CN117296209A - Electrical connector, electronic equipment and preparation method of electrical connector - Google Patents
Electrical connector, electronic equipment and preparation method of electrical connector Download PDFInfo
- Publication number
- CN117296209A CN117296209A CN202180098045.5A CN202180098045A CN117296209A CN 117296209 A CN117296209 A CN 117296209A CN 202180098045 A CN202180098045 A CN 202180098045A CN 117296209 A CN117296209 A CN 117296209A
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- Prior art keywords
- bonding
- substrate
- electrical connector
- solder
- protrusion
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- 238000002360 preparation method Methods 0.000 title description 15
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 229910000679 solder Inorganic materials 0.000 claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000000926 separation method Methods 0.000 claims abstract description 3
- 230000008878 coupling Effects 0.000 claims description 44
- 238000010168 coupling process Methods 0.000 claims description 44
- 238000005859 coupling reaction Methods 0.000 claims description 44
- 238000003466 welding Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 16
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 239000010949 copper Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000004080 punching Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
Abstract
An electrical connector having a bonding portion (10, 30) welded to a substrate (600,510), and at least one bonding protrusion (20) is provided on the bonding portion (10, 30), and the bonding protrusion (20) is used to define a separation distance between the bonding portion (10, 30) and the substrate (600,510), an electronic device, and a method of manufacturing the same are provided. In use, the bonding protrusions (20) press against the substrate (600,510) and serve to define the gap between the substrate (600,510) and the bonding portions (10, 30), i.e. to define the thickness of the solder, ensuring the reliability of the soldering.
Description
The application relates to the technical field of circuits, in particular to an electrical connector, electronic equipment and a preparation method thereof.
Electronic products are required to be electrically interconnected with external systems through terminals and the like. Terminals are typically implemented by leadframe, PIN-bonding to a substrate. Internal electrical interconnections may be made through clips. Because the terminals are integrally connected at the time of manufacturing, the bonding layer thickness of the bonding portion (soldering, sintering, etc.) of the lead frame with the substrate may be stuck together with the bonding surface of the lead frame with the bonding surface of the substrate, resulting in failure of the electronic product such as a module by empty soldering, or the thickness of the soldering layer is too thin, resulting in too low a soldering layer thickness or sintering layer thickness, which reduces the reliability of the bonding layer.
To improve the connection effect, the prior art controls the thickness of the solder layer by laying copper wires in the solder strip, adding copper mesh, and adding nickel balls. However, copper wires and copper mesh are liable to warp when they are cut into chips, and Cu wires or copper mesh also react with solder. The nickel balls or copper balls are unevenly distributed in the welding strip, the granularity distribution of the metal balls is also in a range, and the thickness is difficult to control. And during reflow, particles overflow along with solder, and the effect of controlling thickness and warpage is lost. In particular, since the bonding area of the lead frame is too small and copper wires are difficult to be processed to a proper size for use, the reliability of the connection between the lead frame and the substrate is now an urgent problem to be solved.
Disclosure of Invention
The application provides an electrical connector, an electronic device and a preparation method thereof, which are used for improving the reliability of connection between the electrical connector and a substrate.
In a first aspect, an electrical connector is provided, the electrical connector having a bonding portion welded to a substrate, and at least one bonding protrusion is disposed on the bonding portion, and the bonding protrusion is configured to define a separation distance between the bonding portion and the substrate. When in use, the bonding protrusion is pressed against the substrate and is used for limiting the gap between the substrate and the bonding part, namely limiting the thickness of the solder, so that the reliability of welding is ensured.
In a specific embodiment, each of the coupling protrusions and the coupling portion may be formed in a separate structure or an integral structure. Each combining protrusion is of a protruding structure formed by stamping, and the combining portion and the combining protrusion are of an integrated structure by stamping, so that the combined structure is convenient to manufacture. Or each combining protrusion and the combining part adopt a split structure, and the combining protrusions are welded or adhered on the combining part.
In a specific embodiment, when the coupling projections are provided, each of the coupling projections is a hollow cylindrical structure. Therefore, the solder can be filled in the hollow cavity of the bonding bulge, and bonding reliability is improved.
