TW202410212A - Bending correction system and manufacturing system - Google Patents

Abstract

The problem of the present invention is to provide a bend correction system and a manufacturing system including the bend correction system. The bend correction system includes a bend correction device independent from the processing device, and it is easy to transport the formed substrate from the bend correction device to the processing device. A curve correction system according to the solution of the present invention includes a curve correction device and a relay unit. The bend correction device corrects the bend of the first formed substrate and manufactures the second formed substrate. The relay unit is disposed between the external processing device of the bend correction device and the bend correction device. The processing device processes the second formed substrate. The relay unit includes a first transport mechanism that receives the second formed substrate from the bend correction device and transports the second formed substrate to the processing device.

Description

Bending correction system and manufacturing system

The present invention relates to a bend correction system and a manufacturing system.

Japanese Patent Application Publication No. 2014-192434 (Patent Document 1) discloses a marking device. The marking device includes a droplet ejection device and a substrate bend correction device. In this marking device, after the bend of the substrate is corrected by the substrate bend correction device, the substrate is marked by the droplet ejection device (see Patent Document 1).

[Prior technical literature] (patent document) Patent Document 1: Japanese Patent Application Publication No. 2014-192434

(The problem that the invention aims to solve) The bend correction device that corrects the bend of the molded substrate and the processing device that processes the molded substrate whose bend has been corrected may not be integrally formed. In such a case, the molded substrate whose bend has been corrected is transported from the bend correction device to the processing device manually, for example. However, manually transporting the molded substrate is not necessarily efficient. The above-mentioned Patent Document 1 does not disclose a solution to the problem that occurs when the bend correction device is independent from the processing device.

The present invention was made to solve such problems, and its purpose is to provide a bend correction system and a manufacturing system including the bend correction system. The bend correction system includes a bend correction device independent of the processing device, and is easy to mold the substrate. Transported from the bend correction device to the processing device.

(means used to solve problems) A curve correction system according to one aspect of the present invention includes a curve correction device and a relay unit. The bend correction device corrects the bend of the first formed substrate and manufactures the second formed substrate. The relay unit is disposed between the external processing device of the bend correction device and the bend correction device. The processing device processes the second formed substrate. The relay unit includes a first transport mechanism that receives the second formed substrate from the bend correction device and transports the second formed substrate to the processing device.

A manufacturing system according to another aspect of the present invention includes the above-mentioned bend correction system and the above-mentioned processing device. The processing device includes: a containment part and a control part. The accommodating part accommodates the second molded substrate. The second molded substrate transported by the first transport mechanism is accommodated in the accommodating portion. The control unit determines whether the second molded substrate can be received depending on the storage state of the second molded substrate in the storage unit.

(The effect of the invention) According to the present invention, it is possible to provide a bend correction system including a bend correction device independent from a processing device, and a manufacturing system including the bend correction system, in which a molded substrate can be easily transported from the bend correction device to the processing device.

The following is a detailed description of an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") using drawings. In addition, the same symbols are added to the same or corresponding parts in the drawings, and their descriptions are not repeated. In addition, in order to facilitate understanding, each drawing will schematically omit or exaggerate objects appropriately.

[1.Composition] ＜1-1. Manufacturing system configuration＞ FIG. 1 is a front view schematically showing a manufacturing system 1 including a bend correction system 5 according to this embodiment. In addition, in each drawing described in this specification, each of the X axis and the Y axis represents a common direction.

As shown in FIG. 1 , the manufacturing system 1 includes a bend correction system 5 and a cutting device 20 . In the manufacturing system 1, the curvature of the molded substrate is corrected, and a plurality of electronic components are manufactured by cutting the molded substrate with the curvature corrected.

In the molded substrate, a semiconductor wafer fixed to a metal frame is sealed with resin, for example. In such a molded substrate, warping may occur because, for example, the thermal shrinkage rate of the metal frame is different from the thermal shrinkage rate of the resin. In the bend correction system 5, the bend of the formed substrate is corrected. In this specification, the molded substrate before the bend is corrected is also called the "first molded substrate", and the molded substrate after the bend is corrected is called the "second molded substrate".

Examples of molded substrates include a substrate on which a semiconductor wafer is fixed, a substrate on which a lead frame is sealed with resin, and a substrate on which capacitors, resistors, etc. are sealed with resin. Examples of molded substrates include: BGA (Ball Grid Array, ball grid array) packaging substrate, LGA (Land Grid Array, plane grid array) packaging substrate, CSP (Chip Size Package, chip size package) packaging substrate , LED (Light Emitting Diode, light-emitting diode) packaging substrate and QFN (Quad Flat No-leaded, quad flat no-lead) packaging substrate.

The curve correction system 5 includes a curve correction device 10 and a relay unit 30 . The bend correction device 10 is configured to correct the bend of the first molded substrate S1 to produce the second molded substrate S2. The relay unit 30 is fixed to the curve correction device 10 and includes a first conveyance mechanism 300 and a jig 350 . The bend correction device 10 is positioned relative to the cutting device 20 via the jig 350 . The first transport mechanism 300 is configured to receive the second formed substrate S2 from the bend correction device 10 and transport the received second formed substrate S2 to the cutting device 20 .

That is, the bend correction system 5 is configured to correct the bend of the first molded substrate S1 to produce the second molded substrate S2 and transport the second molded substrate S2 to the cutting device 20 . The second molded substrate S2 transported to the cutting device 20 is accommodated in the substrate cassette included in the second accommodating portion 210 of the cutting device 20 . Each of the curve correction device 10 and the relay unit 30 will be described in detail later.

The cutting device 20 is configured to separate the second formed completed substrate S2 into a plurality of electronic components by cutting the second formed completed substrate S2. In the cutting device 20, for example, a rotating blade (not shown) is used to cut the second formed completed substrate S2 placed on a cutting platform (not shown). In this way, a plurality of electronic components (cut products) are manufactured.

