CN114980547A - OSP pretreatment process for removing stains on copper surface of finished PCB bonding pad - Google Patents
OSP pretreatment process for removing stains on copper surface of finished PCB bonding pad Download PDFInfo
- Publication number
- CN114980547A CN114980547A CN202210438678.2A CN202210438678A CN114980547A CN 114980547 A CN114980547 A CN 114980547A CN 202210438678 A CN202210438678 A CN 202210438678A CN 114980547 A CN114980547 A CN 114980547A
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- China
- Prior art keywords
- water washing
- osp
- copper surface
- oil removal
- treatment process
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- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 56
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 32
- 239000010949 copper Substances 0.000 title claims abstract description 32
- 238000005406 washing Methods 0.000 claims abstract description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000007605 air drying Methods 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 238000005507 spraying Methods 0.000 claims abstract description 13
- 239000002253 acid Substances 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 7
- 239000004094 surface-active agent Substances 0.000 claims abstract description 7
- 239000007864 aqueous solution Substances 0.000 claims abstract description 3
- 239000013527 degreasing agent Substances 0.000 claims abstract 2
- 238000005237 degreasing agent Methods 0.000 claims abstract 2
- 238000002203 pretreatment Methods 0.000 claims 12
- 239000003921 oil Substances 0.000 abstract description 54
- 239000003086 colorant Substances 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 3
- 239000000341 volatile oil Substances 0.000 abstract description 3
- 239000003344 environmental pollutant Substances 0.000 abstract description 2
- 231100000719 pollutant Toxicity 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000519995 Stachys sylvatica Species 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses an OSP pretreatment process for removing stains on the copper surface of a finished PCB bonding pad, which comprises the following steps: primary oil removal, primary water washing, secondary oil removal, secondary water washing, micro-etching, tertiary water washing, acid washing, water washing, film forming air drying, DI water washing and drying, wherein the oil removal agent used for secondary oil removal contains a surfactant C 17 H 37 SO 4 Na and builder Na 2 SiO 3 The aqueous solution of (1) is a circulating spraying mode, the concentration of the degreasing agent is 5-10%, the microetching thickness is 1.0-1.5um, the PH value of DI water washing is 4.0-7.0, and the film thickness in the film forming and air drying process is 0.2-0.5 um. The directional cleaning method mainly aims at the pollution of deep oxidation and volatile oil stain on the copper surface, and can clean more than 99.9% of pollutants on the copper surface, so that appearance flaws such as variegation, seven colors, white points and the like on the surface of the PCB pad are eliminated, the appearance quality of the PCB is improved, and the application requirements of the market on PCB products are met.
Description
Technical Field
The invention relates to the field of circuit board processing, in particular to an OSP pretreatment process for removing stains on a copper surface of a finished PCB pad.
Background
OSP is a process for surface treatment of Printed Circuit Board (PCB) copper foil that meets RoHS directive requirements. OSP is the abbreviation of Organic solder mask Preservatives, also known as copper protectant, also known as Preflux. Briefly, OSP chemically grows an organic film on a clean bare copper surface. The film has the advantages of oxidation resistance, thermal shock resistance and moisture resistance, and is used for protecting the copper surface from continuously rusting (oxidation, vulcanization or the like) in a normal environment; however, at subsequent high soldering temperatures, the protective film must be readily removed by the flux so that the exposed clean copper surface can be immediately bonded to the molten solder in a very short time to form a strong solder joint.
With the development of modern technology, the requirements of electronic products for PCBs are gradually increased, and besides the requirement of PCBs for ensuring complete and reliable performance, the requirement of PCBs for ensuring zero defects in appearance is! The pretreatment oil removal effect of the OSP is to remove stains remained on the surface of the PCB pad in the production process of the previous process procedure so as to expose a clean copper surface and ensure the film forming effect. However, in the conventional OSP process, due to incomplete oil removal, deep oxidation of the copper surface of the pad and the cleaning of the area polluted by volatile oil stains cannot be realized, so that the color difference of the copper surface of the PCB pad is often caused, appearance defects such as white spots, variegated colors, seven-color colors and the like are formed, the appearance tolerance standard of customers on the PCB is exceeded, and the requirements of the modern process cannot be met.
