and second closed angle (16) that discharge set up correspondingly, and second closed angle (16) that discharges are connected with the lateral wall of encapsulation platform (1) through discharge wire (15) simultaneously.
4. An ESD package structure for electrostatic protection as defined in claim 1, wherein: the pins (11) are distributed on the conductive block (10) at equal intervals, and sealing gaskets (12) are arranged at the joint of the pins (11) and the packaging table (1).
5. An ESD package structure for electrostatic protection as defined in claim 1, wherein: the heat conducting fins (2102) are distributed between the heat conducting plate (2101) and the heat radiating plate (2103) at equal intervals, heat radiating rods (2104) are connected to the front side wall and the rear side wall of the heat conducting plate (2101), and meanwhile the heat radiating rods (2104) are connected to the front side wall and the rear side wall of the packaging table (1) in a penetrating mode.
CN202311463875.0A 2023-11-06 2023-11-06 ESD packaging structure with electrostatic protection Active CN117316891B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311463875.0A CN117316891B (en) 2023-11-06 2023-11-06 ESD packaging structure with electrostatic protection

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Application Number Priority Date Filing Date Title
CN202311463875.0A CN117316891B (en) 2023-11-06 2023-11-06 ESD packaging structure with electrostatic protection

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CN117316891B true CN117316891B (en) 2024-05-14

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010091380A (en) * 2000-03-15 2001-10-23 윤종용 High thermal emissive semiconductor chip package
CN102222662A (en) * 2011-07-01 2011-10-19 中国科学院微电子研究所 Packaging structure for performing electrostatic protection by using point discharge
CN109346442A (en) * 2018-10-10 2019-02-15 唐燕 It is a kind of be easy to radiate chip-packaging structure and its packaging method
CN112420622A (en) * 2020-10-27 2021-02-26 王海魁 Chip packaging structure easy to dissipate heat and packaging method thereof
CN213635955U (en) * 2020-11-18 2021-07-06 深圳市中明科技股份有限公司 Anti-static chip packaging structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010091380A (en) * 2000-03-15 2001-10-23 윤종용 High thermal emissive semiconductor chip package
CN102222662A (en) * 2011-07-01 2011-10-19 中国科学院微电子研究所 Packaging structure for performing electrostatic protection by using point discharge
CN109346442A (en) * 2018-10-10 2019-02-15 唐燕 It is a kind of be easy to radiate chip-packaging structure and its packaging method
CN112420622A (en) * 2020-10-27 2021-02-26 王海魁 Chip packaging structure easy to dissipate heat and packaging method thereof
CN213635955U (en) * 2020-11-18 2021-07-06 深圳市中明科技股份有限公司 Anti-static chip packaging structure

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