CN117280602A - Piezoelectric vibration device and method for manufacturing piezoelectric vibration device - Google Patents
Piezoelectric vibration device and method for manufacturing piezoelectric vibration device Download PDFInfo
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- CN117280602A CN117280602A CN202280031818.2A CN202280031818A CN117280602A CN 117280602 A CN117280602 A CN 117280602A CN 202280031818 A CN202280031818 A CN 202280031818A CN 117280602 A CN117280602 A CN 117280602A
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- cover member
- holding member
- vibration device
- sealing material
- piezoelectric vibration
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000003566 sealing material Substances 0.000 claims abstract description 105
- 238000010438 heat treatment Methods 0.000 claims abstract description 66
- 238000007789 sealing Methods 0.000 claims abstract description 36
- 238000002844 melting Methods 0.000 claims abstract description 28
- 230000008018 melting Effects 0.000 claims abstract description 28
- 238000002360 preparation method Methods 0.000 claims abstract description 18
- 239000006023 eutectic alloy Substances 0.000 claims description 27
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 8
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 136
- 229910052742 iron Inorganic materials 0.000 description 68
- 238000005476 soldering Methods 0.000 description 68
- 239000000463 material Substances 0.000 description 25
- 239000007789 gas Substances 0.000 description 22
- 239000013078 crystal Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 8
- 230000005489 elastic deformation Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The present invention relates to a piezoelectric vibration device capable of filling nitrogen gas or the like into a holding member without increasing the working time, and a method for manufacturing the same. The manufacturing method comprises the following steps: a member preparation step (S110) for preparing a cover member (10) or a holding member (2) having a thick portion by providing a frame-shaped sealing material having a rectangular shape in plan view on a part of a portion of one of the cover member (10) and the holding member (2) that is in contact with the other; a cover member mounting step (S120) for mounting the cover member (10) on the holding member (2) to which the piezoelectric element (7) is bonded, by bringing the thick portion into contact with the other; a temporary fixing step (S130) for heating the cover member (10) mounted on the holding member (2) and melting a part of the thick portion to temporarily fix the cover member (10) and the holding member (2); and a sealing step (S140) for sealing the cover member (10) and the holding member (2) by melting the sealing material (11) including the thick portion.
Description
Technical Field
The present invention relates to a piezoelectric vibration device and a method for manufacturing the piezoelectric vibration device.
Background
The piezoelectric resonator device includes, for example, a crystal resonator using a crystal resonator plate. The crystal resonator has a crystal resonator element as a piezoelectric element, a holding member for holding the crystal resonator element, and a cover member for sealing the holding member. The crystal resonator holds the crystal resonator element in the box-shaped holding member made of an insulator such as ceramic. The crystal resonator is sealed by a cover member in a state where an electrode of the crystal resonator element is bonded to an electrode in the holding member.
The method for manufacturing the piezoelectric vibration device includes a piezoelectric element mounting step, a cover arrangement step, a cover temporary mounting step, and a cover bonding step. In the piezoelectric element mounting step, the piezoelectric element is bonded to an electrode pad in the holding member coated with a conductive bonding material. In the cover placement step, a cover having a joint member is placed in an opening of the holding member to which the piezoelectric element is joined. In the cover temporary mounting step, a part of the joint member of the cover disposed on the holding member is melted and temporarily mounted on the holding member. In the cap bonding step, the holding member is bonded to the cap in a nitrogen atmosphere or a vacuum atmosphere. For example, patent document 1 discloses a cover temporary mounting step in which a metal rod is pressed against a part of the cover and is energized, so that a part of a joining member of the cover is melted by resistance heat and temporarily mounted on the holding member.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2018-88563
Disclosure of Invention
Technical problem to be solved by the invention
In the method for manufacturing the piezoelectric vibration device described in patent document 1, in the cap temporary mounting step, the cap is temporarily fixed to the holding member in a state in which the cap is pressed against the holding member by the metal rod. Thereby, the cover is temporarily attached to the holding member in a state of being in close contact with the holding member. Therefore, in the lid joining step, it is difficult for the gas generated from the joining material or the like in the holding member to be discharged from the gap between the lid and the holding member.
The present invention aims to provide a piezoelectric vibration device and a method for manufacturing the piezoelectric vibration device, which can discharge gas generated from a bonding material in a holding member.
Solution to the above technical problems
The present inventors have studied a piezoelectric vibration device capable of discharging gas generated from a bonding material or the like in a holding member, and a method for manufacturing the piezoelectric vibration device. As a result of intensive studies, the present inventors have conceived the following constitution.
In the method for manufacturing a piezoelectric vibration device according to an embodiment of the present invention, the piezoelectric vibration device includes at least a piezoelectric element, a holding member to which the piezoelectric element is bonded, and a cover member covering the piezoelectric element bonded to the holding member, and the cover member is bonded to the holding member to which the piezoelectric element is bonded via a sealing material.
The method for manufacturing the piezoelectric vibration device comprises the following steps:
a member preparation step of preparing the cover member or the holding member, wherein the cover member or the holding member is provided with a frame-shaped sealing material having a rectangular shape in a plan view, and at least a part of a portion of one of the cover member and the holding member, which is in contact with the other, is provided with a thick wall portion having at least 1 corner of the sealing material thicker than a portion other than the corner, when the piezoelectric element bonded to the holding member is covered with the cover member; a cover member mounting step of bringing the thick portion of one of the cover member and the holding member into contact with the other, and mounting the cover member on the holding member to which the piezoelectric element is bonded; a temporary fixing step of heating at least a cover member mounted on the holding member, and melting at least a part of the thick portion to temporarily fix the cover member and the holding member; and a sealing step of heating the cover member and the holding member, which are temporarily fixed, respectively, and melting the sealing material including the thick portion to seal the cover member and the holding member.
In the above configuration, in the cover member mounting step, the cover member is mounted on the holding member via a sealing material having the thick portion. The cover member is supported by the thick portion at a position spaced from the holding member by a distance corresponding to the thickness of the thick portion. Therefore, in the temporary fixing step, a gap is generated between the cover member and the holding member, which are temporarily fixed by melting a part of the thick portion. Therefore, in the sealing step, when the lid member and the holding member are heated in the atmosphere gas, the atmosphere gas rapidly flows into the holding member from the gap between the lid member and the holding member. This can discharge the gas generated from the bonding material or the like in the holding member.
From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following constitution. In the temporary fixing step, a heating element is brought into contact with a part of the cover member to heat the cover member.
In the above configuration, since the sealing material is in contact with the cover member directly heated by the heat generating body, heat is efficiently transferred from the heat generating body via the cover member. Therefore, in the temporary fixing step, even if the sealing material has a thick portion, the cover member can be temporarily fixed to the holding member without reducing the melting speed of the sealing material. This can discharge the gas generated from the bonding material or the like in the holding member.
