CN116888424A - 热器件 - Google Patents

热器件 Download PDF

Info

Publication number
CN116888424A
CN116888424A CN202280017057.5A CN202280017057A CN116888424A CN 116888424 A CN116888424 A CN 116888424A CN 202280017057 A CN202280017057 A CN 202280017057A CN 116888424 A CN116888424 A CN 116888424A
Authority
CN
China
Prior art keywords
opening
heat sink
block
thermal device
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280017057.5A
Other languages
English (en)
Chinese (zh)
Inventor
藤田尚也
平野义宜
阿部裕一
锅岛宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN116888424A publication Critical patent/CN116888424A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
    • F28D9/0075—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements the plates having openings therein for circulation of the heat-exchange medium from one conduit to another
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F2009/0285—Other particular headers or end plates
    • F28F2009/029—Other particular headers or end plates with increasing or decreasing cross-section, e.g. having conical shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2230/00—Sealing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/10—Particular pattern of flow of the heat exchange media
    • F28F2250/104—Particular pattern of flow of the heat exchange media with parallel flow
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280017057.5A 2021-02-26 2022-02-21 热器件 Pending CN116888424A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-031010 2021-02-26
JP2021031010 2021-02-26
PCT/JP2022/007045 WO2022181566A1 (ja) 2021-02-26 2022-02-21 熱デバイス

Publications (1)

Publication Number Publication Date
CN116888424A true CN116888424A (zh) 2023-10-13

Family

ID=83048044

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280017057.5A Pending CN116888424A (zh) 2021-02-26 2022-02-21 热器件

Country Status (6)

Country Link
US (1) US20240230240A9 (https=)
EP (1) EP4300573A4 (https=)
JP (1) JP7635360B2 (https=)
KR (1) KR20230136162A (https=)
CN (1) CN116888424A (https=)
WO (1) WO2022181566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021263114A2 (en) * 2020-06-25 2021-12-30 Virginia Polytechnic Institute And State University Planar bridging-droplet thermal diode
JPWO2024204312A1 (https=) * 2023-03-28 2024-10-03
WO2025197761A1 (ja) * 2024-03-22 2025-09-25 京セラ株式会社 熱デバイス

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106961A (en) * 1977-02-28 1978-09-18 Ngk Spark Plug Co Ltd Ceramic heating pipes and manufacturing method
JP4035155B1 (ja) * 2006-07-28 2008-01-16 株式会社渕上ミクロ ヒートパイプ及びその製造方法
JP2014017346A (ja) * 2012-07-09 2014-01-30 Seiko Epson Corp 電子部品パッケージ及び光学デバイス
CN211297526U (zh) * 2020-01-20 2020-08-18 张文锦 均温板
JPWO2020196528A1 (https=) * 2019-03-25 2020-10-01

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1467182A (en) 1973-12-26 1977-03-16 Burroughs Corp Gas discharge display panel
JPS53106135A (en) * 1977-02-28 1978-09-14 Ricoh Co Ltd Sealing method for head pipe roller
JPS5810370Y2 (ja) * 1977-08-26 1983-02-25 日本特殊陶業株式会社 電子回路装置塔載用セラミック基板
JPS5885555A (ja) * 1981-11-17 1983-05-21 Ngk Spark Plug Co Ltd セラミツクヒ−トシンク
US4437510A (en) * 1982-03-29 1984-03-20 The United States Of America As Represented By The Secretary Of The Navy Heat pipe control apparatus
JP2539663B2 (ja) * 1988-05-11 1996-10-02 株式会社フジクラ 高温用セラミックヒ―トパイプ
IL129448A (en) 1996-10-25 2003-05-29 Yuzhi Qu Superconducting heat transfer medium
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
JP4234621B2 (ja) * 2004-02-16 2009-03-04 株式会社日立製作所 液冷システムおよび電子装置
WO2007029359A1 (en) * 2005-09-01 2007-03-15 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
US9586382B2 (en) * 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure
US20100294461A1 (en) 2009-05-22 2010-11-25 General Electric Company Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same
JP2011096994A (ja) 2009-09-29 2011-05-12 Kyocera Corp 冷却器、配線基板、および発光体
US10175005B2 (en) * 2015-03-30 2019-01-08 Infinera Corporation Low-cost nano-heat pipe
JP6893160B2 (ja) * 2017-10-26 2021-06-23 新光電気工業株式会社 ヒートパイプ、ヒートパイプの製造方法
US10881034B2 (en) * 2017-11-21 2020-12-29 Syracuse University Passive nano-heat pipes for cooling and thermal management of electronics and power conversion devices
TWI658248B (zh) * 2018-02-13 2019-05-01 奇鋐科技股份有限公司 均溫板注水部封邊結構及其製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106961A (en) * 1977-02-28 1978-09-18 Ngk Spark Plug Co Ltd Ceramic heating pipes and manufacturing method
JP4035155B1 (ja) * 2006-07-28 2008-01-16 株式会社渕上ミクロ ヒートパイプ及びその製造方法
JP2014017346A (ja) * 2012-07-09 2014-01-30 Seiko Epson Corp 電子部品パッケージ及び光学デバイス
JPWO2020196528A1 (https=) * 2019-03-25 2020-10-01
CN211297526U (zh) * 2020-01-20 2020-08-18 张文锦 均温板

Also Published As

Publication number Publication date
JPWO2022181566A1 (https=) 2022-09-01
EP4300573A4 (en) 2025-02-12
US20240230240A9 (en) 2024-07-11
US20240133636A1 (en) 2024-04-25
EP4300573A1 (en) 2024-01-03
JP7635360B2 (ja) 2025-02-25
WO2022181566A1 (ja) 2022-09-01
KR20230136162A (ko) 2023-09-26

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