CN116895513A - 等离子体处理装置 - Google Patents
等离子体处理装置 Download PDFInfo
- Publication number
- CN116895513A CN116895513A CN202310352493.4A CN202310352493A CN116895513A CN 116895513 A CN116895513 A CN 116895513A CN 202310352493 A CN202310352493 A CN 202310352493A CN 116895513 A CN116895513 A CN 116895513A
- Authority
- CN
- China
- Prior art keywords
- flange
- insulating
- insulating spacer
- processing apparatus
- plasma processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 202
- 239000000758 substrate Substances 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 48
- 230000002093 peripheral effect Effects 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 27
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 239000010408 film Substances 0.000 description 25
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000009832 plasma treatment Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022-063464 | 2022-04-06 | ||
JP2022063464A JP7510457B2 (ja) | 2022-04-06 | 2022-04-06 | プラズマ処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116895513A true CN116895513A (zh) | 2023-10-17 |
Family
ID=88289906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310352493.4A Pending CN116895513A (zh) | 2022-04-06 | 2023-04-04 | 等离子体处理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7510457B2 (ko) |
KR (1) | KR20230143951A (ko) |
CN (1) | CN116895513A (ko) |
TW (1) | TWI835618B (ko) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5883652U (ja) | 1981-11-25 | 1983-06-06 | 古河電気工業株式会社 | ブレミツクスバ−ナの逆火防止装置 |
JP2001313286A (ja) | 2000-02-24 | 2001-11-09 | Tokyo Electron Ltd | 平行平板型ドライエッチング装置 |
JPWO2010079740A1 (ja) * | 2009-01-09 | 2012-06-21 | 株式会社アルバック | プラズマ処理装置 |
CN102272895A (zh) * | 2009-01-09 | 2011-12-07 | 株式会社爱发科 | 等离子体处理装置 |
KR20110104982A (ko) * | 2009-01-09 | 2011-09-23 | 가부시키가이샤 아루박 | 플라즈마 처리 장치 및 플라즈마 cvd 성막 방법 |
DE112010000869B4 (de) * | 2009-01-09 | 2013-10-17 | Ulvac, Inc. | Plasmaverarbeitungsvorrichtung und Verfahren zum Bilden monokristallinen Siliziums |
JP5394403B2 (ja) * | 2009-01-09 | 2014-01-22 | 株式会社アルバック | プラズマ処理装置 |
JP2012049221A (ja) | 2010-08-25 | 2012-03-08 | Toppan Printing Co Ltd | 太陽電池モジュールとその製造方法とバックシート付き回路層と太陽電池 |
JP6373708B2 (ja) | 2014-09-30 | 2018-08-15 | 株式会社Screenホールディングス | プラズマ処理装置およびプラズマ処理方法 |
SG11201704051SA (en) | 2014-12-03 | 2017-06-29 | Ulvac Inc | Target assembly |
JP2018041716A (ja) | 2016-09-01 | 2018-03-15 | 株式会社豊田自動織機 | 電池パック |
JP2019053924A (ja) | 2017-09-15 | 2019-04-04 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US11512393B2 (en) | 2018-11-29 | 2022-11-29 | Lam Research Corporation | Dynamic sheath control with edge ring lift |
-
2022
- 2022-04-06 JP JP2022063464A patent/JP7510457B2/ja active Active
-
2023
- 2023-04-04 CN CN202310352493.4A patent/CN116895513A/zh active Pending
- 2023-04-04 KR KR1020230044285A patent/KR20230143951A/ko unknown
- 2023-04-06 TW TW112112808A patent/TWI835618B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20230143951A (ko) | 2023-10-13 |
TW202409331A (zh) | 2024-03-01 |
JP7510457B2 (ja) | 2024-07-03 |
TWI835618B (zh) | 2024-03-11 |
JP2023154254A (ja) | 2023-10-19 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |