CN117047324B - Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate - Google Patents
Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate Download PDFInfo
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- CN117047324B CN117047324B CN202311140860.0A CN202311140860A CN117047324B CN 117047324 B CN117047324 B CN 117047324B CN 202311140860 A CN202311140860 A CN 202311140860A CN 117047324 B CN117047324 B CN 117047324B
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- dimensional code
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- 239000000919 ceramic Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000010147 laser engraving Methods 0.000 title claims abstract description 23
- 238000005406 washing Methods 0.000 claims abstract description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 55
- 238000001035 drying Methods 0.000 claims description 24
- 238000005554 pickling Methods 0.000 claims description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 11
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 7
- 230000003078 antioxidant effect Effects 0.000 claims description 7
- 238000004364 calculation method Methods 0.000 claims description 6
- 238000007605 air drying Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000006356 dehydrogenation reaction Methods 0.000 claims description 5
- 238000007602 hot air drying Methods 0.000 claims description 5
- 239000001294 propane Substances 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 5
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005237 degreasing agent Methods 0.000 description 2
- 239000013527 degreasing agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of copper-clad ceramic substrates, in particular to a reworking method for laser engraving of two-dimensional codes on a ceramic copper-clad carrier. The method comprises the steps of sequentially treating a ceramic copper-clad carrier plate with a two-dimensional code through a plurality of processes by using a horizontal line, and thoroughly removing the original two-dimensional code on the ceramic copper-clad carrier plate by a method of proportioning solutions with different concentrations, wherein the solutions comprise an oil removal solution, a microetching solution, an acid washing solution, an OSP solution and the like; and engraving the treated ceramic copper-clad carrier plate through special reworking parameters and different laser light sources, so as to achieve the purpose of reworking and prepare the reworked two-dimensional code. The reworking method of the laser engraving two-dimensional code can ensure that the two-dimensional code is still readable after the customer finishes the secondary reflow soldering.
Description
Technical Field
The invention relates to the technical field of copper-clad ceramic substrates, in particular to a reworking method for laser engraving of two-dimensional codes on a ceramic copper-clad carrier.
Background
The ceramic copper-clad carrier plate (DCB/AMB/DPC) is formed by high-temperature sintering, has larger surface roughness (the roughness is Ra:0.5-0.8, rz:1.5-2.5, rmax: 5-15), has a grain range of 100-1500 mu m, has larger grain difference between different thicknesses and different types of products, has complex manufacturing process, and often has the problem of reworking the products due to oxidation pollution and the like in the production process. The common reworking method uses 5% -10% sulfuric acid, however, if the product is provided with a two-dimensional code, the color of the two-dimensional code is light, the two-dimensional code is readable in a factory, but after the product is sent to a client and subjected to reflow soldering twice, the two-dimensional code gradually disappears, and cannot be read. If the product is directly covered by coding after the sulfuric acid reworking, the reworked two-dimension code can interfere with the original two-dimension code after the client is subjected to reflow soldering for two times, so that the two-dimension code cannot be read.
Therefore, we propose a reworking method for laser engraving of two-dimensional codes by using a ceramic copper-clad carrier plate.
Disclosure of Invention
The invention aims to provide a reworking method for laser engraving of a two-dimensional code on a ceramic copper-clad carrier plate, which aims to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme:
the reworking method for laser engraving of the two-dimensional code by the ceramic copper-clad carrier plate is characterized by comprising the following steps of:
step S1: placing a ceramic copper-clad carrier plate with a two-dimensional code on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) The water is placed in an oil removal groove section for oil removal treatment, and then washed and cleaned by pure water respectively through a water washing groove section and a pure water groove section;
(2) Transferring into a microetching tank section for microetching treatment, and then respectively washing and cleaning by pure water through a water washing tank section and a pure water tank section;
(3) Transferring into a pickling tank section for pickling treatment, washing twice through a twice washing tank section, and drying by strong wind through a drying tank section;
(4) Transferring into an OSP groove section to form an organic protective layer, and then washing twice through a water washing groove section and an ultrasonic washing groove section;
(5) Transferring into a high-pressure water washing tank section, performing pressurized water washing, and then respectively performing hot drying and cold drying through a hot air drying tank section and a cold air drying tank section to obtain a treated ceramic copper-clad carrier plate;
step S2: calculating the number Y of the matrixes according to the two-dimension codes, measuring the dimension A of the two-dimension codes, and selecting the diameter of a laser spot;
step S3: calculating the number X of the engraved lines in the matrix according to a reworking parameter calculation formula;
step S4: and (3) using reworking parameters, and carrying out laser engraving on the treated ceramic copper-clad carrier plate through different laser light sources to obtain the reworked two-dimensional code.