From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following constitution. In the temporary fixing step, the cover member is heated in a state where the cover member is held by the mounting unit.
In the above configuration, in the cover member mounting step, the cover member is held in position relative to the holding member by a mounting unit for mounting the cover member on the holding member. Therefore, the positional accuracy of the cover member temporarily fixed to the holding member by the temporary fixing step is improved, and the time required for transferring from the cover member mounting step to the temporary fixing step can be shortened. This can discharge the gas generated from the bonding material or the like in the holding member.
From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following constitution. In the temporary fixing step, the cover member is pressed by the heating element.
In the above configuration, in the temporary fixing step, the cover member is pressed against the holding member while being heated by the heating element. Therefore, the melting speed of the thick wall portion located between the cover member and the holding member increases. This can discharge the gas generated from the bonding material or the like in the holding member.
From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following constitution. In the temporary fixing step, a portion of the cover member overlapping at least a portion of the sealing material in a plan view is pressed.
In the above configuration, since the sealing material is located closest to the cover member directly heated by the heat generating body, heat is efficiently transferred from the heat generating body via the cover member. Therefore, in the temporary fixing step, even if the sealing material has a thick portion, the cover member can be temporarily fixed to the holding member without reducing the melting speed of the thick portion. This can discharge the gas generated from the bonding material or the like in the holding member.
From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following constitution. In the temporary fixing step, the heating element is brought into contact with a position on an arbitrary outer edge side than a center of the cover member in a plan view to heat the cover member.
In the above configuration, in the temporary fixing step, the cover member is pressed by the heating element between the center of the cover member and an arbitrary outer edge in a plan view. That is, the cover member having the outer edge supported by the holding member is pressed by the heat generating body to a position closer to the portion supported by the holding member than the center. The elastic deformation amount of the cover member generated when the heating element is pressed to a position on an arbitrary outer edge side from the center of the cover member is smaller than the elastic deformation amount of the cover member generated when the heating element is pressed to the center of the cover member. Therefore, even if the cover member is restored to the state before elastic deformation after temporary fixation, the influence of the engaging portion is suppressed, and therefore the cover member is appropriately temporarily fixed to the holding member.
From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following constitution. The sealing material is gold-tin alloy.
In the above configuration, the sealing material is a gold-tin alloy, and thus has high thermal conductivity. That is, the thick-walled portion of the sealing material is rapidly heated to the melting temperature. Therefore, in the temporary fixing step, the cover member can be temporarily fixed to the holding member without reducing the melting speed of the thick portion. This can discharge the gas generated from the bonding material or the like in the holding member.
From other viewpoints, the piezoelectric vibration device of the present invention preferably includes the following constitution. Which is a piezoelectric vibration device manufactured by the above-described method for manufacturing each piezoelectric element vibration device.
In the above configuration, in the sealing step, the piezoelectric vibration device can discharge gas generated from the bonding material or the like in the holding member from the gap when the holding member is sealed by the cover portion. Thus, the piezoelectric vibration device can suppress degradation of the piezoelectric element in the holding member.
From other viewpoints, the piezoelectric vibration device of the present invention preferably includes the following constitution. The piezoelectric vibration device is manufactured by the above-described method for manufacturing each piezoelectric element vibration device, wherein the sealing material includes a eutectic alloy and a non-eutectic alloy having a melting point higher than that of the eutectic alloy, and the sealing material includes the non-eutectic alloy in at least 1 corner of the sealing material in a rectangular frame shape in a plan view.
In the above configuration, the corners of the sealing material contain a non-eutectic alloy having a higher melting point than the eutectic alloy, and therefore are less likely to melt than the corners not containing the non-eutectic alloy. In addition, since the corner portion of the sealing material having the thick portion has a relatively large volume as compared with the straight portion, it is difficult to melt as compared with the side portion. Therefore, when the solder is melted and the piezoelectric vibration device is mounted (reflow-mounted) on the external substrate, the sealing material is less likely to be melted and flows out to the cavity side. This can prevent the poor air tightness when the piezoelectric vibration device is mounted on an external substrate.
[ eutectic alloy ]
In the present specification, a eutectic alloy refers to an alloy that solidifies from a liquid phase to a state having 2 solid phases when the alloy solidifies. In this embodiment, the eutectic alloy is a gold-tin alloy. Eutectic alloys have a lower melting point than non-eutectic alloys.
Effects of the invention
According to an embodiment of the present invention, the gas generated from the joining material or the like in the holding member can be discharged.
Drawings
Fig. 1 is a schematic exploded perspective view showing the overall configuration of a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 2 is a sectional view taken along the direction a in fig. 1.
Fig. 3 is a plan view of a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 4 is a flowchart of a piezoelectric element sealing process included in the method for manufacturing a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 5A is a plan view of a lid member prepared in a member preparation step with a sealing material included in the method for manufacturing a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 5B is a longitudinal side view of the lid member prepared in the sealing material-containing member preparation step included in the method for manufacturing a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 5C is a side view in the width direction of the lid member prepared in the member preparation step with the sealing material included in the method for manufacturing the piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 6 is a cross-sectional view taken along the direction a of fig. 3 of the holding member and a side view of the cover member mounted on the holding member in the cover member mounting step included in the method for manufacturing a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 7 is a side view of a cover member heated by a heating element and a sectional view of a holding member heated by a holding member heating device in fig. 3 in a temporary fixing step included in the method for manufacturing a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 8 is a cross-sectional view showing a lid member heated and pressed by a lid member heating device and a holding member heated by a holding member heating device in a sealing process included in the method for manufacturing a piezoelectric vibration device according to embodiment 1 of the present invention.
Fig. 9 is a side view of a cover member heated by a heating element in a state of being held by a suction nozzle and a sectional view of a holding member heated by a holding member heating device in fig. 3 in a temporary fixing step included in a method for manufacturing a piezoelectric vibration device according to embodiment 2 of the present invention.
Fig. 10 is a side view of a cover member heated by a heating element in a state of being held by a suction nozzle and a sectional view of a holding member heated by a holding member heating device in fig. 3 in a temporary fixing step included in a method for manufacturing a piezoelectric vibration device according to embodiment 3 of the present invention.
Fig. 11 is a partial cross-sectional view of a piezoelectric vibration device according to another embodiment of the present invention.
Fig. 12 is a cross-sectional view in the direction a of fig. 3 of a side view of a cover member heated by a heating element in a state held by an adsorption nozzle and a holding member having a size of 1.2mm long and 1.0mm short heated by a holding member heating device in a temporary fixing step included in the method for manufacturing a piezoelectric vibration device according to the present invention.
