CN116893725A - Server, server cooling system and server cooling method - Google Patents
Server, server cooling system and server cooling method Download PDFInfo
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- CN116893725A CN116893725A CN202310945400.9A CN202310945400A CN116893725A CN 116893725 A CN116893725 A CN 116893725A CN 202310945400 A CN202310945400 A CN 202310945400A CN 116893725 A CN116893725 A CN 116893725A
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- 238000001816 cooling Methods 0.000 title claims abstract description 211
- 238000010438 heat treatment Methods 0.000 claims abstract description 166
- 239000007788 liquid Substances 0.000 claims abstract description 96
- 238000001514 detection method Methods 0.000 claims description 54
- 239000000110 cooling liquid Substances 0.000 claims description 53
- 239000002826 coolant Substances 0.000 claims description 33
- 230000020169 heat generation Effects 0.000 claims description 31
- 230000007246 mechanism Effects 0.000 claims description 27
- 238000005192 partition Methods 0.000 claims description 19
- 238000005265 energy consumption Methods 0.000 abstract description 20
- 230000009467 reduction Effects 0.000 abstract description 12
- 238000004134 energy conservation Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 description 34
- 238000000034 method Methods 0.000 description 24
- 239000002699 waste material Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 230000001276 controlling effect Effects 0.000 description 7
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000008844 regulatory mechanism Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Computer Hardware Design (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to the technical field of cooling devices, in particular to a server, a server cooling system and a server cooling method. The server comprises an equipment main body, a main board, a fan and a liquid cooling plate, wherein the main board, the fan and the liquid cooling plate are all arranged in the equipment main body; one side of the main board is provided with a first heating area, the other opposite side of the main board is provided with a second heating area, and the heating value of the first heating area is smaller than that of the second heating area under the working condition of the main board; the fan is arranged corresponding to the first heating area and used for cooling the first heating area; the liquid cooling plate is arranged in the second heating area and used for cooling the second heating area. The server provided by the embodiment of the application has the advantages of energy conservation and consumption reduction.
Description
Technical Field
The application relates to the technical field of cooling devices, in particular to a server, a server cooling system and a server cooling method.
Background
A server is a type of computer that runs faster and is more loaded than a normal computer. The server generates a large amount of heat during operation, and heat dissipation is required to be performed on the server in order to avoid hardware faults, system breakdown and the like caused by overhigh temperature of the server. Most of the heat dissipation modes in the server are air-cooling liquid-cooling mixed heat dissipation modes.
In the air-cooled liquid-cooled hybrid heat dissipation system, air flow guided by a fan is blown to a main board, and a liquid cooling plate in a liquid-cooled heat dissipation part is in contact with a heat generating component on the main board. The fan has low utilization efficiency and high noise; the liquid cooling radiating part is designed under the worst working condition, so that the flow waste is caused when the load of the server is reduced, the energy consumption is wasted, and the burden of a circulating pump and the pressure-bearing burden of a pipeline in the coolant distribution unit are increased.
Obviously, the air-cooling liquid-cooling mixed heat dissipation mode in the prior art has the problems of high noise and energy consumption.
Disclosure of Invention
In view of the above, the present application aims to provide a server, a server cooling system and a server cooling method, so as to solve or partially solve the problems of noise and energy consumption of the existing air-cooling and liquid-cooling mixed heat dissipation method of the server.
In order to achieve the above purpose, the technical scheme of the application is realized as follows:
in a first aspect, the present application provides a server, including an apparatus main body, a main board, a fan, and a liquid cooling board, where the main board, the fan, and the liquid cooling board are all disposed in the apparatus main body; one side of the main board is provided with a first heating area, the other opposite side of the main board is provided with a second heating area, and the heating value of the first heating area is smaller than that of the second heating area under the working condition of the main board; the fan is arranged corresponding to the first heating area and used for cooling the first heating area; the liquid cooling plate is arranged in the second heating area and used for cooling the second heating area.
Further, the server further comprises a partition board, wherein the partition board is arranged in the equipment main body and is perpendicular to the main board; one surface of the partition plate corresponds to the first heating area, and the other surface of the partition plate corresponds to the second heating area.
Further, one end of the device main body is a front window, the opposite end of the device main body is a rear window, and the first heating area and the second heating area are both arranged along the direction from the front window to the rear window.
Further, the fan is connected with the front window, and the wind flow guided by the fan flows out of the rear window after entering from the front window; or the fan is connected with the rear window, and the wind flow guided by the fan flows out of the front window after entering from the rear window.
Further, the fan is located in the middle of the first heating area, and the air flow guided by the fan flows out of the rear window after entering from the front window, or the air flow guided by the fan flows out of the front window after entering from the rear window.
Further, the main board comprises a first component and a second component, wherein the first component is positioned in the first heating area, and the second component is positioned in the second heating area; the first component and the second component generate heat when the main board is in operation.
Further, the first component comprises at least one of a hard disk, a low-power consumption board card and a power supply device.
Further, the second component comprises at least one of a central processing unit, a memory bank and a graphics processor.
Further, the liquid cooling plates are in one-to-one contact with the second components.
In a second aspect, the present application further provides a server cooling system, including a cooling controller, a cooling liquid circulation control mechanism, a first temperature detection module, a second temperature detection module, and the server described above; the cooling controller is connected with the cooling liquid circulation control mechanism, the first temperature detection module, the second temperature detection module and a fan in the server, the first temperature detection module is used for detecting the temperature of a first heating area, and the second temperature detection module is used for detecting the temperature of a second heating area; the cooling controller controls the rotating speed of the fan according to the temperature detected by the first temperature detection module; and the cooling controller controls the cooling liquid circulation control mechanism to act according to the temperature detected by the second temperature detection module, and the cooling liquid circulation control mechanism controls the flow of cooling liquid in the liquid cooling plate.
