CN116997084A - Drilling method for high-aspect ratio small-spacing holes - Google Patents
Drilling method for high-aspect ratio small-spacing holes Download PDFInfo
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- CN116997084A CN116997084A CN202310998370.8A CN202310998370A CN116997084A CN 116997084 A CN116997084 A CN 116997084A CN 202310998370 A CN202310998370 A CN 202310998370A CN 116997084 A CN116997084 A CN 116997084A
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- Prior art keywords
- hole
- drilling
- aspect ratio
- holes
- high aspect
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- 238000005553 drilling Methods 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000007664 blowing Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 12
- 238000009713 electroplating Methods 0.000 abstract description 6
- 230000005856 abnormality Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 30
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 238000007747 plating Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a drilling method of a hole with a high aspect ratio and a small space, which comprises the following steps: preparing a production plate, wherein at least two first drilling holes and second drilling holes are arranged on the production plate, the hole diameters of the first drilling holes are smaller than or equal to the hole diameters of the second drilling holes, and the hole diameters of the first drilling holes are 0.075-0.18 mm; drilling a first through hole and a second through hole at the first drilling position and the second drilling position in sequence; and (3) carrying out back drilling on the first through hole, wherein the outer diameter of a drill bit during back drilling is smaller than the aperture of the first through hole. According to the method, the first through hole which is drilled first is drilled back, so that dust in the hole is removed, and the problem of copper-free quality abnormality of the later-stage electroplating hole caused by plugging of the hole by the high-aspect-ratio small-spacing Kong Fenchen is solved.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a drilling method for holes with high aspect ratio and small spacing.
Background
With the continuous miniaturization and high integration of electronic products, the circuit board gradually moves to the directions of high-precision fine circuits, small apertures and high aspect ratios (6:1-10:1), and the development trends of high-precision circuit board, small apertures, narrow aperture spacing, high thickness-diameter ratio and narrow line spacing increase the difficulty of circuit board manufacture.
The hole metallization process is one of the most important working procedures in the printed circuit board, relates to the quality of the internal quality of the multilayer printed circuit board, and mainly works to drill the needed holes on the multilayer printed circuit board, remove drilling dirt in the holes, deposit conductive metal copper on the hole wall layer and realize good electrical interconnection. The drilling processing method comprises the following steps: numerical control drilling, laser drilling, chemical etching and the like are adopted for holes with the aperture of 0.15mm at present, and a numerical control drilling machine is used for sequentially drilling holes with different diameters according to corresponding processing parameters by utilizing drill bits with different diameters under the control of a computer according to drilling band data, so that all required via holes are obtained on a printed circuit board at one time.
For two holes with the hole spacing of 0.075 mm-0.18 mm, because the hole spacing is too close, when drilling the second hole, the cut dust and dust easily falls into the first hole drilled at the adjacent position, thus causing hole blocking, and the thickness-diameter ratio (plate thickness/drill bit diameter) is more than or equal to 10:1, dust in holes is difficult to clean in copper precipitation treatment, so that copper precipitation on the hole walls is avoided, and the problems of no copper in holes and product rejection of open electric test are caused in later electroplating.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a drilling method of a hole with a high aspect ratio and a small space, which is used for removing dust in a hole by back drilling a first pre-drilled through hole and solving the problem of copper-free quality abnormality of a later-stage electroplating hole caused by plugging the hole with the high aspect ratio and the small space Kong Fenchen.
In order to solve the technical problems, the invention provides a drilling method of a high aspect ratio small-spacing hole, which comprises the following steps:
s1, preparing a production plate, wherein at least two first drilling holes and second drilling holes with the hole spacing of 0.075-0.18 mm are formed in the production plate, and the hole diameter of the first drilling holes is less than or equal to the hole diameter of the second drilling holes;
s2, drilling a first through hole and a second through hole at the first drilling position and the second drilling position in sequence;
s3, back drilling is carried out on the first through hole, and the outer diameter of a drill bit during back drilling is smaller than the aperture of the first through hole.
Further, when the aperture of the first drilling position is smaller than that of the second drilling position, the first through hole and the second through hole are respectively formed by using the drills with different sizes, and the outer diameter of the drill is equal to the aperture of the first through hole.
Further, in step S2, when the aperture of the first drilling hole is the same as the aperture of the second drilling hole, the first through hole and the second through hole are drilled by two drills, and the outer diameters of the two drills are the same.