Detailed Description
Hereinafter, embodiments will be described with reference to the drawings. In the drawings, the same portions are denoted by the same reference numerals, and description of the same portions is not repeated. The dimensions of the constituent members in each drawing do not faithfully represent the actual dimensions of the constituent members, the ratio of the dimensions of the constituent members, and the like.
In the following description of the piezoelectric vibration device 1 as an embodiment of the present invention, the longitudinal direction of the piezoelectric vibration device 1 is the "X direction", the width direction is the "Y direction", and the opening direction of the opening portion of the holding member 2 for holding the piezoelectric element 7, that is, the direction orthogonal to the X direction and the Y direction is the "Z direction". In the present embodiment, the X direction and the Y direction are directions on a horizontal plane. The Z direction is the vertical direction. That is, the Z direction is the up-down direction. However, the orientation of the piezoelectric vibration device 1 in use is not intended to be limited by definition of this direction.
In the following description, the expressions "fixed", "connected", "joined" and "attached" include not only the case where the components are directly fixed to each other but also the case where the components are fixed via other components. That is, in the following description, the expression of fixing and the like includes the meaning of direct and indirect fixing and the like of the components to each other.
Embodiment 1
< composition of piezoelectric vibration device 1 >)
The piezoelectric vibration device 1 of the present invention will be described with reference to fig. 1 to 3. Fig. 1 is a schematic exploded perspective view showing the overall configuration of a piezoelectric vibration device 1. Fig. 2 is a sectional view taken along the direction a in fig. 1. Fig. 3 is a plan view of the piezoelectric vibration device 1.
As shown in fig. 1 and 2, the piezoelectric vibration device 1 is a device having a piezoelectric element 7 that converts a force applied to a piezoelectric body into a voltage or converts a voltage applied to a piezoelectric body into a force. The piezoelectric vibration device 1 has a holding member 2, a piezoelectric element 7, and a cover member 10.
The holding member 2 is a container made of an insulator for holding the piezoelectric element 7. The holding member 2 is a ceramic housing in the present embodiment. The holding member 2 is formed by sintering ceramic powder. The holding member 2 may be formed by stacking a plurality of insulators. The holding member 2 has a bottom portion 3, an electrode pad 4, a side wall portion 6, and an external terminal 5.
The bottom 3 is a portion constituting the bottom surface of the holding member 2. The bottom 3 is formed by a rectangular plate-like member. An electrode pad 4 of a conductive metal is formed along one short side of the rectangular plate-like member on the upper surface of one surface of the bottom 3. The electrode pad 4 is electrically connected to the piezoelectric element 7. The electrode pad 4 is a part of an electrical circuit that applies a voltage to the piezoelectric element 7. An external terminal 5 of a conductive metal is deposited on the lower surface of the other surface of the bottom 3. The external terminal 5 is electrically connected to an external board not shown. The external terminal 5 is a terminal for transmitting a signal from an external substrate to the piezoelectric element 7 and applying a voltage. The electrode pad 4 and the external terminal 5 are electrically connected by a wiring pattern not shown.
The side wall portion 6 is a portion constituting a side surface of the holding member 2. The side wall portion 6 is located at the outer edge of the bottom portion 3. The side wall 6 is a frame-shaped wall surrounding the bottom 3. The side wall portion 6 extends upward from the upper surface of the bottom portion 3. The side wall 6 has a predetermined thickness from the outer surface toward the inner surface. The upper end portion of the side wall portion 6 has an engagement surface 6a with which the cover member 10 is engaged. The holding member 2 thus configured constitutes an internal space S for accommodating the piezoelectric element 7 by the upper surface of the bottom portion 3 and the inner side surface of the side wall portion 6. The holding member 2 is opened upward from the upper surface of the bottom 3. The electrode pad 4 is located in the inner space S.
The piezoelectric element 7 is a piezoelectric body that converts an applied force into a voltage, or converts an applied voltage into a force. In the present embodiment, the piezoelectric element 7 is a rectangular crystal resonator element obtained by cutting a crystal in a specific direction. In the piezoelectric element 7, the electrodes 8 are deposited on both of the pair of principal surfaces having the largest area. Part of the electrode 8 is led out to one end of the crystal resonator plate in the longitudinal direction. The piezoelectric element 7 is located in the inner space S of the holding member 2. The piezoelectric element 7 adheres the electrode 8 to the electrode pad 4 of the holding member 2 via the conductive bonding material 9. Thus, the piezoelectric element 7 can be electrically connected to the external substrate via the wiring pattern, not shown, from the electrode 8 to the electrode pad 4 and the external terminal 5. The piezoelectric element 7 is held by the holding member 2 in a cantilever-supported state. Thus, the piezoelectric element 7 oscillates at a predetermined frequency by a voltage applied from the external substrate.
The cover member 10 is a member that changes the internal space S of the holding member 2 into a sealed space. The cover member 10 is made of a metal material such as kovar. The lid member 10 is, for example, applied with electrolytic nickel plating or electroless nickel plating. The cover member 10 is positioned at the upper end of the holding member 2 such that the lower surface as one surface faces the holding member 2. The cover member 10 has a size to cover the opening of the internal space S in the holding member 2 as viewed in the Z direction in plan view. Further, the cover member 10 is smaller than the holding member 2 as viewed from the Z direction.
As shown in fig. 3, a frame-shaped sealing material 11 is provided in the lid member 10 at a portion overlapping the joint surface 6a of the side wall portion 6 of the holding member 2 as viewed in the Z direction. That is, when viewed from the Z direction, the cover member 10 has the sealing material 11 surrounding the opening portion of the holding member 2 at the portion contacting the bonding surface 6a of the holding member 2 when covering the internal space S including the piezoelectric element 7 bonded to the holding member 2. The sealing material 11 is a gold-tin alloy. The sealing material 11 has 2 longitudinal direction linear portions 11b extending in the X direction, 2 width direction linear portions 11a extending in the Y direction, and 4 corner portions 11c connecting the longitudinal direction linear portions 11b and the width direction linear portions 11a, as viewed in the Z direction.
The corner area Ar per unit length (see hatched portion) of the extending direction of the 4 corners 11c is larger than the longitudinal direction linear portion area Al per unit length (see hatched portion) of the extending direction of the longitudinal direction linear portion 11b and the width direction linear portion area As per unit length (see hatched portion) of the extending direction of the width direction linear portion 11a, as seen in the Z direction.
The sealing material 11 includes a eutectic alloy and a non-eutectic alloy having a melting point higher than that of the eutectic alloy. In the present embodiment, the corner 11c includes a non-eutectic alloy. The off-eutectic alloy may be contained in at least one of the width direction linear portion 11a and the length direction linear portion 11b, in addition to the corner portion 11 c. The cover member 10 is joined to the joining surface 6a of the holding member 2 via a sealing material 11. The interior space S of the holding member 2 is vacuum. The internal space S of the holding member 2 may be filled with nitrogen gas or the like.
