CN117316808A - Warp correcting device - Google Patents

Warp correcting device Download PDF

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Publication number
CN117316808A
CN117316808A CN202310653639.9A CN202310653639A CN117316808A CN 117316808 A CN117316808 A CN 117316808A CN 202310653639 A CN202310653639 A CN 202310653639A CN 117316808 A CN117316808 A CN 117316808A
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CN
China
Prior art keywords
substrate
molded substrate
lower member
heating
correcting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310653639.9A
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Chinese (zh)
Inventor
坂上雄哉
渡边创
吉冈翔
早川海斗茂
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Towa Corp
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Towa Corp
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Publication of CN117316808A publication Critical patent/CN117316808A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention provides a warp correction device capable of improving heating efficiency of a formed substrate and reducing possibility of breakage of the formed substrate. The warp correction device is provided with a housing unit, a heating unit, a cooling unit, and a conveyance mechanism. The accommodating portion accommodates the molded substrate. The heating unit heats the molded substrate. The cooling unit cools the molded substrate while pressurizing the molded substrate. The conveying mechanism conveys the formed substrate supplied from the accommodating part to the heating part, and conveys the formed substrate heated by the heating part to the cooling part. The heating section heats the molded substrate in a state where the molded substrate is disposed in an internal space formed in the heating section.

Description

Warp correcting device
Technical Field
The present invention relates to a warp correcting device.
Background
Japanese patent application laid-open No. 2014-192434 (patent document 1) discloses a substrate warp correction device. The substrate warp correcting device includes: a heating member for heating the substrate; and a cooling member for cooling the substrate. In this substrate warp correcting device, the substrate is cooled by the cooling member after being heated by the heating member. When the substrate is warped, the substrate is heated to plastically deform the substrate flatly. Thereafter, the substrate is cooled to correct warpage of the substrate (see patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2014-192434
Disclosure of Invention
In the first technique disclosed in patent document 1, a substrate is heated in a state where the substrate is placed on an open heating stage. However, the heating stage is open, and thus the heating efficiency of the substrate is not necessarily high.
In the second technique disclosed in patent document 1, the substrate is heated in a state in which the substrate is placed on an open heating stage and the upper surface of the substrate is pressed by a substrate pressing member. However, when the upper surface of the substrate is pressed in a state where the substrate is not sufficiently heated, the substrate may be broken.
The present invention has been made to solve such a problem, and an object of the present invention is to provide a warp correction device capable of improving heating efficiency of a molded substrate and reducing the possibility of breakage of the molded substrate.
The warp correcting device of the present invention comprises a housing part, a heating part, a cooling part and a conveying mechanism. The accommodating portion accommodates the molded substrate. The heating unit heats the molded substrate. The cooling unit cools the molded substrate while pressurizing the molded substrate. The conveying mechanism conveys the formed substrate supplied from the accommodating part to the heating part, and conveys the formed substrate heated by the heating part to the cooling part. The heating section heats the molded substrate in a state where the molded substrate is disposed in an internal space formed in the heating section.
According to the present invention, it is possible to provide a warp correction device capable of improving heating efficiency of a molded substrate and reducing the possibility of breakage of the molded substrate.
Drawings
Fig. 1 is a perspective view schematically showing a warp correcting device according to embodiment 1.
Fig. 2 is a plan view schematically showing a warp correcting device according to embodiment 1.
Fig. 3 is a plan view schematically showing the carry-in side rail portion.
Fig. 4 is a view schematically showing a section IV-IV of fig. 3.
Fig. 5 is a view schematically showing a side surface of the first rail in a case where one first rail is viewed from between a pair of first rails.
Fig. 6 is a plan view schematically showing a lower member of the heating section.
Fig. 7 is a view schematically showing a state of an upper member of the heating section when viewed from below.
Fig. 8 is a view schematically showing a cross section in a state where the lower member and the upper member are closed.
Fig. 9 is a schematic diagram showing a part of a side surface of the second conveyance mechanism when the second conveyance mechanism is viewed from the X-axis direction.
Fig. 10 is a schematic diagram showing a part of a side surface of the second conveyance mechanism in the case where the second conveyance mechanism is viewed from the Y-axis direction.
Fig. 11 is a plan view schematically showing a lower member of the cooling portion.
Fig. 12 is a view schematically showing a part of a cross section in a state where the lower member is overlapped with the upper member.
Fig. 13 is a flowchart showing an operation procedure of the warp correcting device according to embodiment 1.
Fig. 14 is a plan view schematically showing a warp correcting device according to embodiment 2.
Fig. 15 is a view schematically showing an XV-XV cross section in fig. 14.
Fig. 16 is a view schematically showing a state in which the first housing portion is viewed from a position opposite to a position where the pair of rails exist in the X-axis direction.
Fig. 17 is a view schematically showing a state of the push rod or the like as viewed in the X-axis direction.
Fig. 18 is a view schematically showing a section XVIII-XVIII of fig. 15.
Fig. 19 is a view schematically showing a state in which a molded substrate is disposed in an internal space formed by a lower member and an upper member.
FIG. 20 is a view schematically showing a section XX-XX of FIG. 15.
Fig. 21 is a flowchart showing an operation procedure of the warp correcting device according to embodiment 2.
Fig. 22 is a diagram schematically showing a first other example of the layout.
Fig. 23 is a diagram schematically showing a second other example of the layout.
Fig. 24 is a plan view schematically showing another example of the warp correcting device.
Description of the reference numerals
10. 10A, 10B, 10C, 10D: a warp correcting device; 100. 100C: a housing part; 100A1, 100B1: a first housing part; 100A2, 100B2: a second accommodating portion; 110. 110A, 120A: a hopper; 150: a motor; 160: a ball screw; 170: a movable stage; 200. 200B: a carry-in side rail portion; 210: a first track; 211: a step portion; 220: a first block; 221: a first guide portion; 230. 810: a holder; 300. 300A, 300B, 300C: a heating section; 310. 310A, 410A: a lower member; 311. 321: a heater; 312. 412: a claw entrance portion; 315: a cylinder; 320. 320A, 420A: an upper member; 400. 400A, 400B, 400C: a cooling unit; 413: a pin; 415: an electric actuator; 500. 500B: a carry-out side rail portion; 600: a conveying mechanism; 610. 610C: a first conveying mechanism; 611. 631: an adsorption unit; 620. 620C: a second conveying mechanism; 621: a base; 622: a claw; 623: a pressing plate; 624: a pushing mechanism; 625: a holding unit; 626: a claw portion; 630. 630C: a third conveying mechanism; 700. 700A: a control unit; 800: a track; 820: a push rod; 830A, 830B: a drive belt; 840: a linear guide; 850: a base portion; 900: a common rail; 1000: a heating table; c1: a concave portion; s1: a formed substrate; t1: a tapered portion; v1, VA1: an inner space.
Detailed Description
Hereinafter, an embodiment of one side of the present invention (hereinafter, also referred to as "the present embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated. In each of the drawings, the object is schematically and appropriately omitted or exaggerated for easier understanding.
[ 1] embodiment 1]
<1-1. Structure >
(1-1-1. Integral Structure of warp correction device)
Fig. 1 is a perspective view schematically showing a warp correcting device 10 according to embodiment 1. Fig. 2 is a plan view schematically showing the warp correcting device 10. In each of the drawings described in the present specification, the X-axis and the Y-axis each represent a common direction.
Referring to fig. 1 and 2, the warp correcting device 10 is configured to correct warp of the molded substrate S1. The molded substrate S1 is, for example, resin-sealed with a semiconductor chip fixed to a metal frame. In such a molded substrate S1, warpage may occur, for example, due to the heat shrinkage rate of the metal frame being different from that of the resin.
Examples of the molded substrate S1 include a substrate to which a semiconductor chip is fixed, a substrate in which a lead frame is resin-sealed, and a substrate in which a capacitor, a resistor, and the like are resin-sealed. Examples of the molded substrate S1 include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package: chip size package) package substrate, an LED (Light Emitting Diode: light emitting diode) package substrate, and a QFN (Quad Flat No-lead) package substrate.
