CN117733358A - Reworking method for engraving two-dimensional codes on copper-clad plate - Google Patents
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- CN117733358A CN117733358A CN202410008803.5A CN202410008803A CN117733358A CN 117733358 A CN117733358 A CN 117733358A CN 202410008803 A CN202410008803 A CN 202410008803A CN 117733358 A CN117733358 A CN 117733358A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004140 cleaning Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 10
- 238000005406 washing Methods 0.000 claims description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 47
- 238000001035 drying Methods 0.000 claims description 29
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 22
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 20
- 238000005554 pickling Methods 0.000 claims description 18
- 239000003963 antioxidant agent Substances 0.000 claims description 11
- 230000003078 antioxidant effect Effects 0.000 claims description 11
- 238000006356 dehydrogenation reaction Methods 0.000 claims description 10
- 239000001294 propane Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- 238000007605 air drying Methods 0.000 claims description 5
- 238000007602 hot air drying Methods 0.000 claims description 5
- 238000005237 degreasing agent Methods 0.000 claims description 3
- 239000013527 degreasing agent Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
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- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention relates to the technical field of copper-clad plates, in particular to a reworking method for engraving two-dimensional codes on a copper-clad plate. According to the invention, the original two-dimensional code and sintered crystal grains on the copper-clad plate are thoroughly removed in a laser smearing mode, so that the copper-clad plate after laser removal is prepared; sequentially carrying out multiple processes by using a horizontal line, and cleaning the substrate by using solutions with different concentrations; and finally, re-engraving the cleaned copper-clad plate by using common coding parameters so as to ensure the definition and readability of the two-dimensional code. Through the reworking method, the two-dimensional code on the copper-clad plate can be effectively removed and re-engraved, so that the two-dimensional code information can be read after a customer performs secondary reflow soldering. The method can improve product quality and production efficiency.
Description
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a reworking method for engraving two-dimensional codes on a copper-clad plate.
Background
The copper-clad plate is a material commonly used for manufacturing a circuit board, and the structure of the copper-clad plate consists of a base material and a copper foil. In the production process, the copper-clad plate is prone to problems such as grain difference and oxidation pollution, which may lead to the need of reworking. The range of the crystal grains of the copper-clad plate is generally between 100 and 1500 mu m, and base materials and copper foils with different thicknesses and types have different structures and chemical compositions, so that the crystal grains of the copper-clad plate are greatly different. Meanwhile, the whole copper-clad plate has a longer production process, and the problems of oxidization and pollution can occur in the process. This is due to exposure of the copper foil surface and exposure to air, humidity and other environmental factors. Oxidation and contamination can reduce the conductivity and solderability of the copper foil, thereby affecting the overall circuit board performance. In order to solve these problems, rework is required to ensure quality and reliability of the product.
The traditional reworking mode uses 5% -10% sulfuric acid to treat the copper-clad plate, but the color of the two-dimensional code on the surface of the product becomes light. Although the reworked two-dimensional code can still be read in a factory, the two-dimensional code gradually disappears after the product is subjected to reflow soldering twice, so that the two-dimensional code cannot be read at a client. In order to solve the problem, a background technology of engraving two-dimensional codes of the copper-clad plate is introduced. After reworking, the method is realized by engraving two-dimension codes without directly printing codes on the product for covering. The method has the advantages that interference between the reworked two-dimension code and the original two-dimension code cannot be generated after the client is subjected to reflow soldering for two times, and the problem that the two-dimension code cannot be read is avoided.
Therefore, we propose a reworking method for engraving two-dimensional codes by using copper-clad plates.