In this way, the piezoelectric vibration device 1 seals the holding member 2 filled with nitrogen gas with the piezoelectric element 7 positioned in the internal space S by the cover member 10. The gold-tin alloy joining the lid member 10 and the holding member 2 contains a non-eutectic alloy having a melting point higher than that of the eutectic alloy. The corner 11c has a larger volume per unit length than the width direction linear portion 11a and the length direction linear portion 11b, and is therefore less likely to melt than the linear portion. Therefore, when the solder is melted and the piezoelectric vibration device 1 is mounted (reflow-mounted) on the external substrate, even if the sealing material 11 is melted by the heat of heating the solder, it is difficult to flow out to the cavity side. This can suppress the air tightness defect when the piezoelectric vibration device 1 is mounted on an external substrate.
Method of manufacturing piezoelectric vibration device 1
Next, a piezoelectric element sealing step S100 included in the method of manufacturing the piezoelectric vibration device 1 according to the present invention will be described with reference to fig. 4 to 8. Fig. 4 is a flowchart of a piezoelectric element sealing step S100 included in the method of manufacturing the piezoelectric vibration device 1. Fig. 5A is a plan view of the cover member 10 prepared in the sealing material-containing member preparation step S110 included in the method of manufacturing the piezoelectric vibration device 1. Fig. 5B is a side view in the width direction of the cover member 10 prepared in the member preparation step S110 with a sealing material included in the method of manufacturing the piezoelectric vibration device 1. Fig. 5C is a longitudinal side view of the cover member 10 prepared in the sealing material-containing member preparation step S110 included in the method of manufacturing the piezoelectric vibration device 1. Fig. 6 is a cross-sectional view taken along the direction a in fig. 3 of the holding member 2 and a cross-sectional view taken along the side of the cover member 10 mounted on the holding member 2 in the cover member mounting step S120 included in the method for manufacturing the piezoelectric vibration device 1. Fig. 7 is a side view showing the cover member 10 heated by the soldering iron 13 and a cross-sectional view of the holding member 2 heated by the holding member heating device 14 in the temporary fixing step S130 included in the manufacturing method of the piezoelectric vibration device 1. Fig. 8 is a cross-sectional view showing the lid member 10 heated and pressed by the lid member heating device 15 and the holding member 2 heated by the holding member heating device 14 in the sealing step S140 included in the manufacturing method of the piezoelectric vibration device 1.
As shown in fig. 4, the piezoelectric element sealing step S100 is a step of sealing the piezoelectric element 7 located in the internal space S of the holding member 2 by the cover member 10 (see fig. 2). The piezoelectric element sealing step S100 includes a sealing material-containing component preparation step S110, a cover member mounting step S120, a temporary fixing step S130, and a sealing step S140.
As an initial state of the piezoelectric vibration device 1, the piezoelectric element 7 is assembled to the holding member 2. The piezoelectric element 7 is bonded to the electrode pad 4 of the holding member 2 by a fusion bonding material. That is, the piezoelectric element 7 is assembled in a state that can oscillate by application of a voltage in the internal space S of the holding member 2.
As shown in fig. 4, 5A, 5B, and 5C, the sealing material-provided member preparation step S110 is a step of preparing the sealing material-provided member, i.e., the lid member 10, having the sealing material 11 provided in a predetermined state. In the sealing material-equipped component preparation step S110, in the prepared cover member 10, when the piezoelectric element 7 bonded to the holding member 2 is covered with the cover member 10, the sealing material 11 is applied to the cover member 10 at a portion where the lower surface, which is the surface facing the piezoelectric element 7, contacts the holding member 2 (see fig. 3). The sealing material 11 is a gold-tin alloy in a eutectic state.
The sealing material 11 provided on the lid member 10 is formed in a rectangular frame shape as seen in a plan view, i.e., in a direction perpendicular to the lower surface. That is, the sealing material 11 includes a linear 2-sided width direction linear portion 11a extending in the width direction of the lid member 10, a linear 2-sided length direction linear portion 11b extending in the length direction of the lid member 10, and circular arc-shaped 4 corner portions 11c connecting the width direction linear portion 11a and the length direction linear portion 11b, respectively. The width direction linear portion 11a and the length direction linear portion 11b extend in directions substantially perpendicular to each other. The 4 corners 11c have a predetermined curvature. The corner 11c comprises a non-eutectic alloy.
The width Wr in the radial direction of the 4 corner portions 11c is larger than the width Wl in the width direction of the cover member 10 of the 2 longitudinal direction straight portions 11b and the width Ws in the longitudinal direction of the cover member 10 of the 2 longitudinal direction straight portions 11 a. The 4 corner portions 11c have thick portions each having a thickness Tr thicker than a thickness Tl of the 2 longitudinal direction linear portions 11b in a direction perpendicular to the lower surface and a thickness Ts of the 2 width direction linear portions 11a in a direction perpendicular to the lower surface. That is, the 4 corner portions 11c protrude in a direction perpendicular to the lower surface of the cover member 10 than the width direction linear portions 11a and the length direction linear portions 11 b. Therefore, the volume per unit length of the extending direction of the 4 corner portions 11c of the sealing material 11 is larger than the volumes per unit length of the width direction straight portions 11a and the length direction straight portions 11 b.
As shown in fig. 4, 6, and 7, the cover member mounting step S120 is a step of mounting the cover member 10, which is the member with the sealing material prepared in the member with the sealing material preparation step S110, on the holding member 2. In the cover member mounting step S120, the holding member 2 is mounted on the holding member heating device 14. The holding member 2 is preheated by the holding member heating device 14 and maintained at a predetermined temperature. The cover member 10 is sucked by a suction nozzle 12 of a carrying device, which is a carrying unit. The lower surface of the lid member 10 provided with the sealing material 11 faces the holding member 2, and is mounted on the holding member 2 through the suction nozzle 12. The thick portion of the corner 11c of the sealing material 11 provided on the lower surface of the cover member 10 is in contact with the joint surface 6a of the holding member 2. On the other hand, the widthwise linear portion 11a and the lengthwise linear portion 11b of the sealing material 11 do not contact the joint surface 6 a.
As shown in fig. 4 and 7, the temporary fixing step S130 is a step of temporarily fixing the cover member 10 mounted on the holding member 2 in the cover member mounting step S120. In the temporary fixing step S130, the soldering iron 13 as a heating element is in contact with the upper surface of the cover member 10. The soldering iron 13 is located at substantially the center in the width direction and substantially the center in the length direction of the cover member 10. The cover member 10 is heated to a predetermined temperature by a soldering iron 13. Next, the sealing material 11 provided to the cover member 10 is heated by the cover member 10. Further, the sealing material 11 is heated by the holding member 2 maintained at a predetermined temperature by the holding member heating device 14.