It is assumed that the relay portion 30 is not fixed to the curve correction device 10 . In this case, there is no mechanism for conveying the second molded substrate S2 produced by the bend correction device 10 to the cutting device 20 . In this case, the second molded substrate S2 is transported from the bend correction device 10 to the cutting device 20 manually, for example. However, manual transportation of the second molded substrate S2 is not necessarily efficient.

In the bend correction system 5 included in the manufacturing system 1, the first conveying mechanism 300 included in the relay section 30 receives the second formed substrate S2 from the bend correction device 10, and conveys the received second formed substrate S2 to the cutting device 20. Therefore, according to the bend correction system 5, since the second formed substrate S2 is conveyed from the bend correction device 10 to the cutting device 20 by the first conveying mechanism 300, even if the bend correction device 10 is independent of the cutting device 20, the second formed substrate S2 can be easily conveyed to the cutting device 20.

The curve correction device 10 includes a first control device 160 . The first control device 160 includes: a first communication unit 161 and a first control unit 162 .

The first communication unit 161 is configured to communicate with the second communication unit 201 (described later) included in the cutting device 20 via the communication line L1, for example. In addition, the first communication unit 161 does not necessarily need to communicate with the second communication unit 201 through the communication line L1, but may also communicate with the second communication unit 201 through wireless communication. In addition, the information communicated between the first communication unit 161 and the second communication unit 201 may include not only the signals described below, but also at least part of the following: error information in the bend correction device 10 or the cutting device 20, information input to The dimensional information of the object (first molded substrate S1 ) of the bend correction device 10 , the condition information such as heating time and cooling time in the bend correction device 10 , and the cutting object (second molded substrate S1 ) input to the cutting device 20 Dimensional information of the formed substrate S2), processing condition information such as cutting conditions in the cutting device 20, and the like.

The first control unit 162 includes, for example, a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). The first control unit 162 is configured to control the various components in the bending correction device 10 and the relay unit 30 in response to information processing. The first control unit 162 controls the first conveying mechanism 300 based on the information obtained by the first communication unit 161, for example.

The cutting device 20 includes a second control device 200 . The second control device 200 includes a second communication unit 201 and a second control unit 202 .

The second communication unit 201 is configured to communicate with the first communication unit 161 included in the bending correction device 10 via the communication line L1. In addition, the second communication unit 201 does not necessarily have to communicate with the first communication unit 161 via the communication line L1, and can also communicate with the first communication unit 161 via wireless communication.

The second control unit 202 includes, for example, a CPU, RAM, and ROM. The second control unit 202 is configured to control each component in the cutting device 20 in response to information processing. The second control unit 202 , for example, controls the second communication unit 201 to send information to the curve correction device 10 .

In the bending correction system 5, when the conveyance preparation of the second formed substrate S2 to the cutting device 20 is completed, a signal requesting to receive the second formed substrate S2 (hereinafter also referred to as a "receiving request signal") is sent from the first communication unit 161 to the second communication unit 201. When the substrate box contained in the second storage unit 210 has sufficient empty space, a signal indicating that the second formed substrate S2 can be received (hereinafter also referred to as a "receiving signal") is sent from the second communication unit 201 to the first communication unit 161. In response to receiving the receiving signal through the first communication unit 161, the first conveying mechanism 300 conveys the second formed substrate S2 to the cutting device 20.

As described above, in the manufacturing system 1 , the transfer of the second molded substrate S2 from the bend correction device 10 to the cutting device 20 is performed taking into account the empty space in the substrate cassette included in the second accommodating part 210 . Therefore, according to the manufacturing system 1, the second molded substrate S2 can be transported from the bend correction device 10 to the cutting device 20 at an appropriate timing. The transfer operation of the second molded substrate S2 from the bend correction device to the cutting device 20 will be described in detail later.

＜1-2. Composition of the bend correction device＞ FIG. 2 is a perspective view schematically showing the curve correction device 10 according to this embodiment. FIG. 3 is a plan view schematically showing the curvature correction device 10 . Referring to FIGS. 2 and 3 , the bend correction device 10 is configured to correct the bend of the first molded substrate S1 to produce the second molded substrate S2.

The bend correction device 10 includes a first accommodation part 100, a carry-in side rail part 110, a heating part 120, a cooling part 130, a carry-out side rail part 140, and a second conveyance mechanism 150. The second transport mechanism 150 includes transport mechanisms 151, 154, and 157. In addition, in this embodiment, the heating unit 120 and the cooling unit 130 are configured to process a plurality (specifically, two pieces) of the first molded substrates S1 at one time, but the heating unit 120 and the cooling unit 130 may also be used. Each of the unit 120 and the cooling unit 130 is configured to process one first formed substrate S1 or three or more first formed substrates S1 at a time. In addition, in FIG. 2, the second conveyance mechanism 150 is omitted.

The first accommodating part 100 includes, for example, a plurality of substrate cassettes 101 . The substrate cassette 101 accommodates a plurality of first molded substrates S1. The first molded substrate S1 accommodated in the substrate cassette 101 is supplied to the carry-in side rail portion 110 .

The first formed substrate S1 supplied to the loading side rail section 110 is transported from the loading side rail section 110 to the heating section 120 by the transport mechanism 151. The transport mechanism 151, for example, includes a plurality of (for example, two) adsorption sections 152. Each adsorption section 152 holds the first formed substrate S1 by adsorbing one of the first formed substrates S1. The transport mechanism 151 holds a plurality of first formed substrates S1 by, for example, sequentially adsorbing the first formed substrates S1 sequentially supplied to the loading side rail section 110.

