CN116893725A - Server, server cooling system and server cooling method - Google Patents

Abstract

The application relates to the technical field of cooling devices, in particular to a server, a server cooling system and a server cooling method. The server comprises an equipment main body, a main board, a fan and a liquid cooling plate, wherein the main board, the fan and the liquid cooling plate are all arranged in the equipment main body; one side of the main board is provided with a first heating area, the other opposite side of the main board is provided with a second heating area, and the heating value of the first heating area is smaller than that of the second heating area under the working condition of the main board; the fan is arranged corresponding to the first heating area and used for cooling the first heating area; the liquid cooling plate is arranged in the second heating area and used for cooling the second heating area. The server provided by the embodiment of the application has the advantages of energy conservation and consumption reduction.

Description

Server, server cooling system and server cooling method

Technical field

The present invention relates to the technical field of cooling devices, and in particular to servers, server cooling systems and server cooling methods.

Background technique

A server is a type of computer that runs faster and with a higher load than a regular computer. The server generates a lot of heat when working. In order to avoid hardware failure or system crash due to excessive server temperature, the server needs to be cooled. Most of the heat dissipation methods in servers are air-cooled and liquid-cooled hybrid heat dissipation.

In the air-cooling and liquid-cooling hybrid heat dissipation method, the air flow guided by the fan blows towards the motherboard, and the liquid cooling plate in the liquid cooling part is in contact with the heating components on the motherboard. Among them, the fan utilization efficiency is low and the noise is high; the liquid cooling part is designed for the worst working conditions. When the server load decreases, it will cause a waste of flow, waste energy and increase the circulation in the coolant distribution unit. Pump burden and pipeline pressure burden.

Obviously, the existing air-cooling and liquid-cooling hybrid heat dissipation methods have problems of high noise and waste of energy consumption.

Contents of the invention

In view of this, the present invention aims to propose a server, a server cooling system and a server cooling method to solve or partially solve the problems of high noise and waste of energy consumption in the air-cooled and liquid-cooled hybrid heat dissipation method of existing servers.

In order to achieve the above objects, the technical solution of the present invention is implemented as follows:

In a first aspect, the present invention provides a server, including a device main body, a motherboard, a fan and a liquid cooling plate. The main board, the fan and the liquid cooling plate are all located in the device body; a side of the main board One side is a first heating area, and the opposite side of the mainboard is a second heating area. When the mainboard is in operation, the calorific value of the first heating area is less than the calorific value of the second heating area; The fan is provided corresponding to the first heating area and is used to cool the first heating area; the liquid cooling plate is provided in the second heating area and is used to cool the second heating area.

Further, the server further includes a partition plate, which is arranged in the main body of the device and perpendicular to the main board; one side of the partition plate corresponds to the first heating area, and the opposite side of the partition plate The other side corresponds to the second heating zone.

Further, one end of the equipment body is a front window, and the opposite end of the equipment body is a rear window. The first heating area and the second heating area are both along the direction from the front window to the rear window. Orientation settings.

Further, the fan is connected to the front window, and the air flow guided by the fan enters from the front window and flows out from the rear window; or, the fan is connected to the rear window, and the air flow guided by the fan The air flow enters through the rear window and then flows out from the front window.

Further, the fan is located in the middle of the first heating area, and the air flow guided by the fan enters from the front window and then flows out from the rear window, or the air flow guided by the fan enters from the rear window. and then flowed out of the front window.

Further, the mainboard includes a first component and a second component, the first component is located in the first heating area, and the second component is located in the second heating area; when the mainboard is working, The first component and the second component generate heat.

Further, the first component includes at least one of a hard disk, a low-power consumption board, and a power supply device.

Further, the second component includes at least one of a central processing unit, a memory module, and a graphics processor.

Further, the liquid cooling plate is in one-to-one contact with the second component.

In a second aspect, the present invention also provides a server cooling system, including a cooling controller, a coolant circulation control mechanism, a first temperature detection module, a second temperature detection module and the above-mentioned server; the cooling controller and the cooling system The liquid circulation control mechanism, the first temperature detection module, the second temperature detection module, and the fan connection in the server are connected. The first temperature detection module is used to detect the temperature of the first heating zone, and the second temperature detection module is used to detect the temperature of the first heating zone. The temperature detection module is used to detect the temperature of the second heating zone; the cooling controller controls the fan speed according to the temperature detected by the first temperature detection module; the cooling controller controls the fan speed according to the temperature detected by the second temperature detection module The cooling liquid circulation control mechanism operates, and the cooling liquid circulation control mechanism controls the flow rate of the cooling liquid in the liquid cooling plate.

In a third aspect, the present invention also provides a server cooling method, which includes: detecting the temperature of a first heating zone, controlling the rotation speed of a fan according to the temperature of the first heating zone; detecting the temperature of a second heating zone, and controlling the speed of a fan according to the temperature of the first heating zone. The temperature of the second heating zone controls the flow of coolant in the liquid cooling plate.