Disclosure of Invention
In order to solve the problems, the invention discloses an OSP pretreatment process for removing stains on the copper surface of a finished PCB bonding pad, which comprises the following steps: primary oil removal, primary water washing, secondary oil removal, secondary water washing, micro-etching, tertiary water washing, acid washing, water washing, film forming air drying, DI water washing and drying.
Preferably, the oil removing agent for secondary oil removal is an aqueous solution containing a surfactant C17H37SO4Na and a builder Na2SiO 3.
Preferably, the concentration of the oil removing agent is 5-10%.
Preferably, the secondary oil removal mode is a circulating spraying mode.
Preferably, the circulating spraying time is 5-10S.
Preferably, the ratio of the C17H37SO4Na to the Na2SiO3 is 1-30: 1.
Preferably, the microetching thickness is 1.0-1.5 um.
Preferably, the DI water wash pH is 4.0 to 7.0.
Preferably, the film thickness in the film-forming air-drying process is 0.2-0.5 um.
The invention enhances the oil removing effect by adding two oil removing process flows, adopts the specially-made oil removing agent, mainly carries out directional cleaning on the pollution of deep oxidation and volatile oil stain on the copper surface, and can clean over 99.9 percent of pollutants on the copper surface, thereby avoiding appearance flaws such as variegated colors, seven colors, white points and the like on the surface of the PCB pad, improving the appearance quality of the PCB and meeting the application requirements of the market on PCB products.
Drawings
FIG. 1 is a schematic diagram of an OSP pre-processing circuit board according to an embodiment of the present invention;
FIG. 2 is a circuit board before OSP treatment in the conventional process.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The following detailed description of specific embodiments of the invention refers to the accompanying drawings.
Example 1
An OSP pretreatment process for removing stains on the copper surface of a finished PCB bonding pad comprises the following steps: primary oil removal, primary water washing, secondary oil removal, secondary water washing, micro-etching, tertiary water washing, acid washing, water washing, film forming air drying, DI water washing and drying.
Wherein, the primary oil removal and the primary water washing are common traditional common oil removal water washing methods, and the oil removal agent used for the secondary oil removal is surfactant C 17 H 37 SO 4 Na and builder Na 2 SiO 3 The concentration of the oil removing agent is 8 percent, the secondary oil removing mode is a circulating spraying mode, the circulating spraying time is 7S, C 17 H 37 SO 4 Na and Na 2 SiO 3 The ratio of the micro-etching to the film is 10:1, the micro-etching thickness is 1.2um, the pH value of DI water washing is 5.0, and the film thickness in the film forming and air drying process is 0.3 um. Other processes are carried out by using common processes in the prior art.
Example 2
An OSP pretreatment process for removing stains on the copper surface of a finished PCB bonding pad comprises the following steps: primary oil removal, primary water washing, secondary oil removal, secondary water washing, micro-etching, tertiary water washing, acid washing, water washing, film forming air drying, DI water washing and drying.
Wherein, the primary oil removal and the primary water washing are common traditional common oil removal water washing methods, and the oil removal agent used for the secondary oil removal is surfactant C 17 H 37 SO 4 Na and builder Na 2 SiO 3 The concentration of the oil removing agent is 5 percent, the secondary oil removing mode is a circulating spraying mode, and the circulating spraying time is 5S, C 17 H 37 SO 4 Na and Na 2 SiO 3 The ratio of the micro-etching to the dry film is 1:1, the micro-etching thickness is 1um, the pH value of DI water washing is 4.0, and the film thickness in the film forming and air drying process is 0.2 um. Other processes are carried out by using common processes in the prior art.
Example 3
An OSP pretreatment process for removing stains on the copper surface of a finished PCB bonding pad comprises the following steps: primary oil removal, primary water washing, secondary oil removal, secondary water washing, micro-etching, tertiary water washing, acid washing, water washing, film forming air drying, DI water washing and drying.