The heating unit 120 includes a lower member 121 and an upper member 122 . Each of the lower member 121 and the upper member 122 includes a heater. The lower member 121 and the upper member 122 face each other in the up-down direction. A plurality of (for example, two) first molded substrates S1 are arranged on the lower member 121 . The lower member 121 is configured to rise and fall. As the lower member 121 rises, a part of the upper surface of the lower member 121 (specifically, the outer peripheral upper surface) comes into contact with the lower surface of the lower member 122, and the lower member 121 and the upper member 122 overlap.

FIG. 4 is a diagram schematically showing a cross-section of the lower member 121 and the upper member 122 in a closed state. As shown in FIG. 4 , each recessed portion C1 of the lower member 121 is closed by the upper member 122 , thereby forming a plurality (two) rectangular parallelepiped-shaped internal spaces V1 in the heating unit 120 . Each internal space V1 is, for example, a closed space. Here, the so-called closed space refers to a sealed space. In addition, the internal space V1 does not necessarily need to be a sealed space. The internal space V1 suffices, for example, as long as it is a space surrounded by a recess and a cover. The recess can accommodate the first formed substrate S1 and the cover covers at least a part of the recess.

A first formed substrate S1 is disposed in each of the plurality of internal spaces V1. In addition, in the present embodiment, the first formed substrate S1 is disposed in the internal space V1 in such a manner that the resin portion (the black portion in FIG. 4) is located at the lower side (the substrate portion is located at the upper side), but the first formed substrate S1 may also be disposed in such a manner that the resin portion is located at the upper side (the substrate portion is located at the lower side). The height H1 of each internal space V1 is, for example, longer than the thickness of the first formed substrate S1 in an unbent state. The first formed substrate S1 does not contact the upper component 122, and is not subjected to pressure by the upper component 122, except in the case of excessive bending. Therefore, when the lower component 121 and the upper component 122 are closed, no more force than necessary is applied to the first formed substrate S1.

When the lower member 121 and the upper member 122 are closed, the heaters 124 and 123 are respectively located above and below the internal space V1. The internal space V1 is heated by the heaters 124 and 123. Furthermore, the first molded substrate S1 arranged in the internal space V1 is heated by the heaters 124 and 123 . This heating softens the resin portion of the first molded substrate S1.

The time for heating the first formed substrate S1 in the internal space V1 is, for example, the time required to stabilize the temperature of the internal space V1 and to heat the entire area of the first formed substrate S1 approximately evenly. In addition, in order to keep the internal space V1 warm, the lower component 121 and the upper component 122 are closed except when the first formed substrate S1 is moved into the heating unit 120 and when the first formed substrate S1 is moved out of the heating unit 120.

In the bend correction device 10, the first formed substrate S1 is heated while being arranged in the internal space V1 of the heating unit 120. Therefore, according to the bend correction device 10, the heating efficiency of the first formed substrate S1 can be improved compared with, for example, a case where the upper part of the heating unit 120 is entirely open. In addition, according to the bend correction device 10, since no more force than necessary is applied to the first formed substrate S1 when the first formed substrate S1 is heated, the possibility of damage to the first formed substrate S1 can be reduced.

Furthermore, in the curvature correction device 10, the inner space V1 is formed in a state where the lower member 121 and the upper member 122 are closed. Therefore, according to the bend correction device 10, by releasing the closed state of the lower member 121 and the upper member 122, it is possible to easily arrange the first molded substrate S1 in the internal space V1 and take out the first molded substrate S1 from the internal space V1. Everyone.

Furthermore, according to the bending correction device 10, since the first formed substrate S1 is arranged in the recess C1, for example, when the lower member 121 is raised to overlap the upper member 122, the possibility of positional deviation of the first formed substrate S1 in the horizontal direction when the lower member 121 is raised can be reduced.

Referring again to FIGS. 2 and 3 , the heated first formed substrate S1 is transported from the heating part 120 to the cooling part 130 by the transport mechanism 154 . The transport mechanism 154 does not adsorb the first molded substrate S1 but mechanically holds the first molded substrate S1. This is to avoid leaving adsorption marks that may be caused by adsorbing and holding the resin portion of the first molded substrate S1 that has been heated and softened.

The cooling unit 130 includes a lower member 131 and an upper member 132 . Each of the lower member 131 and the upper member 132 includes a part of a tubular flow path (not shown) in which the low-temperature heat medium supplied from the cooling machine circulates. The lower member 131 and the upper member 132 face each other in the up-down direction. A plurality of (for example, two) first molded substrates S1 are arranged on the lower member 131 . The lower member 131 is configured to rise and fall. As the lower member 131 rises, the upper surface of the first formed substrate S1 disposed on the lower member 131 contacts the lower surface of the upper member 132, and the lower member 131 and the upper member 132 hold the first formed substrate S1 between each other. Occasionally overlap. The first molded substrate S1 is pressed by the lower member 131 and the upper member 132 in a state where the lower member 131 and the upper member 132 are overlapped vertically. The first molded substrate S1 is cooled by the cooling unit 130 while being pressed by the lower member 131 and the upper member 132 . Thereby, the bend of the first molded substrate S1 is corrected, and the second molded substrate S2 is manufactured.

The second formed substrate S2 manufactured by cooling the cooling section 130 is transported from the cooling section 130 to the carry-out side rail section 140 by the transport mechanism 157. The transport mechanism 157 includes, for example, a plurality of (for example, two) adsorption sections 158. Each adsorption section 158 holds the second formed substrate S2 by adsorbing the second formed substrate S2. The transport mechanism 157 holds a plurality of second formed substrates S2 by, for example, sequentially adsorbing the second formed substrates S2 disposed on the lower component 131 of the cooling section 130. The second formed substrate S2 transported to the carry-out side rail section 140 is carried out to the first transport mechanism 300 of the relay section 30.