In a specific embodiment, each of the bonding protrusions is a solid structure when the bonding protrusions are provided. The supporting effect is enhanced by the solid structure.
In a specific embodiment, each of the bonding protrusions is an inverted mesa-like structure. The bonding area with the solder can be increased, the welding effect is improved, and meanwhile, the preparation of the bonding protrusions is also convenient.
In a specific embodiment, the plurality of bonding protrusions are uniformly disposed at the bonding portion. Thereby improving the welding effect.
In a specific embodiment, each bonding protrusion has a cross-section that is circular, elliptical, rectangular, or polygonal; the cross section is a section perpendicular to the height direction of the bonding protrusions. The combining bulges adopt a regular graph structure, so that the preparation is convenient.
In a specific embodiment, when the coupling projections are provided, each of the coupling projections is a bent plate-like structure formed by punching. To facilitate the preparation of the bonding bumps.
In a specific embodiment, each bonding protrusion is dome-shaped. Namely, an arc-shaped convex structure with one end open is formed by stamping.
In a specific embodiment, the electrical connector is a leadframe, an electrical connection terminal, or a PIN.
In a second aspect, there is provided an electronic device substrate and any one of the above electrical connectors, wherein the substrate and the bonding portion are connected by solder bonding, the plurality of bonding bumps are pressed against the substrate, and the solder wraps each bonding bump; the electronic device further includes a functional device electrically connected to the substrate through the electrical connection. When the welding device is used, the plurality of bonding protrusions are pressed on the substrate and are used for limiting the gap between the substrate and the bonding part, namely, the thickness of the welding strip is limited, the welding reliability is ensured, and the welding of the electric connecting piece and the substrate can be realized by using common welding materials.
In a third aspect, a method for manufacturing an electronic device is provided, the method comprising the steps of:
coating solder on the substrate;
pressing the bonding part of the electric connector on the solder, and inserting the bonding protrusion of the electric connector into the solder and pressing against the substrate;
and welding and connecting the substrate and the joint part.
In the technical scheme, the plurality of bonding protrusions are pressed on the substrate and are used for limiting the gap between the substrate and the bonding part, namely, the thickness of the welding strip is limited, the welding reliability is ensured, and the welding of the electric connecting piece and the substrate can be realized by using common welding materials.
In a specific embodiment, the bonding protrusions of the electrical connector are inserted into the solder and pressed against the substrate, specifically: the combining protrusion is of a hollow cylindrical structure; the solder is filled in the hollow cavity of the bonding protrusion. The connection strength between the electric appliance connecting piece and the substrate is further improved.
The bonding material is not limited to solder, but may be a sintered material including, but not limited to, silver paste, copper paste, organic conductive adhesive, organic adhesive, and the like.
Fig. 1 is a side view of a leadframe provided in an embodiment of the present application;
FIG. 2 is a schematic view of a first joint according to an embodiment of the present disclosure;
fig. 3 is a schematic view of the preparation of a lead frame according to an embodiment of the present application;
fig. 4 is a schematic diagram of a lead frame according to an embodiment of the present disclosure when connected to a substrate;
fig. 5 is a schematic diagram of a first bonding portion according to an embodiment of the present disclosure when the first bonding portion is connected to a substrate;
fig. 6 is a schematic structural diagram of another lead frame according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of another lead frame according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of another lead frame according to an embodiment of the present disclosure;
fig. 9 is a schematic structural view of a PIN needle provided in an embodiment of the present application;
fig. 10 is a schematic diagram of the preparation of a PIN needle provided in an embodiment of the present application;
fig. 11 is a schematic diagram of a PIN provided in an embodiment of the present application when the PIN is connected to a substrate;
fig. 12 is a schematic view of a first bonding portion according to an embodiment of the present disclosure when the first bonding portion is connected to a substrate;
fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
For the convenience of understanding, the electrical connector according to the embodiments of the present application will be described first, and the electrical connector according to the embodiments of the present application is a device for connecting other electronic apparatuses with a substrate. The electrical connection may be a lead frame or PIN or conductive connection terminal. This will be described below.