Wherein, the primary oil removal and the primary water washing are common traditional common oil removal water washing methods, and the oil removal agent used for the secondary oil removal is surfactant C 17 H 37 SO 4 Na and builder Na 2 SiO 3 The concentration of the oil removing agent is 10 percent, the secondary oil removing mode is a circulating spraying mode, the circulating spraying time is 10S, C 17 H 37 SO 4 Na and Na 2 SiO 3 The ratio of the micro-etching to the film is 30:1, the micro-etching thickness is 1.5um, the pH value of DI water washing is 7.0, and the film thickness in the film forming and air drying process is 0.5 um. Other processes are carried out by using common processes in the prior art.
Example 4
An OSP pretreatment process for removing stains on the copper surface of a finished PCB bonding pad comprises the following steps: primary oil removal, primary water washing, secondary oil removal, secondary water washing, micro-etching, tertiary water washing, acid washing, water washing, film forming air drying, DI water washing and drying.
Wherein, the primary oil removal and the primary water washing are common traditional common oil removal water washing methods, and the oil removal agent used for the secondary oil removal is surfactant C 17 H 37 SO 4 Na and builder Na 2 SiO 3 The concentration of the oil removing agent is 15 percent, the secondary oil removing mode is a circulating spraying mode, the circulating spraying time is 7S, C 17 H 37 SO 4 Na and Na 2 SiO 3 The ratio of the micro-etching to the film is 20:1, the micro-etching thickness is 1.4um, the pH value of DI water washing is 6.0, and the film thickness in the film forming and air drying process is 0.4 um. Other processes are carried out by common processes in the prior art.
Oil removal: the quality of the oil removing effect directly influences the film forming quality. Degreasing is poor, resulting in uneven film thickness. In one aspect, the concentration can be controlled within a process range by analyzing the solution. On the other hand, whether the oil removing effect is good or not is required to be checked frequently, and if the oil removing effect is not good, the oil removing liquid is required to be replaced in time.
Micro-etching: the purpose of microetching is to form a rough copper surface, which facilitates film formation. Since the film formation rate is directly affected by the thickness of the microetching, it is very important to maintain the microetching thickness stably in order to form a stable film thickness. The microetching thickness is controlled to be 1.0-1.5 um. Before each production run, the microetching rate can be measured, and the microetching time can be determined according to the microetching rate.
Film forming: DI water is preferably used for water washing before film formation to prevent the film formation solution from being contaminated. The washing after film formation is preferably performed with DI water, and the pH should be controlled to 4.0-7.0 to prevent contamination and damage of the film layer. The key of the OSP process is to control the thickness of the oxidation-proof film. The film is too thin and has poor thermal shock resistance, when reflow soldering is carried out, the film layer can not resist high temperature (190-. Generally, it is suitable to control the film thickness between 0.2um and 0.5 um.
With reference to fig. 1-2, compared with the conventional OSP process, the embodiment of the invention adds an oil removal process after the oil removal of the pretreatment process for deeply treating foreign matters on the copper surface, and has better effects on reducing appearance defects such as variegated colors, seven colors, white points and the like on the copper surface of the PCB and improving the appearance quality of the PCB.
The above embodiments only describe the best mode of use of the existing equipment, and similar common mechanical means are used to replace the elements in the present embodiments, which fall into the protection scope.
Claims (9)
1. An OSP pretreatment process for removing stains on a copper surface of a finished PCB pad is characterized by comprising the following steps: the method comprises the following steps: primary oil removal, primary water washing, secondary oil removal, secondary water washing, micro-etching, tertiary water washing, acid washing, water washing, film forming air drying, DI water washing and drying.
2. The OSP pre-treatment process for removing copper surface stains from a finished PCB pad of claim 1, wherein the OSP pre-treatment process comprises the following steps: the degreasing agent for secondary oil removal contains a surfactant C 17 H 37 SO 4 Na and builder Na 2 SiO 3 An aqueous solution of (a).
3. The OSP pre-treatment process for removing copper surface stains from a finished PCB pad of claim 2, wherein the pre-treatment process comprises the following steps: the concentration of the oil removing agent is 5-10%.