＜1-3. Structure of relay unit＞ As described above, the relay unit 30 includes the first conveyance mechanism 300 and the jig 350 . First, the structure of the jig 350 will be described, and then the structure of the first conveyance mechanism 300 will be described.

FIG. 5 is a top view schematically showing the jig 350. FIG. 6 is a front view schematically showing the jig 350. FIG. 7 is a view schematically showing the VII-VII section of FIG. 5. As described above, the bending correction device 10 is positioned relative to the cutting device 20 via the jig 350. In addition, in each of FIG. 6 and FIG. 7, the casters of the cutting device 20 or the feet of the supporting device are recorded with dotted lines.

5, 6 and 7, the jig 350 includes a first positioning member 360, a second positioning member 370 and a bearing member 380. Each of the first positioning member 360 and the second positioning member 370 is fixed to the bending correction device 10. On the other hand, the bearing member 380 is fixed to the cutting device 20.

The first positioning member 360 is fixed with a bolt to the lower end of the end on the cutting device 20 side in the X-axis direction and one end in the Y-axis direction (the front of the bend correcting device 10 ) with a bolt. Ends). The first positioning member 360 includes a shaft 361 and an L-shaped member 362 . The shaft 361 is a rod-shaped member extending in the X-axis direction. The L-shaped member 362 includes two surfaces that are orthogonal to each other, and one of the surfaces is fixed to the bend correction device 10 by bolts. The shaft 361 is fixed to the other surface. That is, the shaft 361 is fixed to the curve correction device 10 via the L-shaped member 362 .

The second positioning member 370 is fixed by bolts to the lower end of the end on the cutting device 20 side in the X-axis direction and the other end in the Y-axis direction (the rear end of the bending correction device 10) in the bending correction device 10. The second positioning member 370 includes: a shaft 371, an adjustment bolt 372, and a plate-like member 373. The shaft 371 is a rod-like member extending in the X-axis direction. The adjustment bolt 372 is configured to be mounted on the front end of the shaft 371 and to extend and retract relative to the shaft 371 in the X-axis direction. The plate-like member 373 is fixed to the bending correction device 10 by bolts. The shaft 371 is fixed to the plate-like member 373. That is, each of the shaft 371 and the adjustment bolt 372 is fixed to the bending correction device 10 via the plate member 373 .

The bearing member 380 includes a fixed part 381 and a receiving part 382 . The fixing part 381 has a shape extending in the X-axis direction, and is fixed to the angle tube 220 of the cutting device 20 by bolts. The fixing part 381 has three surfaces respectively facing the upper surface and both sides of the angle tube 220 extending in the X-axis direction. In a state where the three surfaces are respectively facing the upper surface and both sides of the angle tube 220 , the fixing part 381 is fixed to the angle tube 220 by bolts.

The receiving portion 382 is fixed to the lower end of the fixing portion 381. The receiving portion 382 has a shape extending in the X-axis direction. In the receiving portion 382, a recess C2 is formed at the end on the side of the bending correction device 10. The front end of the shaft 361 is fitted into the recess C2. Thereby, the position of the bending correction device 10 relative to the cutting device 20 in each of the X-axis direction and the Y-axis direction is determined.

In addition, by adjusting the expansion and contraction state of the adjustment bolt 372 while the front end of the shaft 361 is fitted into the recessed portion C2, the position in the rotation direction of the bend correction device 10 with the front end of the shaft 361 as the center of rotation is determined. In this way, each of the first positioning member 360 and the second positioning member 370 is not fixed to the cutting device 20 . In this embodiment, the expansion and contraction state of the adjustment bolt 372 is adjusted so that the bend correction device 10 and the cutting device 20 become parallel.

Fig. 8 is a plan view schematically showing the first transport mechanism 300. Fig. 9 is a view schematically showing a cross section taken along line IX-IX of Fig. 8 .

Referring to FIGS. 8 and 9 , the first transport mechanism 300 includes a base plate 305, a pair of intermediate rails 310, a push rod 321, an electric actuator 320, a first sensor 340, and a second sensor 341. The base plate 305 is a plate-shaped member extending in the X-axis direction. Each of the pair of intermediate rails 310, the electric actuator 320, and the first sensor 340 is fixed to the base plate 305.

The pair of relay rails 310 extend in the X-axis direction and are arranged on the extension line of the carrying-out side rail section 140 of the bend correction device 10. The front end of the pair of relay rails 310 on the cutting device 20 side is located near the second receiving section 210 of the cutting device 20. The second formed substrate S2 manufactured in the bend correction device 10 is transported from the carrying-out side rail section 140 to the pair of relay rails 310. The second formed substrate S2 is transported to the substantially central portion of the pair of relay rails 310 in the X-axis direction by, for example, a push rod (not shown) that transports the second formed substrate S2 placed on the carrying-out side rail portion 140 in the X-axis direction.

The push rod 321 is configured to move in the X-axis direction and transport the second molded substrate S2 placed on the relay rail 310 . The push rod 321 is installed on the electric actuator 320.

The electric actuator 320 extends in the X-axis direction, and includes, for example, a ball screw, a motor that drives the ball screw, and a linear guide rail (all not shown). The base of the push rod 321 is fixed to the moving part that moves in the X-axis direction by driving the ball screw. That is, the push rod 321 moves in the X-axis direction as the motor included in the electric actuator 320 is driven. The push rod 321 transports the second formed substrate S2 and stores the second formed substrate S2 into the substrate cassette included in the second accommodating part 210 .

The first sensor 340 is, for example, disposed near the boundary between the carrying-out side rail 140 and the pair of relay rails 310. The first sensor 340 is configured to detect that the second formed substrate S2 has been transferred from the bend correction device 10 to the first transfer mechanism 300. The detection signal from the first sensor 340 is sent to the first control unit 162 of the bend correction device 10.