Lead frames (lead frames for short) are bonded to electrodes of a substrate of an electronic product, serve as internal circuit terminals to be electrically connected with external electrical components to form a key structural member of an electrical circuit, play a role of a bridge connected with external wires, and are required to be used in most semiconductor integrated circuits, so that the lead frames are important basic materials in the electronic information industry. When the lead frame is prepared, the lead frame is mainly produced by a die stamping method and a chemical etching method. The raw materials used for the lead frame are: KFC, C194, C7025, feNi42, TAMAC-15, PMC-90, and the like. MaterialMainly according to the desired properties of the product: (strength, electrical conductivity, and thermal conductivity). Alternatively, the lead frame may be bonded to a metallized ceramic substrate (e.g., al 2 O 3 -DBC，AlN-DBC，Si 3 N 4 -AMB, alN-AMB, IMS (Insulated Material Substrate, insulating material substrate)) and the semiconductor product is formed and then sheared to form the conductive terminals. The lead frame also facilitates the manufacturing process of the product.
PIN PINs (PIN connectors), which are a metallic substance used in connectors to accomplish electrical conduction (transmission) of electricity (signals), are commonly bonded to substrates, such as by soldering or sintering.
In the prior art, the deformation of the lead frame and the PIN needle during welding can cause the empty welding condition due to the fact that the thickness of a bonding layer of a bonding part (welding, sintering and the like) of the lead frame and the PIN needle and the bonding surface of the substrate are possibly bonded together, so that electronic products such as modules and the like are invalid; or the thickness of the solder layer is too thin, resulting in too low a thickness of the solder layer or the sintered layer and reduced reliability of the bonding layer. In order to improve the reliability of the electrical connector and the substrate when being connected, the embodiment of the application provides an electrical connector, which is described in detail below with reference to the specific drawings.
The electrical connector provided in the embodiment of the present application may be a lead frame or a PIN, and the structure of the electrical connector of the present application will be described below by taking the lead frame and the PIN as examples.
Referring to fig. 1, fig. 1 shows a side view of a lead frame. The lead frame is used for connecting the substrate with external electrical components to achieve electrical connection. The lead frame has two coupling parts, namely a first coupling part 10 and a second coupling part 30, respectively, the first coupling part 10 and the second coupling part 30 are respectively arranged at two ends of the lead frame, and the first coupling part 10 and the second coupling part 30 are connected through a connecting part 40. The first bonding portion 10 is a bonding portion for electrically connecting to the substrate, and the second bonding portion 30 is a bonding portion for electrically connecting to an external electrical component. When the lead frame is matched with the substrate and an external electric component, the first bonding part 10 is welded on the substrate and is electrically connected with a circuit on the substrate; the second bonding portion 30 is bonded or contacted on the external electrical component to achieve conductive connection between the internal electronic component (electronic device on the substrate) and the external electrical component through the lead frame.
In an alternative, the first coupling part 10, the connecting part 40, and the second coupling part 30 have a zigzag structure. The first combining part 10 and the second combining part 30 are arranged in parallel, the connecting part 40 is inclined relative to the first combining part 10 and the second combining part 30, and the included angle between the first combining part 10 and the connecting part 40 and the included angle between the second combining part 30 and the connecting part 40 are all more than or equal to 90 degrees, so that interference between the first combining part 10 and the second combining part 30 is avoided. Illustratively, the included angles between the first and second combining parts 10 and 30 and the connecting part 40 are respectively 90 ° to 180 °, such as different included angles of 90 °, 135 °, 150 °, 180 °.
The second bonding portion 30 of the lead frame is provided with a positioning hole 31, and the positioning hole 31 is used for being matched with a die for positioning when the lead frame is prepared.