Disclosure of Invention
The invention aims to provide a reworking method for engraving two-dimensional codes on a copper-clad plate, which aims to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme:
a reworking method for engraving two-dimensional codes on copper-clad plates comprises the following steps:
s1: measuring the dimension A and the dimension Y of the two-dimensional code, and selecting the diameter of a laser spot; calculating the number X of lines to be engraved according to a filling formula; carrying out laser irradiation on the surface of the copper-clad plate with the two-dimensional code according to the number X of lines to be engraved by using one of ultraviolet laser, green laser and infrared laser, and removing the two-dimensional code by using all filled removing conditions to obtain the copper-clad plate after laser removal;
s2: placing the copper-clad plate after laser removal on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Oil removal treatment: placing the water tank into an oil removal tank, removing oil by using an oil removing agent, and then placing the water tank and a pure water tank into a washing tank and a pure water tank for washing and pure water cleaning respectively;
(2) Microetching: transferring to a microetching tank, performing microetching treatment by using 757 propane dehydrogenation, and then placing into a water washing tank and a pure water tank for washing and pure water cleaning respectively;
(3) Acid washing: transferring to a pickling tank, carrying out pickling treatment by using sulfuric acid, then placing the pickling tank into a twice washing tank, respectively washing twice, and then transferring to a drying tank for strong wind drying;
(4) OSP processing: transferring to an OSP tank, performing OSP treatment by using an antioxidant, washing twice by using a washing tank section and an ultrasonic washing tank section, and then transferring to a high-pressure washing tank section for pressurized water washing;
(5) And (3) drying: transferring to a hot air drying tank and a cold air drying tank, and respectively performing hot drying and cold drying to obtain a cleaned copper-clad plate;
s3: and engraving the cleaned copper-clad plate by using conventional engraving parameters.
Further, in the step S1, the diameter of the ultraviolet laser spot is 20 μm, the diameter of the green laser spot is 30 μm, and the diameter of the infrared laser spot is 50 μm.
Further, the removal dimension Y in the step S1 is 1.5-2.0 times of the dimension a of the two-dimensional code.
Further, the filling formula in the step S1 is as follows: x= (a+a×50%)/laser spot diameter.
Further, the concentration of the degreasing agent in the step S2 is 10-20wt%.
Further, the temperature of the pure water in the step S2 is 20-30 ℃.
Further, the concentration of 757 propane dehydrogenation in the step S2 is 5-15wt%.
Further, the concentration of sulfuric acid in the step S2 is 3-5wt%.
Further, the gas used for blowing the strong wind in the step S2 is air.
Further, the antioxidant concentration in the step S2 is 40-80wt% and the pH is 4.8-5.8.
Further, in the step S2, the ultrasonic cleaning time is 30-60min.
Further, the pressure of the pressurized water washing in the step S2 is 3-9Mpa.
Further, the hot drying temperature in the step S2 is 80-120 ℃ and the cold drying temperature is 20-25 ℃.
Further, the conventional engraving parameters in the step S3 are: the engraving depth is 5-10 mu m, the engraving speed is 180-300mm/s, and the laser power is 10W-20W.
Compared with the prior art, the invention has the following beneficial effects:
according to the reworking method for engraving the two-dimensional code on the copper-clad plate, the original two-dimensional code and sintered grains on the copper-clad plate are thoroughly removed in a laser smearing mode, and the surface smoothness is ensured; sequentially carrying out multiple processes by using a horizontal line, and cleaning the substrate by using solutions with different concentrations; and finally, re-engraving the cleaned copper-clad plate by using common coding parameters so as to ensure the definition and readability of the two-dimensional code. Through the reworking method, the two-dimensional code on the copper-clad plate can be effectively removed and re-engraved, so that the two-dimensional code information can be read after a customer performs secondary reflow soldering. The method can improve product quality and production efficiency.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
fig. 1 is a diagram before processing two-dimensional codes according to embodiments 1, 2 and 3 of the present invention;
fig. 2 is a diagram showing two-dimensional code processing according to embodiments 1, 2 and 3 of the present invention;
fig. 3 is a diagram after two-dimensional code processing according to embodiment 1, embodiment 2 and embodiment 3 of the present invention.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Degreasing agent in this example: LJ-8401 acid cleaner is from new Bomei materials Co., shenzhen City; antioxidant: model JZ-218, available from Dongguan chemical Co., ltd.