The warp correcting device 10 includes a housing portion 100, a carry-in side rail portion 200, a heating portion 300, a cooling portion 400, a carry-out side rail portion 500, a carrying mechanism 600, and a control portion 700. The conveyance mechanism 600 includes a first conveyance mechanism 610, a second conveyance mechanism 620, and a third conveyance mechanism 630. In addition, embodiment 1 adopts the following structure: the processes of the plurality of (specifically, two) molded substrates S1 are performed at a time in each of the heating unit 300 and the cooling unit 400, but the following structures may be adopted: the heating unit 300 and the cooling unit 400 perform processing of one formed substrate S1 or three or more formed substrates S1 at a time. In fig. 1, the conveyance mechanism 600 and the control unit 700 are omitted.
The housing portion 100 includes, for example, hoppers (magazine) 110, 120. The hoppers 110 and 120 each house a plurality of molded substrates S1. The hopper 110 accommodates the molded substrate S1 before warp correction, and the hopper 120 accommodates the molded substrate S1 after warp correction. The molded substrate S1 stored in the hopper 110 is supplied to the carry-in side rail portion 200. At the point of time when the resin sealing surface is supplied to the carry-in side rail portion 200, for example, the molded substrate S1 faces downward. In addition, at this point of time, the resin sealing surface of the molded substrate S1 may be faced upward.
The molded substrate S1 supplied to the carry-in side rail portion 200 is transferred from the carry-in side rail portion 200 to the heating portion 300 by the first transfer mechanism 610. The first conveying mechanism 610 includes, for example, a plurality of (e.g., two) suction portions 611. Each suction portion 611 holds one molded substrate S1 by sucking the molded substrate S1. The first conveying mechanism 610 sequentially adsorbs the molded substrates S1 sequentially supplied to the carry-in side rail portion 200, for example, to hold a plurality of molded substrates S1.
The heating part 300 includes a lower member 310 and an upper member 320. The lower member 310 and the upper member 320 each include a heater. The lower member 310 and the upper member 320 are opposite to each other in the up-down direction. A plurality of (e.g., two) shaped substrates S1 are disposed on the lower member 310. The lower member 310 is configured to be capable of being raised and lowered. As the lower member 310 rises, a portion of the upper surface of the lower member 310 (specifically, the outer peripheral upper surface) comes into contact with the lower surface of the upper member 320 and the lower member 310 overlaps with the upper member 320. As will be described in detail later, the lower member 310 and the upper member 320 are overlapped in this way, so that an internal space to be described later is formed in the heating portion 300. The molded substrate S1 is heated by the heating unit 300 while being disposed in the internal space of the heating unit 300. In addition, when the molded substrate S1 is heated, the molded substrate S1 does not contact the upper member 320 except for the case where excessive warpage occurs, and the like, and is not pressurized by the upper member 320. By this heating, the resin portion of the molded substrate S1 is softened.
The heated formed substrate S1 is transported from the heating section 300 to the cooling section 400 by the second transport mechanism 620. As will be described in detail later, the second conveying mechanism 620 does not adsorb the formed substrate S1, but mechanically holds the formed substrate S1. This is because no adsorption mark that may be generated by adsorbing and holding the resin portion of the heated and softened formed substrate S1 remains.
The cooling part 400 includes a lower member 410 and an upper member 420. The lower member 410 and the upper member 420 each include a portion of a tubular flow path (not shown) through which a low-temperature heat medium supplied from a cooler is circulated. The lower member 410 and the upper member 420 are opposite to each other in the up-down direction. A plurality of (e.g., two) shaped substrates S1 are disposed on the lower member 410. The lower member 410 is configured to be raised and lowered. As the lower member 410 is raised, the upper surface of the molded substrate S1 disposed on the lower member 410 contacts the lower surface of the upper member 420, and the lower member 410 and the upper member 420 overlap each other with the molded substrate S1 interposed therebetween. The molded substrate S1 is pressurized by the lower member 410 and the upper member 420 in a state where the lower member 410 and the upper member 420 are overlapped in this way. The molded substrate S1 is cooled by the cooling unit 400 while being pressurized by the lower member 410 and the upper member 420. Thereby, the warp of the molded substrate S1 is corrected.
The formed substrate S1 cooled by the cooling unit 400 is conveyed from the cooling unit 400 to the carry-out side rail 500 by the third conveying mechanism 630. The third conveyance mechanism 630 includes, for example, a plurality of (e.g., two) suction units 631. Each suction portion 631 suctions the molded substrate S1 to hold the molded substrate S1. The third conveying mechanism 630 holds a plurality of molded substrates S1 by sequentially adsorbing the molded substrates S1 disposed on the lower member 410 of the cooling unit 400, for example. The molded substrate S1 conveyed to the carry-out side rail 500 is carried out to the hopper 120. Thus, the molded substrate S1 with the warp corrected is completed.
The control unit 700 includes a CPU (Central Processing Unit: central processing unit), a RAM (Random Access Memory: random access Memory), a ROM (Read Only Memory), and the like. The control unit 700 is configured to control each component in the warp correction device 10 based on information processing. The structure of each part included in the warp correcting device 10 will be described in detail below.
(1-1-2. Structure of carry-in side Rail portion)
Fig. 3 is a plan view schematically showing the carry-in side rail portion 200. As shown in fig. 3, the carry-in side rail portion 200 includes a pair of first rails 210 and grippers 230. A first block 220 is provided at an end of the first rail 210 on the hopper 110 side. The gripper 230 is movable in the X-axis direction. The gripper 230 holds the formed substrate S1 supplied from the hopper 110 and pulls out the formed substrate S1 in the X-axis direction. Thus, the shaped substrate S1 passes through the pair of first blocks 220 and is disposed on the pair of first rails 210.
Fig. 4 is a view schematically showing a section IV-IV of fig. 3. As shown in fig. 4, a step 211 extending in the X-axis direction is formed in each of the first rails 210. The shaped substrate S1 led out from the holder 230 is supported from below by the step 211.
Fig. 5 is a diagram schematically showing a side surface of the first rail 210 in a case where one first rail 210 is viewed from between a pair of first rails 210. Referring to fig. 5, as described above, the first block 220 is provided at the hopper 110-side end of the first rail 210. The first block 220 is formed with a first guide 221. The first guide 221 is configured as a groove extending in the X direction, for example, and is configured such that both end portions of the molded substrate S1 can be inserted into the groove.
A tapered portion T1 is formed at an end of the first guide 221 on the hopper 110 side. The tapered portion T1 has a shape in which the interval between the grooves in the up-down direction becomes narrower as the distance from the hopper 110 increases. The formed substrate S1 passes through the first block 220 of the first rail 210 from the hopper 110 and is supplied to the first rail 210, and thus it can also be said that the tapered portion T1 has a shape in which the intervals of the grooves in the up-down direction become narrower toward the direction in which the formed substrate S1 is supplied. The tapered portion T1 may be formed so as to have a shape in which the interval in the vertical direction is narrower as the direction of conveyance of the formed substrate S1 is forward.
Since the tapered portion T1 is formed at the end portion of the first guide portion 221 on the hopper 110 side, the molded substrate S1 is appropriately guided to the step portion 211 even if the molded substrate S1 is warped, for example. That is, according to the warp correcting device 10, since at least a part of the first guide portion 221 has the tapered portion T1 having the interval in the up-down direction narrower as it is farther from the housing portion 100, even if the formed substrate S1 is warped, the formed substrate S1 can be supplied from the housing portion 100 to the carry-in side rail portion 200 relatively smoothly.
(1-1-3. Structure of heating portion)
Fig. 6 is a plan view schematically showing the lower member 310 of the heating section 300. As shown in fig. 6, the lower member 310 has a rectangular shape in a plan view. The lower member 310 is made of metal, for example.
A plurality of (two) recesses C1 aligned in the Y-axis direction are formed in the lower member 310. The shape of each concave portion C1 in a plan view is not particularly limited as long as it is a shape capable of accommodating the molded substrate S1, and is, for example, rectangular. The bottom surface of each concave portion C1 is a flat surface. The formed substrate S1 conveyed by the first conveying mechanism 610 (fig. 2) is disposed in the concave portion C1. A planar heater 311 having substantially the same size as the molded substrate S1 in plan view is fitted to the lower member 310 at a position corresponding to each concave portion C1 in plan view. The lower member 310 is heated by each heater 311. The shape of the heater fitted into the lower member 310 is not necessarily planar, and may be, for example, a tubular shape as long as the heater can heat the entire area of the molded substrate S1 substantially uniformly, as will be described later. In the lower member 310, the number, size, and fitting position of the heaters 311 are not limited to this. For example, one heater 311 may be embedded in one surface of the lower member 310. The lower member 310 is provided with a plurality of claw entering portions 312 at the outer peripheral edge of the position where the molded substrate S1 is arranged in a plan view. Each of the claw entering portions 312 is a concave portion. The claws 622 provided in the second conveying mechanism 620 can enter the respective claw entrance portions 312.