Compared with the existing technology, the server of the present invention has the following advantages:

In the server of the present invention, one side of the mainboard is the first heating area, and the opposite side of the mainboard is the second heating area. When the mainboard is in operation, the calorific value of the first heating area is less than the calorific value of the second heating area. ; The fan is arranged corresponding to the first heating area and is used to cool the first heating area; the liquid cooling plate is arranged in the second heating area and is used to cool the second heating area. The motherboard is divided into first and second heating areas according to the amount of heat generated during operation. Fans and liquid cooling plates cool the first and second heating areas respectively. Since the fan only cools the second heating zone, the number of fans can be reduced, the cost can be reduced, and fan noise can be reduced; the air flow guided by the fan can be avoided from being wasted by side flow at the position of the liquid cooling plate, reducing the ineffective space of air cooling and improving air cooling efficiency; Moreover, it can avoid the flow resistance of the components in the second heating zone and the liquid cooling plate from reducing the fan utilization efficiency, improve the air flow utilization rate, reduce the energy consumption when the fan is used, and effectively save energy; it can also avoid the air flow passing through many components and easily forming turbulence. zone causes excessive server noise, reducing the user experience; the liquid cooling plate only cools the second heating zone, which can reduce flow waste caused by server load reduction, reduce energy waste, and reduce the burden and burden on the circulation pump in the coolant distribution unit. Pipeline pressure burden. The server can also further reduce energy consumption by establishing an adjustment mechanism for fans and liquid cooling plates. Therefore, the server in the embodiment of the present application has the advantages of low noise and energy saving and consumption reduction.

The above description is only an overview of the technical solution of the present invention. In order to have a clearer understanding of the technical means of the present invention, it can be implemented according to the content of the description, and in order to make the above and other objects, features and advantages of the present invention more obvious and understandable. , the specific embodiments of the present invention are listed below.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present invention more clearly, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. , for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exerting creative labor.

Figure 1 is a schematic layout diagram of a server according to an embodiment of the present invention;

Figure 2 is a schematic structural diagram of a motherboard according to an embodiment of the present invention;

Figure 3 is a schematic structural diagram of a server cooling system according to an embodiment of the present invention;

Figure 4 is a flow chart 1 of the server cooling method according to the embodiment of the present invention;

Figure 5 is a flow chart 2 of the server cooling method according to the embodiment of the present invention.

Explanation of reference symbols:

1-Equipment body; 2-Mainboard; 3-Fan; 4-Liquid cooling plate; 5-First heating area; 6-Second heating area; 7-Partition board; 8-Front window; 9-Rear window; 10- The first component; 11-the second component; 12-the water inlet pipe; 13-the water outlet pipe.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.

An embodiment of the present application provides a server. Refer to Figure 1 , which shows a schematic layout diagram of the server in the embodiment of the present application. The server includes a device body 1, a motherboard 2, a fan 3 and a liquid cooling plate 4. The motherboard 2, the fan 3 and the liquid cooling plate 4 are all located in the device body 1; one side of the motherboard 2 is the first heating area 5, and the motherboard 2 The opposite side of is the second heating area 6. When the motherboard 2 is working, the calorific value of the first heating area 5 is less than the calorific value of the second heating area 6; the fan 3 is set corresponding to the first heating area 5 for The first heating area 5 is cooled; the liquid cooling plate 4 is provided in the second heating area 6 for cooling the second heating area 6 .

Specifically, the device main body 1 is provided with an accommodation space, and the main board 2, the fan 3 and the liquid cooling plate 4 are all located in the accommodation space. The device main body 1 can protect and support the main board 2, the fan 3 and the liquid cooling plate 4. The device main body 1 includes, for example, a housing and other components.

The motherboard 2 includes a hard disk, a low-power board, a central processing unit, a memory bar, a graphics processor and other components. When the motherboard 2 is working, the hard disk, a low-power board, a central processor, a memory bar, a graphics processor and other components. The heating conditions are different. Components with relatively high calorific value, such as central processing units, memory sticks, graphics processors, etc., can be placed in the first heating area 5; components with relatively low calorific value can be placed in the second heating area 5. Heating area 6 includes components with relatively low heat generation, such as hard drives and low-power boards. At this time, when the motherboard 2 is in operation, the calorific value of the first heating area 5 will be less than the calorific value of the second heating area 6 . Referring further to FIG. 1 , the upper side of the main board 2 is the first heating area 5 , and the lower side of the main board 2 is the second heating area 6 .

The fan 3 is an electrical appliance that can use a motor to drive the fan blades to rotate to accelerate air circulation. The fan 3 cools the first heating area 5 by increasing air circulation in the first heating area 5 .

There is a coolant flow channel in the liquid cooling plate 4. When the server is in use, the coolant flow channel of the liquid cooling plate 4 is used for the flow of coolant. During the flow process, the coolant will absorb the heat of the second heating zone 6 to achieve Cooling of the second heating zone 6. Among them, the embodiment of the present application does not specifically limit the cooling liquid flow channel in the liquid cooling plate 4 , as long as it meets the cooling liquid flow demand and the cooling demand of the second heating zone 6 .

