WO2022257019A1

WO2022257019A1 - Electrical connector and preparation method therefor, and electronic device

Info

Publication number: WO2022257019A1
Application number: PCT/CN2021/098985
Authority: WO
Inventors: 郎丰群; 吕镇; 吴晓诚
Original assignee: 华为技术有限公司
Priority date: 2021-06-08
Filing date: 2021-06-08
Publication date: 2022-12-15
Also published as: CN117296209A

Abstract

Provided are an electrical connector and a preparation method therefor, and an electronic device. The electrical connector is provided with a joint portion (10, 30) welded to a substrate (600, 510), the combination portion (10, 30) is provided with at least one combination protrusion (20), and the combination protrusion (20) is used for defining a spacing distance between the combination portion (10, 30) and the substrate (600, 510). When in use, the combination protrusion (20) abuts against the substrate (600, 510) and is used for defining an interval between the substrate (600, 510) and the combination portion (10, 30), i.e., the thickness of solder is defined, thereby ensuring the welding reliability.

Description

A kind of electrical connector, electronic equipment and preparation method thereof

technical field

The present application relates to the field of circuit technology, in particular to an electrical connector, an electronic device and a preparation method thereof.

Background technique

All electronic products need to be electrically interconnected with external systems through terminals, etc. Terminals are generally implemented by bonding lead frames and PIN pins to the substrate. Internal electrical interconnection can be achieved through clips. Because each terminal of the lead frame is connected as a whole during manufacturing, due to the deformation of the lead frame during welding, the thickness of the joint layer of the joint part (soldering, sintering, etc.) of the lead frame and the substrate may be attached to the joint surface of the lead frame and the substrate. Together, lead to empty soldering and failure of electronic products such as modules, or the thickness of the soldering layer is too thin, resulting in too low thickness of the soldering layer or sintered layer and reducing the reliability of the bonding layer.

In order to improve the connection effect, in the prior art, the thickness of the welding layer is controlled by laying copper wires in the welding strip, adding copper mesh, and adding nickel balls and copper balls. However, when the copper wire and copper mesh are cut into solder pieces, they are easily warped, and the Cu wire or copper mesh also reacts with the solder. Nickel balls or copper balls are unevenly distributed in the welding strip, and the particle size distribution of metal balls also has a range, so it is difficult to control the thickness. Moreover, the particles overflow with the solder during reflow, losing the effect of controlling thickness and warpage. In particular, the area of the joint of the lead frame is too small, and it is difficult to process the copper wire to a suitable size for use. Therefore, the reliability of the connection between the lead frame and the substrate has become an urgent problem to be solved.

Contents of the invention

The present application provides an electrical connector, an electronic device and a preparation method thereof, which are used to improve the reliability of the connection between the electrical connector and a substrate.

In the first aspect, an electrical connector is provided. The electrical connector has a joint portion welded to a substrate, and at least one joint protrusion is provided on the joint portion, and the joint protrusion is used to limit the connection between the joint portion and the substrate. interval distance between. When in use, the bonding protrusion presses against the substrate, and is used to limit the gap between the substrate and the bonding portion, that is, to limit the thickness of the solder, so as to ensure the reliability of soldering.

In a specific embodiment, each combining protrusion and combining portion can adopt a separate structure or an integrated structure. Exemplarily, each combination protrusion is a protrusion structure formed by stamping. By adopting a stamping method, the combination part and the combination protrusion are integrated, which is convenient for preparation. Or a split structure is adopted between each combining protrusion and the joint part, and the combining protrusion is welded or bonded to the joint part.

In a specific embodiment, when the combining protrusions are provided, each combining protrusion is a hollow cylindrical structure. Therefore, the solder can be filled in the hollow cavity of the bonding protrusion, and the bonding reliability is improved.

In a specific embodiment, when the combining protrusions are provided, each combining protrusion is a solid structure. Enhanced support with solid structure.