Fig. 7 is a view schematically showing a state of the upper member 320 of the heating unit 300 when viewed from below. As shown in fig. 7, the upper member 320 has a flat plate shape and a rectangular shape in a plan view. The upper member 320 is made of metal, for example. The upper member 320 functions as a cover for closing each concave portion C1 of the lower member 310, for example.
A plurality of (two) planar heaters 321 having substantially the same size as the molded substrate S1 in a plan view are embedded in the upper member 320 in a state of being aligned in the Y-axis direction. The upper member 320 is heated by each heater 321. The position of the heater 321 in the upper member 320 at least partially overlaps the position of the heater 311 in the lower member 310 in a plan view. The shape of the heater fitted into the upper member 320 is not necessarily planar, and may be, for example, a tubular shape as long as the heater can heat the entire area of the molded substrate S1 substantially uniformly, as will be described later. In the upper member 320, the number, size, and fitting position of the heaters 321 are not limited to this. For example, one heater 321 may be embedded in one surface of the upper member 320.
Fig. 8 is a view schematically showing a cross section in a state where the lower member 310 and the upper member 320 are closed. As shown in fig. 8, a plurality of (two) rectangular parallelepiped-shaped internal spaces V1 are formed in the heating portion 300 by closing the respective concave portions C1 of the lower member 310 by the upper member 320. Each internal space V1 is, for example, a closed space. Here, the closed space means a closed space. The internal space V1 does not necessarily need to be a closed space. The internal space V1 may be, for example, a space surrounded by a recess capable of accommodating the molded substrate S1 and a cover part covering at least a part of the recess.
The molded substrate S1 is disposed in each of the plurality of internal spaces V1, V1. The height H1 of each internal space V1 is longer than the thickness of the molded substrate S1 in a warp-free state, for example. Thus, in a state where the lower member 310 and the upper member 320 are closed, unnecessary force is not applied to the formed substrate S1.
In a state where the lower member 310 and the upper member 320 are closed, the heaters 321, 311 are located above and below the internal space V1, respectively. The internal space V1 is heated by the heaters 321 and 311. The formed substrate S1 disposed in the internal space V1 is heated by the heaters 321 and 311. The time for heating the formed substrate S1 in the internal space V1 is, for example, a time required for the temperature of the internal space V1 to be stable and for the entire region of the formed substrate S1 to be heated substantially uniformly. In addition, the lower member 310 and the upper member 320 are closed to maintain the temperature of the internal space V1 at a timing other than when the molded substrate S1 is carried into the heating unit 300 and when the molded substrate S1 is carried out from the heating unit 300.
In the warp correction device 10, the molded substrate S1 is heated in a state of being placed in the internal space V1 of the heating unit 300. Thus, according to the warp correcting device 10, for example, the heating efficiency of the molded substrate S1 can be improved as compared with a case where the upper side of the heating portion 300 is entirely opened. In addition, according to the warp correcting device 10, when the molded substrate S1 is heated, unnecessary force is not applied to the molded substrate S1, and therefore the possibility of breakage of the molded substrate S1 can be reduced.
In the warp correcting device 10, the inner space V1 is formed in a state where the lower member 310 and the upper member 320 are closed. Thus, according to the warp correcting device 10, by releasing the state in which the lower member 310 and the upper member 320 are closed, it is possible to easily perform the arrangement of the formed substrate S1 in the internal space V1 and the removal of the formed substrate S1 from the internal space V1, respectively.
Further, according to the warp correcting device 10, since the molded substrate S1 is disposed in the concave portion C1, for example, when the lower member 310 and the upper member 320 are overlapped with each other by raising the lower member 310, it is possible to reduce the possibility that the molded substrate S1 is displaced in the horizontal direction when the lower member 310 is raised and lowered.
(1-1-4. Structure of second conveying mechanism)
Fig. 9 is a schematic diagram showing a part of a side surface of the second conveying mechanism 620 when the second conveying mechanism 620 is viewed from the X-axis direction. Fig. 10 is a schematic diagram showing a part of a side surface of the second conveying mechanism 620 when the second conveying mechanism 620 is viewed from the Y-axis direction.
As shown in fig. 9 and 10, the second conveying mechanism 620 includes a plurality of (two) holding units 625 arranged in the Y-axis direction. Each holding unit 625 is configured to hold the molded substrate S1.
Each holding unit 625 includes a pair of claw portions 626, a pressing plate 623, and a plurality of (two) pressing mechanisms 624. In each holding unit 625, the pressing plate 623 and the plurality of pressing mechanisms 624 are located between the pair of claw portions 626 in the Y-axis direction.
Each claw 626 is movable in the Y-axis direction. Each claw portion 626 includes a base 621 and a plurality (three) of claws 622. The base 621 is a metal rod-like member, for example, and extends in the X-axis direction. A plurality of claws 622 are provided at the base 621 at equal intervals from each other. Each of the plurality of claws 622 is made of metal, for example, and extends downward from the base 621. The lower end of each claw 622 is bent toward the platen 623 side. The bent portion of the lower end of each claw 622 supports the lower surface of the formed substrate S1.
The pressing plate 623 has a rectangular shape in plan view. The pressing plate 623 is made of an elastic member such as rubber or metal, for example. The pressing plate 623 presses the upper surface of the formed substrate S1 from above to below, for example. The upper surface of the pressing plate 623 is directly or indirectly coupled to the pressing mechanism 624. The pressing mechanism 624 includes an elastic body such as a spring, for example, and presses the pressing plate 623 from above to below.
When holding the molded substrate S1 disposed on the lower member 310 of the heating unit 300, each holding unit 625 enters the recess C1 formed in the lower member 310. The second conveying mechanism 620 descends, and the lower surface of the pressing plate 623 contacts the upper surface of the formed substrate S1. Before the second conveying mechanism 620 descends, the pair of claw portions 626 move in the direction away from each other. When each claw 622 enters the claw entrance portion 312 and the second conveying mechanism 620 is further lowered, the pressing mechanism 624 contracts, the pressing plate 623 contacts and lightly presses the upper surface of the formed substrate S1, and the position of each claw 626 is relatively lowered. Thereafter, the pair of claw portions 626 moves in the direction of approaching each other within the claw entrance portion 312. Thus, the bent portions at the lower ends of the claws 622 are brought into positions partially opposed to the lower surface of the molded substrate S1. Thereafter, the second conveying mechanism 620 is lifted, and the lower surfaces of the molded substrates S1 are supported by the bent portions of the lower ends of the claws 622 while the upper surfaces of the molded substrates S1 are pressed by the holding platen 623. Thus, each of the molded substrates S1 is stably held by each of the holding units 625.
(1-1-5. Structure of Cooling part)
Fig. 11 is a plan view schematically showing the lower member 410 of the cooling portion 400. As shown in fig. 11, the lower member 410 has a rectangular shape in a plan view, similar to the lower member 310 of the heating section. The upper surface of the lower member 410 is planar. At the upper surface of the lower member 410, positioning pins 413 may be provided so as to protrude at a plurality of positions near the outer periphery of the position where the formed substrate S1 is arranged. An elastic member is provided at the base of the pin 413, and the elastic member is compressed by the upper member 420 in a state where the molded substrate S1 is sandwiched between the lower member 410 and the upper member 420, as described later. The lower member 410 is made of metal, for example.
A single tubular flow path (not shown) for circulating a low-temperature heat medium (e.g., water) from the cooler is formed in one surface of the lower member 410. The lower member 410 is cooled by passing the low-temperature heat medium sent from the cooler through the tubular flow path. The shape and position of the tubular flow path formed inside the lower member 410 are not particularly limited, as long as the entire lower member 410 can be cooled.