Further, in step S2, after the first drill bit drills the first through hole, the first drill bit is changed to another drill bit by a tool changing operation, and then the second through hole is drilled.
In step S2, the thickness-to-diameter ratio of the first through hole to the second through hole is equal to or greater than 10:1.
Further, in step S3, the outside diameter of the drill tip at the time of back drilling is smaller than the aperture of the first through hole by 0.05mm.
Further, the step S3 further includes the following steps:
s4, carrying out high-pressure water washing treatment on the production plate;
s5, hole blowing treatment is carried out on the production plate.
Further, in step S4, the pressure during high-pressure water washing is 10-20kg/cm 2 The water flow is controlled at 3+/-1L/min.
Further, in step S5, the air pressure during the hole blowing treatment is controlled to be 4-12Kpa.
Further, the production board is a multilayer board formed by laminating an inner core board and an outer copper foil into a whole by using prepregs.
Compared with the prior art, the invention has the following beneficial effects:
in the invention, after the first through hole and the second through hole are drilled in sequence, the first through hole drilled in advance is subjected to back drilling so as to remove dust in the hole, and the problem of copper-free quality abnormality of the later-stage electroplating hole caused by plugging the hole by a small distance Kong Fenchen with a high aspect ratio is solved; and the outer diameter of the drill bit adopted during back drilling is smaller than the aperture of the first through hole, so that when the coaxial drill bit is used for down drilling, dust in the hole can be effectively removed, the drill bit during back drilling can be ensured not to touch the wall of the first through hole, the problem that when the drill bit with the same aperture as the first through hole is adopted for back drilling, the drill deviation is caused due to the influence of factors such as the alignment precision and the processing error of the drilling machine, and further the deformation and the damage of the first through hole are caused, so that the drilling quality is ensured.
Secondly, when the apertures of the first through hole and the second through hole are different, drilling the first through hole and the second through hole respectively by using drill bits with different sizes, and drilling holes with smaller sizes firstly and then drilling holes with larger sizes; when the apertures of the first through hole and the second through hole are the same, if the same drill bit is used for continuously drilling the two holes, the temperature is concentrated in the process of drilling the second through hole due to the high temperature generated when the first through hole is drilled on the production plate and the drill bit, so that the local temperature is too high, and chip removal is difficult due to the fact that a resin medium layer on the production plate is in a molten state.
In addition, high-pressure water washing and hole blowing treatment are added after the back drilling, so that holes are cleaned and blown by strong wind, dust in the holes is further cleaned, and hole blocking is avoided.
Drawings
FIG. 1 is a schematic illustration of a production plate in one embodiment with first and second through holes of different apertures drilled therein;
fig. 2 is a schematic view of a production board in another embodiment in which first and second through holes of the same aperture are drilled.
Detailed Description
In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the circuit board shown in the embodiment includes a drilling process of holes with high aspect ratio and small spacing, and sequentially includes the following processing procedures:
(1) Cutting: and (3) opening a core plate according to the size of 520mm multiplied by 620mm of the jointed board, wherein the thickness of the core plate is 0.5mm, and the thicknesses of copper layers on the two surfaces of the core plate are 0.5oz.
(2) Inner layer circuit fabrication (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, completing the inner layer line exposure by using a 5-6 grid exposure rule (a 21 grid exposure rule) by using a full-automatic exposure machine, and forming an inner layer line pattern after development; etching the inner layer, namely etching the core plate after exposure and development to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mi; and (3) inner-layer AOI, and then checking defects such as open and short circuit, line notch, line pinhole and the like of the inner-layer line, carrying out defective scrapping treatment, and outputting a defect-free product to the next flow.
(3) Pressing: the browning speed is according to the thick browning of copper at the bottom, core board, prepreg, outer copper foil are laminated according to the requirement sequentially, then select the appropriate lamination condition to laminate the laminated board according to sheet Tg, form the production board, should produce and be equipped with at least two hole spacing in 0.075mm ~ 0.18 mm's first drilling site and second drilling site on the board, the aperture of first drilling site is less than or equal to the aperture of second drilling site, two drilling sites are the position that need drill in subsequent processing.
(4) Drilling: according to the prior art, a drill bit is used to drill a first through hole 1 and a second through hole 2 (as shown in fig. 1 or fig. 2) at a first drilling site and a second drilling site in sequence.
In an embodiment, when the aperture of the first drilling hole is smaller than that of the second drilling hole, the first through hole 1 and the second through hole 2 are drilled by adopting the drill bits with different sizes (as shown in fig. 1), namely, the first through hole 1 is drilled by adopting the drill bit with the same size as that of the first through hole, then the second through hole 2 is drilled after being changed into the drill bit with the same size as that of the second through hole through the tool changing operation, and the problem of local overhigh temperature in the drilling process can be avoided by adopting a mode of respectively drilling the front drill bit and the rear drill bit for two holes with different apertures.
In another embodiment, when the aperture of the first drilling site is the same as that of the second drilling site, the first through hole 1 and the second through hole 2 are drilled by using two drills (as shown in fig. 2), and the outer diameters of the two drills are the same; the first through hole 1 is drilled by adopting a drill bit with the same size as the aperture of the first through hole, then the second through hole 2 is drilled after the drill bit is changed into another drill bit with the same size through tool changing operation, and the problem of overhigh local temperature in the drilling process can be avoided by adopting a mode of respectively drilling the front drill bit and the rear drill bit aiming at two holes with the same aperture.
In the above, the thickness-diameter ratio of the first through hole to the second through hole is more than or equal to 10:1.
(5) And (3) back drilling: the first through hole 1 is subjected to back drilling, and the outer diameter of a drill bit during back drilling is smaller than the aperture of the first through hole, so that a dust removing hole 3 (shown in fig. 1 or 2) is formed, and dust in the hole is removed; and (3) carrying out back drilling at the center corresponding to the first through hole during back drilling.
In an embodiment, the outer diameter of the drill bit during back drilling is smaller than the aperture of the first through hole by 0.05mm, namely, the aperture of the dust removing hole is smaller than the aperture of the first through hole by 0.05mm, and under the condition of the aperture size of the phase difference, the dust in the hole can be effectively removed, meanwhile, the drill bit during back drilling can be ensured not to touch the wall of the first through hole, the problem that when back drilling is carried out by adopting the drill bit with the same aperture of the first through hole, the drill deviation is caused due to the influence of factors such as the alignment precision and the processing error of the drilling machine, and further the deformation and the damage of the first through hole are caused, so that the drilling quality is ensured.
(6) Washing: and (3) carrying out high-pressure water washing treatment on the production plate, wherein the high-pressure water washing adopts a spray water washing mode.
The pressure during high-pressure water washing is 10-20kg/cm 2 Preferably 15kg/cm 2 The water flow rate is controlled to be 3+/-1L/min, preferably 3L/min.
(7) Blowing holes: blowing the hole to the production plate, wherein the air pressure is controlled to be 4-12Kpa during the hole blowing; and hole blowing is carried out by adopting a hole blowing machine during hole blowing treatment.
(9) Copper deposition: a layer of thin copper is deposited on the plate surface and the hole wall by using an electroless copper plating method, the backlight test is carried out for 10 grades, and the thickness of the deposited copper in the hole is 0.5 mu m.
(10) Full plate electroplating: full plate electroplating was performed at a current density of 18ASF for 120min to thicken the hole copper and plate copper layers.
(11) Outer layer circuit (positive process) was fabricated: transferring the outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive line film and using a 5-7-grid exposure rule (a 21-grid exposure rule), and developing to form the outer layer line pattern on a production board; plating an outer layer pattern, then plating copper and plating tin on the production board respectively, setting plating parameters according to the required copper thickness, wherein the copper plating is to plate the whole board for 60min at the current density of 1.8ASD, and the tin plating is to plate the whole board for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 μm; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production plate, wherein the copper thickness of the outer layer circuit is more than or equal to 70 mu m; and the outer layer AOI is used for detecting whether the outer layer circuit has defects such as open circuit, notch, incomplete etching, short circuit and the like by comparing with CAM data by using an automatic optical detection system.
(12) Solder resist, silk-screen character: after silk-screen printing the solder resist ink on the surface of the production plate, sequentially performing pre-curing, exposure, development and heat curing treatment to enable the solder resist ink to be cured into a solder resist layer; specifically, the TOP surface is coated with a protective layer for preventing bridging between lines during welding, providing a permanent electrical environment and resisting chemical corrosion, and beautifying appearance by adding 'UL mark' to TOP surface characters, so that the lines and the base material which do not need to be welded are coated with the protective layer.