In a specific embodiment, each combination protrusion is an inverted terrace structure. The bonding area with the solder can be increased, the soldering effect can be improved, and the preparation of the bonding bump can be facilitated.

In a specific embodiment, a plurality of combining protrusions are uniformly arranged on the combining portion. Thereby improving the effect of welding.

In a specific embodiment, the cross section of each combining protrusion is circular, elliptical, rectangular or polygonal; the cross section is a cross section perpendicular to the height direction of the combining protrusion. The combination protrusion adopts a regular graphic structure, which is convenient for preparation.

In a specific embodiment, when the combining protrusions are provided, each combining protrusion is a bent plate-like structure formed by stamping. To facilitate the preparation of joint protrusions.

In a specific embodiment, each combination protrusion is a dome-shaped structure. That is, an arc-shaped convex structure with one end open is formed by stamping.

In a specific implementation, the electrical connector is a lead frame, an electrical connection terminal or a PIN needle.

In a second aspect, an electronic device is provided, the substrate of the electronic device and the electrical connector described in any one of the above, wherein the substrate and the bonding portion are connected by soldering, and the plurality of bonding protrusions are against Pressing against the substrate, the solder wraps each bonding bump; the electronic device also includes a functional device, and the functional device is electrically connected to the substrate through the electrical connection. When in use, a plurality of bonding protrusions are pressed against the substrate, and are used to limit the gap between the substrate and the bonding part, that is, to limit the thickness of the soldering strip and ensure the reliability of the soldering, which can be realized by using ordinary solder Soldering of electrical connectors and substrates.

In a third aspect, a method for preparing an electronic device is provided, and the method includes the following steps:

Coating solder on the substrate;

pressing the bonding portion of the electrical connector on the solder, and inserting the bonding protrusion of the electrical connector into the solder and pressing against the substrate;

The substrate is connected to the joint by welding.

In the above technical solution, a plurality of bonding protrusions are used to press against the substrate, and are used to limit the gap between the substrate and the bonding part, that is, to limit the thickness of the soldering strip, to ensure the reliability of soldering, and to use ordinary solder The welding of the electrical connector and the substrate can be realized.

In a specific implementation, the bonding protrusion of the electrical connector is inserted into the solder and pressed against the substrate, specifically: the bonding protrusion is a hollow cylindrical structure; the solder Fill in the hollow cavity of the combination protrusion. The connection strength between the electrical connector and the substrate is further improved.

The aforementioned bonding materials are not limited to solder, and may also be sintered materials, including but not limited to materials such as silver paste, silver paste, copper paste, copper paste, organic conductive adhesive, and organic adhesive.

Description of drawings

Fig. 1 is the side view of the lead frame provided by the embodiment of the present application;

Fig. 2 is a schematic diagram of the first joint part provided by the embodiment of the present application;

Fig. 3 is the schematic diagram of the preparation of the lead frame provided by the embodiment of the present application;

Fig. 4 is a schematic diagram when the lead frame provided by the embodiment of the present application is connected to the substrate;

Fig. 5 is a schematic diagram of the connection between the first bonding part and the substrate provided by the embodiment of the present application;

FIG. 6 is a schematic structural diagram of another lead frame provided by an embodiment of the present application;

FIG. 7 is a schematic structural diagram of another lead frame provided by an embodiment of the present application;

FIG. 8 is a schematic structural diagram of another lead frame provided by an embodiment of the present application;

FIG. 9 is a schematic structural diagram of a PIN needle provided in an embodiment of the present application;

Figure 10 is a schematic diagram of the preparation of the PIN needle provided in the embodiment of the present application;

FIG. 11 is a schematic diagram of the connection between the PIN needle and the substrate provided by the embodiment of the present application;

Fig. 12 is a schematic diagram of the connection between the first bonding part and the substrate provided by the embodiment of the present application;

FIG. 13 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Detailed ways

For the convenience of understanding, the electrical connectors involved in the embodiments of the present application are described firstly. The electrical connectors involved in the embodiments of the present application are devices used for connecting other electronic devices on the substrate. The electrical connector can be a lead frame or a PIN pin or a conductive connection terminal. Each of them will be described below.