In a third aspect, the present application further provides a server cooling method, including detecting a temperature of a first heating area, and controlling a rotation speed of a fan according to the temperature of the first heating area; and detecting the temperature of the second heating area, and controlling the flow rate of cooling liquid in the liquid cooling plate according to the temperature of the second heating area.
Compared with the prior art, the server disclosed by the application has the following advantages:
in the server, one side of the main board is a first heating area, the other opposite side of the main board is a second heating area, and the heating value of the first heating area is smaller than that of the second heating area under the working condition of the main board; the fan is arranged corresponding to the first heating area and used for cooling the first heating area; the liquid cooling plate is arranged in the second heating area and used for cooling the second heating area. The main board is partitioned according to the heating value under the working condition, namely a first heating area and a second heating area, and the fan and the liquid cooling plate are used for cooling the first heating area and the second heating area respectively. Because the fans only cool the second heating area, the number of the fans can be reduced, the cost is reduced, and the noise of the fans is reduced; the waste of the side flow of the air flow guided by the fan at the position of the liquid cooling plate can be avoided, the ineffective space of air cooling is reduced, and the air cooling efficiency is improved; the flow resistance of the part and the liquid cooling plate at the second heating area can be prevented from reducing the utilization efficiency of the fan, the utilization rate of wind flow is improved, the energy consumption of the fan in use is reduced, and the energy is effectively saved; the phenomenon that wind flows through a plurality of parts to easily form turbulent flow areas to cause overlarge noise of the server can be avoided, and the use experience of users is reduced; the liquid cooling plate only cools the second heating area, so that flow waste caused by load reduction of the server can be reduced, energy consumption waste is reduced, and the burden of a circulating pump and the burden of pressure bearing of a pipeline in the coolant distribution unit are reduced. The server can further reduce energy consumption by establishing an adjustment mechanism for the fan and the liquid cooling plate. Therefore, the server provided by the embodiment of the application has the advantages of low noise, energy conservation and consumption reduction.
The foregoing description is only an overview of the present application, and is intended to be implemented in accordance with the teachings of the present application in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present application more readily apparent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments of the present application will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic layout diagram of a server according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a motherboard according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a server cooling system according to an embodiment of the present application;
FIG. 4 is a flowchart illustrating a method for cooling a server according to an embodiment of the present application;
fig. 5 is a flowchart of a second method for cooling a server according to an embodiment of the application.
Reference numerals illustrate:
1-an apparatus body; 2-a main board; 3-fans; 4-liquid cooling plate; 5-a first heat generation zone; 6-a second heat generation zone; 7-a partition plate; 8-front window; 9-rear window; 10-a first part; 11-a second component; 12-a water inlet pipe; 13-water outlet pipe.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
An embodiment of the present application provides a server, and referring to fig. 1, a schematic layout diagram of the server in the embodiment of the present application is shown. The server comprises an equipment main body 1, a main board 2, a fan 3 and a liquid cooling plate 4, wherein the main board 2, the fan 3 and the liquid cooling plate 4 are all arranged in the equipment main body 1; one side of the main board 2 is provided with a first heating area 5, the other opposite side of the main board 2 is provided with a second heating area 6, and under the working condition of the main board 2, the heating value of the first heating area 5 is smaller than that of the second heating area 6; the fan 3 is arranged corresponding to the first heating area 5 and is used for cooling the first heating area 5; the liquid cooling plate 4 is disposed in the second heat generating area 6, and is used for cooling the second heat generating area 6.
Specifically, the device main body 1 is provided with an accommodating space, and the main board 2, the fan 3 and the liquid cooling plate 4 are all arranged in the accommodating space, so that the device main body 1 can play a role in protecting and supporting the main board 2, the fan 3 and the liquid cooling plate 4. The apparatus main body 1 includes, for example, a housing or the like.
The main board 2 comprises a hard disk, a low-power board card, a central processing unit, a memory bar, a graphic processor and other components, and under the working condition of the main board 2, the heating conditions of the hard disk, the low-power board card, the central processing unit, the memory bar and the graphic processor are different. The component with relatively high heat productivity, such as a central processing unit, a memory bank, a graphics processor, etc., may be provided in the first heat generating area 5; the second heat generating area 6 is provided with a component with relatively low heat generation, such as a hard disk and a low-power board card. At this time, the heat generated by the first heat generating area 5 is smaller than that of the second heat generating area 6 when the main board 2 is in operation. With further reference to fig. 1, the upper side of the main board 2 is a first heat generating area 5, and the lower side of the main board 2 is a second heat generating area 6.
The fan 3 is an electric device that can accelerate air circulation by driving the blades to rotate by a motor. The fan 3 achieves cooling of the first heat generating area 5 by increasing the air circulation at the first heat generating area 5.
The liquid cooling plate 4 is provided with a cooling liquid flow channel, and when the server is in use, the cooling liquid flow channel of the liquid cooling plate 4 is used for cooling liquid to flow, and the cooling liquid can absorb heat of the second heating area 6 in the flowing process so as to realize cooling of the second heating area 6. The embodiment of the present application does not specifically limit the cooling liquid flow channel in the liquid cooling plate 4, and only needs to meet the cooling liquid flow requirement and the cooling requirement of the second heating area 6.
