CN117156680A - High-precision windowing process for aluminum-based flexible circuit board - Google Patents
High-precision windowing process for aluminum-based flexible circuit board Download PDFInfo
- Publication number
- CN117156680A CN117156680A CN202311184842.2A CN202311184842A CN117156680A CN 117156680 A CN117156680 A CN 117156680A CN 202311184842 A CN202311184842 A CN 202311184842A CN 117156680 A CN117156680 A CN 117156680A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- sided
- film
- protective film
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 36
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000001681 protective effect Effects 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 11
- 238000004080 punching Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000005056 compaction Methods 0.000 claims description 3
- 239000007888 film coating Substances 0.000 claims description 3
- 238000009501 film coating Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims 2
- 238000003475 lamination Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 48
- 238000003466 welding Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003872 anastomosis Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A high-precision windowing process for an aluminum-based flexible circuit board belongs to the technical field of production processes of flexible circuit boards, and adopts a laser to precisely position an opening protection film to replace an original post-opening laminating process of the protection film. And the base film surface is windowed after forming the circuit, so that no step difference exists between photosensitive film lamination and protective film lamination, the lamination technical difficulty can be obviously reduced, and the quality reliability and yield are improved.
Description
Technical Field
The application relates to a production process of an aluminum-based flexible circuit board, in particular to a high-precision windowing process in the production process of the aluminum-based flexible circuit board.
Background
The flexible circuit board is a printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, is called a flexible board or FPC for short, and has the characteristics of high wiring density, light weight and thin thickness.
At present, in the production process of aluminum-based flexible circuit boards, firstly, window opening treatment is needed on a film, then, the aluminum substrate is processed with alignment holes, and then, the bottom protection film and the aluminum material are accurately positioned through alignment equipment, and then, are pressed and cured.
The alignment work of the high alignment precision treatment process applied to the laser fiber welding FPC disclosed in the publication No. CN113411973A is as follows: respectively aligning and bonding the cover film and the bottom surface and the top surface of the FPC substrate, and comprising the following steps: taking two groups of covering films; sequentially aligning and superposing one group of cover films, the FPC and the other group of cover films on the PIN sleeving jig through the positioning holes; mounting the PIN sleeving jig on a fake-paste machine; the coverlay film and the FPC were adhered by a dummy laminator.
The comparison technology does not solve the problems that the whole FPC process flow is long, the cost is high, the product has a section difference during dry film lamination, the lamination difficulty is high, and the yield is low; and double-sided photosensitive film sticking and double-sided exposure, resulting in the problem of high material and equipment costs.
Disclosure of Invention
The application aims at solving the existing problems, and provides a bonding process for replacing the original protective film opening by adopting a laser to accurately position an opening protective film. And the base film surface is windowed after forming the circuit, so that no step difference exists between photosensitive film lamination and protective film lamination, the lamination technical difficulty can be obviously reduced, and the quality reliability and yield are improved.
In order to achieve the technical purpose, the technical scheme provided at present is as follows: a high precision windowing process for an aluminum-based flexible circuit board, comprising:
A. selecting materials: selecting a coiled aluminum substrate and a PI protective film; the PI protective film is provided with a plurality of universal openings;
B. sticking film: respectively feeding an aluminum substrate and a PI protective film by using a coiling machine; the PI protective film is pressed tightly with the lower surface of the aluminum substrate through a pressing roller, so that the PI protective film is attached to the lower surface of the aluminum substrate to form a single-sided aluminum substrate;
C. exposure: covering the upper surface of the single-sided aluminum substrate with a photosensitive film; transferring the image through exposure, and leaving an exposure circuit which is not corroded during etching after projection to form a single-sided prefabricated circuit board;
D. etching: developing and etching the single-sided exposed light on the single-sided prefabricated circuit board by using etching liquid, and then stripping the exposed photosensitive film to form the single-sided circuit board;
E. punching: forming an upper opening circuit board by punching a required opening on the upper PI protective film of the single-sided circuit board;
F. and (3) film coating: pressing the PI protective film and the upper surface of the upper opening circuit board so that the PI protective film is attached to the upper surface of the upper opening circuit board;
G. punching: and forming the double-sided opening circuit board on the lower PI protective film of the upper opening circuit board through laser forming.
In an embodiment, in the step B, after the PI protective film and the lower surface of the aluminum substrate are pressed by the pressing roller; in the step F, the PI protective film and the upper surface of the single-sided circuit board are pressed by a pressing roller; the film needs to be cured after the compaction.
In an embodiment, in step B, the feeding speed is between 1.5M/min and 2.5M/min.
Compared with the prior art, the application has the following beneficial effects: the PIN jig is omitted, so that the whole process flow is shortened, and the cost is reduced; and the photosensitive film has no step difference, low lamination difficulty and high yield. And the step of single-sided photosensitive film pasting and single-sided exposure has low material and equipment cost.