The second sensor 341 is arranged, for example, near the ends of the pair of relay rails 310 on the cutting device 20 side. The second sensor 341 is configured to detect that the second molded substrate S2 has been transferred from the first transport mechanism 300 to the second accommodating part 210 of the cutting device 20 . The detection signal sent by the second sensor 341 is sent to the first control part 162 of the curve correction device 10 .

In the first conveyance mechanism 300, the upper part is covered by the cover 330. The cover 330 is made of acrylic, for example. In the space surrounded by the base plate 305 and the cover 330, for example, a pair of relay rails 310, a push rod 321, and an electric actuator 320 are arranged. Specifically, with respect to the bend correction device 10 and the cutting device 20 which are arranged parallel to each other by the jig 350 , the relay portion 30 is arranged across the base plate 305 so that the pair of the first conveyance mechanism 300 is centered. The relay rail 310 is connected in parallel with the carry-out side rail portion 140 of the bend correction device 10 and communicates with a position where the second housing portion 210 of the cutting device 20 can be disposed. In this way, the first conveyance mechanism 300 is not fixed to the cutting device 20 .

[2. Action] FIG. 10 is a flowchart showing the transport operation of the second formed substrate S2 from the bend correction device 10 to the cutting device 20 . The processing shown in the flowchart on the left is executed by the first control unit 162 of the bend correction device 10 after the first sensor 340 detects the passage of the second molded substrate S2. The processing shown in the flowchart on the right is executed by the second control unit 202 of the cutting device 20 .

Referring to the flowchart on the left side of FIG. 10 , the first control unit 162 controls the first communication unit 161 to send a reception request signal to the disconnection device 20 (step S100). The first control unit 162 determines whether a reception possible signal is received from the disconnection device 20 via the first communication unit 161 (step S110). If it is determined that the reception possible signal is not received (No in step S110), the first control unit 162 waits until a reception possible signal is received.

On the other hand, if it is determined that the reception possible signal has been received (Yes in step S110), the first control unit 162 controls the electric actuator 320 to start the second forming process that will be placed on the pair of relay rails 310. The completed substrate S2 is transported to the cutting device 20 (step S120). Thereby, the conveyance of the second molded substrate S2 by the push rod 321 is started.

The first control unit 162 determines whether a detection signal is received from the second sensor 341 via the first communication unit 161 (step S130). If it is determined that no detection signal is received from the second sensor 341 (No in step S130), the first control unit 162 waits until a detection signal is received from the second sensor 341.

On the other hand, if it is determined that the detection signal is received from the second sensor 341 (Yes in step S130), the first control unit 162 controls the first communication unit 161 to send a signal indicating that the conveyance of the second formed substrate S2 to the cutting device 20 has been completed (hereinafter also referred to as a "conveying completion signal") to the cutting device 20 (step S140). Thereby, the conveyance of the second formed substrate S2 to the substrate box contained in the second storage unit 210 of the cutting device 20 is completed.

Referring to the flowchart on the right side of FIG. 10 , the second control unit 202 determines whether a reception request signal is received from the bend correction device 10 via the second communication unit 201 (step S200 ). If it is determined that the reception request signal is not received (No in step S200), the second control unit 202 waits until the reception request signal is received.

On the other hand, if it is determined that the receiving request signal has been received (yes in step S200), the second control unit 202 determines whether there is a specified empty space in any of the plurality of substrate boxes contained in the second receiving unit 210 (step S210). In addition, the specified empty space is a predetermined space, which can be a space capable of accommodating one second formed substrate S2, or a space capable of accommodating a plurality of second formed substrates S2.

If it is determined that there is no specified empty space in any substrate box (No in step S210), the second control unit 202 waits until receiving a signal that a specified empty space appears in the substrate box. In the cutting device 20, the processing of taking out the second formed substrate S2 from the second receiving unit 210 and cutting the second formed substrate S2 is performed in parallel with the processing shown in the flowchart. By taking out the second formed substrate S2 from the second receiving unit 210, the empty space of the substrate box contained in the second receiving unit 210 becomes larger.

On the other hand, if it is determined that there is a specified empty space in any one of the plurality of substrate cassettes (yes in step S210), the second control unit 202 controls the second receiving unit 210 so that the substrate cassette with the specified empty space comes to the receiving position of the second formed substrate S2 (step S220). Then, the second control unit 202 controls the second communication unit 201 to send a reception possible signal to the bend correction device 10 (step S230).

The second control unit 202 determines whether the second communication unit 201 has received the transport end signal from the bending correction device 10 (step S240). If it is determined that the transport end signal has not been received (No in step S240), the second control unit 202 waits until the transport end signal is received.

On the other hand, if it is determined that the transfer end signal has been received (YES in step S240), the process shown in this flowchart ends. Thereby, the transportation of the second molded substrate S2 to the substrate cassette contained in the second accommodating part 210 of the cutting device 20 is completed, and the second control unit 202 can recognize that the transportation of the second molded substrate S2 is completed.

In the bend correction system 5, in response to the first sensor 340 detecting the reception of the second formed substrate S2, a reception request signal is sent to the cutting device 20. Therefore, according to the bend correction system 5, since the signal requesting the reception of the second formed substrate S2 is sent to the cutting device 20 before the second formed substrate S2 is conveyed to the cutting device 20, the conveyance of the second formed substrate S2 corresponding to the state of the cutting device 20 can be realized.

Furthermore, in the bend correction system 5 , in response to the first communication unit 161 receiving the reception possible signal from the cutting device 20 , the first transport mechanism 300 transports the second molded substrate S2 to the cutting device 20 . Therefore, according to the bend correction system 5, since the second molded substrate S2 is transferred after receiving the reception enable signal, the second molded substrate S2 can be transferred to the cutting device 20 at an appropriate timing.