The lower member 410 is provided with a plurality of claw entry portions 412 around a position where the molded substrate S1 is arranged in a plan view. Each of the claw entrance portions 412 is a concave portion. The claws 622 of the second conveying mechanism 620 can enter the respective claw entrance portions 412.
In order to place the formed substrate S1 on the upper surface of the lower member 410, the second conveying mechanism 620 is lowered in a state where the formed substrate S1 is held by each holding unit 625. The second conveying mechanism 620 descends, and the lower surface of the formed substrate S1 contacts the upper surface of the lower member 410. When the second conveying mechanism 620 further descends, the pressing mechanism 624 contracts, the pressing plate 623 presses the upper surface of the formed substrate S1, and the position of each claw 626 relatively descends, and each claw 622 enters the claw entrance 412. After that, the pair of claw portions 626 moves in the direction away from each other. Thereby, each claw 626 moves to a position where the bent portion of the lower end of each claw 622 does not face the lower surface of the formed substrate S1. Thereafter, as the second conveying mechanism 620 is lifted, the formed substrate S1 is placed on the lower member 410.
The upper member 420 has a rectangular shape in a plan view, similar to the upper member 320 of the heating unit 300. The lower surface of the upper member 420 is planar. The upper member 420 is made of metal, for example.
One groove (not shown) for circulating a low-temperature heat medium (e.g., water) from the cooler is formed in one surface of the upper member 420. The upper member 420 is cooled by passing a low-temperature heat medium sent from the cooler through the tank. The shape and position of the groove formed in the lower member 410 are not particularly limited, as long as the entire lower member 410 can be cooled.
Fig. 12 is a diagram schematically showing a part of a cross section in a state where the lower member 410 and the upper member 420 are overlapped. As shown in fig. 12, each of the molded substrates S1 is cooled while being sandwiched between the lower member 410 and the upper member 420. That is, each of the formed substrates S1 is cooled while being pressurized by the lower member 410 and the upper member 420. The warp of the formed substrate S1 is corrected by cooling in a state of being sandwiched by the upper surface (plane) of the lower member 410 and the lower surface (plane) of the upper member 420.
In addition, the warp correcting device 10 has the following functions: in a state where the molded substrate S1 is disposed on the upper surface of the lower member 410, the second conveying mechanism 620 presses the molded substrate S1 from above, thereby cooling the molded substrate S1. For example, in the case where this function is enabled, the following actions may not be executed: the formed substrate S1 is cooled by closing the lower member 410 and the upper member 420.
(1-1-6. Structure of carry-out side Rail portion)
Referring again to fig. 1 and 2, the carry-out side rail portion 500 has substantially the same structure as the carry-in side rail portion 200, and includes a pair of second rails (not shown) and second blocks (not shown) provided at the ends of the second rails on the hopper 120 side. The pair of second rails has substantially the same structure as the pair of first rails 210 except for the length in the X-axis direction. As for the second block, description will be made later, the taper formed on the inner side has a difference from the first block 220. The other point of difference between the carry-out side rail portion 500 and the carry-in side rail portion 200 is that the carry-out side rail portion 500 includes a push rod disposed between a pair of second rails, instead of the grippers 230.
The push rod can move along the X-axis direction. The pusher presses the molded substrate S1 conveyed to the carry-out side rail 500 by the third conveying mechanism 630 toward the hopper 120 in the X-axis direction. Thus, the molded substrate S1 moves on the pair of second rails, passes through the pair of second blocks, and is carried out to the hopper 120. For example, a reflective sensor that emits light upward may be provided to the push rod. This makes it possible to detect that the molded substrate S1 having a warp which cannot be pushed by the pusher is left, that is, the warp is large and the molded substrate S1 is placed on the pusher. For example, when such a molded substrate S1 is detected, the warp correcting device 10 may be stopped.
Like the step 211 of the first rail 210 in the carry-in side rail 200, a step extending in the X-axis direction is formed in each of the second rails. The step portion supports the formed substrate S1 conveyed to the carry-out side rail portion 500 by the third conveying mechanism 630 from below.
As described above, the second block is provided at the hopper 120-side end of the second rail. A second guide portion is formed in the second block in the same manner as the first guide portion 221 in the carry-in side rail portion 200 (see fig. 5). The second guide portion is constituted by a groove for sandwiching the molded substrate S1 from above and below, for example, as in the first guide portion 221.
A tapered portion is formed at an end of the second guide portion opposite to the hopper 120. Unlike the tapered portion T1 (see fig. 5) of the first guide portion 221, the tapered portion has a shape in which the interval between the grooves in the up-down direction becomes narrower as the tapered portion approaches the hopper 120. Since the molded substrate S1 passes through the second block from the second rail and is supplied to (accommodated in) the hopper 120, the tapered portion may have a shape in which the interval between the grooves in the up-down direction is narrowed toward the direction in which the molded substrate S1 is supplied. The tapered portion may have a shape in which the interval in the vertical direction is narrower as the tapered portion is oriented forward in the conveying direction of the formed substrate S1.
Since the tapered portion is formed at the end portion of the second guide portion opposite to the hopper 120, for example, even if the heated and cooled formed substrate S1 is slightly warped, the formed substrate S1 can be properly carried out to the hopper 120. That is, according to the warp correcting device 10, since at least a part of the second guide portion has the tapered portion in which the interval in the up-down direction becomes narrower as the second guide portion gets closer to the housing portion 100, even if the warp of the formed substrate S1 is not sufficiently corrected, the formed substrate S1 can be smoothly carried out from the carry-out side rail portion 500 to the housing portion 100.
<1-2 action of warp correction device >
Fig. 13 is a flowchart showing the operation procedure of the warp correcting device 10. The processing shown in this flowchart is executed by the control unit 700, for example. For example, the control unit 700 may execute the processing shown in the flowchart in parallel.
Referring to fig. 13, the control unit 700 controls the storage unit 100 so that the molded substrate S1 stored in the hopper 110 protrudes (step S100). The control unit 700 controls the grippers 230 of the carry-in side rail unit 200 such that the grippers 230 grip the projected molded substrate S1, and the molded substrate S1 is drawn out to a predetermined position of the pair of first rails 210 by the grippers 230 (step S105).
The control unit 700 controls the first conveying mechanism 610 so that the molded substrates S1 drawn out to the predetermined positions of the pair of first rails 210 are sequentially held (step S110). After the first conveying mechanism 610 holds the plurality of (two in embodiment 1) molded substrates S1, the control unit 700 controls the first conveying mechanism 610 so that the held plurality of molded substrates S1 are conveyed to the heating unit 300 (step S115).
The control unit 700 controls the heating unit 300 so that the lower member 310 and the upper member 320 are closed in a state where the molded substrate S1 is disposed in the recess C1 of the lower member 310, and the molded substrate S1 is heated in a state where the molded substrate S1 is disposed in the internal space V1 (step S120). The control unit 700 determines whether or not a predetermined time has elapsed since the heating unit 300 started heating (step S125). As described above, the predetermined time in step S125 is, for example, a time required for the temperature of the internal space V1 to be stable and for the entire region of the formed substrate S1 to be heated substantially uniformly. When it is determined that the predetermined time has not elapsed (step S125: no), the control unit 700 stands by until the predetermined time has elapsed.
On the other hand, when it is determined that the predetermined time has elapsed (yes in step S125), the control unit 700 controls the heating unit 300 so that the lower member 310 is lowered and the closed state of the lower member 310 and the upper member 320 is released (step S130). The control unit 700 controls the second conveying mechanism 620 so that the heated formed substrate S1 is conveyed from the heating unit 300 to the cooling unit 400 (step S135).
The control unit 700 controls the cooling unit 400 so that the lower member 410 and the upper member 420 are closed in a state where the molded substrate S1 is disposed on the upper surface of the lower member 410, and cools the molded substrate S1 in a state where the molded substrate S1 is pressurized (step S140). The control unit 700 determines whether or not a predetermined time has elapsed since the cooling unit 400 started cooling (step S145). The predetermined time in step S145 is, for example, a time required for the resin portion of the softened formed substrate S1 to be cured again. When it is determined that the predetermined time has not elapsed (step S145: no), the control unit 700 stands by until the predetermined time has elapsed.