The lead frame (lead frame, referred to as the lead frame) is bonded to the electrode of the substrate of the electronic product, and is used as the lead-out end of the internal circuit to electrically connect with the external electrical parts to form a key structural part of the electrical circuit. It acts as a bridge connected to the external wire Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. When the lead frame is prepared, it is mainly produced by die stamping method and chemical etching method. The raw materials used in the lead frame are: KFC, C194, C7025, FeNi42, TAMAC-15, PMC-90, etc. The selection of materials is mainly based on the performance required by the product: (strength, electrical conductivity and thermal conductivity) to choose. In addition, the lead frame can also be bonded to metal-coated ceramic substrates (such as Al ₂ O ₃ -DBC, AlN-DBC, Si ₃ N ₄ -AMB, AlN-AMB, IMS (Insulated Material Substrate, insulating material substrate) by welding and other methods. ) on the electrode, after the semiconductor product is formed, it is cut to form a conductive terminal. The lead frame also facilitates the processing of the product.

PIN pin (PIN connector): PIN pin is a metal substance used to complete the electrical (signal) conduction (transmission) in the connector, and it is commonly used to join with the substrate by welding or sintering.

The deformation of the lead frame and PIN needles in the prior art during welding, the thickness of the joint layer of the joint with the substrate (soldering, sintering, etc.) may be bonded together with the joint surface of the lead frame or PIN needle and the substrate , leading to empty soldering, which leads to failure of electronic products such as modules; or the thickness of the soldering layer is too thin, resulting in too low thickness of the soldering layer or sintered layer and reducing the reliability of the bonding layer. In order to improve the reliability of the connection between the electrical connector and the substrate, an embodiment of the present application provides an electrical connector, which will be described in detail below with reference to specific drawings.

The electrical connector provided in the embodiment of the present application may be a lead frame or a PIN needle, and the structure of the electrical connector of the present application will be described below taking the lead frame and the PIN needle as examples respectively.

Referring to FIG. 1, FIG. 1 shows a side view of a lead frame. The lead frame is used to connect the substrate with external electrical components to realize electrical connection. The lead frame has two joints, respectively the first joint 10 and the second joint 30, the first joint 10 and the second joint 30 are arranged at both ends of the lead frame, and the first joint 10 and the second joint The two connecting parts 30 are connected by a connecting part 40 . Wherein, the first joint part 10 is a joint part used for conductive connection with the substrate, and the second joint part 30 is a joint part used for conductive connection with external electrical components. When the lead frame is mated with the substrate and external electrical components, the first bonding part 10 is welded on the substrate and electrically connected to the circuit on the substrate; the second bonding part 30 is bonded or contacted on the external electrical components to realize the connection through the lead frame. Conductive connection between internal electronic parts (electronic devices on the substrate) and external electrical parts.

In an optional solution, the first combining portion 10 , the connecting portion 40 and the second combining portion 30 have a zigzag structure. The first joint part 10 and the second joint part 30 are arranged in parallel, the connecting part 40 is inclined relative to the first joint part 10 and the second joint part 30, and the angle between the first joint part 10 and the connecting part 40, the second The included angles between the combination part 30 and the connection part 40 are all greater than or equal to 90°, so as to avoid interference between the first combination part 10 and the second combination part 30 . Exemplarily, the angles between the first joint part 10 and the second joint part 30 and the connecting part 40 are all located at 90°-180°, such as 90°, 135°, 150°, 180°, etc. Angle.

The second bonding portion 30 of the lead frame is provided with a positioning hole 31 , and the positioning hole 31 is used to cooperate with the mold for positioning when preparing the lead frame.