In the server of the embodiment of the application, one side of the main board 2 is provided with the first heating area 5, the other opposite side of the main board 2 is provided with the second heating area 6, and under the working condition of the main board 2, the heating value of the first heating area 5 is smaller than that of the second heating area 6; the fan 3 is arranged corresponding to the first heating area 5 and is used for cooling the first heating area 5; the liquid cooling plate 4 is disposed in the second heat generating area 6, and is used for cooling the second heat generating area 6. The main board 2 is partitioned according to the heating value under the working condition, namely a first heating area 5 and a second heating area 6, and the fan 3 and the liquid cooling plate 4 cool the first heating area 5 and the second heating area 6 respectively. Because the fans 3 only cool the second heating area 6, the number of the fans 3 can be reduced, the cost is reduced, and the noise of the fans 3 is reduced; the air flow guided by the fan 3 can be prevented from being wasted by-pass at the position of the liquid cooling plate 4, the ineffective space of air cooling is reduced, and the air cooling efficiency is improved; the flow resistance of the parts at the second heating area 6 and the liquid cooling plate 4 can be prevented from reducing the utilization efficiency of the fan 3, the utilization rate of wind flow is improved, the energy consumption of the fan 3 in use is reduced, and the energy is effectively saved; the phenomenon that wind flows through a plurality of parts to easily form turbulent flow areas to cause overlarge noise of the server can be avoided, and the use experience of users is reduced; the liquid cooling plate 4 only cools the second heating area 6, so that flow waste caused by the reduction of server load can be reduced, energy consumption waste is reduced, and the burden of a circulating pump and the burden of pipeline pressure in the coolant distribution unit are reduced. The server can further reduce the power consumption by establishing a regulation mechanism for the fan 3 and the liquid cooling plate 4. Therefore, the server provided by the embodiment of the application has the advantages of low noise, energy conservation and consumption reduction.
Further, as the integration level and the computing performance of the server are gradually improved, the power consumption of key components is almost doubled, and the temperature requirement on the server in operation is lower and lower, so that the server has higher cooling requirement. The key components are, for example, a central processing unit, a memory bank, etc., and the embodiment of the present application does not specifically limit the key components.
In the prior art, the heat dissipation of the server mainly adopts air cooling heat dissipation, liquid cooling heat dissipation and air cooling liquid cooling mixed heat dissipation. The air cooling heat dissipation has limited heat dissipation efficiency, the air cooling heat dissipation mode is basically close to the economic and effective heat dissipation limit, and the noise of the fan 3 is larger. The liquid cooling heat dissipation mode of the server mainly comprises cold plate type liquid cooling and immersed type liquid cooling, wherein the cold plate type liquid cooling scheme is basically adaptive to an original server air cooling structure, and does not design a corresponding server liquid cooling structure according to liquid cooling, so that the energy conservation of the server is still limited to a certain extent. In addition, the liquid cooling heat dissipation is in extensive development, is designed under the worst working condition, and when the load of the server is reduced, the waste of flow is caused, the energy consumption is wasted, and the burden of a circulating pump and the pressure bearing burden of a pipeline of the coolant distribution unit are increased. The air cooling and liquid cooling mixed heat dissipation is to be compatible with liquid cooling on the air cooling design, the fan 3 and the liquid cooling plate 4 are mixed in the same space and are used for heat dissipation together, the air flow is wasted in the side flow at the liquid cooling position, the air cooling ineffective space is large, and the utilization efficiency of the fan 3 is low due to the large flow resistance in the radiator. In addition, the wind flow guided by the fan blows to the main board, and the wind flow flows through a plurality of parts, so that turbulence areas are easily formed to cause overlarge system noise, and the use experience of users is reduced. The cold plate type liquid cooling of air cooling and liquid cooling mixed heat dissipation is designed according to the worst working condition, a feedback adjustment mechanism is not needed, and when the load of the server is reduced, the server can be cooled according to the initial maximum flow, so that a certain degree of energy consumption is wasted.
In the server of the embodiment of the application, the main board 2 is divided into the first heating area 5 and the second heating area 6 according to the heating value under the working condition, and the fan 3 and the liquid cooling plate 4 cool the first heating area 5 and the second heating area 6 respectively, so that the problems can be better solved; the server has the advantages of small noise, high cooling efficiency and energy conservation and consumption reduction; and can meet the PUE value (ratio of all energy consumed by the data center to energy consumed by IT loads) requirements for the data center. Moreover, the server of the embodiments of the present application may be designed for higher integration, modularity, and high density features.
Optionally, the server further includes a partition 7, where the partition 7 is disposed in the device main body 1 and is perpendicular to the main board 2; one side of the partition plate 7 corresponds to the first heat generating area 5, and the opposite side of the partition plate 7 corresponds to the second heat generating area 6. The first heating area 5 and the second heating area 6 are completely separated by the arrangement of the middle partition plate 7 of the server, so that the waste of side flow caused by the fact that wind flow enters and blows to the second heating area 6 can be effectively avoided, the ineffective space of wind cooling is reduced, the wind cooling efficiency is improved, the wind flow utilization rate is effectively improved, the energy consumption of the fan 3 in use is reduced, and the energy is effectively saved; and, avoid the wind flow to flow through the part of second heating zone 6 and cause the turbulent flow district, can effectively fall the noise.
Alternatively, referring to fig. 1, one end of the apparatus body 1 is a front window 8, the opposite end of the apparatus body 1 is a rear window 9, and the first heat generating region 5 and the second heat generating region 6 are disposed along the direction from the front window 8 to the rear window 9.
Alternatively, in a specific embodiment of the present application, referring to fig. 1, the fan 3 is connected to the front window 8, and the wind flow guided by the fan 3 flows out of the rear window 9 after entering from the front window 8. The fan 3 is arranged in the equipment main body 1, the front window 8 is used as an air inlet, the rear window 9 is used as an air outlet, and the air flow enters from the front window 8 and flows out of the rear window 9, so that heat of the first heating area 5 is taken away, and the first heating area 5 is cooled.