The first bonding portion 10 is easily extruded or thinned when the first bonding portion 10 is welded to the substrate, and for this purpose, the first bonding portion 10 provided in this application embodiment is provided with a bonding protrusion 20, and the bonding protrusion 20 is located on a surface of the first bonding portion 10 facing the substrate and protrudes outside the surface. As shown in fig. 1, the height of the bonding protrusion 20 protruding out of the surface of the first bonding portion 10 is t, and when the first bonding portion 10 is aligned with the substrate, the bonding protrusion 20 abuts against the substrate, so as to define the height of the gap between the first bonding portion 10 and the substrate, i.e. t. At the time of soldering, the solder fills in the gap between the substrate and the first bonding portion 10, and thus the height of the solder is also t. The value of t is reasonably calculated, so that the thickness of the solder can be ensured. During welding, the thickness of the solder can be ensured through the bonding protrusions 20, and the occurrence of the condition of cold joint is avoided, so that the reliability during welding is ensured, and the stability and reliability of the lead frame during connection with the substrate are improved.
As an alternative, the number of the coupling protrusions 20 may be at least one, and the number of the coupling protrusions 20 may be one, two, three, or the like. When the number of the coupling projections 20 is plural, the plural coupling projections 20 have the same height. When in use, the plurality of bonding protrusions 20 are pressed against the substrate to jointly limit the gap between the substrate and the first bonding portion 10, namely, the thickness of the welding strip is limited, the welding reliability is ensured, and the welding of the electrical connector and the substrate can be realized by using common welding flux.
It should be understood that the plurality of coupling protrusions 20 have the same height including the following cases: the plurality of coupling projections 20 may be identical in height to or different from the plurality of coupling projections 20 provided in the same first coupling portion 10; when the lead frame includes a plurality of first bonding portions 10, the bonding protrusions 20 provided on different first bonding portions 10 may have the same height.
When the plurality of bonding protrusions 20 are disposed, the plurality of bonding protrusions 20 may be disposed in different manners when disposed, and illustratively, the plurality of bonding protrusions 20 are uniformly disposed at the first bonding portion 10, or the plurality of bonding protrusions 20 are disposed at the first bonding portion 10 in a non-uniform manner.
Referring to fig. 2, fig. 2 shows a schematic structural view of the first joint 10. When the coupling projections 20 are provided, each of the coupling projections 20 has a hollow cylindrical structure. The cylindrical structure is open at both ends and is designated as a first opening 21 and a second opening 23 for convenience of description. The first opening 21 is close to the first joint 10, and the second opening 23 is far from the first joint 10. When the bonding protrusion 20 is pressed against the substrate, the first opening 21 is pressed against the substrate. During soldering, the solder can enter the hollow cavity of the bonding protrusion 20 through the first opening 21 and is filled, so that the inner side wall (the side wall of the hollow cavity 22) and the outer side wall of the bonding protrusion 20 can be soldered with the solder, and the reliability of the lead frame and the substrate during soldering is improved.
When the coupling projections 20 are specifically provided, each of the coupling projections 20 has an inverted mesa structure. For ease of understanding, a mesa-like structure will be described first. The mesa structure has two opposing first and second surfaces aligned in a height direction, wherein the first surface has a surface area greater than a surface area of the second surface. When the table-shaped structure is placed in the normal direction, the first surface is a bottom surface, and the second surface is a top surface; when the table-shaped structure is inverted, the first surface is a top surface, and the second surface is a bottom surface. With the structure shown in fig. 2, the bonding protrusion 20 gradually tapers in a direction away from the first bonding portion 10, and when the bonding is adopted, on the one hand, the contact area between the bonding protrusion 20 and the solder can be increased, and on the other hand, a draft slope can be formed, so that the mold can be conveniently removed during preparation, and the preparation of the bonding protrusion 20 is facilitated. It should be understood that the coupling protrusion 20 may have a columnar structure, such as a cylinder, a square column, etc., in addition to the above-described mesa structure.
As an alternative, the shape of the bonding protrusions 20 is not specifically limited in the embodiment of the present application, and the cross section of each bonding protrusion 20 is one of the following: circular, oval, rectangular or polygonal, or may take on different shapes such as trapezoidal, semicircular, elliptical, prismatic, etc., or other convex shapes, may be used in embodiments of the present application. Wherein the cross section is a section perpendicular to the height direction of the coupling protrusion 20.