When the first joint part 10 and the substrate are soldered, the solder is likely to be extruded or the solder is thin. For this reason, the first joint part 10 provided in the embodiment of the present application is provided with a joint protrusion 20, and the joint protrusion 20 is located at the second joint. A bonding portion 10 faces the surface of the substrate and protrudes outside the surface. As shown in FIG. 1, the height of the coupling protrusion 20 protruding from the surface of the first coupling part 10 is t. When the first coupling part 10 is aligned with the substrate, the coupling protrusion 20 presses against the substrate, defining The height of the gap between the first bonding portion 10 and the substrate is t. During soldering, the solder fills the gap between the substrate and the first joint part 10 , so the height of the solder is also t. Reasonably calculate the value of t, so as to ensure the thickness of the solder. During soldering, the thickness of the solder can be ensured by combining the bumps 20 to avoid false soldering, thereby ensuring the reliability of soldering and improving the stability and reliability of the connection between the lead frame and the substrate.

As an optional solution, the number of combining protrusions 20 may be at least one, and the number of exemplary combining protrusions 20 may be one, two, three or other different numbers. When the number of coupling protrusions 20 is plural, the heights of the coupling protrusions 20 are the same. When in use, a plurality of bonding protrusions 20 are pressed against the substrate to jointly define the gap between the substrate and the first bonding portion 10, that is, to limit the thickness of the soldering strip and ensure the reliability of soldering. The welding of the electrical connector and the substrate can be realized.

It should be understood that the same height of a plurality of bonding protrusions 20 includes the following situation: for a plurality of bonding protrusions 20 arranged on the same first bonding portion 10, the heights of a plurality of bonding protrusions 20 may be the same or different; When multiple first coupling parts 10 are included, the heights of the coupling protrusions 20 provided on different first coupling parts 10 may be the same or different.

When a plurality of combination protrusions 20 are arranged, the plurality of combination protrusions 20 can be arranged in different ways. Exemplarily, a plurality of combination protrusions 20 are uniformly arranged on the first combination part 10, or a plurality of combination protrusions 20 The coupling protrusions 20 are disposed on the first coupling portion 10 in a non-uniform manner.

Referring to FIG. 2 , FIG. 2 shows a schematic structural view of the first combining part 10 . When the combining protrusions 20 are provided, each combining protrusion 20 is a hollow cylindrical structure. Both ends of the cylindrical structure are open, which are respectively named as the first opening 21 and the second opening 23 for the convenience of description. The first opening 21 is close to the first joint part 10 , and the second opening 23 is away from the first joint part 10 . When the bonding protrusion 20 is pressed against the substrate, the first opening 21 is pressed against the substrate. During soldering, the solder can enter the hollow cavity of the combination protrusion 20 through the first opening 21 and fill it, so that the inner side wall (the side wall of the hollow cavity 22) and the outer side wall of the combination protrusion 20 can be Solder with solder to improve the reliability of lead frame and substrate when soldering.

When specifically setting the combination protrusions 20, each combination protrusion 20 is an inverted platform structure. For the convenience of understanding, the mesa-like structure will be described first. The mesa structure has two opposite first surfaces and second surfaces arranged along the height direction, wherein the surface area of the first surface is larger than that of the second surface. When the table-shaped structure is placed upright, the first surface is the bottom surface, and the second surface is the top surface; when the table-shaped structure is inverted, the first surface is the top surface, and the second surface is the bottom surface. In combination with the structure shown in FIG. 2, the joint protrusion 20 gradually becomes thinner along the direction away from the first joint part 10. When this joint is adopted, on the one hand, the contact area of the joint protrusion 20 and the solder can be increased; A draft slope can be formed to facilitate the removal of the mold during preparation and to facilitate the preparation of the joint protrusion 20 . It should be understood that, in addition to the above-mentioned platform-shaped structure, the coupling protrusion 20 may also adopt a columnar structure, such as a cylinder, a square cylinder, and the like.

As an optional solution, the embodiment of the present application does not specifically limit the shape of the combination protrusion 20, and the cross section of each combination protrusion 20 is one of the following: circular, elliptical, rectangular or polygonal, Alternatively, different shapes such as trapezoid, semicircle, quasi-ellipse, and prism, or other convex shapes can also be used, all of which can be applied in the embodiments of the present application. Wherein, the above-mentioned cross section is a cross section perpendicular to the height direction of the coupling protrusion 20 .

With reference to Fig. 3, Fig. 3 has shown the preparation method of lead frame 100, when preparing lead frame 100, adopt upper mold 200 and lower mold 300 to cooperate to prepare lead frame 100, have accommodating lead frame between upper mold 200 and lower mold 300 100 cavity. The upper mold 200 is provided with a positioning column 201 that matches the positioning hole of the lead frame 100, and the upper mold 200 is provided with a stamping head 202 for stamping to form a bonding protrusion, and the stamping head 202 is a circular head structure. A punching hole 301 matched with the punching head 202 is set on the lower mold 300 . When the lead frame 100 is stamped and formed, the stamping head 202 is stamped on the first joint portion of the lead frame 100, causing the first joint portion under the stamping head 202 to undergo plastic deformation, forming a joint between the first joint portion of the lead frame 100 and the substrate. Reinforcement structure (binding bumps).

When preparing the combination protrusion, the size of the formed combination protrusion can be controlled by adjusting the height of the punch head 202 and the size of the punching hole 301 on the lower mold 300 matched therewith. For example, the height of the bonding protrusions can be between 10-700 μm, such as 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm and other different heights. The overall size of the bonding protrusion can be 30-3000 μm, such as 100 μm, 400 μm, 600 μm, 800 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm and other different sizes. It should be understood that the external dimensions of the coupling protrusions are related to the dimensions of the first coupling portion, and can be set according to requirements during specific configuration.

It should be understood that, in addition to the above-mentioned preparation methods, it is also possible to directly form the bonding bumps during the preparation of the lead frame 100 . Alternatively, the coupling protrusion and the lead frame 100 are separate structures, and the coupling protrusion is fixedly connected to the first coupling portion of the lead frame 100 by welding or bonding.

Referring to FIG. 4 , when mating the lead frame 100 with the substrate 600 , place solder 700 at the junction of the lead frame 100 on the substrate 600 , or print solder paste, silver paste, copper paste and other bonding materials, or dispense glue. The lead frame 100 is placed on the bonding fixture 500 . A certain force is exerted on the lead frame 100 by the upper pressing plate 400 so that the first bonding portion of the lead frame 100 is not easy to warp. After that, reflow or sintering is performed to bond the lead frame 100 on the substrate 600 . The thickness of the solder between the bonding portion and the substrate 600 is equal, so that the thermal resistance can be reduced and the reliability can be improved.

Referring to FIG. 5 , when a hollow structure is used in conjunction with the protrusion 20 , molten solder 700 enters the hollow structure during soldering, so that both the inner and outer sides of the hollow structure can be joined. By adopting the above-mentioned structure, on the one hand, the bonding area is increased and the reliability is increased; on the other hand, the disadvantage that the bottom of the solid structure cannot be welded is avoided.

It should be understood that the structure of the combination protrusion 20 provided in the embodiment of the present application is not limited to the structure shown in FIG. 1 , and other structural forms may also be adopted.

As shown in FIG. 6 , FIG. 6 illustrates a schematic structural diagram of another lead frame provided by an embodiment of the present application. The coupling protrusion 20 provided in the embodiment of the present application may also be a solid structure, that is, the coupling protrusion 20 is a solid structure that protrudes outward from the first coupling portion 10 .

Referring to FIG. 7 , FIG. 7 illustrates a schematic structural diagram of another lead frame provided by an embodiment of the present application. Each combining protrusion 20 is a bent plate structure formed by stamping. During manufacture, the bent structure is formed by stamping, and the bent structure can serve as a structure defining the distance between the first bonding portion 10 and the substrate. In addition, during soldering, the solder wraps the bent structure, which can also increase the contact area between the first joint part 10 and the solder, thereby increasing the reliability when the first joint part 10 is connected to the substrate.

