CN116888535A - 感光性组合物、转印膜、图案形成方法、电路布线的制造方法、触摸面板的制造方法 - Google Patents

感光性组合物、转印膜、图案形成方法、电路布线的制造方法、触摸面板的制造方法 Download PDF

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Publication number
CN116888535A
CN116888535A CN202280014728.2A CN202280014728A CN116888535A CN 116888535 A CN116888535 A CN 116888535A CN 202280014728 A CN202280014728 A CN 202280014728A CN 116888535 A CN116888535 A CN 116888535A
Authority
CN
China
Prior art keywords
compound
photosensitive composition
photosensitive layer
photosensitive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280014728.2A
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English (en)
Chinese (zh)
Inventor
山口圭吾
儿玉邦彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN116888535A publication Critical patent/CN116888535A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CN202280014728.2A 2021-02-26 2022-02-17 感光性组合物、转印膜、图案形成方法、电路布线的制造方法、触摸面板的制造方法 Pending CN116888535A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021030620 2021-02-26
JP2021-030620 2021-02-26
PCT/JP2022/006314 WO2022181431A1 (ja) 2021-02-26 2022-02-17 感光性組成物、転写フィルム、パターン形成方法、回路配線の製造方法、タッチパネルの製造方法

Publications (1)

Publication Number Publication Date
CN116888535A true CN116888535A (zh) 2023-10-13

Family

ID=83049330

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280014728.2A Pending CN116888535A (zh) 2021-02-26 2022-02-17 感光性组合物、转印膜、图案形成方法、电路布线的制造方法、触摸面板的制造方法

Country Status (3)

Country Link
JP (1) JPWO2022181431A1 (https=)
CN (1) CN116888535A (https=)
WO (1) WO2022181431A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024052274A (ja) * 2022-09-30 2024-04-11 富士フイルム株式会社 組成物、転写フィルム、積層体の製造方法、硬化膜及びデバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5387896B2 (ja) * 2009-06-05 2014-01-15 日立化成株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
JP5466522B2 (ja) * 2010-02-08 2014-04-09 太陽ホールディングス株式会社 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5777461B2 (ja) * 2011-09-14 2015-09-09 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JPWO2015002071A1 (ja) * 2013-07-04 2017-02-23 味の素株式会社 感光性樹脂組成物

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Publication number Publication date
JPWO2022181431A1 (https=) 2022-09-01
WO2022181431A1 (ja) 2022-09-01

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