On the other hand, when it is determined that the predetermined time has elapsed (yes in step S145), the control unit 700 controls the cooling unit 400 so as to lower the lower member 410 and release the closed state of the lower member 410 and the upper member 420 (step S150). The control unit 700 controls the third conveying mechanism 630 so that the cooled formed substrate S1 is conveyed from the cooling unit 400 to the carry-out side rail 500 (step S155). Thereafter, the control unit 700 controls the push rods 530 of the carry-out side rail unit 500 so that the molded substrate S1 is carried out from the carry-out side rail unit 500 to the storage unit 100 (step S160). Thereby, the molded substrate S1 with the warp corrected is completed.
<1-3. Characteristics >
As described above, in the warp correction device 10 of the present embodiment, the molded substrate S1 is heated in a state of being placed in the internal space V1 of the heating unit 300. Thus, according to the warp correcting device 10, for example, the heating efficiency of the molded substrate S1 can be improved as compared with a case where the upper side of the heating portion 300 is entirely opened. In addition, according to the warp correcting device 10, since the force more than necessary is not applied to the formed substrate S1 when the formed substrate S1 is heated, the possibility of breakage of the formed substrate S1 can be reduced.
The warp correcting device 10 is an example of the "warp correcting device" in the present invention. The housing portion 100 is an example of a "housing portion" in the present invention. The heating unit 300 is an example of a "heating unit" in the present invention. The cooling unit 400 is an example of the "cooling unit" in the present invention. The conveyance mechanism 600 is an example of the "conveyance mechanism" in the present invention. The molded substrate S1 is an example of the "molded substrate" in the present invention. The internal space V1 is an example of the "internal space" in the present invention.
The carry-in side rail portion 200 is an example of the "carry-in side rail portion" in the present invention. The carry-out side rail 500 is an example of the "carry-out side rail" in the present invention. The first conveying mechanism 610 is an example of the "first conveying mechanism" in the present invention. The second conveying mechanism 620 is an example of the "second conveying mechanism" in the present invention. The third conveyance mechanism 630 is an example of the "third conveyance mechanism" in the present invention. The first rail 210 and the second rail are examples of "rails" in the present invention, respectively. The first block section 220 and the second block are examples of "blocks" in the present invention, respectively. The first guide 221 and the second guide are examples of "guide" in the present invention, respectively. The claw portion 626 is an example of "claw portion" in the present invention. The platen 623 is an example of a "platen" in the present invention. The lower member 310 is an example of "lower member" in the present invention. The upper member 320 is an example of "upper member" in the present invention.
[ 2] embodiment 2]
In the warp correction device 10 according to embodiment 1, the molded substrate S1 is conveyed by the conveying mechanism 600 (the first conveying mechanism 610, the second conveying mechanism 620, and the third conveying mechanism 630). However, the conveyance of the formed substrate S1 is not necessarily performed by the conveyance mechanism 600. The warp correction device 10A according to embodiment 2 is not provided with the conveying mechanism 600. The warp correcting device 10A will be described in detail below.
<2-1 Structure of warp correction device >
Fig. 14 is a plan view schematically showing a warp correcting device 10A according to embodiment 2.
Fig. 15 is a view schematically showing an XV-XV cross section in fig. 14. Referring to fig. 14 and 15, the warp correcting device 10A includes a first housing portion 100A1, a heating portion 300A, a cooling portion 400A, a second housing portion 100A2, a pair of rails 800, driving belts 830A, 830B, a gripper 810, and a push rod 820.
In the warp correcting device 10A, the first housing portion 100A1 and the second housing portion 100A2 are connected via a pair of rails 800 in the X-axis direction. The first housing portion 100A1 includes a plurality of hoppers 110A, and the second housing portion 100A2 includes a plurality of hoppers 120A. The magazine 110A accommodates the plurality of formed substrates S1 before warp correction, and the magazine 110B accommodates the plurality of formed substrates S1 after warp correction.
Fig. 16 is a diagram schematically showing a state in which the first housing portion 100A1 is viewed from a position opposite to a position where the pair of rails 800 exist in the X-axis direction. As shown in fig. 16, in the first housing portion 100A1, a plurality of hoppers 110A are stacked on the movable table 170. The movable table 170 is coupled to the motor 150 via a ball screw 160. That is, in the first housing portion 100A1, the movable table 170 is moved up and down by driving the motor 150, and the hopper 110A protruding the formed substrate S1 is switched.
Referring again to fig. 14 and 15, the heating portion 300A and the cooling portion 400A are located in regions overlapping with regions sandwiched by the pair of rails 800 in plan view, respectively. The heating unit 300A and the cooling unit 400A are at least partially overlapped with the pair of rails 800 in a plan view. More specifically, the heating unit 300A and the cooling unit 400A are disposed above the path between the pair of rails 800. By adopting such a layout, the occupied space (footprint) of the entire apparatus can be reduced as compared with a case where at least one of the heating portion 300A and the cooling portion 400A is not located in an area overlapping with an area sandwiched by the pair of rails 800.
The distance between the heating unit 300A and the first housing unit 100A1 is shorter than the distance between the cooling unit 400A and the first housing unit 100A 1. The distance between the cooling unit 400A and the second housing unit 100A2 is shorter than the distance between the heating unit 300A and the second housing unit 100A 2.
The clamper 810 and the push rod 820 are respectively configured to be movable in the X-axis direction with the driving of the driving belts 830A, 830B. The gripper 810 can grip the formed substrate S1. The clamper 810 is movable in the X-axis direction within a range from the region between the first housing portion 100A1 and the heating portion 300A to the region between the heating portion 300A and the cooling portion 400A. The push rod 820 is configured to push the molded substrate S1 toward the second housing portion 100 A2. The push rod 820 can move in a range from the region between the first housing portion 100A1 and the heating portion 300A to the region between the cooling portion 400A and the second housing portion 100A 2.
The gripper 810 grips the molded substrate S1 supplied from the first housing portion 100A1, and moves the molded substrate S1 to above the lower member 310A of the heating portion 300A. The push rod 820 moves the heated formed substrate S1 from above the lower member 310A of the heating unit 300A to above the lower member 410A of the cooling unit 400A, and moves the cooled formed substrate S1 out to the second housing unit 100A 2.
Fig. 17 is a diagram schematically showing a state of the push rod 820 and the like as viewed in the X-axis direction. In this figure, the structure of the holder 810 and the like is not illustrated. Referring to fig. 17, for example, the push rod 820 may have the structure shown in the figure. That is, the push rod 820 can also move in the X-axis direction in accordance with the rotation of the drive belt 830B. In addition, a linear guide 840 may be provided at a side of the push rod 820 such that the push rod 820 moves linearly along the X-axis. In addition, the push rod 820 can also be rotated. In addition, the holder 810 can also have the same structure.
Fig. 18 is a view schematically showing a section XVIII-XVIII of fig. 15. As shown in fig. 18, the heating unit 300A includes a flat plate-shaped lower member 310A and a box-shaped upper member 320A opened downward. The lower member 310A and the upper member 320A are disposed in the base portion 850, respectively, and include a planar heater, not shown. The lower member 310A and the upper member 320A are opposed to each other in the up-down direction. The lower member 310A is configured to be connected to a driving source 315 such as a cylinder or an electric actuator, and to be raised and lowered. The formed substrate S1 is lifted by the lower member 310A in a state where the formed substrate S1 is located above the lower member 310A, the formed substrate S1 is disposed above the lower member 310A, the lower member 310A is lifted further to separate the formed substrate S1 from the pair of rails 800, and the formed substrate S1 is disposed in the internal space formed by the lower member 310A and the upper member 320A. In this state, the molded substrate S1 is heated.
Fig. 19 schematically shows a state in which the molded substrate S1 is disposed in the internal space formed by the lower member 310A and the upper member 320A. As shown in fig. 19, the molded substrate S1 is disposed in an internal space VA1 formed by a flat plate-shaped lower member 310A and a box-shaped upper member 320A whose lower part is opened. The shaped substrate S1 is heated in a state where at least a part of its upper surface is not in contact with the lower surface of the upper member 320A, that is, in a state where a space is provided between the upper surface of the shaped substrate S1 and the lower surface of the upper member 320A. Further, the internal space VA1 is not an enclosed space, but is partially communicated with the outside.