(13) Surface treatment (nickel-gold plating): the chemical principle is communicated with the copper surface of the welding pad of the solder mask windowing position, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(14) Electric test: the electrical conductivity of the finished board is tested, and the board is tested by the following steps: and (5) flying probe testing.
(15) And (3) forming: according to the prior art, the appearance is milled according to the design requirement, and the appearance tolerance is +/-0.05mm, so that the circuit board is manufactured.
(16) FQC: and checking the appearance of the circuit board according to the customer acceptance standard and the I department inspection standard, and if the circuit board is defective, repairing the circuit board in time, thereby ensuring that the circuit board provides excellent quality control for customers.
(17) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not.
(18) And (3) packaging: and (5) sealing and packaging the circuit board according to the packaging mode and the packaging quantity required by the customer, placing the drier and the humidity card, and then delivering.
The foregoing has described in detail the technical solutions provided by the embodiments of the present invention, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present invention, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present invention; meanwhile, as for those skilled in the art, according to the embodiments of the present invention, there are variations in the specific embodiments and the application scope, and the present description should not be construed as limiting the present invention.
Claims (10)
1. A method of drilling high aspect ratio small pitch holes comprising the steps of:
s1, preparing a production plate, wherein at least two first drilling holes and second drilling holes with the hole spacing of 0.075-0.18 mm are formed in the production plate, and the hole diameter of the first drilling holes is less than or equal to the hole diameter of the second drilling holes;
s2, drilling a first through hole and a second through hole at the first drilling position and the second drilling position in sequence;
s3, back drilling is carried out on the first through hole, and the outer diameter of a drill bit during back drilling is smaller than the aperture of the first through hole.
2. The method of drilling high aspect ratio small pitch holes of claim 1, wherein when the aperture of the first drilling site is smaller than the aperture of the second drilling site, the first through hole and the second through hole are drilled with different sizes of the drill bit, respectively.
3. The method of drilling holes with high aspect ratio and small pitch according to claim 1, wherein in the step S2, when the aperture of the first drilling hole is the same as the aperture of the second drilling hole, the first through hole and the second through hole are drilled by using two drills, respectively, and the outer diameters of the two drills are the same.
4. A method of drilling high aspect ratio small pitch holes as claimed in claim 3, wherein in step S2, after a first through hole is drilled at a first drill, the first drill is changed to another drill by a tool changing operation, and then a second through hole is drilled.
5. The method for drilling high aspect ratio small pitch holes according to claim 1, wherein in step S2, the thickness-to-diameter ratio of the first through hole and the second through hole is equal to or greater than 10:1.
6. The method of drilling high aspect ratio small pitch holes according to claim 1, wherein in step S3, the outside diameter of the drill bit at the time of back drilling is smaller than the diameter of the first through hole by 0.05mm.
7. The method of drilling high aspect ratio small pitch holes according to any one of claims 1-5, further comprising the step of, after step S3:
s4, carrying out high-pressure water washing treatment on the production plate;
s5, hole blowing treatment is carried out on the production plate.
8. The method for drilling high aspect ratio small pitch holes according to claim 7, wherein in step S4, the pressure at the time of high pressure water washing is 10 to 20kg/cm 2 The water flow is controlled at 3+/-1L/min.
9. The method for drilling high aspect ratio small pitch holes according to claim 7, wherein in step S5, the air pressure during the hole blowing process is controlled to be 4-12Kpa.
10. The method of drilling high aspect ratio small pitch holes according to claim 1, wherein the production board is a multilayer board in which an inner core board and an outer copper foil are laminated together by prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310998370.8A CN116997084A (en) | 2023-08-08 | 2023-08-08 | Drilling method for high-aspect ratio small-spacing holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310998370.8A CN116997084A (en) | 2023-08-08 | 2023-08-08 | Drilling method for high-aspect ratio small-spacing holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116997084A true CN116997084A (en) | 2023-11-03 |
Family
ID=88526397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310998370.8A Pending CN116997084A (en) | 2023-08-08 | 2023-08-08 | Drilling method for high-aspect ratio small-spacing holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116997084A (en) |
-
2023
- 2023-08-08 CN CN202310998370.8A patent/CN116997084A/en active Pending
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