Referring to fig. 3, fig. 3 illustrates a manufacturing method of the lead frame 100, and when manufacturing the lead frame 100, the lead frame 100 is manufactured by using the upper mold 200 and the lower mold 300 in cooperation, and a cavity for accommodating the lead frame 100 is provided between the upper mold 200 and the lower mold 300. The upper die 200 is provided with a positioning post 201 that mates with a positioning hole of the lead frame 100, and the upper die 200 is provided with a punch 202 for punching to form a bonding protrusion, the punch 202 having a circular head structure. A punch hole 301 is provided in the lower die 300, which is matched with the punch 202. In the case of the lead frame 100, the press head 202 presses the first bonding portion of the lead frame 100 during press molding, and the first bonding portion under the press head 202 is deformed in plastic, thereby forming a first bonding portion of the control lead frame 100 and a substrate bonding enhancing structure (bonding bump).
In preparing the bonding protrusions, the size of the bonding protrusions formed may be controlled by adjusting the height of the stamping head 202 and the size of the stamping holes 301 on the lower mold 300 to be matched therewith. For example, the height of the bonding bumps may be between 10 and 700 μm, such as the bonding bumps having different heights of 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, etc. The bonding bumps may have a physical dimension of 30-3000 μm, such as a physical dimension of 100 μm, 400 μm, 600 μm, 800 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, etc. It should be understood that the external dimensions of the coupling protrusion are related to the dimensions of the first coupling portion, and may be set as desired when specifically provided.
It should be appreciated that in addition to the above-described fabrication methods, bonding bumps may also be formed directly upon fabrication of the lead frame 100. Or the bonding protrusions and the lead frame 100 are in a split structure, and the bonding protrusions are fixedly connected with the first bonding portions of the lead frame 100 in a welding or bonding mode.
Referring to fig. 4, when the lead frame 100 is mated with the substrate 600, solder 700 is placed on the bonding portion of the lead frame 100 on the substrate 600, or a bonding material such as solder paste, silver paste, copper paste, or the like is printed, or dispensing is performed. The lead frame 100 is placed on the bonding fixture 500. The first bonding portion of the lead frame 100 is less likely to be lifted by applying a certain force to the lead frame 100 by the upper platen 400. After that, reflow or sintering is performed to bond the lead frame 100 to the substrate 600. The thickness of the solder between the joint and the substrate 600 is equal, so that the thermal resistance can be reduced and the reliability can be improved.
Referring to fig. 5, when the coupling protrusion 20 adopts a hollow structure, molten solder 700 enters the hollow structure portion at the time of soldering, so that both inner and outer sides of the hollow structure can be coupled. By adopting the structure, on one hand, the joint area is increased, and the reliability is improved; on the other hand, the disadvantage that the bottom of the solid structure cannot be welded is avoided.
It should be understood that the structure of the engaging protrusion 20 provided in the embodiment of the present application is not limited to the structure shown in fig. 1, and other structures may be adopted.
As shown in fig. 6, fig. 6 illustrates a schematic structure of another lead frame according to an embodiment of the present application. The bonding protrusion 20 provided in the embodiment of the present application may also be a solid structure, that is, the bonding protrusion 20 is a solid structure protruding outside the first bonding portion 10.
Referring to fig. 7, fig. 7 illustrates a schematic structure of another lead frame according to an embodiment of the present application. Each of the coupling projections 20 is a bent plate-like structure formed by punching. In the preparation, a bending structure is formed by stamping, and the bending structure can be used as a structure for limiting the interval between the first joint part 10 and the substrate. In addition, during welding, the solder wraps the bending structure, so that the contact area between the first joint part 10 and the solder can be increased, and further, the reliability of the first joint part 10 when being connected with the substrate is increased.
In addition to the above structure, the coupling protrusion may be formed in a dome-like structure, and when the dome-like structure is used, it may be formed by punching, so that a recess is formed at one side of the first coupling portion and an arc-shaped protrusion is formed at the other side.
Referring to fig. 8, fig. 8 shows a conductive connection terminal. The conductive connection terminal includes two first bonding portions 112, and the two first bonding portions 112 are respectively arranged at two sides of the second bonding portion 110. When being matched with the substrate, the two first combining parts 112 are respectively welded and connected with the substrate. It should be understood that the coupling protrusions 111 illustrated in the above examples may be used for the coupling protrusions provided on each first coupling portion 112, and will not be described in detail herein.
Referring to fig. 9, fig. 9 shows a schematic view of a PIN needle. The PIN needles are used to make an electrically conductive connection between the electrical device and the substrate. The PIN comprises a first bonding portion 220 and a second bonding portion 210, wherein the first bonding portion 220 and the second bonding portion 210 form a bending structure, the first bonding portion 220 is used for being welded with a substrate, and the second bonding portion 210 is used for being welded with or in plug-in contact with an external electric component.
When the first bonding portion 220 is welded to the substrate, the condition that the solder is leaked or thinner is easy to occur, for this reason, the first bonding portion 220 provided in the embodiment of the present application is provided with the bonding protrusion 230, and the bonding protrusion 230 is located on the surface of the first bonding portion 220 facing the substrate and protrudes outside the surface. As shown in fig. 9, the height of the bonding protrusion 230 protruding out of the surface of the first bonding portion 220 is t, and when the first bonding portion 220 is aligned with the substrate, the bonding protrusion 230 is pressed against the substrate, so as to define the height of the gap between the first bonding portion 220 and the substrate, i.e. t. At the time of soldering, the solder fills in the gap between the substrate and the first bonding portion 220, and thus the height of the solder is also t. The value of t is reasonably calculated, so that the thickness of the solder can be ensured. During welding, the thickness of the solder can be ensured through the combining protrusion 230, and the condition of cold joint is avoided, so that the reliability during welding is ensured, and the stability and reliability of the connection of the PIN needle and the substrate are improved.
The specific structure and shape of the PIN bonding protrusions 230 may refer to the specific structure and shape of the bonding protrusions 230 in the lead frame, and will not be described in detail herein.
Referring to fig. 10, fig. 10 shows a PIN needle preparation method, in which a PIN needle is prepared by using an upper mold 310 and a lower mold 320 in cooperation, and a cavity for accommodating the PIN needle is provided between the upper mold 310 and the lower mold 320. A punch 311 for punching the coupling protrusion is provided on the upper die 310, and the punch 311 has a circular head structure or other shape structure. A punch hole 321 is provided in the lower die 320 and is matched with the punch head 311. In the PIN press molding, the punch 311 presses the first joint portion of the PIN, and the first joint portion 220 under the punch 311 is deformed in plasticity, thereby forming a first joint portion for controlling the PIN and a substrate joint reinforcing structure (joint protrusion).
In preparing the bonding protrusions, the size of the bonding protrusions formed may be controlled by adjusting the height of the punching head 311 and the size of the punching hole 321 of the lower mold 320 to be matched therewith. For example, the height of the bonding bumps may be between 10 and 700 μm, such as the bonding bumps having different heights of 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, etc. The bonding bumps may have a physical dimension of 30-3000 μm, such as a physical dimension of 100 μm, 400 μm, 600 μm, 800 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, etc. It should be understood that the external dimensions of the coupling protrusion are related to the dimensions of the first coupling portion, and may be set as desired when specifically provided. The external dimension is the length, width or diameter of the bonding protrusion.
It will be appreciated that in addition to the above-described manner of preparation, it is also possible to use a method in which the bonding protrusions are directly formed when the PIN is prepared. Or the combination protrusion and the PIN needle are in a split structure, and the combination protrusion is fixedly connected with the first combination part 220 of the PIN needle in a welding or bonding mode.
Referring to fig. 11, when bonding a PIN with a substrate 510, the PIN is fixed to the substrate 510 by a jig, and solder 610 is placed on the bonding portion of the PIN on the substrate 510, or a bonding material such as solder paste, silver paste, copper paste, or the like is printed, or dispensing is performed. The PIN needle is placed on the engagement fixture 410. The pressing plate 420 applies a certain force on the PIN needle, so that the first joint part of the PIN needle is not easy to tilt, and the pressing plate 420 has the function of PIN positioning. After which reflow or sintering is performed to bond the PIN needles to the substrate 510. The thickness of the solder between the joint and the substrate 510 is equal, so that the thermal resistance can be reduced and the reliability can be improved.