A part of the thick wall portion of the corner 11c of the cover member 10 is melted. When the predetermined heating temperature and the predetermined heating time are reached, the soldering iron 13 is separated from the cover member 10. In this way, the cover member mounting step S120 heats the cover member 10 by the soldering iron 13 while the holding member 2 is heated by the holding member heating device 14. Therefore, the sealing material 11 melts faster than melting based on only the heat from the soldering iron 13. The amount of melting of the thick portion of the corner 11c is adjusted by the contact position of the soldering iron with the lid member 10, the contact area of the soldering iron with the lid member 10, the heating time for heating the lid member 10 by the soldering iron, and the heating temperature for heating the lid member 10 by the soldering iron.
The sealing material 11 is joined to the joining surface 6a of the holding member 2 in a state where the thickness Tr of the thick wall portion of the corner portion 11c is thinned by the amount of melting by heating of the soldering iron 13. Through the temporary fixing step S130, the sealing material 11 is melted by the soldering iron 13 and the heated holding member 2 and then solidified, whereby a non-eutectic alloy having a higher melting point than the eutectic alloy is produced. On the other hand, the widthwise linear portion 11a and the lengthwise linear portion 11b of the sealing material 11 do not contact the joint surface 6a of the holding member 2. That is, gaps are generated between the widthwise straight portions 11a and the lengthwise straight portions 11b of the sealing material 11 of the cover member 10 and the joint surfaces 6a of the side wall portions 6 of the holding member 2.
As shown in fig. 4, 7, and 8, the sealing step S140 is a step of sealing the holding member 2 by the cover member 10 temporarily fixed to the holding member 2 in the temporary fixing step S130. In the sealing step S140, the cover member 10 and the holding member 2 are heated in vacuum. The holding member 2 is heated to a predetermined temperature by the holding member heating device 14. The cover member 10 is pressed against the holding member 2 while being heated to a predetermined temperature by the cover member heating device 15. The sealing material 11 is melted by heat from the holding member heating device 14 and the lid member heating device 15.
As the thick portion of the corner 11c melts, the widthwise straight portion 11a and the lengthwise straight portion 11b of the sealing material 11 approach the joint surface 6a. At this time, in the internal space S of the holding member 2, gas is generated from the bonding material 9 or the like that bonds the piezoelectric element 7 and the electrode pad 4. The generated gas is discharged to the outside of the internal space S from the gaps between the widthwise straight portion 11a and the lengthwise straight portion 11b and the joint surface 6a.
When the thickness Ts of the width direction linear portion 11a, the thickness Tl of the longitudinal direction linear portion 11b, and the thickness Tr of the corner portion 11c are substantially the same due to the melting of the thick portion of the corner portion 11c, the width direction linear portion 11a, the longitudinal direction linear portion 11b, and the corner portion 11c come into contact with the joint surface 6a. That is, the cover member 10 is in contact with the joint surface 6a via the sealing material 11. When the sealing material 11 cools, the holding member 2 is joined to the cover member 10. Thereby, the holding member 2 is sealed at the opening by the cover member 10. At this time, the internal space S of the holding member 2 is vacuum.
In the cover member mounting step S120 of the method for manufacturing the piezoelectric vibration device 1 configured as described above, the cover member 10 is mounted on the holding member 2 via the sealing material 11. The cover member 10 is supported by the thick portion of the corner 11c at a position spaced from the joint surface 6a of the side wall 6 by a distance corresponding to the thickness Tr of the corner 11 c. Therefore, in the temporary fixing step S130, a gap is generated between the cover member 10 temporarily fixed by melting the thick portion of the corner 11c and the joint surface 6a of the side wall portion 6 of the holding member 2, at a portion other than the thick portion of the corner 11 c.
Therefore, in the sealing step S140, when the holding member 2 and the lid member 10 are heated in vacuum, the gas generated from the bonding material 9 or the like located in the internal space S of the holding member 2 is discharged from the gap between the holding member 2 and the lid member 10 to the outside of the internal space S. Further, since the cover member 10 provided with the sealing material 11 is directly heated by the soldering iron 13, heat from the soldering iron 13 is efficiently transferred to the sealing material 11 via the metallic cover member 10. This can exhaust the gas generated from the joining material 9 and the like located in the internal space S of the holding member 2.
The holding member 2 of the piezoelectric vibration device 1 manufactured by the above-described method for manufacturing the piezoelectric vibration device 1 is bonded to the cover member 10 by the sealing material 11 having the thickness Tr of the corner 11c thicker than the thickness Ts of the widthwise straight portion 11a and the thickness Tl of the lengthwise straight portion 11 b. Therefore, the corner area Ar per unit length in the extending direction of the 4 corners 11c of the sealing material 11 is larger than the longitudinal direction linear portion area Al per unit length in the extending direction of the longitudinal direction linear portion 11b and the width direction linear portion area As per unit length in the extending direction of the width direction linear portion 11a, as viewed in the Z direction. In the temporary fixing step S130, the sealing material 11 is melted and solidified to form the off-eutectic alloy. Therefore, the corner 11c of the sealing material 11 is less likely to melt than the width direction linear portion 11a and the longitudinal direction linear portion 11 b. The sealing material 11 of the piezoelectric vibration device 1 configured as described above is not easily flowed out to the cavity side even when melted when solder is melted and mounted (reflow-mounted) on an external substrate.
Embodiment 2
A piezoelectric element sealing step S100A included in the method of manufacturing the piezoelectric vibration device 1 according to embodiment 2 of the present invention will be described with reference to fig. 4 and 9. Fig. 9 is a side view of the cover member 10 heated by the soldering iron 13 and a cross-sectional view of the holding member 2 heated by the holding member heating device 14 in fig. 3 in the temporary fixing step S130A included in the manufacturing method of the piezoelectric vibration device 1. In the following embodiments, the same points as those of the embodiments described above will be omitted from the detailed description, and the description will be focused on different portions.
As shown in fig. 4, the piezoelectric element sealing step S100A includes a component preparation step S110 with a sealing material, a cover member mounting step S120, a temporary fixing step S130A, and a sealing step S140.
In the cover member mounting step S120, the cover member 10 is suctioned by the suction nozzle 12 of the conveying device, which is the mounting unit. The suction nozzle 12 is located at the substantially center in the width direction of the cover member 10 and is offset to one side from the substantially center in the longitudinal direction. The lower surface of the cover member 10 provided with the sealing material 11 faces the holding member 2 and is mounted on the holding member 2.