Further, the degreasing tank section in the step S1 uses a degreasing solution to degrease, wherein the degreasing solution contains 10-20wt% of degreasing agent, and the balance is water.
Further, the temperature of the pure water in the step S1 is 20-50 ℃.
Further, the microetching groove section in the step S1 is microetched by adopting a microetching solution, wherein the microetching solution contains 10-20wt%757 propane for dehydrogenation, and the balance is water.
Further, the pickling tank section in the step S1 is pickled by adopting an pickling solution, and the pickling solution is sulfuric acid with the weight percent of 5-15%.
Further, the gas used for blowing the strong wind in the step S1 is air.
Further, in the step S1, an OSP (organic solder mask) groove section is treated by adopting an OSP solution, wherein the OSP solution contains 40-80wt% of antioxidant, the balance is water, and the pH is 4.8-6.0.
Further, in the step S1, the ultrasonic cleaning time is 30-50min.
Further, the pressure of the pressurized water washing in the step S1 is 5-10MPa.
Further, the hot drying temperature in the step S1 is 100-120 ℃, and the cold drying temperature is 20-30 ℃.
Further, in the step S3, the reworking parameter calculation formula is: x=a/y×0.5/laser spot diameter×2.
Further, the laser light source in the step S4 is one of ultraviolet laser, green laser and infrared laser; wherein the diameter of the ultraviolet laser spot is 20 mu m, the diameter of the green laser spot is 30 mu m, and the diameter of the infrared laser spot is 50 mu m.
Compared with the prior art, the invention has the following beneficial effects:
according to the reworking method for the ceramic copper-clad carrier plate laser engraving two-dimensional code, the original two-dimensional code is thoroughly removed by proportioning solutions with different concentrations, and then the reworking is achieved by engraving through special reworking parameters.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
fig. 1 is a two-dimensional code engraving profile of embodiment 1, embodiment 2 and embodiment 3 of the present invention;
fig. 2 is a diagram before reworking of the two-dimensional code of embodiment 1, embodiment 2 and embodiment 3 in the present invention;
fig. 3 is a two-dimensional code reworking middle diagram of embodiment 1, embodiment 2 and embodiment 3 in the present invention;
fig. 4 is a diagram after reworking the two-dimensional code of embodiment 1, embodiment 2 and embodiment 3 in the present invention.
Detailed description of the preferred embodiments
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The degreasing agent in the implementation: model LX0124, from new materials limited in dongguan Long Xuan; antioxidant: benzimidazole, from Shenzhen Co., ltd.
Example 1: a reworking method for laser engraving of a two-dimensional code on a ceramic copper-clad support plate comprises the following steps:
step S1: placing a ceramic copper-clad carrier plate with a two-dimensional code on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Placing the water-washing tank section into an oil removal tank section for oil removal treatment (the oil removal agent accounts for 10 wt%), and then washing and cleaning pure water respectively through a water washing tank section and a pure water tank section (20 ℃);
(2) Transferring into microetching tank section for microetching treatment (757 propane dehydrogenation accounts for 10wt%), and then washing and cleaning with pure water respectively through water washing tank section and pure water tank section (20deg.C);
(3) Transferring into a pickling tank section for pickling treatment (5 wt% sulfuric acid), washing twice through a twice washing tank section, and drying by strong wind through a drying tank section;
(4) Transferring into an OSP tank section (antioxidant accounting for 40wt%, and PH=4.8) to form an organic protective layer, and washing twice through a water washing tank section and an ultrasonic washing tank section (washing for 30 min);
(5) Transferring into a high-pressure water washing tank section, performing pressurized water washing, and then respectively performing hot drying (100 ℃) and cold drying (20 ℃) through a hot air drying tank section and a cold air drying tank section to prepare the treated ceramic copper-clad carrier plate;
step S2: calculating the matrix quantity Y=14 according to the two-dimension codes, measuring the dimension A=3000 μm of the two-dimension codes, and selecting the laser spot diameter to be 20 μm;
step S3: calculating the number X=3000/14×0.5/20×2=10.71 of carving lines in the matrix according to the reworking parameter calculation formula X=A/Y×0.5/laser spot diameter×2, and rounding 11 carving lines in each matrix;
step S4: and (3) using special reworking parameters, and carrying out laser engraving on the treated ceramic copper-clad carrier plate through ultraviolet laser to obtain the reworked two-dimensional code.