In addition to the above structure, the combination protrusion can also adopt a dome-shaped structure. When the dome-shaped structure is adopted, it can be formed by stamping, so that a depression is formed on one side of the first joint part, and an arc-shaped protrusion is formed on the other side.

Referring to FIG. 8, FIG. 8 illustrates the conductive connection terminals. The conductive connecting terminal includes two first bonding portions 112 arranged on two sides of the second bonding portion 110 . When cooperating with the substrate, the two first combining portions 112 are connected to the substrate by welding respectively. It should be understood that the combination protrusions 111 provided on each first combination portion 112 may be the combination protrusions 111 illustrated above, which will not be described in detail here.

Referring to FIG. 9, FIG. 9 shows a schematic diagram of a PIN needle. The PIN needle is used to realize the conductive connection between the electrical device and the substrate. The PIN needle includes a first joint part 220 and a second joint part 210, wherein the first joint part 220 and the second joint part 210 form a bent structure, the first joint part 220 is used for welding connection with the substrate, and the second joint part 210 It is used for welding connection or plug contact with external electrical parts.

When the first joint part 220 and the substrate are soldered, it is easy to have missing soldering or the solder is thin. For this reason, the first joint part 220 provided in the embodiment of the present application is provided with a joint protrusion 230, and the joint protrusion 230 is located on the first joint. The bonding portion 220 faces the surface of the substrate and protrudes outside the surface. As shown in FIG. 9, the height of the coupling protrusion 230 protruding from the surface of the first coupling portion 220 is t. When the first coupling portion 220 is aligned with the substrate, the coupling protrusion 230 presses against the substrate, defining The height of the gap between the first bonding portion 220 and the substrate is t. During soldering, the solder fills the gap between the substrate and the first bonding portion 220 , so the height of the solder is also t. Reasonably calculate the value of t, so as to ensure the thickness of the solder. During soldering, the thickness of the solder can be ensured by combining the protrusions 230 to avoid false soldering, thereby ensuring the reliability of soldering and improving the stability and reliability of the connection between the PIN pin and the substrate.

The specific structure and shape of the bonding protrusion 230 of the PIN needle can refer to the specific structure and shape of the bonding protrusion 230 in the lead frame, and will not be described in detail here.

With reference to Fig. 10, Fig. 10 has shown the preparation mode of PIN needle, when preparing PIN needle, adopt upper mold 310 and lower mold 320 to cooperate to prepare PIN needle, have the cavity that accommodates PIN needle between upper mold 310 and lower mold 320 . A stamping head 311 for stamping and forming the bonding protrusion is provided on the upper mold 310, and the stamping head 311 is a circular head structure or other shape structures. A punching hole 321 matched with the punching head 311 is set on the lower mold 320 . When the PIN pin is stamped and formed, the stamping head 311 stamps the first joint part of the PIN pin, so that the first joint part 220 under the stamping head 311 undergoes plastic deformation, and the bonding between the first joint part and the substrate of the control PIN pin is strengthened. structure (combined with bumps).

When preparing the combination protrusion, the size of the formed combination protrusion can be controlled by adjusting the height of the punch head 311 and the size of the punching hole 321 on the lower mold 320 matched therewith. For example, the height of the bonding protrusions can be between 10-700 μm, such as 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm and other different heights. The overall size of the bonding protrusion can be 30-3000 μm, such as 100 μm, 400 μm, 600 μm, 800 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm and other different sizes. It should be understood that the external dimensions of the coupling protrusions are related to the dimensions of the first coupling portion, and can be set according to requirements during specific configuration. The external dimension is the length, width or diameter of the bonding protrusion.

It should be understood that, in addition to the above-mentioned preparation methods, it is also possible to directly form the bonding protrusions during the preparation of the PIN needle. Alternatively, the coupling protrusion and the PIN needle are of a separate structure, and the coupling protrusion is fixedly connected to the first coupling portion 220 of the PIN pin by welding or bonding.

Referring to FIG. 11 , when combining the PIN needle with the substrate 510, the PIN needle and the substrate 510 are relatively fixed by a clamp, and solder 610 is placed at the junction of the PIN needle on the substrate 510, or printed solder paste, silver paste, copper paste and other bonding materials, or dispensing, etc. The PIN pins are placed on the engagement fixture 410 . The pressure plate 420 exerts a certain force on the PIN pin so that the first joint part of the PIN pin is not easy to lift, and the pressure plate 420 also has the function of PIN positioning. Reflow or sintering is then performed to bond the PIN pins on the substrate 510 . The thickness of the solder between the bonding part and the substrate 510 is equal, so that the thermal resistance can be reduced and the reliability can be improved.

Referring to FIG. 12 , when a hollow structure is adopted for the combined protrusion 230 , molten solder 610 enters the hollow structure during soldering, so that the inner and outer sides of the hollow structure can be joined together. By adopting the above-mentioned structure, on the one hand, the bonding area is increased and the reliability is increased; on the other hand, the disadvantage that the bottom of the solid structure cannot be welded is avoided.

The bonding protrusion of the PIN needle provided in the embodiment of the present application may also be a solid structure, and the bonding material may be solder, sintering material or other bonding materials.

The embodiment of the present application also provides an electronic device, and the electronic device may specifically be a module such as a power supply module or an IC module. The electronic device substrate and any one of the above electrical connectors. As shown in Figure 13, the electronic device includes a substrate, a lead frame, conductive connection terminals and functional devices.

The substrate includes three parts, namely a ceramic substrate 650 for support, a first circuit metal layer 620 and a second circuit metal layer 630 disposed on one side of the ceramic substrate 650, and a heat dissipation metal layer disposed on the other side of the ceramic substrate 650. 660.

Functional devices can be external electrical components or internal electronic components; the so-called external and internal are based on the division of the substrate, the external refers to being located outside the substrate, and the internal refers to being located on the substrate and carried by the substrate.

The number of external electrical components is two, which are the first external electrical component 1000 and the second external electrical component 2000; wherein, the first external electrical component 1000 and the second external electrical component 2000 can be batteries or other electrical components with electrical functions module. In FIG. 13 , the first external electric component 1000 is a battery, and the second external electric component 2000 is a motor.

The number of internal electronic components is one, and the internal electronic component is a chip 640 . The chip 640 is welded on the first loop metal layer 620 and electrically connected to the first loop metal layer 620 , and the chip 640 is electrically connected to the second loop metal layer 630 through the conductive connection terminal 140 . The specific structure of the conductive connecting terminal 140 can be described with reference to FIG. 8 . During connection, the two first bonding portions of the conductive connection terminal 140 are soldered and connected to the chip 640 and the second loop metal layer 630 in one-to-one correspondence, so as to realize the electrical connection between the chip 640 and the second loop metal layer 630 . In addition, during soldering, the thickness of the solder to be soldered is limited by the bonding protrusions provided on the two first bonding parts, so as to ensure the reliability of the connection.

There are two lead frames, namely the first lead frame 110 and the second lead frame 120 . The first bonding portion 10 of the first lead frame 110 is connected to the first circuit metal layer 620 by soldering, a plurality of bonding protrusions 20 are pressed against the first circuit metal layer 620 , and the solder wraps each bonding protrusion 20 . The second bonding portion 30 of the first lead frame 110 serves as a DC input terminal and is electrically connected to the output end of the first external electrical component 1000 . Specifically, the two can be fixedly connected by bolts. When the above structure is adopted, the plurality of bonding protrusions 20 are pressed against the first circuit metal layer 620, and are used to define the gap between the first circuit metal layer 620 and the first bonding part 10, that is, to define the gap of the solder strip. The thickness ensures the reliability of welding, and the welding between the electrical connector and the first circuit metal layer 620 can be realized by using ordinary solder.