As shown in fig. 4 and 9, the temporary fixing step S130A is a step of temporarily fixing the cover member 10 mounted on the holding member 2 in the cover member mounting step S120 to the holding member 2. In the temporary fixing step S130A, the soldering iron 13 as a heating element is in contact with the upper surface of the cover member 10 in a state where the cover member 10 is adsorbed by the adsorption nozzle 12, which is a mounting unit. The soldering iron 13 is located at the substantially center in the width direction of the cover member 10, and is offset to the other side than the substantially center in the longitudinal direction. That is, in the temporary fixing step S130A, the cover member 10 is in contact with the soldering iron 13 at a position closer to the other outer edge than the center of the cover member 10 in the longitudinal direction in a plan view. Thus, the soldering iron 13 is in contact with the cover member 10 at a distance from the suction nozzle 12.
Further, the cover member 10 is heated to a predetermined temperature by the soldering iron 13 in a state of being sucked by the suction nozzle 12. The cover member 10 is heated by the soldering iron 13 and by the holding member 2 maintained at a prescribed temperature by the holding member heating device 14. A part of the thick wall portion of the corner 11c in the sealing material 11 of the lid member 10 is melted. At this time, the cover member 10 is engaged with the engagement surface 6a of the holding member 2 in a state where the position with respect to the holding member 2 is held by the suction nozzle 12. When the predetermined heating temperature and the predetermined heating time are reached, the soldering iron 13 is separated from the cover member 10.
In the above-described configuration, the cover member 10 is temporarily fixed to the holding member 2 in a state where the position with respect to the holding member 2 is held by the suction nozzle 12. That is, when the thick portion of the corner 11c is melted, the cover member 10 is not displaced from the holding member 2. Therefore, the positional accuracy of the cover member 10 temporarily fixed to the holding member 2 via the thick-walled portion of the corner 11c is improved, and the time required for transferring from the cover member mounting step S120 to the temporary fixing step S130 can be shortened. This can exhaust the gas generated from the joining material 9 or the like located in the internal space S of the holding member 2 without increasing the working time.
Embodiment 3
A piezoelectric element sealing step S100B included in the method of manufacturing the piezoelectric vibration device 1 according to embodiment 3 of the present invention will be described with reference to fig. 4 and 10. Fig. 10 is a side view of the cover member 10 heated by the soldering iron 13 and a cross-sectional view of the holding member 2 heated by the holding member heating device 14 in fig. 3 in the temporary fixing step S130B included in the manufacturing method of the piezoelectric vibration device 1.
As shown in fig. 4, the piezoelectric element sealing step S100B includes a component preparation step S110 with a sealing material, a cover member mounting step S120, a temporary fixing step S130B, and a sealing step S140.
As shown in fig. 4 and 10, the temporary fixing step S130B is a step of temporarily fixing the cover member 10 to the holding member 2. In the temporary fixing step S130B, the soldering iron 13 is in contact with the upper surface of the cover member 10 in a state where the cover member 10 is held by the suction nozzle 12. The soldering iron 13 is located at a portion overlapping with at least a part of the sealing material 11 as seen in a direction perpendicular to the upper surface of the cover member 10 (in plan view). In the present embodiment, the soldering iron 13 is located at a portion overlapping with the thick wall portion of the corner 11c of the sealing material 11, as viewed from the direction perpendicular to the upper surface of the cover member 10. That is, the soldering iron 13 is located closest to the corner 11c having a thickness in the sealing material 11.
Further, the cover member 10 is heated to a predetermined temperature by the soldering iron 13, and is pressed against the holding member 2 with a predetermined force. The sealing material 11 is heated and pressed by the cover member 10 heated by the soldering iron 13, and is heated by the holding member 2 maintained at a prescribed temperature by the holding member heating device 14. Thereby, a part of the thick portion of the corner 11c is melted. When the predetermined heating time and pressing time are reached, the soldering iron 13 is separated from the cover member 10.
In the present embodiment, the soldering iron 13 is in contact with a portion of the cover member 10 overlapping at least a part of the sealing material 11 in a plan view. That is, the soldering iron 13 contacts the outer edge side of the center of the cover member 10 in a plan view.
The cover member 10 having the outer edge supported by the holding member 2 is pressed against the holding member 2 by the soldering iron 13 at a position closer to the portion supported by the holding member 2 than the center of the cover member 10. The cover member 10 is elastically deformed toward the holding member 2 by the pressing of the soldering iron 13. The elastic deformation amount of the cover member 10 generated when the soldering iron 13 presses the center of the cover member 10 at an arbitrary outer edge side is smaller than the elastic deformation amount generated when the soldering iron 13 presses the center of the cover member 10. Therefore, by pressing the soldering iron 13 to a position on an arbitrary outer edge side from the center of the cover member 10, it is possible to suppress the influence of the engaging portion when the cover member 10 is restored to the state before elastic deformation after temporary fixing. Thereby, the cover member 10 is temporarily fixed to the holding member 2 as appropriate.
In the temporary fixing step S130B, when the sealing material 11 of the cover member 10 sucked by the suction nozzle 12 is heated by the soldering iron 13, the heat transferred from the soldering iron 13 to the cover member 10 is transferred not only to the sealing material 11 but also to the suction nozzle 12. The heat transferred to the suction nozzle 12 is not melted by the sealing material 11 but is discharged to the outside. Therefore, the sealing material 11 is supplied with more heat by suppressing the heat transferred from the soldering iron 13 to the suction nozzle 12. Therefore, in order to suppress heat transferred to the suction nozzle 12, the soldering iron 13 is preferably heated as far as possible from the suction nozzle 12.
In the temporary fixing step S130B, the portion of the lid member 10 overlapping the corner 11c of the sealing material 11 is heated by the soldering iron 13 as viewed from the direction perpendicular to the upper surface of the lid member 10, so that the heat of the soldering iron 13 is more efficiently transferred to the thick portion of the sealing material 11. Therefore, in the temporary fixing step S130, the cover member 10 can be temporarily fixed to the holding member 2 without reducing the melting speed of the corner 11c, which is a thick portion. This can exhaust the gas generated from the joining material 9 or the like located in the internal space S of the holding member 2 without increasing the working time.
Other embodiments
In the above embodiment, in the temporary fixing steps S130 and S130A, S B, the cover member 10 is heated by the soldering iron 13 while being sucked by the suction nozzle 12. However, in the temporary fixing step, the cover member may be heated by a soldering iron in a state of not being sucked by the suction nozzle.
When the cover member is heated by the soldering iron in a state where the cover member is not sucked by the suction nozzle, the cover member is held at a position having a slight gap with the joint surface of the holding member by the suction nozzle in the cover member transfer step.
Next, in the temporary fixing step, the cover member attached to the suction nozzle is separated from the suction nozzle and then brought into contact with the holding member. For example, after the cover member attached to the suction nozzle is separated from the suction nozzle by the soldering iron moving toward the holding member, the cover member is pressed against the holding member by the soldering iron. Further, the cover member is heated in a state of being pressed against the holding member by the soldering iron. That is, the cover member is heated by the soldering iron in a state of not being in contact with the suction nozzle. Therefore, the heat transferred from the soldering iron to the cover member is transferred to the sealing material without escaping to the outside through the suction nozzle.