Example 2: a reworking method for laser engraving of a two-dimensional code on a ceramic copper-clad support plate comprises the following steps:
step S1: placing a ceramic copper-clad carrier plate with a two-dimensional code on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Placing the water-washing tank section into an oil removal tank section for oil removal treatment (the oil removal agent accounts for 15 wt%), and then washing and cleaning pure water respectively through a water washing tank section and a pure water tank section (30 ℃);
(2) Transferring into microetching tank section for microetching treatment (757 propane dehydrogenation accounts for 15 wt%), and then washing and cleaning with pure water respectively through water washing tank section and pure water tank section (30 ℃);
(3) Transferring into a pickling tank section for pickling treatment (10 wt% sulfuric acid), washing twice through a twice washing tank section, and drying by strong wind through a drying tank section;
(4) Transferring into an OSP tank section (the antioxidant accounts for 60wt%, and the PH=5.0) to form an organic protective layer, and then washing twice through a water washing tank section and an ultrasonic washing tank section (washing for 40 min);
(5) Transferring into a high-pressure water washing tank section, performing pressurized water washing, and then respectively performing hot drying (110 ℃) and cold drying (25 ℃) through a hot air drying tank section and a cold air drying tank section to prepare the treated ceramic copper-clad carrier plate;
step S2: calculating the matrix quantity Y=14 according to the two-dimension codes, measuring the dimension A=3000 μm of the two-dimension codes, and selecting the diameter of a laser spot to be 30 μm;
step S3: calculating the number of carving lines in the matrix 3000/14X 0.5/30X 2=7.14 according to the reworking formula x=a/Y X0.5/laser spot diameter X2, and rounding to 7 carving lines in each matrix;
step S4: and (3) carrying out laser engraving on the treated ceramic copper-clad carrier plate by using a green laser by using special reworking parameters to obtain the reworked two-dimensional code.
Example 3: a reworking method for laser engraving of a two-dimensional code on a ceramic copper-clad support plate comprises the following steps:
step S1: placing a ceramic copper-clad carrier plate with a two-dimensional code on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Placing the water-washing tank section into an oil removal tank section for oil removal treatment (the oil removal agent accounts for 20wt%), and then washing and cleaning the water-washing tank section and a pure water tank section (50 ℃) respectively;
(2) Transferring into microetching tank section for microetching treatment (757 propane dehydrogenation accounts for 20wt%), and then washing and cleaning with pure water respectively through water washing tank section and pure water tank section (50 ℃);
(3) Transferring into a pickling tank section for pickling treatment (15 wt% sulfuric acid), washing twice through a twice washing tank section, and drying by strong wind through a drying tank section;
(4) Transferring into an OSP tank section (antioxidant accounts for 80wt%, and PH=6.0) to form an organic protective layer, and washing twice through a water washing tank section and an ultrasonic washing tank section (washing for 50 min);
(5) Transferring into a high-pressure water washing tank section, performing pressurized water washing, and then respectively performing hot drying (120 ℃) and cold drying (30 ℃) through a hot air drying tank section and a cold air drying tank section to prepare the treated ceramic copper-clad carrier plate;
step S2: calculating the matrix quantity Y=14 according to the two-dimension codes, measuring the dimension A=3000 μm of the two-dimension codes, and selecting the laser spot diameter to be 50 μm;
step S3: calculating the number of carving lines in the matrix 3000/14X 0.5/50X 2=4.29 according to the reworking parameter calculation formula X=A/Y X0.5/laser spot diameter X2, and rounding to 4 carving lines in each matrix;
step S4: and (3) carrying out laser engraving on the treated ceramic copper-clad carrier plate by using reworking parameters through ultraviolet laser to obtain the reworked two-dimensional code.