Alternatively, in another embodiment of the present application, the fan 3 is connected to the rear window 9, and the wind flow guided by the fan 3 flows out of the front window 8 after entering from the rear window 9. The fan 3 is arranged in the equipment main body 1, the front window 8 is used as an air outlet, the rear window 9 is used as an air inlet, and the air flow enters from the rear window 9 and flows out of the front window 8, so that the heat of the first heating area 5 is taken away, and the cooling of the first heating area 5 is realized.
It is to be understood that the number of fans 3 is not particularly limited in the embodiment of the present application, for example, 3, 4, 5, etc. fans 3 are provided. Wherein in fig. 1, 3 fans are provided.
Alternatively, in the third embodiment of the present application, the fan 3 is located at the middle of the first heating area 5, and the air flow guided by the fan 3 flows out from the rear window 9 after entering from the front window 8, or the air flow guided by the fan 3 flows out from the front window 8 after entering from the rear window 9.
Alternatively, referring to fig. 1, the main board 2 includes a first component 10 and a second component 11, where the first component 10 is located in the first heat generating area 5, and the second component 11 is located in the second heat generating area 6; the main board 2 generates heat when in operation, the first component 10 and the second component 11. The fan 3 is arranged corresponding to the first heating area 5, and specifically cools the first component 10 of the first heating area 5; the liquid cooling plate 4 is arranged in the second heat generating area 6, in particular for cooling the second component 11 of the second heat generating area 6.
Optionally, the first component 10 includes at least one of a hard disk, a low power consumption board, and a power supply device.
Wherein the hard disk is the primary storage device in the server.
It can be appreciated that the low-power board card is not particularly limited in the embodiment of the present application, and for example, the low-power board card is at least one of an array card (Raid card), an expansion card (PCIE card), a display card (e.g., T4 card), and the like. Specifically, the Raid (disk array) is a disk group with huge capacity formed by combining a plurality of independent disks, the efficiency of the whole disk system is improved by using the addition effect generated by providing data by individual disks, and the data is cut into a plurality of sections and respectively stored on each hard disk by using the technology. The number of channels of the data acquisition card is 4 channels for synchronous acquisition, and the depth of the memory is 64K words. The display card converts the display information to drive the display, and provides progressive or interlaced scanning signals to the display to control the correct display of the display.
Optionally, the second component 11 includes at least one of a central processing unit, a memory bank, and a graphics processor.
Specifically, a central processing unit (Central Processing Unit, abbreviated as CPU) is used as an operation and control core of the server, and is a final execution unit for information processing and program running. Memory banks (DIMMs) are computer components that a CPU can address via a bus and perform read and write operations. Graphics processor (graphics processing unit, abbreviated GPU), also known as display core, vision processor, display chip, is a microprocessor that performs image and graphics related operations.
It will be appreciated that the first component 10 and the second component 11 are not particularly limited in the embodiment of the present application, and the components on the motherboard 2 are not particularly limited in the embodiment of the present application. For example, the main board 2 further includes a network card, which is a low-power component, and the heating value of the network card when in operation is lower than that of the central processing unit, the memory bank, and the like when in operation, and the network card may be disposed in the first heating area 5. When the heat dissipation effect of the fan 3 on the network card is poor, the network card can also be arranged in the second heat generation area 6 to dissipate heat through the liquid cooling plate 4. The network card is a piece of hardware used to allow the server to communicate over the network.
Referring to fig. 1, the arrangement positions and the number of the first components 10 and the second components 11 on the motherboard 2 are set according to the use requirement of the server, which is not particularly limited in the embodiment of the present application, for example, as shown in fig. 1 and 2.
In the server according to the embodiment of the present application, the components on the motherboard 2 may be selectively disposed in the first heat generation area 5 or the second heat generation area 6 according to specific heat dissipation requirements, so as to adopt air cooling or liquid cooling to dissipate heat, thereby meeting the heat dissipation requirements for the components on the motherboard 2.
Optionally, the liquid cooling plates 4 are in one-to-one contact with the second components 11, so as to achieve effective heat dissipation of the second components 11.
Optionally, in the case that the second component 11 has at least two liquid cooling plates 4, at least two liquid cooling plates 4 may be connected through a pipeline, and at least two liquid cooling plates 4 may be connected in series or may be connected in parallel, and the connection relationship and the connection manner between the liquid cooling plates 4 are not particularly limited in the embodiment of the present application, so long as the cooling requirement of the second component 11 is satisfied. Referring to fig. 1, four liquid cooling plates 4 are provided, and the four liquid cooling plates 4 are connected in series through a pipeline. The cooling liquid flowing in from the water inlet pipe 12 sequentially passes through the four liquid cooling plates 4 and then flows out through the water outlet pipe 13.
Referring to fig. 1, in the server according to the embodiment of the present application, a first component 10 and a second component 11 on a motherboard 2 are arranged according to a user requirement, where the first component 10 is located in a first heat generating area 5, and the second component 11 is located in a second heat generating area 6. In the left-right direction of fig. 1, the right end of the apparatus main body 1 is a front window 8, the left end of the apparatus main body 1 is a rear window 9, and the first heat generating area 5 and the second heat generating area 6 are both disposed along the left-right direction, and in a specific embodiment, the fan 3 is disposed near the front window 8.
In the operating condition of the main board 2, both the first part 10 on the first heat generating area 5 and the second part 11 of the second heat generating area 6 generate heat. The fan 3 is blown corresponding to the first heating area 5, and the air flow is blown out from the rear window 9 after entering from the front window 8 and passing through the first heating area 5, so that the air flow takes away the heat of the first component 10 on the first heating area 5 in the flowing process of the first heating area 5, and the cooling of the first heating area 5 is realized. The cooling plate is used for cooling liquid to flow, the cooling liquid absorbs heat of the second component 11 in the flowing process, and the cooling liquid absorbing heat brings heat out of the server when flowing out of the server, so that cooling of the second heating area 6 is realized.
In the server according to the embodiment of the present application, one side of the main board 2 is a first heating area 5, the opposite side of the main board 2 is a second heating area 6, a first component 10 of the main board 2 is located in the first heating area 5, and a second component 11 of the main board 2 is located in the second heating area 6. Under the working condition of the main board 2, the heating value of the first component 10 on the first heating area 5 is relatively small, the fan 3 is arranged corresponding to the first heating area 5, and the heat of the first component 10 on the first heating area 5 is taken away by the wind flow rotating by the fan 3 in the flowing process of the first heating area 5, so that the first heating area 5 is cooled. The heat productivity of the second component 11 on the second heat generating area 6 is relatively large, the liquid cooling plate 4 is arranged on the second heat generating area 6 and is in contact with the second component 11 on the second heat generating area 6, the heat of the second component 11 is absorbed in the flowing process of the cooling liquid in the liquid cooling plate 4, and the cooling liquid absorbing the heat brings the heat out of the server when the cooling liquid absorbing the heat flows out of the server, so that the cooling of the second heat generating area 6 is realized.
The main board 2 is partitioned according to the heating value under the working condition, and is divided into a first heating area 5 and a second heating area 6, and the first heating area 5 and the second heating area 6 are partitioned by a partition board. The fans 3 only cool the first heating areas 5, so that the number of the fans 3 can be reduced, the cost is reduced, and the noise generated when the fans 3 rotate is reduced; the arrangement of the partition plate can avoid the waste of the side flow of the air flow guided by the fan 3 at the position of the second heating area 6, and reduce the ineffective space of air cooling; the utilization efficiency of the fan 3 can be prevented from being reduced by the flow resistance of the part at the second heating area 6 and the liquid cooling plate 4, the air cooling efficiency can be improved, the air flow utilization rate can be improved, the energy consumption of the fan 3 in use can be reduced, and the energy is effectively saved; the wind current can also be avoided flowing through the second district 6 that generates heat, causes the wind current to flow through the part numerous, easily forms the turbulent flow district and causes the server noise too big, reduces user's use experience sense. The liquid cooling plate 4 only cools the second heating area 6, so that flow waste caused by the reduction of server load can be reduced, energy consumption waste is reduced, and the burden of a circulating pump and the burden of pipeline pressure in the coolant distribution unit are reduced. The server can further reduce the power consumption by establishing a regulation mechanism for the fan 3 and the liquid cooling plate 4. In summary, the server of the embodiment of the application has the advantages of energy saving and consumption reduction.
The embodiment of the application also provides a server cooling system, which is shown by referring to FIG. 3 and comprises a cooling controller, a cooling liquid circulation control mechanism, a first temperature detection module, a second temperature detection module and the server; the cooling controller is connected with the cooling liquid circulation control mechanism, a first temperature detection module, a second temperature detection module and a fan in the server, wherein the first temperature detection module is used for detecting the temperature of a first heating area 5 in the server, and the second temperature detection module is used for detecting the temperature of a second heating area 6 in the server; the cooling controller controls the rotating speed of a fan 3 in the server according to the temperature detected by the first temperature detection module, and the fan 3 rotates to cool the first heating area 5; the cooling controller controls the cooling liquid circulation control mechanism to act according to the temperature detected by the second temperature detection module, the cooling liquid circulation control mechanism controls the flow of the cooling liquid in the liquid cooling plate 4 in the server, and the liquid cooling plate 4 is used for cooling the second heating area 6.
Specifically, the cooling controller is used for the integrated control of server cooling system, and cooling controller is connected with coolant circulation control mechanism, first temperature detection module, second temperature detection module, and cooling controller can receive the temperature signal that first temperature detection module and second temperature detection module detected to can control fan 3 and rotate, and control coolant circulation control mechanism action, make coolant circulation control mechanism control the flow of coolant in the liquid cooling board 4.
The first temperature detection module is configured to detect the temperature of the first heat generation area 5, and it can be understood that the first temperature detection module is not specifically limited in the embodiment of the present application, and the requirement for detecting the temperature of the first heat generation area 5 can be met. For example, the first temperature detection module is a temperature detection unit on the first component 10; for example, the first temperature detection module is a temperature sensor that can detect the first component 10; for example, the first temperature detecting module is a temperature sensor for detecting the temperature of the first heating area 5; the first temperature detection module is a component, and the first temperature detection module can also be a combination of various components.
Alternatively, in the case where the first temperature detection module has a plurality of temperature detection modules, the cooling controller controls the rotation speed of the fan 3 according to the highest temperature among the plurality of temperatures detected by the first temperature detection module.
Further, in an embodiment of the present application, the temperature of the first heat generating area 5 detected by the first temperature detecting module includes a first temperature, and when the cooling controller controls the fan 3 to rotate according to the first temperature, the rotational speed of the fan 3 is increased when the temperature of the first temperature is higher, so as to increase the flow rate of the air flow at the first heat generating area 5, and heat of the first heat generating area 5 is taken away during the air flow. When the first temperature is relatively low, the rotation speed of the fan 3 is reduced to reduce the flow rate of the air flow at the first heat generation area 5, so that more energy is saved and the noise generated when the fan 3 rotates is reduced under the condition of meeting the heat dissipation requirement of the first heat generation area 5. Wherein the first temperature is relatively low and relatively high may be set according to the use requirements. For example, the server cooling system is provided with a first threshold temperature, the first temperature being relatively high when the first temperature is greater than the first threshold temperature; when the first temperature is less than the first threshold temperature, the first temperature is relatively low.