In the temporary fixing step configured as described above, the heat of the soldering iron is not transferred from the suction nozzle to the outside but is efficiently transferred to the sealing material, so that the melting speed of the sealing material is increased and the melting range of the sealing material is widened. This shortens the working time of the temporary fixing step. Further, the temporary fixing strength between the cover member and the holding member by the sealing material is improved. Further, since heat is not discharged from the suction nozzle to the outside, a decrease in temperature of the soldering iron can be suppressed in the case where a plurality of cover members are temporarily fixed in succession. Thus, even if a plurality of cover members are temporarily fixed continuously by the soldering iron, the quality of the temporary fixation is stable. The temporary fixing step of heating by the soldering iron in a state where the cover member is not adsorbed by the adsorbing nozzle is suitable for a case where the adsorbing nozzle is a metal adsorbing nozzle having high thermal conductivity.
In the above embodiment, the lid member 10 provided with the sealing material 11 is prepared in the sealing material-attached member preparation step S110. However, as shown in fig. 11, the sealing material-provided member preparation step S110 may be performed to prepare the holding member 2 provided with the sealing material 11. In the cover member mounting step S120, the cover member 10 without the sealing material 11 is mounted on the holding member 2.
In the above embodiment, the holding member 2 has a rectangular shape in a plan view, for example. The holding member 2 is configured to have a long side of 2.0mm and a short side of 1.6mm, for example. The holding member 2 is configured to have a long side of 1.6mm and a short side of 1.2mm, for example. The holding member 2 is configured to have a long side of 1.2mm and a short side of 1.0mm, for example.
The diameter (adsorption area) of the adsorption nozzle 12 and the size (contact area) of the contact portion of the soldering iron 13 are determined based on the size of the holding member 2 (cover member 10). For example, the diameter of the suction nozzle 12 is about 1/3 of the long side of the lid member 10 with respect to the holding member 2 having a size of 1.2mm on the long side and 1.0mm on the short side (see fig. 12). For example, the size of the tip of the soldering iron 13 is about 1/2 of the long side of the cover member 10 in the long side direction of the cover member 10 with respect to the holding member 2 having a size of 1.2mm on the long side and 1.0mm on the short side.
In the above embodiment, the temporary fixing steps S130, S130A, and S130B heat the cover member 10 by the soldering iron 13, and heat the holding member 2 by the holding member heating device 14. However, the temporary fixing step may be configured to heat only the cover member with the heat generating body.
In the above embodiment, the temporary fixing steps S130, S130A, and S130B heat the cover member 10 by directly contacting the cover member 10 with the soldering iron 13. However, the temporary fixing step may not be directly in contact with the heat generating element such as a soldering iron when the cover member is heated. The temporary fixing step may be configured by heating the cover member 10 and the holding member in a heating furnace, for example. In addition, heating by far infrared rays or laser light may be used.
In the above embodiment, the temporary fixing steps S130, S130A, and S130B heat the cover member 10 by bringing the soldering iron 13 into direct contact with the cover member 10. However, the temporary fixing step may be configured such that the cover member is directly heated by pressing the cover member with a heating element such as a soldering iron. In the temporary fixing step, the cover member is heated by the heat generating body while being pressed against the holding member by the heat generating body. Therefore, the melting speed of the thick portion located between the cover member and the holding member increases. This can exhaust the gas generated from the joining material or the like located in the inner space of the holding member.
In the above embodiment, the temporary fixing step S130A directly contacts the soldering iron 13 in a state where the cover member 10 is sucked by the suction nozzle 12. However, the temporary fixing step may be configured to press the cover member while holding the cover member by a mounting means such as an adsorption nozzle. The cover member is heated by the heating element in a state of being pressed by the mounting unit to the holding member. This can exhaust the gas generated from the joining material or the like located in the inner space of the holding member.
In the above embodiment, the temporary fixing step S130A brings the soldering iron 13 into contact with the cover member 10 while the cover member 10 is sucked by the suction nozzle 12. However, the temporary fixing step may be configured such that the cover member 10 is held by a mounting unit such as a suction nozzle, and the cover member is pressed by the mounting unit and a heating element such as a soldering iron. The cover member is heated by the heat generating body while being pressed by the mounting unit and the heat generating body, respectively. At this time, the mounting unit and the heating element are positioned so as to be a wire object sandwiching the center line in the longitudinal direction of the cover member. Therefore, in the temporary fixing step, the load per unit area applied to the sealing material can be made nearly uniform. This can suppress variation in the joint state of the 4 corners.
In the above embodiment, the temporary fixing step S130A brings the soldering iron 13 into contact with the cover member 10 held by the suction nozzle 12. However, the temporary fixing step may be performed by heating the lid member with the suction nozzle directly or indirectly heated by the heating element in a state where the lid member is held by the mounting unit such as the suction nozzle. This can exhaust the gas generated from the joining material or the like located in the inner space of the holding member.
In the above embodiment, the piezoelectric element 7 of the piezoelectric vibration device 1 is located in the internal space S of the holding member 2. However, the piezoelectric element and the electronic component element of the piezoelectric vibration device may be located in the internal space of the holding member. The electronic component element is an integrated circuit element at least comprising an oscillating circuit. The electronic component element may be a vibrator having a temperature sensor incorporated therein.
In the above embodiment, the sealing material 11 is a gold-tin alloy. However, the sealing material may be formed of a material capable of sealing the holding member with the cover member. The sealing material may be, for example, a metal solder, a thermoplastic resin, a glass material, or the like.
In the above embodiment, the piezoelectric element sealing step S100 bonds the cover member 10 to the holding member 2 in a monolithic state. However, in the piezoelectric element sealing step, the cover member may be bonded to each of the sheet members in which a plurality of holding members are connected in a matrix.
The plurality of holding members 2 are integrally formed as sheet members connected to each other. The size of the sheet member is the same regardless of the size of the holding member 2. That is, the number of holding members 2 included in the sheet-like member varies depending on the size of the holding members 2. With such a configuration, even if the size of the holding member 2 is changed, the method of manufacturing the piezoelectric vibration device does not need to adjust the manufacturing apparatus of the piezoelectric vibration device or the like in accordance with the size of the holding member 2.