Example 1: a reworking method for engraving two-dimensional codes on copper-clad plates comprises the following steps:
s1: measuring a two-dimensional code size A=3000 μm and a removal size Y=4500 μm, wherein the spot diameter of the selected ultraviolet laser is 20 μm; according to the filling formula: x= (a+a×50%)/laser spot diameter calculation engraving line number x= (3000+3000×50%)/20=225; carrying out laser irradiation on the surface of the copper-clad plate with the two-dimensional code according to the number X of lines to be engraved by using ultraviolet laser, and removing the two-dimensional code by using all filled removing conditions to prepare the copper-clad plate after laser removal;
s2: placing the copper-clad plate after laser removal on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Oil removal treatment: placing in an oil removal tank, performing oil removal treatment (10 wt% of oil removal agent) by using the oil removal agent, and then placing in a water washing tank and a pure water tank (20 ℃) for washing and pure water cleaning respectively;
(2) Microetching: transferring to a microetching tank, performing microetching treatment (757 propane dehydrogenation 5 wt%) by using 757 propane dehydrogenation, and then placing into a water washing tank and a pure water tank (20 ℃) for washing and pure water cleaning respectively;
(3) Acid washing: transferring to a pickling tank, carrying out pickling treatment (3 wt% sulfuric acid) by using sulfuric acid, then placing the pickling tank into a double-time pickling tank, respectively washing twice, and then transferring to a drying tank for strong wind drying;
(4) OSP processing: transferring to an OSP tank, performing OSP treatment (40 wt% of antioxidant, pH=4.8) by using the antioxidant, washing twice by using a water washing tank section and an ultrasonic washing tank section (30 min), and then transferring to a high-pressure water washing tank section for pressurized water washing (3 MPa);
(5) And (3) drying: transferring to a hot air drying tank and a cold air drying tank, and respectively performing hot drying (80 ℃) and cold drying (20 ℃) to obtain a cleaned copper-clad plate;
s3: and engraving the cleaned copper-clad plate by using conventional engraving parameters.
Example 2: a reworking method for engraving two-dimensional codes on copper-clad plates comprises the following steps:
s1: measuring the dimension A=3000 μm of the two-dimensional code and the dimension Y=5400 μm of the removal dimension, wherein the spot diameter of the selected ultraviolet laser is 30 μm; according to the filling formula: x= (a+a×50%)/laser spot diameter calculation engraving line number x= (3000+3000×50%)/30=150; using green laser, carrying out laser irradiation on the surface of the copper-clad plate with the two-dimensional code according to the number X of lines to be engraved, and removing the two-dimensional code through all filled removal conditions to obtain the copper-clad plate after laser removal;
s2: placing the copper-clad plate after laser removal on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Oil removal treatment: placing in an oil removal tank, performing oil removal treatment (15 wt% of oil removal agent) by using the oil removal agent, and then placing in a water washing tank and a pure water tank (25 ℃) for washing and pure water cleaning respectively;
(2) Microetching: transferring to a microetching tank, performing microetching treatment (10 wt%757 propane dehydrogenation) by using 757 propane dehydrogenation, and then placing into a water washing tank and a pure water tank (25 ℃) for washing and pure water cleaning respectively;
(3) Acid washing: transferring to a pickling tank, carrying out pickling treatment (4 wt% sulfuric acid) by using sulfuric acid, then placing the pickling tank into a double-time pickling tank, respectively washing twice, and then transferring to a drying tank for strong wind drying;
(4) OSP processing: transferring to an OSP tank, performing OSP treatment (60 wt% of antioxidant, pH=5.0) by using the antioxidant, washing twice by using a water washing tank section and an ultrasonic washing tank section (40 min), and then transferring to a high-pressure water washing tank section for pressurized water washing (6 MPa);
(5) And (3) drying: transferring to a hot air drying tank and a cold air drying tank, and respectively performing hot drying (100 ℃) and cold drying (23 ℃) to obtain a cleaned copper-clad plate;
s3: and engraving the cleaned copper-clad plate by using conventional engraving parameters.
Example 3: a reworking method for engraving two-dimensional codes on copper-clad plates comprises the following steps:
s1: measuring the dimension A=3000 μm of the two-dimensional code and the dimension Y=6000 μm of the removal dimension, wherein the diameter of the selected ultraviolet laser spot is 50 μm; according to the filling formula: x= (a+a×50%)/laser spot diameter calculation engraving line number x= (3000+3000×50%)/50=90; using infrared laser to irradiate the surface of the copper-clad plate with the two-dimensional code according to the number X of lines to be engraved, and removing the two-dimensional code by using all filled removing conditions to prepare the copper-clad plate after laser removal;
s2: placing the copper-clad plate after laser removal on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Oil removal treatment: placing in an oil removal tank, performing oil removal treatment (20wt% of oil removal agent) by using the oil removal agent, and then placing in a water washing tank and a pure water tank (30 ℃) for washing and pure water cleaning respectively;
(2) Microetching: transferring to a microetching tank, performing microetching treatment (15 wt%757 propane dehydrogenation) by using 757 propane dehydrogenation, and then placing into a water washing tank and a pure water tank (30 ℃) for washing and pure water cleaning respectively;
(3) Acid washing: transferring to a pickling tank, carrying out pickling treatment (5 wt% sulfuric acid) by using sulfuric acid, then placing the pickling tank into a double-time pickling tank, respectively washing twice, and then transferring to a drying tank for strong wind drying;
(4) OSP processing: transferring to an OSP tank, performing OSP treatment (80 wt% of antioxidant, pH=5.8) by using the antioxidant, washing twice by using a water washing tank and an ultrasonic washing tank (60 min), transferring to a high-pressure water washing tank section, and performing pressurized water washing (9 MPa);
(5) And (3) drying: transferring to a hot air drying tank and a cold air drying tank, and respectively performing hot drying (120 ℃) and cold drying (25 ℃) to obtain a cleaned copper-clad plate;
s3: and engraving the cleaned copper-clad plate by using conventional engraving parameters.