Referring to fig. 12, when the coupling protrusion 230 adopts a hollow structure, molten solder 610 enters the hollow structure portion at the time of soldering, so that both inner and outer sides of the hollow structure can be coupled. By adopting the structure, on one hand, the joint area is increased, and the reliability is improved; on the other hand, the disadvantage that the bottom of the solid structure cannot be welded is avoided.
The bonding protrusions of the PIN needle provided in the embodiments of the present application may also be solid structures, and the bonding material may be solder, sintering material, or other bonding materials.
The embodiment of the application also provides electronic equipment, which can be a power module, an IC module and other modules. The electronic device substrate and the electrical connector according to any one of the above. As shown in fig. 13, the electronic apparatus includes a substrate, a lead frame, conductive connection terminals, and functional devices.
The substrate includes three parts, which are a ceramic substrate 650 for supporting, a first loop metal layer 620 and a second loop metal layer 630 disposed on one side of the ceramic substrate 650, and a heat dissipation metal layer 660 disposed on the other side of the ceramic substrate 650, respectively.
The functional device may be an external electrical component or an internal electronic component; the outer and inner parts are divided based on the substrate, the outer part being referred to as being located outside the substrate and the inner part being referred to as being located on and carried by the substrate.
The number of the external electrical components is two, namely a first external electrical component 1000 and a second external electrical component 2000; the first external electrical component 1000 and the second external electrical component 2000 may be batteries or other modules having electrical functions. In fig. 13, a first external electrical component 1000 is a battery, and a second external electrical component 2000 is a motor.
The number of internal electronic components is one, and the internal electronic components are chips 640. The chip 640 is soldered on the first loop metal layer 620 and is electrically connected to the first loop metal layer 620, and the chip 640 is electrically connected to the second loop metal layer 630 through the conductive connection terminal 140. A specific structure of the conductive connection terminal 140 may be described with reference to fig. 8. In connection, the two first bonding portions of the conductive connection terminal 140 are in one-to-one correspondence with the chip 640 and the second loop metal layer 630, so as to realize electrical connection between the chip 640 and the second loop metal layer 630. In addition, at the time of soldering, the thickness of the solder to be soldered is defined by the bonding protrusions provided on the two first bonding portions to ensure the reliability of the connection.
The number of lead frames is two, namely a first lead frame 110 and a second lead frame 120. The first bonding portion 10 of the first lead frame 110 is connected to the first loop metal layer 620 by solder, the plurality of bonding bumps 20 are pressed against the first loop metal layer 620, and the solder wraps each bonding bump 20. The second coupling portion 30 of the first lead frame 110 serves as a DC input terminal to be electrically connected to the output terminal of the first external electrical component 1000, and specifically, both may be fixedly connected by bolts. When the above structure is adopted, the plurality of bonding protrusions 20 are pressed against the first circuit metal layer 620, and are used for defining a gap between the first circuit metal layer 620 and the first bonding portion 10, that is, defining the thickness of the solder strip, ensuring the reliability of soldering, and soldering the electrical connector and the first circuit metal layer 620 by using common solder.
The second lead frame 120 is arranged in a similar manner to the first lead frame 110. The first bonding portion of the second lead frame 120 is welded to the second loop metal layer 630, and the second bonding portion serves as an AC output terminal and is electrically connected to the input end of the second external electrical component 2000, and specifically, the two may be fixedly connected by bolts.
In operation, direct current provided by the first external electrical component 1000 (battery) may be converted to alternating current by the electronics and input into the second external electrical component 2000 (motor) through the second lead frame 120 to cause the motor to operate.
As an alternative, the electronic device further comprises a PIN 130, the first joint of the PIN 130 is welded to the second loop metal layer 630, and the second joint is connected to the third external electrical component 3000 in a plugging manner as a connecting piece, wherein the third external electrical component 3000 may be a module driver.
It should be understood that the electrical connections referred to in the embodiments of the present application may include solder, plug connections, bolt connections, or other electrical connection means.