In addition, in the bending correction system 5, in response to the second sensor 341 detecting the conveyance of the second formed substrate S2, a conveyance completion signal is sent to the cutting device 20. Therefore, according to the bending correction system 5, the cutting device 20 can recognize that the conveyance of the second formed substrate S2 to the cutting device 20 has been completed.

Furthermore, in the manufacturing system 1 , it is determined whether the cutting device 20 can receive the second molded substrate S2 in response to the storage state of the second molded substrate S2 in the second container 210 (the state of the empty space in the substrate cassette). Substrate S2. Therefore, according to the manufacturing system 1, it can be appropriately determined whether the second molded substrate S2 can be received in the cutting device 20.

[3. Characteristics] As described above, in the bend correction system 5 , the first transport mechanism 300 included in the relay unit 30 receives the second molded substrate S2 from the bend correction device 10 , and transports the received second molded substrate S2 to Cut-off device 20. Therefore, according to the bend correction system 5, since the second molded substrate S2 is transported from the bend correction device 10 to the cutting device 20 by the first transport mechanism 300, even if the bend correction device 10 is independent from the cutting device 20, The second molded substrate S2 can be easily transported to the cutting device 20 .

In addition, the curve correction system 5 is an example of the "curvature correction system" in the present invention. The bend correction device 10 is an example of the "bend correction device" in the present invention, the relay unit 30 is an example of the "relay unit" in the present invention, and the first transport mechanism 300 is the "first transport mechanism" in the present invention. An example of. The first control unit 162 is an example of the "first control unit" in the present invention, and the first communication unit 161 is an example of the "communication unit" in the present invention. The first sensor 340 is an example of the "first sensor" in the present invention, and the second sensor 341 is an example of the "second sensor" in the present invention. The pair of relay rails 310 is an example of the "pair of rails" in the present invention, and the push rod 321 is an example of the "conveying member" in the present invention.

The first storage section 100 is an example of the "first storage section" in the present invention, the heating section 120 is an example of the "heating section" in the present invention, and the cooling section 130 is an example of the "cooling section" in the present invention. The second conveying mechanism 150 is an example of the "second conveying mechanism" in the present invention. The second storage section 210 is an example of the "second storage section" in the present invention. The cutting device 20 is an example of the "processing device" in the present invention. The manufacturing system 1 is an example of the "manufacturing system" in the present invention.

[4. Other implementation forms] The concept of the above implementation forms is not limited to the implementation forms described above. Below, an example of other implementation forms to which the concept of the above implementation forms can be applied is described.

＜4-1＞ In the above embodiment, only one first conveying mechanism 300 is provided between the bend correction device 10 and the cutting device 20 . However, the number of first conveyance mechanisms 300 is not limited to this. For example, a plurality of first conveyance mechanisms 300 may be provided between the bend correction device 10 and the cutting device 20 . For example, a plurality of first transport mechanisms 300 can be arranged so that a plurality of first transport mechanisms 300 are arranged in the Y-axis direction, or a plurality of first transport mechanisms 300 can be arranged so as to be arranged in the height direction. 300. Thereby, a plurality of second molded substrates S2 can be transported in parallel from the bend correction device 20 to the cutting device 20 .

<4-2> In the above-mentioned embodiment, the second formed substrate S2 is transported from the bending correction device 10 to the cutting device 20. However, the transport destination of the second formed substrate S2 is not limited thereto. The second formed substrate S2 can also be transported to, for example, a grinder for grinding the surface of the second formed substrate S2, or a laser marking device for marking the surface of the second formed substrate S2. That is, the transport destination of the second formed substrate S2 can be any processing device that processes the second formed substrate S2.

<4-3> In the above-mentioned embodiment, the bending amount of the second formed substrate S2 transported to the side rail section 140 can also be measured. For example, a measuring unit for measuring the bending degree of the second formed substrate S2 can be set near the side rail section 140 to measure the bending amount of the second formed substrate S2. The measuring unit can be composed of a laser displacement meter, for example. The laser displacement meter can be moved along the long side or short side direction of the second formed substrate S2 to measure the bending amount of the second formed substrate S2. For example, the following configuration may be adopted: when the bending amount of the second formed substrate S2 is below the allowable value, the second formed substrate S2 is transported to the relay section 30, and when the bending amount of the second formed substrate S2 is greater than the allowable value, the second formed substrate S2 is not transported to the relay section 30. For example, the side rail section 140 may extend to the first receiving section 100, and when the bending amount of the second formed substrate S2 is greater than the allowable value, the second formed substrate S2 is received in the substrate box contained in the first receiving section 100.

The above is an illustrative description of the embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for illustrative purposes. Accordingly, the components described in the detailed description and the accompanying drawings may include components that are not essential for solving the problem. Therefore, it should not be immediately determined that these non-essential components are essential just because they are described in the detailed description and the accompanying drawings.

Furthermore, the above-mentioned embodiments are merely examples of the present invention in all aspects. The above-mentioned embodiments can be variously improved or modified within the scope of the present invention. That is, when implementing the present invention, a specific configuration can be appropriately adopted corresponding to the embodiment.

[Additional Note] This manual discloses at least a variety of technical ideas including the following technologies.

<Technique 1> (Construction) A bending correction system comprises: a bending correction device that corrects the bending of a first formed substrate and manufactures a second formed substrate; and a relay section that is arranged between a processing device outside the bending correction device and the bending correction device; wherein, the processing device processes the second formed substrate; the relay section includes: a first conveying mechanism that receives the second formed substrate from the bending correction device and conveys the received second formed substrate to the processing device.

(efficacy, etc.) In this bend correction system, the first conveying mechanism included in the relay unit receives the second formed substrate from the bend correcting device, and conveys the received second formed substrate to the processing device. Therefore, according to this bend correction system, since the second molded substrate is transported from the bend correction device to the processing device by the first transport mechanism, even if the bend correction device is independent from the processing device, the second molded substrate can be easily transported to the processing device.

＜Technology 2＞ (composition) The curve correction system described in Technology 1 further has: The first control part controls the aforementioned first conveying mechanism; and The first communication unit communicates with the aforementioned processing device.

(Effects, etc.) According to the bending correction system, since the second formed substrate is transported from the bending correction device to the processing device by the first transport mechanism when the first control unit and the first communication unit are used, the second formed substrate can be easily transported to the processing device even if the bending correction device is independent of the processing device.

<Technique 3> (Construction) The bending correction system described in Technique 2, wherein, the relay unit further comprises: a first sensor, which detects that the second formed substrate has been received from the bending correction device; the first control unit, in response to the first sensor detecting the reception of the second formed substrate, controls the first communication unit to send a signal to the processing device requesting the reception of the second formed substrate.

(efficacy, etc.) In the bend correction system, in response to the first sensor detecting the reception of the second formed substrate, a signal requesting the reception of the second formed substrate is sent to the processing device. Therefore, according to this bend correction system, since the signal requesting reception of the second molded substrate is sent to the processing device before the second molded substrate is transferred to the processing device, it is possible to realize the second molding according to the state of the processing device. The transfer of the substrate is completed.

＜Technology 4＞ (composition) The curve correction system described in Technology 2 or Technology 3, wherein, The first control unit, in response to the first communication unit receiving a signal indicating that the second formed substrate can be received from the processing device, controls the first transport mechanism to transport the second formed substrate to the processing device. .

(Effects, etc.) In the bending correction system, in response to the first communication unit receiving a signal from the processing device indicating that the second formed substrate can be received, the first conveying mechanism conveys the second formed substrate to the processing device. Therefore, according to the bending correction system, since the second formed substrate is conveyed after receiving the signal indicating that the second formed substrate can be received, the second formed substrate can be conveyed to the processing device at an appropriate time.

＜Technology 5＞ (composition) The curvature correction system according to any one of Technologies 2 to 4, wherein, The relay part further includes: a second sensor that detects that the second formed substrate has been transported to the processing device; The first control unit, in response to the second sensor detecting the transportation of the second molded substrate, controls the first communication unit to send an indication to the processing device that the second molded substrate has been transported to the processing device. The signal of the end.

(Effects, etc.) In the bending correction system, in response to the second sensor detecting the conveyance of the second formed substrate, a signal indicating that the conveyance of the second formed substrate to the processing device has been completed is sent to the processing device. Therefore, according to the bending correction system, the processing device can recognize that the conveyance of the second formed substrate to the processing device has been completed.

<Technique 5-2> (Composition) The bending correction system described in any one of Techniques 1 to 5, wherein, the aforementioned first conveying mechanism comprises: a pair of rails on which the aforementioned second formed substrate is placed; and a conveying member that conveys the aforementioned second formed substrate placed on the aforementioned pair of rails.

(Effects, etc.) In the bending correction system, the second formed substrate received from the bending correction device is placed on a pair of rails, and the conveying member conveys the second formed substrate placed on the pair of rails to the processing device. Therefore, according to the bending correction system, since the second formed substrate is conveyed from the bending correction device to the processing device by the first conveying mechanism, even if the bending correction device is independent of the processing device, the second formed substrate can be easily conveyed to the processing device.

＜Technology 6＞ (composition) The curvature correction system according to any one of Technologies 1 to 5, wherein, The aforementioned bend correction device has: A first receiving part that receives the aforementioned first formed substrate; a heating part that heats the first formed substrate; a cooling unit that cools the first formed substrate while pressurizing the first formed substrate; and a second transport mechanism that transports the first formed substrate supplied from the first accommodating section to the heating section, and transports the first formed substrate heated by the heating section to the cooling section; and , The heating unit heats the first molded substrate in a state where the first molded substrate is disposed in the internal space formed in the heating unit.

(efficacy, etc.) In the bend correction device included in this bend correction system, the first molded substrate is heated while being arranged in the internal space of the heating unit. Therefore, according to this bend correction system, the heating efficiency of the first molded substrate can be improved compared to, for example, a case where the upper part of the heating portion is entirely open. Furthermore, according to this bend correction system, no force greater than necessary is applied to the first molded substrate when heating the first molded substrate, so the possibility of damage to the first molded substrate can be reduced.

＜Technology 7＞ (composition) The bend correction system described in Technology 6, wherein, The height direction length of the internal space is longer than the height direction length of the first molded substrate in an unbent state.

(Effects, etc.) According to the bending correction system, since the length of the internal space of the heating unit in the height direction is longer than the length of the first formed substrate in the non-bent state in the height direction, it is possible to prevent the first formed substrate from being subjected to a force greater than necessary when the first formed substrate is heated.

<Technique 8> (Composition) The bending correction system described in any one of Techniques 1 to 7, wherein, the aforementioned processing device includes: a second receiving portion, which receives the aforementioned second formed substrate; the aforementioned second formed substrate transported by the aforementioned first transport mechanism is received in the aforementioned second receiving portion.

(efficacy, etc.) In this bend correction system, the second molded substrate transported by the first transport mechanism is accommodated in the second accommodating portion. Therefore, according to this bend correction system, since the second molded substrate is transported from the bend correction device to the processing device by the first transport mechanism, and the second molded substrate is accommodated in the second accommodating portion, even if the bend correction device automatically Even if the processing device is independent, the second molded substrate can be easily accommodated in the second accommodation portion.

＜Technology 9＞ (composition) A manufacturing system that has: The curve correction system described in Technology 8; and The aforementioned processing device; and, The processing device further includes a second control unit that determines whether the second molded substrate can be received in response to the storage state of the second molded substrate in the second accommodating part.