In the server of the embodiment of the present application, one side of the mainboard 2 is the first heating area 5, and the opposite side of the mainboard 2 is the second heating area 6. When the mainboard 2 is working, the amount of heat generated by the first heating area 5 The calorific value is less than that of the second heating area 6; the fan 3 is provided corresponding to the first heating area 5 for cooling the first heating area 5; the liquid cooling plate 4 is provided in the second heating area 6 for cooling the second heating area 6. The motherboard 2 is partitioned according to the amount of heat generated during operation, and is divided into a first heating area 5 and a second heating area 6 respectively. The fan 3 and the liquid cooling plate 4 cool the first heating area 5 and the second heating area 6 respectively. Since the fan 3 only cools the second heating zone 6, the number of fans 3 can be reduced, the cost can be reduced, and the noise of the fan 3 can be reduced; the air flow guided by the fan 3 can be avoided from being wasted by side flow at the position of the liquid cooling plate 4, and the ineffective space for air cooling can be reduced. , improve the air cooling efficiency; and can avoid the flow resistance of the 6 components in the second heating zone and the liquid cooling plate 4 to reduce the utilization efficiency of the fan 3, improve the air flow utilization rate, reduce the energy consumption when the fan 3 is used, and effectively save energy; it can also Avoid airflow flowing through many components, which can easily form turbulent areas, causing excessive server noise and reducing the user experience; the liquid cooling plate 4 only cools the second heating zone 6, which can reduce flow waste caused by server load reduction and reduce energy consumption. Waste and reduce the burden on the circulation pump and pipeline pressure in the coolant distribution unit. The server can also further reduce energy consumption by establishing an adjustment mechanism for fan 3 and liquid cooling plate 4. Therefore, the server in the embodiment of the present application has the advantages of low noise and energy saving and consumption reduction.

Furthermore, as server integration and computing performance gradually improve, the power consumption of key components has almost doubled, and the temperature requirements for servers to work are getting lower and lower, so servers have higher cooling requirements. Among them, the key components are, for example, a central processing unit, a memory stick, etc., and the embodiments of this application do not specifically limit the key components.

In the existing technology, server heat dissipation mainly adopts air-cooled heat dissipation, liquid-cooled heat dissipation, and air-cooled and liquid-cooled hybrid heat dissipation. Among them, the heat dissipation efficiency of air-cooling heat dissipation is limited, and the air-cooling heat dissipation method is basically close to the cost-effective heat dissipation limit, and the fan 3 is also noisy. Server liquid cooling methods mainly include cold plate liquid cooling and immersion liquid cooling. Among them, cold plate liquid cooling solutions are basically adapted to the original server air cooling architecture, and the corresponding server liquid cooling architecture is not designed based on liquid cooling. , there are still certain restrictions on the energy saving of servers. In addition, liquid cooling is under extensive development and is designed for the worst working conditions. When the server load decreases, it will cause a waste of flow, waste energy, and increase the burden on the circulation pump and pipeline pressure of the coolant distribution unit. . Air-cooling and liquid-cooling hybrid heat dissipation are designed to be compatible with liquid cooling in terms of air cooling. Fan 3 and liquid cooling plate 4 are mixed in the same space for heat dissipation. The air flow has side flow waste in the liquid cooling position, and the air cooling ineffective space is large, and the radiator The large internal flow resistance results in low utilization efficiency of fan 3. Moreover, the air flow guided by the fan blows towards the motherboard, and the air flow passes through many components, which can easily form a turbulent area and cause excessive system noise, reducing the user's experience. Cold plate liquid cooling with air-cooled and liquid-cooled hybrid heat dissipation is designed according to the worst working conditions and has no feedback adjustment mechanism. When the server load is reduced, the server will still be cooled according to the initial maximum flow rate, resulting in a certain degree of waste of energy consumption.

In the server of the embodiment of the present application, the motherboard 2 is partitioned according to the amount of heat generated during operation, and is divided into a first heating area 5 and a second heating area 6. The fan 3 and the liquid cooling plate 4 respectively control the first heating area 5 and the second heating area 6. The cooling of the second heating zone 6 can better solve the above problems; the server has low noise, high cooling efficiency, and can achieve energy saving and consumption reduction; and can meet the PUE value of the data center (all energy consumed by the data center and IT load ratio of energy consumed) requirements. Moreover, the server in the embodiment of the present application can be designed to have higher integration, modularity, and high-density features.

Optionally, the server also includes a partition plate 7. The partition plate 7 is provided in the device body 1 and is perpendicular to the main board 2. One side of the partition plate 7 corresponds to the first heating area 5, and the opposite side of the partition plate 7 corresponds to the second heating area. Zone 6. The setting of the partition board 7 in the middle of the server completely separates the first heating area 5 and the second heating area 6, which can effectively avoid the waste of side flow caused by the air flow entering the second heating area 6 and reduce the ineffective space of air cooling. Improve the air cooling efficiency, effectively improve the air flow utilization rate, reduce the energy consumption when the fan 3 is used, and effectively save energy; and avoid the air flow flowing through the components of the second heating zone 6 to cause turbulent areas, which can effectively reduce noise.

Optionally, as shown in Figure 1, one end of the equipment body 1 is the front window 8, the opposite end of the equipment body 1 is the rear window 9, and the first heating area 5 and the second heating area 6 are both along the front window 8 to the rear. Window 9 orientation settings.

Optionally, in a specific embodiment of the present application, as shown in FIG. 1 , the fan 3 is connected to the front window 8 , and the airflow guided by the fan 3 enters from the front window 8 and then flows out from the rear window 9 . The fan 3 is installed in the main body 1 of the device. The front window 8 serves as the air inlet and the rear window 9 serves as the air outlet. When the air flow enters from the front window 8 and flows out from the rear window 9, it takes away the heat of the first heating zone 5, thereby realizing the control of the second heating zone. A heating zone 5 for cooling.

Optionally, in another specific embodiment of the present application, the fan 3 is connected to the rear window 9 , and the airflow guided by the fan 3 enters through the rear window 9 and then flows out from the front window 8 . The fan 3 is installed in the main body 1 of the device. The front window 8 serves as the air outlet and the rear window 9 serves as the air inlet. When the air flow enters from the rear window 9 and flows out from the front window 8, it takes away the heat of the first heating zone 5, thereby realizing the control of the second heating zone. A heating zone 5 for cooling.

It can be understood that the number of fans 3 is not specifically limited in the embodiment of the present application. For example, 3, 4, 5 fans 3 may be provided. Among them, there are three fans in Figure 1.

Optionally, in the third specific embodiment of the present application, the fan 3 is located in the middle of the first heating zone 5 , and the air flow guided by the fan 3 enters from the front window 8 and then flows out from the rear window 9 , or the air flow guided by the fan 3 It enters through the rear window 9 and flows out through the front window 8 .

Optionally, as shown in Figure 1, the mainboard 2 includes a first component 10 and a second component 11. The first component 10 is located in the first heating area 5, and the second component 11 is located in the second heating area 6; the mainboard 2 is working In this case, the first component 10 and the second component 11 generate heat. The fan 3 is arranged corresponding to the first heating area 5 to specifically cool the first component 10 of the first heating area 5; the liquid cooling plate 4 is arranged in the second heating area 6 to specifically cool the second component 11 of the second heating area 6.

Optionally, the first component 10 includes at least one of a hard disk, a low-power consumption board, and a power supply device.

Among them, the hard disk is the main storage device in the server.

It can be understood that the embodiments of the present application do not specifically limit the low-power consumption board. For example, the low-power consumption board is at least an array card (Raid card), an expansion card (PCIE card), a graphics card (such as a T4 card), etc. A sort of. Specifically, a Raid (disk array) is composed of many independent disks combined into a disk group with a huge capacity. It uses the bonus effect generated by the data provided by individual disks to improve the performance of the entire disk system. This technology is used to cut the data into Many sections are stored on various hard drives. The number of channels of the data acquisition card is 4-channel synchronous acquisition, and the memory depth is 64K words. The graphics card converts the display information to drive the display and provides progressive or interlaced scanning signals to the display to control the correct display of the display.

Optionally, the second component 11 includes at least one of a central processing unit, a memory module, and a graphics processor.

Specifically, the Central Processing Unit (CPU), as the computing and control core of the server, is the final execution unit for information processing and program execution. A memory module (DIMM) is a computer component that the CPU can address through the bus and perform read and write operations. Graphics processing unit (abbreviation: GPU), also known as display core, visual processor, and display chip, is a microprocessor that performs image and graphics-related operations.

It can be understood that the embodiment of the present application does not specifically limit the first component 10 and the second component 11 , and the embodiment of the present application does not specifically limit the components on the motherboard 2 . For example, the motherboard 2 also includes a network card. The network card is a low-power component. The heat generated by the network card when working is lower than the heat generated by the central processor, memory modules, etc. when working. The network card can be set in the first heating zone 5. When the heat dissipation effect of the fan 3 on the network card is not good, the network card can also be arranged in the second heating area 6 and the liquid cooling plate 4 can dissipate heat. Among them, the network card is a piece of hardware used to allow the server to communicate on the network.

Referring to Figure 1, the arrangement positions and quantities of the first component 10 and the second component 11 on the motherboard 2 are set according to the usage requirements of the server. This is not specifically limited in the embodiment of the present application, for example, as shown in Figures 1 and 2 .

In the server of the embodiment of the present application, the components on the motherboard 2 can be selectively arranged in the first heating area 5 or the second heating area 6 according to specific heat dissipation requirements to use air cooling or liquid cooling to meet the requirements for the components on the motherboard 2 cooling requirements.

Optionally, the liquid cooling plate 4 is in one-to-one contact with the second component 11 to achieve effective heat dissipation of the second component 11 .

Optionally, in the case where the second component 11 has at least two, at least two liquid cooling plates 4 are also provided, and the at least two liquid cooling plates 4 can be connected through pipelines, and the at least two liquid cooling plates 4 can be connected in series or in parallel. The embodiment of the present application does not specifically limit the relationship and connection method between the liquid cooling plates 4 , as long as the cooling requirements for the second component 11 are met. Referring to Figure 1, there are four liquid cooling plates 4, and the four liquid cooling plates 4 are connected in series through pipelines. The cooling liquid flowing in from the water inlet pipe 12 passes through the four liquid cooling plates 4 in sequence and then flows out through the water outlet pipe 13 .

In the server of the embodiment of the present application, as shown in FIG. 1 , the first component 10 and the second component 11 are arranged on the motherboard 2 according to the usage requirements. The first component 10 is located in the first heating area 5 and the second component 11 is located in the second heating area. Zone 6. In the left-right direction of Figure 1, the right end of the equipment body 1 is the front window 8, and the left end of the equipment body 1 is the rear window 9. The first heating area 5 and the second heating area 6 are both arranged along the left-right direction. In a specific embodiment , the fan 3 is set close to the front window 8.

When the motherboard 2 is in operation, both the first component 10 in the first heating area 5 and the second component 11 in the second heating area 6 generate heat. The fan 3 blows correspondingly to the first heating area 5. The airflow enters from the front window 8, passes through the first heating area 5, and then blows out from the rear window 9. The airflow takes away the first component 10 on the first heating area 5 during the flow of the first heating area 5. of heat to achieve cooling of the first heating zone 5. The cooling plate is used for the flow of coolant, which absorbs the heat of the second component 11 during the flow of the coolant. When the heat-absorbing coolant flows out of the server, it takes the heat out of the server to cool the second heat-generating area 6 .

In the server of the embodiment of the present application, one side of the mainboard 2 is the first heating area 5, and the opposite side of the mainboard 2 is the second heating area 6. The first component 10 of the mainboard 2 is located in the first heating area 5. The second component 11 is located in the second heat generating area 6 . When the motherboard 2 is working, the heat generated by the first component 10 on the first heating area 5 is relatively small. The fan 3 is arranged corresponding to the first heating area 5. The air flow caused by the rotation of the fan 3 flows in the first heating area 5. The heat of the first component 10 on the first heating zone 5 is taken away to achieve cooling of the first heating zone 5 . The second component 11 on the second heating area 6 has a relatively large calorific value. The liquid cooling plate 4 is disposed in the second heating area 6 and is in contact with the second component 11 on the second heating area 6 . During the flow of the coolant, the heat of the second component 11 is absorbed. When the heat-absorbing coolant flows out of the server, the heat is taken out of the server to cool the second heat-generating area 6 .

The mainboard 2 is partitioned according to the amount of heat generated during operation, and is divided into a first heating area 5 and a second heating area 6. A partition board separates the first heating area 5 and the second heating area 6. The fan 3 only cools the first heating zone 5, which can reduce the number of fans 3 used, reduce costs, and reduce the noise when the fan 3 rotates; the setting of the partition board can prevent the air flow guided by the fan 3 from being in the second heating zone 6 There is waste of side flow, reducing the ineffective space of air cooling; and it can avoid the flow resistance of the 6 components in the second heating zone and the liquid cooling plate 4 to reduce the utilization efficiency of the fan 3, which can improve the air cooling efficiency, improve the air flow utilization rate, and reduce the fan 3. Energy consumption during use, effectively saving energy; it can also prevent the air flow from flowing through the second heating zone 6, causing the air flow to flow through many components, easily forming a turbulent area, causing excessive server noise, and reducing the user's use experience. The liquid cooling plate 4 only cools the second heating zone 6, which can reduce flow waste caused by server load reduction, reduce energy waste, and reduce the burden on the circulation pump and pipeline pressure in the coolant distribution unit. The server can also further reduce energy consumption by establishing an adjustment mechanism for fan 3 and liquid cooling plate 4. In summary, the server according to the embodiment of the present application has the advantage of saving energy and reducing consumption.

An embodiment of the present application also provides a server cooling system. Referring to Figure 3, the server cooling system includes a cooling controller, a coolant circulation control mechanism, a first temperature detection module, a second temperature detection module and the above-mentioned server; The cooling controller is connected to the coolant circulation control mechanism, the first temperature detection module, the second temperature detection module, and the fan in the server. The first temperature detection module is used to detect the temperature of the first heating zone 5 in the server. The second temperature detection module The module is used to detect the temperature of the second heating zone 6 in the server; the cooling controller controls the speed of the fan 3 in the server according to the temperature detected by the first temperature detection module, and the rotation of the fan 3 is used to cool the first heating zone 5; the cooling controller controls the speed of the fan 3 in the server according to the temperature detected by the first temperature detection module. The temperature detected by the second temperature detection module controls the action of the coolant circulation control mechanism. The coolant circulation control mechanism controls the flow of coolant in the liquid cooling plate 4 in the server. The liquid cooling plate 4 is used to cool the second heating zone 6 .

Specifically, the cooling controller is used for comprehensive control of the server cooling system. The cooling controller is connected to the coolant circulation control mechanism, the first temperature detection module, and the second temperature detection module. The cooling controller can receive the first temperature detection module and the second temperature detection module. The temperature detection module detects the temperature signal and can control the rotation of the fan 3 and the action of the coolant circulation control mechanism, so that the coolant circulation control mechanism controls the flow of coolant in the liquid cooling plate 4 .

The first temperature detection module is used to detect the temperature of the first heating zone 5. It can be understood that the embodiment of the present application does not specifically limit the first temperature detection module, as long as it meets the temperature detection requirements of the first heating zone 5. For example, the first temperature detection module is a temperature detection unit on the first component 10; for example, the first temperature detection module is a temperature sensor that can detect the first component 10; and for example, the first temperature detection module is to detect the temperature of the first heating zone 5 temperature sensor; the first temperature detection module is one component, and the first temperature detection module can also be a combination of multiple components.

Optionally, when there are multiple first temperature detection modules, the cooling controller controls the rotation speed of the fan 3 according to the highest temperature among the multiple temperatures detected by the first temperature detection module.

Furthermore, in an embodiment of the present application, the temperature of the first heating zone 5 detected by the first temperature detection module includes the first temperature. When the cooling controller controls the rotation of the fan 3 according to the first temperature, when the first temperature When the temperature is high, the rotation speed of the fan 3 increases to increase the flow of air flow in the first heating zone 5 and increase the amount of heat taken away from the first heating zone 5 during the flow of air. When the first temperature is relatively low, the rotation speed of the fan 3 is reduced to reduce the flow of air flow in the first heating zone 5 , which is more energy-saving and reduces the heat dissipation when the fan 3 rotates while meeting the heat dissipation needs of the first heating zone 5 . noise. The relatively low and relatively high first temperatures can be set according to usage requirements. For example, the server cooling system is provided with a first threshold temperature. When the first temperature is greater than the first threshold temperature, the first temperature is relatively high; when the first temperature is less than the first threshold temperature, the first temperature is relatively low.

In another embodiment of the present application, a comparison is made between the first temperature and the first threshold temperature. Every time the first temperature increases by 1 degree or decreases by 1 degree, the rotation speed of the fan 3 increases by 1% or decreases by 1%.

The second temperature detection module is used to detect the temperature of the second heating zone 6. It can be understood that the embodiment of the present application does not specifically limit the second temperature detection module, as long as it meets the temperature detection requirements of the second heating zone 6. For example, the second temperature detection module is a temperature detection unit on the second component 11; for example, the second temperature detection module is a temperature sensor that can detect the second component 11; and for example, the second temperature detection module is to detect the temperature of the second heating zone 6 temperature sensor; the second temperature detection module can also be a baseboard management controller; the second temperature detection module is a component, and the second temperature detection module can also be a combination of multiple components.

Optionally, when there are multiple second temperature detection modules, the cooling controller controls the action of the coolant circulation control mechanism according to the highest temperature among the multiple temperatures detected by the second temperature detection module, and the coolant circulation control mechanism controls the action of the coolant circulation control mechanism. The flow rate of coolant in cold plate 4.

The coolant circulation control mechanism includes a coolant circulation mechanism, a coolant distribution unit, etc. Among them, the coolant circulation mechanism can cool the coolant with an elevated temperature flowing out from the server. The coolant flowing out from the coolant circulation mechanism has a lower temperature and can flow into the server again for heat dissipation. The coolant circulation mechanism can realize the circulation of the coolant. use. The coolant distribution unit manages the performance of the server cooling system with intelligent flow, pressure, and more.

In a specific embodiment, the second temperature detection module of the server cooling system detects the temperature of the second component 11 in the second heating zone 6 and transmits the temperature information to the cooling controller. The temperature control coolant distribution unit 11 controls the coolant flow rate of the coolant entering the liquid cooling plate 4 in the server, thereby achieving the purpose of cooling the second component 11 .

In another specific embodiment, when the second temperature detection module includes a baseboard management controller (BMC), the BMC can obtain the temperature and power consumption information of the chip in the second component 11 and transmit it to the cooling controller, It is processed by the cooling controller. After obtaining the information, the cooling controller sends a control instruction to the coolant distribution unit. The coolant distribution unit adjusts the coolant flow rate provided to the liquid cooling plate 4 in the server to distribute the heat to the second heating zone in the server. 6. The temperature is adjusted to the preset value to achieve dynamic adjustment to achieve energy saving.

In the server cooling system of the embodiment of the present application, the mainboard 2 of the server is partitioned according to the amount of heat generated during operation, and is divided into a first heating area 5 and a second heating area 6. The partition board separates the first heating area 5 and the second heating area 6. The two heating areas 6 are separated, and the fan 3 and the liquid cooling plate 4 cool the first heating area 5 and the second heating area 6 respectively. The first temperature detection module is used to detect the temperature of the first heating zone 5, and the second temperature detection module is used to detect the temperature of the second heating zone 6; the cooling controller controls the rotation speed of the fan 3 according to the temperature detected by the first temperature detection module. 3 rotates to cool the first heating zone 5; the cooling controller controls the action of the coolant circulation control mechanism according to the temperature detected by the second temperature detection module, and the coolant circulation control mechanism controls the flow of coolant in the liquid cooling plate 4, and the liquid cooling plate 4 is used to cool the second heating zone 6. The server cooling system of the embodiment of the present application controls the rotation speed and coolant flow rate of the fan 3 according to the temperature of the first heating zone 5 and the temperature of the second heating zone 6, which has the advantage of saving energy and reducing consumption.

The fan 3 only cools the first heating zone 5, which can reduce the number of fans 3 used, reduce costs, and reduce the noise when the fan 3 rotates; the setting of the partition board can prevent the air flow guided by the fan 3 from being in the second heating zone 6 There is waste of side flow, reducing the ineffective space of air cooling; and it can avoid the flow resistance of the 6 components in the second heating zone and the liquid cooling plate 4, which reduces the utilization efficiency of the fan 3, improves the air cooling efficiency, improves the air flow utilization rate, and reduces the fan 3 It can effectively save energy during use; it can also avoid the wind flowing through many components, which can easily form turbulent areas, causing excessive server noise and reducing the user's experience.

The liquid cooling plate 4 only cools the second heating zone 6, which can reduce flow waste caused by server load reduction, reduce energy waste, and reduce the burden on the circulation pump and pipeline pressure in the coolant distribution unit.

The server in the embodiment of the present application can also have the advantage of saving energy and reducing consumption by establishing an adjustment mechanism for the fan 3 and the liquid cooling plate 4 .

An embodiment of the present application also provides a server cooling method. The server cooling method includes the following steps:

S01, detect the temperature of the first heating zone 5.

In this step, the first temperature detection module is used to detect the temperature of the first heating zone 5. The first temperature detection module detects the temperature signal of the first heating zone 5 and sends it to the cooling controller.

S02, control the rotation speed of the fan 3 according to the temperature of the first heating zone 5.

In this step, the cooling controller will receive the temperature signal of the first heating zone 5 detected by the first temperature detection module, and adjust the speed of the fan 3 according to the temperature of the first heating zone 5 so that the fan 3 rotates to cool the first heating zone 5 .

S03, detect the temperature of the second heating zone 6.

In this step, the second temperature detection module is used to detect the temperature of the second heating zone 6. The second temperature detection module detects the temperature signal of the second heating zone 6 and sends it to the cooling controller.