The embodiment of the application also provides a preparation method of the electronic equipment, which comprises the following steps:
step 001: coating solder on the substrate;
step 002: pressing the bonding part of the electric connector on the solder, and inserting the bonding protrusion of the electric connector into the solder and pressing the bonding protrusion against the substrate;
in particular, the electrical connector may be a lead frame or PIN, and the steps in soldering the electrical connector to the substrate may be described with particular reference to fig. 4 and 10. The combining bulge is of a hollow cylindrical structure; solder fills the hollow cavity of the bonding bump. The connection strength between the electric appliance connecting piece and the substrate is further improved.
Step 003: and welding and connecting the substrate and the joint part.
In the technical scheme, the plurality of bonding protrusions are pressed on the substrate and are used for limiting the gap between the substrate and the bonding part, namely, the thickness of the welding strip is limited, the welding reliability is ensured, and the welding of the electric connecting piece and the substrate can be realized by using common welding materials. It should be understood that the bonding material between the substrate and the electrical connector is not limited to solder, but may be a sintered material, a conductive adhesive, and other bonding materials.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.
Claims (11)
- An electrical connector, characterized in that the electrical connector has a joint welded with a substrate; at least one bonding protrusion is disposed on the bonding portion, and the at least one bonding protrusion is used to define a separation distance between the bonding portion and the substrate.
- The electrical connector of claim 1, wherein each of the bonding protrusions is a solid structure.
- The electrical connector of claim 1, wherein each of the bonding protrusions is dome-shaped.
- The electrical connector of claim 1, wherein each of said coupling projections is a hollow cylindrical structure.
- An electrical connector as claimed in claim 1, 3 or 4, wherein each of said engaging projections is a stamped projection arrangement.
- The electrical connector of any one of claims 1-5, wherein each of the bonding protrusions is an inverted mesa-like structure.
- The electrical connector of any one of claims 1 to 6, wherein each of the bonding bumps has a circular, elliptical, rectangular or polygonal cross section; the cross section is a section perpendicular to the height direction of the bonding protrusions.
- The electrical connector of any one of claims 1-7, wherein the electrical connector is a leadframe or PIN.
- An electronic device comprising a substrate, and an electrical connector according to any one of claims 1 to 8, wherein the substrate and the bonding portion are connected by solder bonding, the plurality of bonding bumps are pressed against the substrate, and the solder wraps each bonding bump;the electronic device further includes a functional device electrically connected to the substrate through the electrical connection.
- A method for manufacturing an electronic device, comprising the steps of:coating solder on the substrate;pressing the bonding part of the electric connector on the solder, and inserting the bonding protrusion of the electric connector into the solder and pressing against the substrate;and welding and connecting the substrate and the joint part.
- The method for manufacturing an electronic device according to claim 10, wherein the bonding bump of the electrical connector is inserted into the solder and pressed against the substrate, specifically:the combining protrusion is of a hollow cylindrical structure; the solder is filled in the hollow cavity of the bonding protrusion.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/098985 WO2022257019A1 (en) | 2021-06-08 | 2021-06-08 | Electrical connector and preparation method therefor, and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117296209A true CN117296209A (en) | 2023-12-26 |
Family
ID=84424748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180098045.5A Pending CN117296209A (en) | 2021-06-08 | 2021-06-08 | Electrical connector, electronic equipment and preparation method of electrical connector |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117296209A (en) |
| WO (1) | WO2022257019A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0969680A (en) * | 1995-08-31 | 1997-03-11 | Matsushita Electric Ind Co Ltd | Mounting of electronic component |
| US20060216970A1 (en) * | 2005-03-28 | 2006-09-28 | Lear Corporation | Electrical connector terminal and method of producing same |
| CN201868599U (en) * | 2010-01-20 | 2011-06-15 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| JP5869282B2 (en) * | 2011-10-03 | 2016-02-24 | タイコエレクトロニクスジャパン合同会社 | Electrical connector |
| CN203013974U (en) * | 2012-08-09 | 2013-06-19 | 泰科电子(上海)有限公司 | Central terminal for electric connector and electric connector comprising same |
-
2021
- 2021-06-08 CN CN202180098045.5A patent/CN117296209A/en active Pending
- 2021-06-08 WO PCT/CN2021/098985 patent/WO2022257019A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022257019A1 (en) | 2022-12-15 |
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