(Effects, etc.) In the manufacturing system, it is determined whether the second formed substrate can be received by the processing device according to the storage state of the second formed substrate in the second storage unit. Therefore, according to the manufacturing system, it is possible to appropriately determine whether the second formed substrate can be received in the processing device.

＜Technology 10＞ (composition) The manufacturing system described in Technology 9, wherein, The aforementioned processing device further includes: a second communication unit that communicates with the aforementioned bend correction system; and, When it is determined that the second formed substrate can be received, the second control unit controls the second communication unit to send a signal indicating that the second formed substrate can be received to the bend correction system.

(efficacy, etc.) In this manufacturing system, when it is determined that the second molded substrate can be received in the processing device, a signal (reception possible signal) indicating that the second molded substrate can be received is sent from the processing device to the bend correction system. Therefore, according to this manufacturing system, the second molded substrate can be transported from the bend correction system to the processing device only when the processing device can receive the second molded substrate.

1: Manufacturing system 5: Bending correction system 10: Bending correction device 20: Cutting device 30: Relay unit 100: First storage unit 101: Substrate box 110: Loading side rail unit 120: Heating unit 121,131: Lower component 122,132: Upper component 123,124: Heater 130: Cooling unit 140: Loading side rail unit 150: Second conveying mechanism 151,154,157: Conveying mechanism 152,158: Adsorption unit 160: First control unit 161: First communication unit 162: First control unit 200: Second control unit 201: Second communication unit 202: Second control unit 210: Second storage unit 220: Angle tube 300: First conveying mechanism 305: Base plate 310: Intermediate rail 320: Electric actuator 321: Push rod 330: Cover 340: First sensor 341: Second sensor 350: Fixture 360: First positioning member 361,371: Shaft 362: L-shaped member 370: Second positioning member 372: Adjustment bolt 373: Plate member 380: Bearing member 381: Fixing unit 382: Receiving unit C1,C2: Recess L1: Communication line S1: First formed substrate S2: Second formed substrate V1: Internal space

Fig. 1 is a front view schematically showing a manufacturing system including a bend correction system. Fig. 2 is a perspective view schematically showing the curvature correction device. Fig. 3 is a plan view schematically showing the curvature correction device. Fig. 4 is a diagram schematically showing a cross-section of the lower member and the upper member in a closed state. Fig. 5 is a top view schematically showing the jig. Figure 6 is a front view schematically showing the jig. Fig. 7 is a diagram schematically showing the VII-VII cross section of Fig. 5. Fig. 8 is a plan view schematically showing the first conveyance mechanism. Fig. 9 is a diagram schematically showing the IX-IX cross section of Fig. 8. FIG. 10 is a flowchart showing the transport operation of the second formed substrate from the bend correction device to the cutting device.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

1: Manufacturing system

5:Bend correction system

10:Bend correction device

20: Cut off device

30: Relay Department

160: First control device

161: First Communications Department

162:First Control Department

200: Second control device

201: Second Communications Department

202: Second control unit

210:Second Containment Department

300: First transport mechanism

350:Jig

L1: communication line

Claims (10)

A curve correction system with: A bend correction device that corrects the bend of the first formed substrate and manufactures the second formed substrate; and a relay portion disposed between the external processing device of the bend correction device and the bend correction device; wherein, The aforementioned processing device processes the aforementioned second formed substrate; The relay unit includes a first transport mechanism that receives the second molded substrate from the bend correction device and transports the received second molded substrate to the processing device. The bend correction system as described in claim 1 further has: The first control part controls the aforementioned first conveying mechanism; and The first communication unit communicates with the aforementioned processing device. The curvature correction system as claimed in claim 2, wherein, The relay part further includes: a first sensor that detects that the second formed substrate has been received from the bend correction device; The first control part, in response to the first sensor detecting the reception of the second formed substrate, controls the first communication part to send a signal requesting the reception of the second formed substrate to the processing device. The bending correction system as described in claim 2 or 3, wherein, the first control unit, in response to the first communication unit receiving a signal from the processing device indicating that the second formed substrate can be received, controls the first conveying mechanism to convey the second formed substrate to the processing device. The curvature correction system according to any one of claims 2 to 4, wherein, The relay part further includes: a second sensor that detects that the second formed substrate has been transported to the processing device; The first control unit, in response to the second sensor detecting the transportation of the second molded substrate, controls the first communication unit to send an indication to the processing device that the second molded substrate has been transported to the processing device. The signal of the end. A bending correction system as described in any one of claims 1 to 5, wherein, the bending correction device comprises: a first receiving section for receiving the first formed substrate; a heating section for heating the first formed substrate; a cooling section for cooling the first formed substrate while pressurizing the first formed substrate; and a second conveying mechanism for conveying the first formed substrate supplied from the first receiving section to the heating section, and conveying the first formed substrate heated by the heating section to the cooling section; and, the heating section heats the first formed substrate while the first formed substrate is arranged in an internal space formed in the heating section. The curvature correction system as claimed in claim 6, wherein, The height direction length of the internal space is longer than the height direction length of the first molded substrate in an unbent state. The curvature correction system according to any one of claims 1 to 7, wherein, The aforementioned processing device includes: a second accommodation portion that accommodates the aforementioned second formed substrate; The second molded substrate transported by the first transport mechanism is accommodated in the second accommodating portion. A manufacturing system that has: The curvature correction system described in claim 8; and The aforementioned processing device; and, The processing device further includes a second control unit that determines whether the second molded substrate can be received in response to the storage state of the second molded substrate in the second accommodating part. A manufacturing system as described in claim 9, wherein: the aforementioned processing device further comprises: a second communication unit, which communicates with the aforementioned bending correction system; and, the aforementioned second control unit, when determining that the aforementioned second formed substrate can be received, controls the aforementioned second communication unit to send a signal to the aforementioned bending correction system indicating that the aforementioned second formed substrate can be received.