S04, control the flow rate of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heating zone 6.

In this step, the cooling controller will receive the second temperature detection module to detect the temperature signal of the second heating zone 6, and adjust the flow rate of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heating zone 6, so that the liquid cooling plate 4 Cool the second heating zone 6.

In the server cooling method of the embodiment of the present application, the temperature of the first heating zone 5 is detected, and the rotation speed of the fan 3 is controlled according to the temperature of the first heating zone 5; the temperature of the second heating zone 6 is detected, and the temperature of the second heating zone 6 is controlled. Control the flow of coolant in the liquid cooling plate 4. The motherboard 2 of the server is partitioned according to the amount of heat generated during operation, and is divided into a first heating area 5 and a second heating area 6. The partition board separates the first heating area 5 and the second heating area 6. The fan 3 and the liquid cooling plate 4 cool the first heating area 5 and the second heating area 6 respectively. The server cooling method controls the rotation speed of the fan 3 according to the temperature of the first heating zone 5 and controls the flow of coolant in the liquid cooling plate 4 according to the temperature of the second heating zone 6, which can achieve ultimate energy saving and consumption reduction.

It can be understood that the embodiment of the present application does not specifically limit the method of detecting the temperature of the first heating zone 5 and controlling the rotation speed of the fan 3 according to the temperature of the first heating zone 5 to realize heat dissipation of the fan 3. There are many methods in the existing technology. This method of detecting temperature and adjusting the rotation speed of the fan 3 according to the temperature to achieve heat dissipation can be applied to the server cooling method implemented in this application as long as it meets the usage requirements of this application.

For example, in a specific embodiment, the first threshold temperature is obtained, the temperature of the first heating zone 5 is detected, the temperature of the first heating zone 5 includes the first temperature, and the first temperature and the first threshold temperature are compared, Every time the first temperature increases or decreases by 1 degree, the rotation speed of the fan 3 increases by 1% or decreases by 1%.

Further, when the first heating zone 5 includes multiple first components 10 , the first temperature may be the highest temperature among the multiple temperatures detected by the first temperature detection module. By adjusting the rotation speed of the fan 3 according to the highest temperature among the detected temperatures, the heat dissipation effect of the fan 3 on the first heating zone 5 can be ensured.

It can be understood that, in order to ensure the heat dissipation effect of the server, it is necessary to continuously detect the temperature of the first heating zone 5 and adjust the rotation speed of the fan 3 according to the obtained first temperature.

It can be understood that the embodiment of the present application does not specifically limit the method of detecting the temperature of the second heating zone 6 and controlling the flow rate of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heating zone 6 to realize heat dissipation of the liquid cooling plate 4 , the existing technology has a variety of methods for detecting temperature and adjusting the flow rate of the coolant in the liquid cooling plate 4 according to the temperature to achieve heat dissipation. All of them can be applied to the server cooling implemented by the present application as long as the usage requirements of the present application are met. in method.

For example, in a specific embodiment, in the step of detecting the temperature of the second heating zone 6 and controlling the flow rate of the cooling liquid in the liquid cooling plate 4 according to the temperature of the second heating zone 6, the following steps are also included:

S11, obtain the second threshold temperature.

S12, detect the temperature of the second heating zone 6 and obtain the second temperature.

S13, determine whether the second temperature is greater than the second threshold temperature;

S14: When the second temperature is greater than the second threshold temperature, increase the rotation speed of the circulation pump in the coolant distribution unit.

S15: When the second temperature is not greater than the second threshold temperature, determine whether the second temperature is equal to the second threshold temperature.

S16: When the second temperature is not equal to the second threshold temperature, reduce the rotation speed of the circulation pump in the coolant distribution unit.

S17: After the rotation speed of the circulation pump in the coolant distribution unit increases or decreases, determine whether the second temperature is equal to the second threshold temperature.

After the rotation speed of the circulation pump in the coolant distribution unit is increased or decreased, when the second temperature is not equal to the second threshold temperature, step S13 is performed.

S18, when the second temperature is equal to the second threshold temperature, the adjustment is completed.

In the above steps, when the second temperature is equal to the second threshold temperature, after the adjustment is completed, wait for the set time and then return to step S11, for example, return to step S11 after 3 seconds to continuously monitor the temperature of the second heating zone 6 and adjust the heat dissipation. .

In the above steps, if the second heating zone 6 includes multiple second components 11 , the second temperature may be the highest temperature among the multiple detected temperatures. By adjusting the flow rate of the cooling liquid in the liquid cooling plate 4 according to the highest temperature among the detected temperatures, the heat dissipation effect of the liquid cooling plate 4 on the second heating zone 6 can be ensured.

It can be understood that in the above steps, in order to continuously detect the temperature of the second heating zone 6, the second temperature in step S12 is the temperature of the second heating zone 6 before the flow rate of the cooling liquid in the liquid cooling plate 4 is adjusted. The second temperature in S17 is the temperature of the second heating zone 6 after the flow rate of the cooling liquid in the liquid cooling plate 4 is increased or decreased.

Optionally, the second temperature may be the temperature of the chip in the second component 11 . At this time, the above steps S11 to S18 are to adjust the rotation speed of the circulation pump in the coolant distribution unit according to the chip temperature to adjust the amount of coolant supplied to the liquid cooling plate 4 .