In the above embodiment, the piezoelectric element 7 of the piezoelectric vibration device 1 is located in the internal space S of the holding member 2. However, the piezoelectric vibration device may be a piezoelectric vibration device having a so-called H-type structure, and may have a bottom portion and frame-shaped side wall portions extending in directions perpendicular to the respective opposing 2 planes of the bottom portion. In the piezoelectric vibration device having the H-shaped structure, the piezoelectric element is located on one plane of the bottom portion and inside one of the side wall portions. In the piezoelectric resonator device having the H-shaped structure, the electronic component element is mounted on the other plane of the bottom portion and is positioned inside the other side wall portion. In the piezoelectric vibration device having the H-shaped structure, the cover member is bonded to the distal end portion of the one side wall portion and the distal end portion of the other side wall portion, respectively, via a sealing material.
The embodiments of the present invention have been described above, but the above embodiments are merely examples for implementing the present invention. Therefore, the present invention is not limited to the above-described embodiment, and the above-described embodiment can be modified and implemented as appropriate within a range not departing from the gist thereof.
Description of the reference numerals
1 piezoelectric vibration device
2 holding member
3 bottom part
4 electrode pad
5 external terminal
6 side wall portion
6a joint surface
7 piezoelectric element
8 electrode
9 bonding material
10 cover member
11 sealing material
11a longitudinal straight portion
11b width direction straight line portion
11c corner (thick wall part)
12 adsorption nozzle
13 soldering iron
14 holding member heating device
15 cover part heating device
S interior space
As width direction straight line area
Area of Al longitudinal straight line
S100, S100A, S B piezoelectric element sealing procedure
S110 component preparation Process with sealing Material
S120 cover member mounting step
S130, S130A, S B temporary fixing Process
And S140, sealing.
Claims (9)
1. A method of manufacturing a piezoelectric vibration device, the piezoelectric vibration device having at least:
a piezoelectric element;
a holding member engaged with the piezoelectric element;
a cover member covering the piezoelectric element bonded to the holding member,
The cover member is engaged with the holding member to which the piezoelectric element is engaged through the sealing material,
the method for manufacturing the piezoelectric vibration device is characterized by comprising the following steps:
a member preparation step of preparing the cover member or the holding member, wherein the cover member or the holding member is provided with a frame-shaped sealing material having a rectangular shape in a plan view, and at least a part of a portion of one of the cover member and the holding member, which is in contact with the other, is provided with a thick wall portion having at least 1 corner of the sealing material thicker than a portion other than the corner, when the piezoelectric element bonded to the holding member is covered with the cover member;
a cover member mounting step of bringing the thick portion of one of the cover member and the holding member into contact with the other, and mounting the cover member on the holding member to which the piezoelectric element is bonded;
a temporary fixing step of heating at least a cover member mounted on the holding member, and melting at least a part of the thick portion to temporarily fix the cover member and the holding member;
and a sealing step of heating the cover member and the holding member, which are temporarily fixed, respectively, and melting the sealing material including the thick portion to seal the cover member and the holding member.
2. The method of manufacturing a piezoelectric vibration device according to claim 1, wherein in the temporary fixing step, a heating element is brought into contact with a part of the cover member to heat the cover member.
3. The method of manufacturing a piezoelectric vibration device according to claim 2, wherein in the temporary fixing step, the cover member is heated in a state where the cover member is held by a mounting unit.
4. A method of manufacturing a piezoelectric vibration device according to claim 2 or claim 3, wherein in the temporary fixing step, the cover member is pressed by the heating element.
5. The method of manufacturing a piezoelectric vibration device according to claim 4, wherein in the temporary fixing step, a portion of the cover member overlapping at least a part of the sealing material in a plan view is pressed.
6. The method of manufacturing a piezoelectric vibration device according to any one of claims 2 to 5, wherein in the temporary fixing step, the heating element is brought into contact with a position on an arbitrary outer edge side than a center of the cover member in a plan view to heat the cover member.
7. The method of manufacturing a piezoelectric vibration device according to any one of claims 1 to 6, wherein the sealing material is a gold-tin alloy.
8. A piezoelectric vibration device manufactured according to the method for manufacturing a piezoelectric vibration device according to any one of claims 1 to 7.
9. A piezoelectric vibration device manufactured by the method for manufacturing a piezoelectric vibration device according to any one of claims 1 to 7, characterized in that,
the sealing material includes a eutectic alloy and a non-eutectic alloy having a melting point higher than that of the eutectic alloy, and the sealing material includes the non-eutectic alloy in at least 1 corner of the sealing material in a rectangular frame shape in a plan view.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-131778 | 2021-08-12 | ||
| JP2021131778 | 2021-08-12 | ||
| PCT/JP2022/029159 WO2023017743A1 (en) | 2021-08-12 | 2022-07-28 | Piezoelectric vibration device and method for manufacturing piezoelectric vibration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117280602A true CN117280602A (en) | 2023-12-22 |
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| CN202280031818.2A Pending CN117280602A (en) | 2021-08-12 | 2022-07-28 | Piezoelectric vibration device and method for manufacturing piezoelectric vibration device |
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| Country | Link |
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| JP (1) | JPWO2023017743A1 (en) |
| CN (1) | CN117280602A (en) |
| TW (1) | TWI836544B (en) |
| WO (1) | WO2023017743A1 (en) |
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|---|---|---|---|---|
| JP3786097B2 (en) * | 2002-03-25 | 2006-06-14 | セイコーエプソン株式会社 | Piezoelectric device lid sealing method, piezoelectric device manufacturing method, and piezoelectric device lid sealing device |
| JP2006049353A (en) * | 2004-07-30 | 2006-02-16 | Kyocera Kinseki Corp | Manufacturing method of package |
| TW201010272A (en) * | 2008-02-18 | 2010-03-01 | Seiko Instr Inc | Method for fabricating piezoeledctric vibrator, piezoeledctric vibrator, oscillator, electronic apparatus and radio-controlled clock |
| JP2011228352A (en) * | 2010-04-15 | 2011-11-10 | Daishinku Corp | Lid, base and package for electronic component |
| JP5508192B2 (en) * | 2010-08-24 | 2014-05-28 | 日本電波工業株式会社 | Piezoelectric device manufacturing method and piezoelectric device |
| JP2014038970A (en) * | 2012-08-18 | 2014-02-27 | Seiko Epson Corp | Method for manufacturing electronic device and electronic device |
| JP2014072883A (en) * | 2012-10-02 | 2014-04-21 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device |
| KR102460754B1 (en) * | 2016-03-17 | 2022-10-31 | 삼성전기주식회사 | Element package and manufacturing method for the same |
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2022
- 2022-07-28 CN CN202280031818.2A patent/CN117280602A/en active Pending
- 2022-07-28 WO PCT/JP2022/029159 patent/WO2023017743A1/en active Application Filing
- 2022-07-28 JP JP2023541403A patent/JPWO2023017743A1/ja active Pending
- 2022-08-05 TW TW111129580A patent/TWI836544B/en active
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| JPWO2023017743A1 (en) | 2023-02-16 |
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| WO2023017743A1 (en) | 2023-02-16 |
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