In another embodiment of the application, the first temperature is increased by 1% or decreased by 1% for every 1 degree increase or decrease in the first temperature compared to the first threshold temperature.
The second temperature detection module is configured to detect the temperature of the second heat generation area 6, and it is understood that the second temperature detection module is not specifically limited in the embodiment of the present application, and the requirement for detecting the temperature of the second heat generation area 6 may be met. For example, the second temperature detection module is a temperature detection unit on the second component 11; the second temperature detection module is, for example, a temperature sensor that can detect the second component 11; for example, the second temperature detecting module is a temperature sensor for detecting the temperature of the second heating area 6; the second temperature detection module can also be a baseboard management controller; the second temperature detection module is a component, and the second temperature detection module can also be a combination of various components.
Optionally, in the case that the second temperature detecting module has a plurality of second temperature detecting modules, the cooling controller controls the cooling liquid circulation control mechanism to act according to the highest temperature among the plurality of temperatures detected by the second temperature detecting module, and the cooling liquid circulation control mechanism controls the flow rate of the cooling liquid in the liquid cooling plate 4.
The coolant circulation control mechanism includes a coolant circulation mechanism, a coolant distribution unit, and the like. The cooling liquid circulation mechanism can cool the cooling liquid with the temperature rising flowing out of the server, the cooling liquid with the temperature lower flowing out of the cooling liquid circulation mechanism can flow into the server again to be used for heat dissipation, and the cooling liquid circulation mechanism can realize the circulation of the cooling liquid. The coolant distribution unit may be intelligent in flow, pressure, etc., managing the performance of the server cooling system.
In a specific embodiment, the second temperature detection module of the server cooling system detects the temperature of the second component 11 in the second heating area 6, and transmits the temperature information to the cooling controller, and the cooling controller controls the coolant distribution unit according to the temperature of the second component 11, and controls the flow of the coolant entering the liquid cooling plate 4 in the server through the coolant distribution unit, so as to achieve the purpose of cooling the second component 11.
In another embodiment, when the second temperature detection module includes a Baseboard Management Controller (BMC), the baseboard management controller may acquire temperature and power consumption information of the chip in the second component 11 and transmit the temperature and power consumption information to the cooling controller, the cooling controller processes the temperature and power consumption information, the cooling controller acquires the information and then sends a control instruction to the coolant distribution unit, and the coolant distribution unit adjusts the flow of the coolant provided to the liquid cooling plate 4 in the server to adjust the temperature of the second heating area 6 in the server to a preset value, so as to achieve dynamic adjustment to achieve the purpose of energy saving.
In the server cooling system according to the embodiment of the application, the main board 2 of the server is partitioned according to the heat productivity under the working condition, and is divided into the first heat generation area 5 and the second heat generation area 6, the first heat generation area 5 and the second heat generation area 6 are partitioned by the partition board, and the fan 3 and the liquid cooling board 4 cool the first heat generation area 5 and the second heat generation area 6 respectively. The first temperature detection module is used for detecting the temperature of the first heating area 5, and the second temperature detection module is used for detecting the temperature of the second heating area 6; the cooling controller controls the rotating speed of the fan 3 according to the temperature detected by the first temperature detection module, and the fan 3 rotates to cool the first heating area 5; the cooling controller controls the cooling liquid circulation control mechanism to act according to the temperature detected by the second temperature detection module, the cooling liquid circulation control mechanism controls the flow of the cooling liquid in the liquid cooling plate 4, and the liquid cooling plate 4 is used for cooling the second heating area 6. The server cooling system of the embodiment of the application correspondingly controls the rotating speed of the fan 3 and the flow of the cooling liquid according to the temperature of the first heating area 5 and the temperature of the second heating area 6, and has the advantages of energy saving and consumption reduction.
The fans 3 only cool the first heating areas 5, so that the number of the fans 3 can be reduced, the cost is reduced, and the noise generated when the fans 3 rotate is reduced; the arrangement of the partition plate can avoid the waste of the side flow of the air flow guided by the fan 3 at the position of the second heating area 6, and reduce the ineffective space of air cooling; the utilization efficiency of the fan 3 can be prevented from being reduced by the flow resistance of the part at the second heating area 6 and the liquid cooling plate 4, the air cooling efficiency is improved, the air flow utilization rate is improved, the energy consumption of the fan 3 in use is reduced, and the energy is effectively saved; the server noise is overlarge because of the fact that wind flows through a plurality of parts and turbulent flow areas are easy to form can be avoided, and the use experience of users is reduced.
The liquid cooling plate 4 only cools the second heating area 6, so that flow waste caused by the reduction of server load can be reduced, energy consumption waste is reduced, and the burden of a circulating pump and the burden of pipeline pressure in the coolant distribution unit are reduced.
The server of the embodiment of the application can also have the advantages of energy conservation and consumption reduction by establishing an adjusting mechanism for the fan 3 and the liquid cooling plate 4.
The embodiment of the application also provides a server cooling method, which comprises the following steps:
s01, detecting the temperature of the first heating area 5.
In this step, the temperature of the first heat generating area 5 is detected by using the first temperature detecting module, and the temperature signal detected by the first temperature detecting module in the first heat generating area 5 is sent to the cooling controller.
S02, controlling the rotating speed of the fan 3 according to the temperature of the first heating area 5.