The setting method of the second lead frame 120 is similar to that of the first lead frame 110 . The first joint part of the second lead frame 120 is soldered to the second circuit metal layer 630, and the second joint part serves as an AC output terminal and is electrically connected to the input end of the second external electrical part 2000. Specifically, the two can be connected by bolts. Realize a fixed connection.

When working, the DC power provided by the first external electrical component 1000 (battery) can be converted into AC power by electronic equipment, and input to the second external electrical component 2000 (motor) through the second lead frame 120 to make the motor work.

As an optional solution, the electronic device further includes a PIN needle 130, the first joint part of the PIN needle 130 is welded and connected to the second loop metal layer 630, and the second joint part is used as a connector to be plugged and connected to the third external electrical part 3000 , wherein, the third external electrical component 3000 may be a module driver.

It should be understood that the electrical connection mentioned in the embodiments of the present application may include welding, plug connection, bolt connection or other electrical connection manners.

The embodiment of the present application also provides a preparation method of an electronic device, the preparation method comprising the following steps:

Step 001: coating solder on the substrate;

Step 002: Press the joint part of the electrical connector on the solder, and insert the joint protrusion of the electrical connector into the solder and press against the substrate;

Specifically, the electrical connector may be a lead frame or a PIN pin, and the steps when the electrical connector is soldered to the substrate may refer to the relevant descriptions in FIG. 4 and FIG. 10 . The joint protrusion is a hollow cylindrical structure; the solder is filled in the hollow cavity of the joint protrusion. The connection strength between the electrical connector and the substrate is further improved.

Step 003: Solder the substrate and the joint.

In the above technical solution, a plurality of bonding protrusions are used to press against the substrate, and are used to limit the gap between the substrate and the bonding part, that is, to limit the thickness of the soldering strip, to ensure the reliability of soldering, and to use ordinary solder The welding of the electrical connector and the substrate can be realized. It should be understood that the bonding material between the substrate and the electrical connector is not limited to solder, and may also be sintered material, conductive adhesive and other bonding materials.

Apparently, those skilled in the art can make various changes and modifications to this application without departing from the protection scope of this application. In this way, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

An electrical connector, characterized in that the electrical connector has a joint portion welded to a substrate; at least one joint protrusion is provided on the joint portion, and the at least one joint protrusion is used to limit the joint portion and The separation distance between the substrates.
The electrical connector according to claim 1, wherein each of said coupling protrusions is a solid structure.
The electrical connector according to claim 1, wherein each of the coupling protrusions is a dome-shaped structure.
The electrical connector according to claim 1, wherein each of the coupling protrusions is a hollow cylindrical structure.
The electrical connector according to claim 1, 3 or 4, characterized in that, each of the combination protrusions is a protrusion structure formed by stamping.
The electrical connector according to any one of claims 1 to 5, characterized in that each of the coupling protrusions is an inverted platform-like structure.
The electrical connector according to any one of claims 1 to 6, characterized in that, the cross-section of each said coupling protrusion is circular, elliptical, rectangular or polygonal; said cross-section is perpendicular to said Combine sections in the height direction of the bump.
The electrical connector according to any one of claims 1-7, wherein the electrical connector is a lead frame or a PIN needle.
An electronic device, characterized by comprising a substrate, and the electrical connector according to any one of claims 1 to 8, wherein the substrate and the bonding portion are connected by soldering, and the plurality of bonding bumps pressing against the substrate, the solder wrapping each bonding bump;

The electronic device further includes a functional device, and the functional device is electrically connected to the substrate through the electrical connection member.
A method for preparing an electronic device, comprising the following steps:

Coating solder on the substrate;

pressing the bonding portion of the electrical connector against the solder, and inserting the bonding protrusion of the electrical connector into the solder and pressing against the substrate;

The substrate is connected to the joint by welding.
The method for manufacturing an electronic device according to claim 10, wherein the bonding protrusion of the electrical connector is inserted into the solder and pressed against the substrate, specifically:

The combination protrusion is a hollow cylindrical structure; the solder is filled in the hollow cavity of the combination protrusion.