FIG. 20 is a view schematically showing a section XX-XX of FIG. 15. As shown in fig. 20, the cooling portion 400A includes a lower member 410A and an upper member 420A. The lower member 410A and the upper member 420A are disposed in the base portion 850, respectively, and include a part of a tubular flow path (not shown) for circulating a low-temperature heat medium supplied from a cooler (not shown). The lower member 410A and the upper member 420A are opposed in the up-down direction. The lower member 410A is configured to be connected to a driving source 415 such as a cylinder or an electric actuator, and to be raised and lowered. The molded substrate S1 is lifted by the lower member 410A in a state where the molded substrate S1 is positioned above the lower member 410A, and the molded substrate S1 is disposed above the lower member 410A, and the lower member 410A is lifted further to separate the molded substrate S1 from the pair of rails 800. Then, by the lower member 410A further rising, the upper surface of the formed substrate S1 disposed on the lower member 410A contacts the lower surface of the upper member 420A, and the lower member 410A and the upper member 420A sandwich the formed substrate S1 therebetween to overlap. That is, the molded substrate S1 is cooled while being pressurized by the lower member 410A and the upper member 420A. Thereby, the warp of the molded substrate S1 is corrected.
Referring again to fig. 15, the control section 700A includes a CPU, a RAM, a ROM, and the like. The control unit 700A is configured to control each component in the warp correction device 10A according to information processing. The operation of the warp correcting device 10A will be described below.
<2-2 action of warp correction device >
Fig. 21 is a flowchart showing an operation procedure of the warp correcting device 10A. The processing shown in this flowchart is executed by the control unit 700A, for example. The control unit 700A may execute the processing shown in the flow chart in parallel, for example.
Referring to fig. 21, the control unit 700A controls the first housing unit 100A1 such that the molded substrate S1 housed in the first housing unit 100A1 protrudes (step S200). The control unit 700A controls the gripper 810 so as to grip the molded substrate S1 supplied from the first housing unit 100A1 and convey the molded substrate S1 to the upper side of the lower member 310A of the heating unit 300A (step S205).
The control unit 700A controls the heating unit 300A such that the lower member 310A is raised and the lower member 310A and the upper member 320A are closed to form the internal space VA1, and the molded substrate S1 is heated while the molded substrate S1 is disposed in the internal space VA1 (step S210). The control unit 700A determines whether or not a predetermined time has elapsed since the heating unit 300A started heating (step S215). The predetermined time in step S215 is, for example, a time required for the temperature of the internal space VA1 to be stable and for the entire region of the formed substrate S1 to be heated substantially equally. When it is determined that the predetermined time has not elapsed (step S215: no), the control unit 700A stands by until the predetermined time has elapsed.
On the other hand, when it is determined that the predetermined time has elapsed (yes in step S215), the control unit 700A controls the heating unit 300A so that the lower member 310A is lowered, and the closed state of the lower member 310A and the upper member 320A is released (step S220). The control unit 700A controls the push rod 820 so that the heated formed substrate S1 is conveyed from a position above the lower member 310A of the heating unit 300A to a position above the lower member 410A of the cooling unit 400A (step S225).
The control unit 700A controls the cooling unit 400A so that the lower member 410A is raised in a state where the molded substrate S1 is positioned above the lower member 410A, the lower member 410A and the upper member 420 are closed, and the molded substrate S1 is cooled in a state where the molded substrate S1 is sandwiched between the lower member 410A and the upper member 420 and pressurized (step S230). The control unit 700A determines whether or not a predetermined time has elapsed since the cooling unit 400A started cooling (step S235). The predetermined time in step S235 is, for example, a time required for the resin portion of the softened formed substrate S1 to be cured again. When it is determined that the predetermined time has not elapsed (step S235: no), the control unit 700A stands by until the predetermined time has elapsed.
On the other hand, when it is determined that the predetermined time has elapsed (yes in step S235), the control unit 700A controls the cooling unit 400A so as to lower the lower member 410A, and releases the closed state in which the molded substrate S1 is sandwiched between the lower member 410A and the upper member 420A (step S240). The control unit 700A controls the push rod 820 so that the cooled molded substrate S1 is transported from a position above the lower member 410A of the cooling unit 400A to the second housing unit 100A2 (step S245). Thereby, the molded substrate S1 with the warp corrected is completed.
<2-3. Characteristics >
As described above, in the warp correction device 10A according to embodiment 2, the molded substrate S1 is heated in a state of being placed in the internal space VA1 of the heating unit 300A. Thus, according to the warp correcting device 10A, for example, the heating efficiency of the molded substrate S1 can be improved as compared with a case where the upper side of the heating portion 300A is entirely opened. In addition, according to the warp correcting device 10A, since the force more than necessary is not applied to the formed substrate S1 when the formed substrate S1 is heated, the possibility of breakage of the formed substrate S1 can be reduced.
In the warp correction device 10A according to embodiment 2, the heating portion 300A and the pair of rails 800 partially overlap each other in a plan view, and the cooling portion 400A and the pair of rails 800 partially overlap each other. Therefore, according to the warp correcting device 10A, the space occupied by the entire device can be reduced as compared with a case where at least one of the heating portion 300A and the cooling portion 400A is not partially overlapped with the pair of rails 800 in a plan view.
The warp correcting device 10A is an example of the "warp correcting device" in the present invention. The configuration including the first housing portion 100A1 and the second housing portion 100A2 is an example of "housing portion" in the present invention. The first housing portion 100A1 is an example of a "first housing portion" in the present invention. The second housing portion 100A2 is an example of "a second housing portion" in the present invention. The heating unit 300A is an example of a "heating unit" in the present invention. The cooling unit 400A is an example of the "cooling unit" in the present invention. The structure including the gripper 810 and the push lever 820 is an example of a "conveying mechanism" in the present invention. The molded substrate S1 is an example of the "molded substrate" in the present invention. The internal space VA1 is an example of the "internal space" in the present invention. The lower member 310A is an example of "lower member" in the present invention. The upper member 320A is an example of "upper member" in the present invention.
[3 ] other embodiments ]
The idea of the above embodiment is not limited to the above-described embodiment. An example of another embodiment to which the idea of the above embodiment can be applied will be described below.
<3-1>
In the warp correcting device 10 according to embodiment 1, two functions are provided: a function of cooling the formed substrate S1 by sandwiching the formed substrate S1 by the lower member 410 and the upper member 420, and a function of cooling the formed substrate S1 by sandwiching the formed substrate S1 by the lower member 410 and the second conveying mechanism 620. However, in the warp correcting device 10, two functions are not necessarily provided. Only one of the function of cooling the formed substrate S1 by sandwiching the formed substrate S1 by the lower member 410 and the upper member 420 and the function of cooling the formed substrate S1 by sandwiching the formed substrate S1 by the lower member 410 and the second conveying mechanism 620 may be provided.
<3-2>
In the warp correcting device 10 according to embodiment 1, the concave portion C1 is provided only in the lower member 310 of the heating unit 300. However, the position where the concave portion C1 is provided is not limited thereto. The concave portion C1 may also be provided in the upper member 320 of the heating portion 300. The concave portion C1 may be provided only on the upper member 320 instead of the lower member 310.
<3-3>
In embodiments 1 and 2, the heater is provided in both the upper member and the lower member of the heating unit. However, the heater is not necessarily provided to both the upper member and the lower member of the heating portion. For example, the heater may be provided only in one of the upper member and the lower member of the heating portion. In embodiments 1 and 2, the cooler is provided in both the upper member and the lower member of the cooling unit. However, the cooler is not necessarily provided to both the upper member and the lower member of the cooling portion. For example, the cooler may be provided only in one of the upper member and the lower member of the cooling portion.
<3-4>
In embodiment 1, the layout of each structure is not limited to the warp correcting device 10.
Fig. 22 is a diagram schematically showing a first other example of the layout. Referring to fig. 22, the warp correction device 10B includes a first housing portion 100B1, a carry-in side rail portion 200B, a heating portion 300B, a cooling portion 400B, a carry-out side rail portion 500B, and a second housing portion 100B2 arranged in a straight line. The conveyance mechanism 600B is arranged along the arrangement of the respective structures. In this example, the molded substrate S1 carried in from the first housing portion 100B1 is finally carried out to the second housing portion 100B2. Such a layout may also be employed.