In this step, the cooling controller receives the temperature signal of the first heat generating area 5 detected by the first temperature detecting module, and adjusts the rotation speed of the fan 3 according to the temperature of the first heat generating area 5, so that the fan 3 rotates to cool the first heat generating area 5.
S03, detecting the temperature of the second heating area 6.
In this step, the second temperature detection module is used to detect the temperature of the second heat generating region 6, and the temperature signal detected by the second temperature detection module in the second heat generating region 6 is sent to the cooling controller.
S04, controlling the flow rate of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heating area 6.
In this step, the cooling controller receives the temperature signal of the second heat generating area 6 detected by the second temperature detecting module, and adjusts the flow rate of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heat generating area 6, so that the liquid cooling plate 4 cools the second heat generating area 6.
In the server cooling method of the embodiment of the application, the temperature of the first heating area 5 is detected, and the rotating speed of the fan 3 is controlled according to the temperature of the first heating area 5; the temperature of the second heat generation area 6 is detected, and the flow rate of the cooling liquid in the liquid cooling plate 4 is controlled according to the temperature of the second heat generation area 6. The main board 2 of the server is partitioned into a first heat generation area 5 and a second heat generation area 6 according to the heat productivity under the working condition, the first heat generation area 5 and the second heat generation area 6 are partitioned by the partition board, and the fan 3 and the liquid cooling plate 4 cool the first heat generation area 5 and the second heat generation area 6 respectively. The server cooling method controls the rotating speed of the fan 3 according to the temperature of the first heating area 5 and controls the flow of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heating area 6, so that the extremely energy saving and consumption reduction can be realized.
It can be understood that, in the embodiment of the present application, the method for detecting the temperature of the first heating area 5 and controlling the rotation speed of the fan 3 according to the temperature of the first heating area 5 to achieve heat dissipation of the fan 3 is not particularly limited, and various methods for detecting the temperature and adjusting the rotation speed of the fan 3 according to the temperature in the prior art to achieve heat dissipation can be applied to the server cooling method implemented in the present application under the condition of meeting the use requirement of the present application.
For example, in a specific embodiment, a first threshold temperature is obtained, the temperature of the first heat generating area 5 is detected, the temperature of the first heat generating area 5 includes a first temperature, and the first temperature and the first threshold temperature are compared, and the rotation speed of the fan 3 is increased by 1% or decreased by 1% every 1 degree or 1 degree of increase of the first temperature.
Further, in the case that the first heat generating area 5 includes a plurality of first components 10, the first temperature may be the highest temperature among the plurality of temperatures detected by the first temperature detecting module. The heat radiation effect of the fan 3 on the first heat generation area 5 can be ensured by adjusting the rotation speed of the fan 3 according to the highest temperature among the detected temperatures.
It will be appreciated that to ensure the heat dissipation effect on the server, it is necessary to continuously detect the temperature of the first heat generating area 5 and adjust the rotation speed of the fan 3 according to the obtained first temperature.
It can be understood that, in the embodiment of the present application, the method for detecting the temperature of the second heating area 6 and controlling the flow of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heating area 6 to achieve heat dissipation of the liquid cooling plate 4 is not particularly limited, and the prior art has various methods for detecting the temperature and adjusting the flow of the cooling liquid in the liquid cooling plate 4 according to the temperature to achieve heat dissipation, so that the method can be applied to the server cooling method implemented in the present application under the condition of meeting the use requirement of the present application.
For example, in a specific embodiment, in the step of detecting the temperature of the second heat generating area 6, in controlling the flow rate of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heat generating area 6, the method further includes the following steps:
s11, acquiring a second threshold temperature.
S12, detecting the temperature of the second heating area 6 to obtain a second temperature.
S13, judging whether the second temperature is greater than a second threshold temperature;
and S14, increasing the rotating speed of the circulating pump in the coolant distribution unit when the second temperature is higher than the second threshold temperature.
And S15, judging whether the second temperature is equal to the second threshold temperature or not when the second temperature is not greater than the second threshold temperature.
S16, when the second temperature is not equal to the second threshold temperature, the rotating speed of the circulating pump in the coolant distribution unit is reduced.
S17, after the rotation speed of the circulating pump in the coolant distribution unit increases or decreases, judging whether the second temperature is equal to a second threshold temperature.
After the rotational speed of the circulation pump in the coolant distribution unit is increased or decreased, when the second temperature is not equal to the second threshold temperature, step S13 is performed.
And S18, finishing the adjustment when the second temperature is equal to the second threshold temperature.
In the above step, when the second temperature is equal to the second threshold temperature, after the adjustment is completed, the process returns to step S11 after waiting for a set time, for example, after 3S, the process returns to step S11, so as to perform continuous temperature monitoring and heat dissipation adjustment on the second heat generation area 6.
In the above step, in the case where the second heat generating region 6 includes the plurality of second members 11, the second temperature may be the highest temperature among the plurality of detected temperatures. According to the highest temperature among the detected temperatures, the flow rate of the cooling liquid in the liquid cooling plate 4 is regulated, so that the heat dissipation effect of the liquid cooling plate 4 on the second heat generation area 6 can be ensured.
It will be understood that, in the above step, in order to continuously detect the temperature of the second heat generating region 6, the second temperature in step S12 is the temperature of the second heat generating region 6 before the flow rate of the cooling liquid in the liquid cooling plate 4 is adjusted, and the second temperature in step S17 is the temperature of the second heat generating region 6 after the flow rate of the cooling liquid in the liquid cooling plate 4 is increased or decreased.