Experiment
Taking the two-dimensional codes obtained in the embodiments 1-3, preparing samples, respectively detecting the performances of the samples and recording the detection results:
from the data in the above table, the following conclusions can be clearly drawn:
the reworking mode of engraving the two-dimensional code by the copper-clad plate is feasible, and the two-dimensional code obtained in the embodiment 1-3 is successfully engraved by the copper-clad plate, and no error or problem occurs.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process method article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process method article or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A reworking method for engraving two-dimensional codes on copper-clad plates is characterized by comprising the following steps of: the method comprises the following steps:
s1: measuring the dimension A and the dimension Y of the two-dimensional code, and selecting the diameter of a laser spot; calculating the number X of lines to be engraved according to a filling formula; carrying out laser irradiation on the surface of the copper-clad plate with the two-dimensional code according to the number X of lines to be engraved by using one of ultraviolet laser, green laser and infrared laser, and removing the two-dimensional code by using all filled removing conditions to obtain the copper-clad plate after laser removal;
s2: placing the copper-clad plate after laser removal on a conveyor belt on a horizontal line, and sequentially carrying out the following processes by using the horizontal line:
(1) Oil removal treatment: placing the water tank into an oil removal tank, removing oil by using an oil removing agent, and then placing the water tank and a pure water tank into a washing tank and a pure water tank for washing and pure water cleaning respectively;
(2) Microetching: transferring to a microetching tank, performing microetching treatment by using 757 propane dehydrogenation, and then placing into a water washing tank and a pure water tank for washing and pure water cleaning respectively;
(3) Acid washing: transferring to a pickling tank, carrying out pickling treatment by using sulfuric acid, then placing the pickling tank into a twice washing tank, respectively washing twice, and then transferring to a drying tank for strong wind drying;
(4) OSP processing: transferring to an OSP tank, performing OSP treatment by using an antioxidant, washing twice by using a washing tank section and an ultrasonic washing tank section, and then transferring to a high-pressure washing tank section for pressurized water washing;
(5) And (3) drying: transferring to a hot air drying tank and a cold air drying tank, and respectively performing hot drying and cold drying to obtain a cleaned copper-clad plate;
s3: and engraving the cleaned copper-clad plate by using conventional engraving parameters.
2. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: in the step S1, the diameter of the ultraviolet laser spot is 20 mu m, the diameter of the green laser spot is 30 mu m, and the diameter of the infrared laser spot is 50 mu m.
3. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the removal dimension Y in the step S1 is 1.5-2.0 times of the dimension A of the two-dimensional code.
4. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the filling formula in the step S1 is as follows: x= (a+a×50%)/laser spot diameter.
5. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the concentration of the degreasing agent in the step S2 is 10-20wt%.
6. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the concentration of 757 propane dehydrogenation in step S2 is 5-15wt%.
7. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the concentration of sulfuric acid in the step S2 is 3-5wt%.
8. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the antioxidant concentration in the step S2 is 40-80wt% and the pH is 4.8-5.8.
9. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the hot drying temperature in the step S2 is 80-120 ℃, and the cold drying temperature is 20-25 ℃.
10. The reworking method for engraving two-dimensional codes on copper-clad plates according to claim 1, which is characterized in that: the conventional engraving parameters in the step S3 are as follows: the engraving depth is 5-10 mu m, the engraving speed is 180-300mm/s, and the laser power is 10W-20W.
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