Experiment
Taking the reworked two-dimensional codes obtained in the embodiments 1-3, preparing samples, respectively detecting the performances of the samples and recording the detection results:
from the data in the above table, the following conclusions can be clearly drawn:
comparing the data of the reworked two-dimensional codes obtained in the embodiments 1-3, it is known that the reworking effect is sequentially ultraviolet better than green light, and the green light is better than infrared.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process method article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process method article or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The reworking method for laser engraving of the two-dimensional code by the ceramic copper-clad carrier plate is characterized by comprising the following steps of:
step S1: placing a ceramic copper-clad carrier plate with a two-dimensional code on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) The water is placed in an oil removal groove section for oil removal treatment, and then washed and cleaned by pure water respectively through a water washing groove section and a pure water groove section;
(2) Transferring into a microetching tank section for microetching treatment, and then respectively washing and cleaning by pure water through a water washing tank section and a pure water tank section;
(3) Transferring into a pickling tank section for pickling treatment, washing twice through a twice washing tank section, and drying by strong wind through a drying tank section;
(4) Transferring into an OSP groove section to form an organic protective layer, and then washing twice through a water washing groove section and an ultrasonic washing groove section;
(5) Transferring into a high-pressure water washing tank section, performing pressurized water washing, and then respectively performing hot drying and cold drying through a hot air drying tank section and a cold air drying tank section to obtain a treated ceramic copper-clad carrier plate;
step S2: calculating the number Y of the matrixes according to the two-dimension codes, measuring the dimension A of the two-dimension codes, and selecting the diameter of a laser spot;
step S3: calculating the number X of the engraved lines in the matrix according to a reworking parameter calculation formula;
step S4: using reworking parameters, and carrying out laser engraving on the treated ceramic copper-clad carrier plate through different laser light sources to obtain a reworked two-dimensional code;
the oil removal tank section in the step S1 is degreased by adopting an oil removal solution, wherein the oil removal solution contains 10-20wt% of oil removal agent, and the balance is water;
the microetching groove section in the step S1 carries out microetching by adopting microetching solution, wherein the microetching solution contains 10-20wt%757 propane for dehydrogenation, and the balance is water;
the pickling tank section in the step S1 is pickled by adopting an pickling solution, wherein the pickling solution is sulfuric acid with the weight percent of 5-15%;
the OSP groove section in the step S1 is treated by adopting an OSP solution, wherein the OSP solution contains 40-80wt% of antioxidant, the balance is water, and the pH is 4.8-6.0;
the model of the oil removing agent is LX0124;
the antioxidant is benzimidazole.
2. The reworking method for laser engraving of two-dimensional codes on ceramic copper-clad carrier plates according to claim 1 is characterized in that: the temperature of the pure water in the step S1 is 20-50 ℃.
3. The reworking method for laser engraving of two-dimensional codes on ceramic copper-clad carrier plates according to claim 1 is characterized in that: the pressure of the pressurized water washing in the step S1 is 5-10MPa.
4. The reworking method for laser engraving of two-dimensional codes on ceramic copper-clad carrier plates according to claim 1 is characterized in that: the hot drying temperature in the step S1 is 100-120 ℃, and the cold drying temperature is 20-30 ℃.
5. The reworking method for laser engraving of two-dimensional codes on ceramic copper-clad carrier plates according to claim 1 is characterized in that: the reworking parameter calculation formula in the step S3 is as follows: x=a/y×0.5/laser spot diameter×2.
6. The reworking method for laser engraving of two-dimensional codes on ceramic copper-clad carrier plates according to claim 1 is characterized in that: the laser light source in the step S4 is one of ultraviolet laser, green laser and infrared laser; wherein the diameter of the ultraviolet laser spot is 20 mu m, the diameter of the green laser spot is 30 mu m, and the diameter of the infrared laser spot is 50 mu m.
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