4. The OSP pre-treatment process for removing copper surface stains from a finished PCB pad of claim 3, wherein the pre-treatment process comprises the following steps: the secondary oil removing mode is a circulating spraying mode.
5. The OSP pre-treatment process for removing copper surface stains from a finished PCB pad of claim 4, wherein the pre-treatment process comprises the following steps: the circulating spraying time is 5-10S.
6. The OSP pre-treatment process for removing copper surface stains from a finished PCB pad of claim 5, wherein the pre-treatment process comprises: said C is 17 H 37 SO 4 Na and Na 2 SiO 3 In a ratio of 1-30: 1.
7. An OSP pretreatment process for removing copper surface stains from a finished PCB pad according to any of claims 1-6, wherein: the micro-etching thickness is 1.0-1.5 um.
8. The OSP pre-treatment process for removing copper surface stains from a finished PCB pad of claim 7, wherein: the pH of the DI water wash is 4.0-7.0.
9. The OSP pre-treatment process for removing copper surface stains from a finished PCB pad of claim 8, wherein: the film thickness in the film-forming air-drying process is 0.2-0.5 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210438678.2A CN114980547A (en) | 2022-04-25 | 2022-04-25 | OSP pretreatment process for removing stains on copper surface of finished PCB bonding pad |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210438678.2A CN114980547A (en) | 2022-04-25 | 2022-04-25 | OSP pretreatment process for removing stains on copper surface of finished PCB bonding pad |
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| Publication Number | Publication Date |
|---|---|
| CN114980547A true CN114980547A (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210438678.2A Pending CN114980547A (en) | 2022-04-25 | 2022-04-25 | OSP pretreatment process for removing stains on copper surface of finished PCB bonding pad |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117047324A (en) * | 2023-09-06 | 2023-11-14 | 四川富乐华半导体科技有限公司 | Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB695555A (en) * | 1950-02-23 | 1953-08-12 | British Cellophane Ltd | Improvements in or relating to the manufacture of films of hygroscopic, non-fibrous,organic material |
| CN1802717A (en) * | 2003-06-03 | 2006-07-12 | 昭和电工株式会社 | Method for producing aluminum material for electrolytic capacitor electrode, aluminum material for electrolytic capacitor electrode, method for producing electrode material for electrolytic capacitor, |
| CN108342258A (en) * | 2017-01-25 | 2018-07-31 | 花王株式会社 | Liquid cleanser composition |
| CN110049630A (en) * | 2019-04-17 | 2019-07-23 | 广州迅磊科技有限公司 | A kind of board production osp processing technology |
| CN110318042A (en) * | 2019-06-18 | 2019-10-11 | 深圳市松柏实业发展有限公司 | Complanation nickel gold assembly line and change nickel gold method |
-
2022
- 2022-04-25 CN CN202210438678.2A patent/CN114980547A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB695555A (en) * | 1950-02-23 | 1953-08-12 | British Cellophane Ltd | Improvements in or relating to the manufacture of films of hygroscopic, non-fibrous,organic material |
| CN1802717A (en) * | 2003-06-03 | 2006-07-12 | 昭和电工株式会社 | Method for producing aluminum material for electrolytic capacitor electrode, aluminum material for electrolytic capacitor electrode, method for producing electrode material for electrolytic capacitor, |
| CN108342258A (en) * | 2017-01-25 | 2018-07-31 | 花王株式会社 | Liquid cleanser composition |
| CN110049630A (en) * | 2019-04-17 | 2019-07-23 | 广州迅磊科技有限公司 | A kind of board production osp processing technology |
| CN110318042A (en) * | 2019-06-18 | 2019-10-11 | 深圳市松柏实业发展有限公司 | Complanation nickel gold assembly line and change nickel gold method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117047324A (en) * | 2023-09-06 | 2023-11-14 | 四川富乐华半导体科技有限公司 | Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate |
| CN117047324B (en) * | 2023-09-06 | 2024-02-13 | 四川富乐华半导体科技有限公司 | Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate |
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Application publication date: 20220830 |
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