Alternatively, the second temperature may be the temperature of the chip in the second component 11. At this time, the above steps S11 to S18 are to adjust the rotation speed of the circulation pump in the coolant distribution unit according to the chip temperature to adjust the amount of the supplied coolant to the liquid cooling plate 4.
It will be appreciated that the magnitude of the increase or decrease in the rotational speed of the circulation pump in the coolant distribution unit is set according to the use requirement, for example, in step S14, when the second temperature is greater than the second threshold temperature, the rotational speed of the circulation pump in the coolant distribution unit is increased by 2%. For another example, in step S16, when the second temperature is not equal to the second threshold temperature, the rotation speed of the circulation pump in the coolant distribution unit is decreased by 2%.
The server cooling method in the embodiment of the application is different from the rough amplification flow and constant flow heat dissipation scheme in the prior art, can perform feedback adjustment according to the real-time temperature when different chips are loaded, effectively improves the energy efficiency, further reduces the PUE, and can reduce the pipeline pressure-bearing risk caused by continuous high flow and the pump life influence caused by high rotation speed of the circulating pump in the coolant distribution unit in the past; through the steps S11-S18, feedback adjustment is realized, the coolant distribution unit and the server are combined in depth, the temperature of the chip can be continuously controlled at a set temperature threshold value, the rotating speed of the circulating pump in the coolant distribution unit is controlled in an actual required range, and deep energy conservation can be realized.
It should be noted that, for simplicity of description, the method embodiments are shown as a series of acts, but it should be understood by those skilled in the art that the embodiments are not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred, and that the acts are not necessarily all required in accordance with the embodiments of the application.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.
Claims (11)
1. The server is characterized by comprising an equipment main body (1), a main board (2), a fan (3) and a liquid cooling plate (4), wherein the main board (2), the fan (3) and the liquid cooling plate (4) are arranged in the equipment main body (1); one side of the main board (2) is provided with a first heating area (5), the other opposite side of the main board (2) is provided with a second heating area (6), and under the working condition of the main board (2), the heating value of the first heating area (5) is smaller than that of the second heating area (6);
the fan (3) is arranged corresponding to the first heating area (5) and is used for cooling the first heating area (5);
the liquid cooling plate (4) is arranged in the second heating area (6) and is used for cooling the second heating area (6).
2. The server according to claim 1, characterized in that it further comprises a partition plate (7), said partition plate (7) being provided inside said apparatus body (1) and being perpendicular to said main plate (2); one surface of the partition plate (7) corresponds to the first heating area (5), and the other surface of the partition plate (7) corresponds to the second heating area (6).
3. The server according to claim 1, wherein one end of the device body (1) is a front window (8), the opposite end of the device body (1) is a rear window (9), and the first heat generating area (5) and the second heat generating area (6) are both arranged along the direction from the front window (8) to the rear window (9).
4. The server according to claim 3, wherein the server is configured to,
the fan (3) is connected with the front window (8), and the wind flow guided by the fan (3) flows out of the rear window (9) after entering from the front window (8); or,
the fan (3) is connected with the rear window (9), and the wind flow guided by the fan (3) flows out of the front window (8) after entering from the rear window (9).
5. A server according to claim 3, characterized in that the fan (3) is located in the middle of the first heating zone (5), the wind flow guided by the fan (3) flowing out of the rear window (9) after entering from the front window (8), or the wind flow guided by the fan (3) flowing out of the front window (8) after entering from the rear window (9).
6. The server according to claim 1, characterized in that the motherboard (2) comprises a first component (10) and a second component (11), the first component (10) being located in the first heat generation area (5) and the second component (11) being located in the second heat generation area (6); the main board (2) generates heat when in operation, the first component (10) and the second component (11).
7. The server of claim 6, wherein the first component (10) comprises at least one of a hard disk, a low power board, a power supply device.
8. The server according to claim 6, wherein the second component (11) comprises at least one of a central processor, a memory bank, a graphics processor.
9. The server according to claim 6, wherein the liquid cooling plates (4) are in one-to-one contact with the second member (11).
10. A server cooling system comprising a cooling controller, a coolant circulation control mechanism, a first temperature detection module, a second temperature detection module, and at least one server according to any one of claims 1-9; the cooling controller is connected with the cooling liquid circulation control mechanism, the first temperature detection module, the second temperature detection module and a fan in the server, the first temperature detection module is used for detecting the temperature of the first heating area (5), and the second temperature detection module is used for detecting the temperature of the second heating area (6);
the cooling controller controls the rotating speed of the fan (3) according to the temperature detected by the first temperature detection module;
the cooling controller controls the cooling liquid circulation control mechanism to act according to the temperature detected by the second temperature detection module, and the cooling liquid circulation control mechanism controls the flow of cooling liquid in the liquid cooling plate (4).
11. A server cooling method is characterized in that,
detecting the temperature of a first heating area, and controlling the rotating speed of a fan according to the temperature of the first heating area;
and detecting the temperature of the second heating area, and controlling the flow rate of cooling liquid in the liquid cooling plate according to the temperature of the second heating area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202310945400.9A CN116893725A (en) | 2023-07-28 | 2023-07-28 | Server, server cooling system and server cooling method |
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| CN202310945400.9A CN116893725A (en) | 2023-07-28 | 2023-07-28 | Server, server cooling system and server cooling method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117750739A (en) * | 2024-02-20 | 2024-03-22 | 山东艾琳智能科技有限公司 | Immersion server cooling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117750739A (en) * | 2024-02-20 | 2024-03-22 | 山东艾琳智能科技有限公司 | Immersion server cooling system |
| CN117750739B (en) * | 2024-02-20 | 2024-05-14 | 山东科技职业学院 | Immersion server cooling system |
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