Fig. 23 is a diagram schematically showing a second other example of the layout. Referring to fig. 23, in warp correction device 10C, molded substrate S1 carried in from housing unit 100C passes through common rail 900, heating unit 300C, and cooling unit 400C, passes through common rail 900 again, and returns to original housing unit 100C. The first conveying mechanism 610C conveys the molded substrate S1 from the common rail 900 to the heating unit 300C, the second conveying mechanism 620C conveys the molded substrate S1 from the heating unit 300C to the cooling unit 400C, and the third conveying mechanism 630C conveys the molded substrate S1 from the cooling unit 400C to the common rail 900. Such a layout may also be employed.
<3-5>
In embodiment 1, the platen 623 of the second conveying mechanism 620 may be heated until the molded substrate S1 is held by the holding unit 625. If the platen 623 is heated, the temperature of the formed substrate S1 can be suppressed from decreasing when the formed substrate S1 is conveyed by the second conveying mechanism 620.
Fig. 24 is a plan view schematically showing the warp correcting device 10D. Referring to fig. 24, as in the warp correction device 10D, the heating table 1000 may be provided at a position overlapping the conveyance path of the second conveyance mechanism 620, that is, at a position overlapping the conveyance path of the second conveyance mechanism 620. The heating table 1000 is configured to include a heater, for example, and heat the platen 623. For example, in the case where the holding unit 625 does not hold the molded substrate S1, the second conveying mechanism 620 may be on standby at a position where the platen 623 is heated by the heating stage 1000.
In addition, a heater may be incorporated in the platen 623. This can maintain the temperature of the platen 623 at a high level. As a result, the temperature of the formed substrate S1 can be suppressed from decreasing when the formed substrate S1 is conveyed by the second conveying mechanism 620.
In the above embodiments and other examples, the molded substrate S1 having the warp corrected by the warp correcting device is accommodated in the accommodating portion provided in the warp correcting device. However, the molded substrate S1 whose warpage has been corrected by the warpage correction device is not necessarily accommodated in the accommodating portion provided in the warpage correction device.
The embodiments of the present invention are described above by way of example. That is, the detailed description and the accompanying drawings are disclosed for illustrative purposes. Therefore, the components described in the detailed description and the drawings may include unnecessary components for solving the problem. Therefore, even if these unnecessary components are described in the detailed description and drawings, these unnecessary components should not be directly recognized as necessary.
The above embodiments are merely illustrative of the present invention in all respects. The above-described embodiments can be variously modified and altered within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be adopted appropriately according to the embodiment.
[4. Additional notes ]
In this specification, at least various technical ideas including the following technologies are disclosed.
< technique 1>
(Structure)
A warp correction device is provided with:
a receiving portion for receiving the molded substrate;
a heating unit configured to heat the molded substrate;
a cooling unit configured to cool the molded substrate while pressurizing the molded substrate; and
a conveying mechanism for conveying the formed substrate supplied from the accommodating part to the heating part and conveying the formed substrate heated by the heating part to the cooling part,
the heating unit heats the molded substrate in a state in which the molded substrate is disposed in an internal space formed in the heating unit.
(effects etc.)
In this warp correction device, the molded substrate is heated in a state of being disposed in the internal space of the heating section. Therefore, according to this warp correction device, for example, the heating efficiency of the molded substrate can be improved as compared with a case where the upper part of the heating portion is opened entirely. In addition, according to the warp correcting device, since the molded substrate is not subjected to force more than necessary when the molded substrate is heated, the possibility of breakage of the molded substrate can be reduced.
< technique 2>
(Structure)
The warp correcting device according to claim 1, wherein the internal space is an enclosed space.
(effects etc.)
According to this warp correction device, the internal space of the heating portion is a closed space, and therefore the heating efficiency of the molded substrate can be further improved.
< technique 3>
(Structure)
In the warp correcting device according to the technology 1 or 2, a length of the inner space in a height direction is longer than a length of the molded substrate in a height direction in a state where no warp is generated.
(effects etc.)
According to this warp correction device, since the length in the height direction of the internal space of the heating portion is longer than the thickness of the molded substrate in the state of not being warped, it is possible to suppress the application of a force more than necessary to the molded substrate when the molded substrate is heated.
< technique 4>
(Structure)
The warp correction device according to any one of the techniques 1 to 3, further comprising:
a carry-in side rail portion for disposing the formed substrate supplied from the accommodating portion; and
a carry-out side rail portion for disposing the formed substrate cooled by the cooling portion,
the conveying mechanism includes:
a first conveying mechanism that conveys the formed substrate from the carry-in side rail portion to the heating portion;
A second conveying mechanism for conveying the formed substrate from the heating part to the cooling part; and
and a third conveying mechanism for conveying the formed substrate from the cooling part to the carrying-out side track part.
(effects etc.)
According to the warp correction device, the conveyance mechanism includes the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism, and therefore the molded substrate can be appropriately conveyed from the carry-in side rail portion to the carry-out side rail portion.
< technique 5>
(Structure)
In the warp correcting device described in technology 4,
at least one of the carry-in side rail portion and the carry-out side rail portion includes:
a pair of rails for disposing the molded substrate; and
a block provided at an end portion of each of the pair of rails on the receiving portion side,
the block has a guide portion for holding the formed substrate from above and below,
at least a part of the guide portion has a tapered shape in which the interval in the vertical direction is narrower as the guide portion is directed forward in the conveyance direction of the formed substrate.
(effects etc.)
According to this warp correcting device, at least any of the following effects can be obtained. That is, if the carry-in side rail portion has such a structure, at least a part of the guide portion has a tapered shape in which the interval in the up-down direction becomes narrower as the direction of conveyance of the formed substrate becomes forward, so that the formed substrate can be supplied from the housing portion to the carry-in side rail portion smoothly even if the formed substrate is warped. In addition, if the carry-out side rail portion has such a structure, at least a part of the guide portion has a tapered shape in which the interval in the up-down direction is narrower as it goes forward in the conveying direction of the formed substrate, so that the formed substrate can be carried out from the carry-out side rail portion smoothly even if the warp of the formed substrate is not sufficiently corrected.
< technique 5-1>
(Structure)
In the warp correcting device described in technology 4,
the carry-in side rail portion includes:
a pair of first rails for disposing the molded substrate; and
a first block provided at an end portion of each of the pair of first rails on the receiving portion side,
the first block has a first guide portion for holding the formed substrate from above and below,
at least a part of the first guide portion has a tapered shape in which the interval in the up-down direction becomes narrower as the first guide portion is further away from the accommodating portion.
(effects etc.)
According to this warp correction device, since at least a part of the first guide portion has a tapered shape in which the vertical interval becomes narrower as the distance from the housing portion increases, even if the molded substrate is warped, the molded substrate can be supplied from the housing portion to the carry-in side rail portion more smoothly.
< technique 5-2>
(Structure)
In the warp correcting device described in the technology 4 or the technology 5-1,
the formed substrate arranged on the carrying-out side track portion is carried out to the accommodating portion,
the carry-out side rail portion includes:
a pair of second rails for disposing the molded substrate; and
a second block provided at an end portion of each of the pair of second rails on the receiving portion side,
The second block has a second guide portion for clamping the formed substrate from above and below,
at least a part of the second guide portion has a tapered shape in which the interval in the up-down direction becomes narrower as the second guide portion approaches the accommodating portion.
(effects etc.)
According to this warp correction device, since at least a part of the second guide portion has a tapered shape in which the interval in the vertical direction becomes narrower as the second guide portion gets closer to the housing portion, the molded substrate can be smoothly carried out from the carrying-out side rail portion even if the warp of the molded substrate is not sufficiently corrected.
< technique 6>
(Structure)
In the warp correcting device according to any one of the technologies 4, 5-1 and 5-2,
the second conveying mechanism conveys the formed substrate in a state in which the formed substrate is mechanically held.
(effects etc.)
For example, if the heated formed substrate is held by suction, there is a possibility that suction marks remain on the formed substrate. According to this warp correction device, the heated formed substrate is mechanically held by the second conveying mechanism, so that the possibility of the suction mark remaining on the formed substrate can be reduced.
< technique 7>
(Structure)
In the warp correcting device described in the technology 6,
The second conveying mechanism includes:
a pair of claw parts facing each other in the horizontal direction and supporting the molded substrate from below; and
a pressing plate for pressing the molded substrate from above,
the formed substrate is mechanically held by the pair of claw portions and the pressing plate.
(effects etc.)
According to this warp correction device, the heated formed substrate is mechanically held by the pair of claw portions and the pressing plate, and therefore the heated formed substrate can be stably conveyed.
< technique 8>
(Structure)
In the warp correcting device described in technology 7,
the warp correction device further includes a heating table provided at a position overlapping the conveyance path of the second conveyance mechanism in a plan view, and configured to heat the platen.
(effects etc.)
According to this warp correction device, since the platen is heated by the heating table, it is possible to suppress a temperature drop of the molded substrate after heating when the platen is pressed.
< technique 9>
(Structure)
In the warp correcting device according to any one of the technologies 1 to 8,
the heating section includes:
a lower member having a plane on which the molded substrate is placed; and
an upper member disposed at a position opposed to the lower member,
A recess is formed in at least one of the lower member and the upper member,
the inner space is formed in a state where the lower member is closed with the upper member.
(effects etc.)
In this warp correcting device, the inner space is formed in a state where the lower member and the upper member are closed. Thus, according to the warp correcting device, by releasing the state in which the lower member and the upper member are closed, it is possible to easily dispose the molded substrate in the internal space and take out the molded substrate from the internal space, respectively.
< technique 10>
(Structure)
In the warp correcting device described in the technology 9,
the recess is formed in the lower member,
the molded substrate is disposed in the recess.
(effects etc.)
According to this warp correction device, since the molded substrate is disposed in the concave portion, for example, in a structure in which the lower member and the upper member are overlapped with each other by raising the lower member, it is possible to reduce the possibility that the molded substrate is displaced in the horizontal direction when the lower member is raised and lowered.
< technique 11>
(Structure)
In the warp correcting device of any one of the technologies 1 to 3,
the housing portion includes:
A first housing portion for housing the molded substrate before being heated by the heating portion; and
a second housing portion for housing the molded substrate cooled by the cooling portion,
the warp correcting device further comprises a pair of rails arranged between the first accommodating part and the second accommodating part,
the conveying mechanism conveys the formed substrate arranged on the pair of rails from the first accommodating portion side to the second accommodating portion side,
the heating portion partially overlaps the pair of rails in a plan view, and the cooling portion partially overlaps the pair of rails.
(effects etc.)
In this warp correction device, the heating portion partially overlaps the pair of rails in a plan view, and the cooling portion partially overlaps the pair of rails. Therefore, according to the warp correcting device, the occupied space can be reduced as compared with a case where at least one of the heating portion and the cooling portion is not partially overlapped with the pair of rails in a plan view.
< technique 12>
(Structure)
In the warp correcting device described in technology 11,
the pair of rails each have a straight line shape in a plan view,
at least one of the heating portion and the cooling portion includes:
A lower member having a plane for supporting the molded substrate from below; and
an upper member disposed at a position opposed to the lower member,
the molded substrate is processed while the lower member is lifted and the lower member is brought close to the upper member.
(effects etc.)
According to this warp correction device, the components (for example, the first housing portion, the heating portion, the cooling portion, and the second housing portion) are arranged linearly, so that the molded substrate can be relatively easily conveyed.

Claims (12)

1. A warp correction device is provided with:
a receiving portion for receiving the molded substrate;
a heating unit configured to heat the molded substrate;
a cooling unit configured to cool the molded substrate while pressurizing the molded substrate; and
a conveying mechanism for conveying the formed substrate supplied from the accommodating part to the heating part and conveying the formed substrate heated by the heating part to the cooling part,
the heating unit heats the molded substrate in a state in which the molded substrate is disposed in an internal space formed in the heating unit.
2. The warp correcting device according to claim 1, wherein,
The interior space is a closed space.
3. The warp correcting device according to claim 1 or 2, wherein,
the length of the inner space in the height direction is longer than the length of the formed substrate in the height direction in a state where no warpage is generated.
4. The warp correcting device according to any one of claims 1 to 3, wherein,
the warp correction device further comprises:
a carry-in side rail portion for disposing the formed substrate supplied from the accommodating portion; and
a carry-out side rail portion for disposing the formed substrate cooled by the cooling portion,
the conveying mechanism includes:
a first conveying mechanism that conveys the formed substrate from the carry-in side rail portion to the heating portion;
a second conveying mechanism for conveying the formed substrate from the heating part to the cooling part; and
and a third conveying mechanism for conveying the formed substrate from the cooling part to the carrying-out side track part.
5. The warp correcting device according to claim 4, wherein,
at least one of the carry-in side rail portion and the carry-out side rail portion includes:
a pair of rails for disposing the molded substrate; and
a block provided at an end portion of each of the pair of rails on the receiving portion side,
The block has a guide portion for holding the formed substrate from above and below,
at least a part of the guide portion has a tapered shape in which the interval in the vertical direction is narrower as the guide portion is directed forward in the conveyance direction of the formed substrate.
6. The warp correcting device according to claim 4 or 5, wherein,
the second conveying mechanism conveys the formed substrate in a state in which the formed substrate is mechanically held.
7. The warp correcting device according to claim 6, wherein,
the second conveying mechanism includes:
a pair of claw parts disposed to face each other in a horizontal direction and supporting the molded substrate from below; and
a pressing plate for pressing the molded substrate from above,
the formed substrate is mechanically held by the pair of claw portions and the pressing plate.
8. The warp correcting device according to claim 7, wherein,
the warp correction device further includes a heating table provided at a position overlapping the conveyance path of the second conveyance mechanism in a plan view, and configured to heat the platen.
9. The warp correcting device according to any one of claims 1 to 8, wherein,
the heating section includes:
A lower member having a plane on which the molded substrate is placed; and
an upper member disposed at a position opposed to the lower member,
a recess is formed in at least one of the lower member and the upper member,
the inner space is formed in a state where the lower member is closed with the upper member.
10. The warp correcting device according to claim 9, wherein,
the recess is formed in the lower member,
the molded substrate is disposed in the recess.
11. The warp correcting device according to any one of claims 1 to 3, wherein,
the housing portion includes:
a first housing portion for housing the molded substrate before being heated by the heating portion; and
a second housing portion for housing the molded substrate cooled by the cooling portion,
the warp correcting device further comprises a pair of rails arranged between the first accommodating part and the second accommodating part,
the conveying mechanism conveys the formed substrate arranged on the pair of rails from the first accommodating portion side to the second accommodating portion side,
the heating portion partially overlaps the pair of rails in a plan view, and the cooling portion partially overlaps the pair of rails.
12. The warp correcting device according to claim 11, wherein,
the pair of rails each have a straight line shape in a plan view,
at least one of the heating portion and the cooling portion includes:
a lower member having a plane for supporting the molded substrate from below; and
an upper member disposed at a position opposed to the lower member,
the molded substrate is processed while the lower member is lifted and the lower member is brought close to the upper member.
CN202310653639.9A 2022-06-29 2023-06-02 Warp correcting device Pending CN117316808A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-104453 2022-06-29
JP2022104453A JP7324908B1 (en) 2022-06-29 2022-06-29 Warp correction device

Publications (1)

Publication Number Publication Date
CN117316808A true CN117316808A (en) 2023-12-29

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Application Number Title Priority Date Filing Date
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KR (1) KR20240002689A (en)
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2570583B2 (en) * 1992-07-31 1997-01-08 日本電気株式会社 Method and apparatus for manufacturing resin-encapsulated semiconductor device
JP5551018B2 (en) * 2010-08-24 2014-07-16 住友重機械工業株式会社 Sealing apparatus and sealing method
JP2012104518A (en) * 2010-11-05 2012-05-31 Sumitomo Heavy Ind Ltd Substrate delivery mechanism of sealing device and substrate delivery method of sealing device
JP2014117888A (en) * 2012-12-17 2014-06-30 Sumitomo Heavy Ind Ltd Resin sealing device
JP2014192434A (en) * 2013-03-28 2014-10-06 Seiko Epson Corp Substrate warpage correction device, substrate warpage correction method, marking apparatus and marking method

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TW202401623A (en) 2024-01-01
JP2024004697A (en) 2024-01-17
JP7324908B1 (en) 2023-08-10

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