Detailed Description
The technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
An embodiment, a high-precision windowing process of an aluminum-based flexible circuit board, includes:
A. selecting materials: selecting a coiled aluminum substrate and a PI protective film; the PI protective film is provided with a plurality of universal openings;
B. sticking film: respectively feeding an aluminum substrate and a PI protective film by using a coiling machine; the PI protective film is pressed tightly with the lower surface of the aluminum substrate through a pressing roller, so that the PI protective film is attached to the lower surface of the aluminum substrate to form a single-sided aluminum substrate;
C. exposure: covering the upper surface of the single-sided aluminum substrate with a photosensitive film; transferring the image through exposure, and leaving an exposure circuit which is not corroded during etching after projection to form a single-sided prefabricated circuit board;
D. etching: developing and etching the single-sided exposed light on the single-sided prefabricated circuit board by using etching liquid, and then stripping the exposed photosensitive film to form the single-sided circuit board;
E. punching: forming an upper opening circuit board by punching a required opening on the upper PI protective film of the single-sided circuit board;
F. and (3) film coating: feeding the PI protection film by using a coiling machine, and compacting the PI protection film and the upper surface of the upper opening circuit board by using a compression roller so that the PI protection film is attached to the upper surface of the upper opening circuit board;
G. punching: and forming a double-sided opening circuit board on the lower PI protective film of the upper opening circuit board through laser forming and matching with the opening on the upper surface.
In step B of the present embodiment, after the PI protective film and the lower surface of the aluminum substrate are pressed by the pressing roller; in the step F, the PI protective film and the upper surface of the single-sided circuit board are pressed by a pressing roller; the film needs to be cured after the compaction.
In step B of this embodiment, the feeding speed is between 1.5M/min and 2.5M/min. The preferred speed for this example is 2M/min.
In step a of this embodiment, the raw material is selected as an aluminum substrate, and because ultrasonic welding is performed by using high-density energy generated by ultrasonic high-frequency mechanical vibration, plastic deformation is generated on the surface of the workpiece, and the surface layer is broken under the action of pressure, so that the welded metal is physically connected at room temperature. Although ultrasonic welding can destroy about 3% of the film layers, the heat conduction efficiency is relatively good due to continuous non-melting welding. Meanwhile, ultrasonic welding has a certain advantage in material cost, and is suitable for thin products. Copper slabs of the international mainstream flat products are generally between 0.12mm and 0.2 mm. In the present application, the aluminum substrate is selected so that the thickness of the FPC in the latter stage can be selected to be 0.2 to 0.3mm at the time of ultrasonic welding.
In the step G, the upper opening double-sided circuit board with the holes in the step E is not required to be overturned and then subjected to the next operation, and the position of the laser cutting machine positioned at the lower part is controlled by detecting the opening path of the upper opening double-sided circuit board, so that the complete anastomosis of the upper surface path and the lower surface path is realized. In the prior art, a mode that one group of cover films, FPC and the other group of cover films are sequentially aligned and overlapped on the PIN sleeving jig through the positioning holes is omitted, and a large amount of work flow is saved.
While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (3)
1. The high-precision windowing process of the aluminum-based flexible circuit board is characterized by comprising the following steps of:
A. selecting materials: selecting a coiled aluminum substrate and a PI protective film; the PI protective film is provided with a plurality of universal openings;
B. sticking film: respectively feeding an aluminum substrate and a PI protective film by using a coiling machine; the PI protective film is pressed tightly with the lower surface of the aluminum substrate through a pressing roller, so that the PI protective film is attached to the lower surface of the aluminum substrate to form a single-sided aluminum substrate;
C. exposure: covering the upper surface of the single-sided aluminum substrate with a photosensitive film; transferring the image through exposure, and leaving an exposure circuit which is not corroded during etching after projection to form a single-sided pre-circuit board;
D. etching: developing and etching the single-sided exposure on the single-sided pre-circuit board by using etching liquid, and then stripping the exposed photosensitive film to form the single-sided circuit board;
E. punching: forming an upper opening circuit board by punching a required opening on the upper PI protective film of the single-sided circuit board;
F. and (3) film coating: pressing the PI protective film and the upper surface of the upper opening circuit board so that the PI protective film is attached to the upper surface of the upper opening circuit board;
G. punching: and forming the double-sided opening circuit board on the lower PI protective film of the upper opening circuit board through laser forming.
2. The high-precision windowing process of an aluminum-based flexible circuit board according to claim 1, wherein in the step B, after the PET film and the lower surface of the aluminum-based substrate are pressed by a pressing roller; in the step E, the PET film and the upper surface of the single-sided circuit board are pressed by a pressing roller; the film needs to be cured after the compaction.
3. The high precision windowing process of an aluminum-based flexible circuit board of claim 1, wherein in step B, the feeding speed is between 1.5M/min and 2.5M/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311184842.2A CN117156680A (en) | 2023-09-14 | 2023-09-14 | High-precision windowing process for aluminum-based flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311184842.2A CN117156680A (en) | 2023-09-14 | 2023-09-14 | High-precision windowing process for aluminum-based flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117156680A true CN117156680A (en) | 2023-12-01 |
Family
ID=88911874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311184842.2A Pending CN117156680A (en) | 2023-09-14 | 2023-09-14 | High-precision windowing process for aluminum-based flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117156680A (en) |
-
2023
- 2023-09-14 CN CN202311184842.2A patent/CN117156680A/en active Pending
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