It can be understood that the amplitude of the increase or decrease in the rotation speed of the circulation pump in the coolant distribution unit is set according to the usage requirements. For example, in step S14, when the second temperature is greater than the second threshold temperature, the circulation pump in the coolant distribution unit is increased. The speed of the pump, the speed of the circulation pump in the coolant distribution unit is increased by 2%. For another example, in step S16, when the second temperature is not equal to the second threshold temperature, the rotation speed of the circulation pump in the coolant distribution unit is reduced, and the rotation speed of the circulation pump in the coolant distribution unit is reduced by 2%.

The server cooling method in the embodiment of the present application is different from the coarse flow and fixed flow heat dissipation solution in the prior art. The server cooling method in the embodiment of the present application can perform feedback adjustment according to the real-time temperature at different chip loads, effectively improving energy efficiency. Further reducing PUE, it can also reduce the risk of pipeline pressure caused by continuous large flow in the past and the impact on pump life caused by the high speed of the circulation pump in the coolant distribution unit; through the above steps S11-S18, feedback adjustment is achieved and the coolant is distributed The deep integration of the unit and the server can continuously control the chip temperature at the set temperature threshold, and control the speed of the circulation pump in the coolant distribution unit within the actual required range, achieving deep energy savings.

It should be noted that for the sake of simple description, the method embodiments are expressed as a series of action combinations. However, those skilled in the art should know that the embodiments of the present application are not limited by the described action sequence, because According to the embodiments of the present application, certain steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily necessary for the embodiments of the present application.

It should be noted that, in this document, the terms "comprising", "comprises" or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article or device that includes a series of elements not only includes those elements, It also includes other elements not expressly listed or inherent in the process, method, article or apparatus. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article or apparatus that includes that element.

The embodiments of the present invention have been described above in conjunction with the accompanying drawings. However, the present invention is not limited to the above-mentioned specific implementations. The above-mentioned specific implementations are only illustrative and not restrictive. Those of ordinary skill in the art will Under the inspiration of the present invention, many forms can be made without departing from the spirit of the present invention and the scope protected by the claims, and these all fall within the protection of the present invention.

Claims (11)

1. A server, characterized in that it includes a device body (1), a mainboard (2), a fan (3) and a liquid cooling plate (4), the mainboard (2), the fan (3) and the The liquid cooling plates (4) are all installed in the device body (1); one side of the main board (2) is the first heating area (5), and the opposite side of the main board (2) is the second heating area. Heating area (6): When the mainboard (2) is working, the calorific value of the first heating area (5) is less than the calorific value of the second heating area (6); The fan (3) is provided corresponding to the first heating area (5) and is used to cool the first heating area (5); The liquid cooling plate (4) is provided in the second heating area (6) and is used to cool the second heating area (6). 2. The server according to claim 1, characterized in that the server further includes a partition plate (7), the partition plate (7) is provided in the device body (1) and is connected with the main board (7). 2) Vertical; one side of the partition plate (7) corresponds to the first heating area (5), and the opposite side of the partition plate (7) corresponds to the second heating area (6). 3. The server according to claim 1, characterized in that one end of the device body (1) is a front window (8), and the opposite end of the device body (1) is a rear window (9), so The first heating area (5) and the second heating area (6) are both arranged along the direction from the front window (8) to the rear window (9). 4. The server according to claim 3, characterized in that, The fan (3) is connected to the front window (8), and the air flow guided by the fan (3) enters from the front window (8) and flows out from the rear window (9); or, The fan (3) is connected to the rear window (9), and the air flow guided by the fan (3) enters from the rear window (9) and then flows out from the front window (8). 5. The server according to claim 3, characterized in that the fan (3) is located in the middle of the first heating area (5), and the air flow guided by the fan (3) flows from the front window (8) ) enters and flows out from the rear window (9), or the air flow guided by the fan (3) enters from the rear window (9) and flows out from the front window (8). 6. The server according to claim 1, characterized in that the mainboard (2) includes a first component (10) and a second component (11), and the first component (10) is located on the first heat-generating area (5), the second component (11) is located in the second heating area (6); when the mainboard (2) is working, the first component (10) and the second component (11) Fever. 7. The server according to claim 6, characterized in that the first component (10) includes at least one of a hard disk, a low-power consumption board, and a power supply device. 8. The server according to claim 6, characterized in that the second component (11) includes at least one of a central processing unit, a memory module, and a graphics processor. 9. The server according to claim 6, characterized in that the liquid cooling plate (4) is in one-to-one contact with the second component (11). 10. A server cooling system, characterized by comprising a cooling controller, a coolant circulation control mechanism, a first temperature detection module, a second temperature detection module and at least one server according to any one of claims 1-9 ; The cooling controller is connected to the coolant circulation control mechanism, the first temperature detection module, the second temperature detection module, and the fan in the server, and the first temperature detection module is used to detect the third The temperature of a heating zone (5), the second temperature detection module is used to detect the temperature of the second heating zone (6); The cooling controller controls the rotation speed of the fan (3) according to the temperature detected by the first temperature detection module; The cooling controller controls the action of the cooling liquid circulation control mechanism according to the temperature detected by the second temperature detection module, and the cooling liquid circulation control mechanism controls the flow rate of the cooling liquid in the liquid cooling plate (4). 11. A server cooling method, characterized by: Detect the temperature of the first heating zone, and control the rotation speed of the fan according to the temperature of the first heating zone; The temperature of the second heating zone is detected, and the flow rate of the cooling liquid in the liquid cooling plate is controlled according to the temperature of the second heating zone.