JPWO2022181566A1 - - Google Patents

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Publication number
JPWO2022181566A1
JPWO2022181566A1 JP2023502411A JP2023502411A JPWO2022181566A1 JP WO2022181566 A1 JPWO2022181566 A1 JP WO2022181566A1 JP 2023502411 A JP2023502411 A JP 2023502411A JP 2023502411 A JP2023502411 A JP 2023502411A JP WO2022181566 A1 JPWO2022181566 A1 JP WO2022181566A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023502411A
Other languages
Japanese (ja)
Other versions
JP7635360B2 (ja
JPWO2022181566A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2022181566A1 publication Critical patent/JPWO2022181566A1/ja
Publication of JPWO2022181566A5 publication Critical patent/JPWO2022181566A5/ja
Application granted granted Critical
Publication of JP7635360B2 publication Critical patent/JP7635360B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
    • F28D9/0075—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements the plates having openings therein for circulation of the heat-exchange medium from one conduit to another
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F2009/0285—Other particular headers or end plates
    • F28F2009/029—Other particular headers or end plates with increasing or decreasing cross-section, e.g. having conical shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2230/00—Sealing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/10—Particular pattern of flow of the heat exchange media
    • F28F2250/104—Particular pattern of flow of the heat exchange media with parallel flow
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023502411A 2021-02-26 2022-02-21 熱デバイス Active JP7635360B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021031010 2021-02-26
JP2021031010 2021-02-26
PCT/JP2022/007045 WO2022181566A1 (ja) 2021-02-26 2022-02-21 熱デバイス

Publications (3)

Publication Number Publication Date
JPWO2022181566A1 true JPWO2022181566A1 (https=) 2022-09-01
JPWO2022181566A5 JPWO2022181566A5 (https=) 2023-11-16
JP7635360B2 JP7635360B2 (ja) 2025-02-25

Family

ID=83048044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023502411A Active JP7635360B2 (ja) 2021-02-26 2022-02-21 熱デバイス

Country Status (6)

Country Link
US (1) US20240230240A9 (https=)
EP (1) EP4300573A4 (https=)
JP (1) JP7635360B2 (https=)
KR (1) KR20230136162A (https=)
CN (1) CN116888424A (https=)
WO (1) WO2022181566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021263114A2 (en) * 2020-06-25 2021-12-30 Virginia Polytechnic Institute And State University Planar bridging-droplet thermal diode
JPWO2024204312A1 (https=) * 2023-03-28 2024-10-03
WO2025197761A1 (ja) * 2024-03-22 2025-09-25 京セラ株式会社 熱デバイス

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106135A (en) * 1977-02-28 1978-09-14 Ricoh Co Ltd Sealing method for head pipe roller
JPS53106961A (en) * 1977-02-28 1978-09-18 Ngk Spark Plug Co Ltd Ceramic heating pipes and manufacturing method
JPH01285791A (ja) * 1988-05-11 1989-11-16 Fujikura Ltd 高温用セラミックヒートパイプ
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
JP2002501599A (ja) * 1996-10-25 2002-01-15 ク，ユズイ 超伝導熱伝達媒質
JP4035155B1 (ja) * 2006-07-28 2008-01-16 株式会社渕上ミクロ ヒートパイプ及びその製造方法
US20100294461A1 (en) * 2009-05-22 2010-11-25 General Electric Company Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same
JP2011096994A (ja) * 2009-09-29 2011-05-12 Kyocera Corp 冷却器、配線基板、および発光体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1467182A (en) 1973-12-26 1977-03-16 Burroughs Corp Gas discharge display panel
JPS5810370Y2 (ja) * 1977-08-26 1983-02-25 日本特殊陶業株式会社 電子回路装置塔載用セラミック基板
JPS5885555A (ja) * 1981-11-17 1983-05-21 Ngk Spark Plug Co Ltd セラミツクヒ−トシンク
US4437510A (en) * 1982-03-29 1984-03-20 The United States Of America As Represented By The Secretary Of The Navy Heat pipe control apparatus
JP4234621B2 (ja) * 2004-02-16 2009-03-04 株式会社日立製作所 液冷システムおよび電子装置
WO2007029359A1 (en) * 2005-09-01 2007-03-15 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
US9586382B2 (en) * 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure
JP2014017346A (ja) * 2012-07-09 2014-01-30 Seiko Epson Corp 電子部品パッケージ及び光学デバイス
US10175005B2 (en) * 2015-03-30 2019-01-08 Infinera Corporation Low-cost nano-heat pipe
JP6893160B2 (ja) * 2017-10-26 2021-06-23 新光電気工業株式会社 ヒートパイプ、ヒートパイプの製造方法
US10881034B2 (en) * 2017-11-21 2020-12-29 Syracuse University Passive nano-heat pipes for cooling and thermal management of electronics and power conversion devices
TWI658248B (zh) * 2018-02-13 2019-05-01 奇鋐科技股份有限公司 均溫板注水部封邊結構及其製造方法
JP7122461B2 (ja) * 2019-03-25 2022-08-19 京セラ株式会社 回路基体およびこれを備える放熱基体または電子装置
CN211297526U (zh) * 2020-01-20 2020-08-18 张文锦 均温板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106135A (en) * 1977-02-28 1978-09-14 Ricoh Co Ltd Sealing method for head pipe roller
JPS53106961A (en) * 1977-02-28 1978-09-18 Ngk Spark Plug Co Ltd Ceramic heating pipes and manufacturing method
JPH01285791A (ja) * 1988-05-11 1989-11-16 Fujikura Ltd 高温用セラミックヒートパイプ
JP2002501599A (ja) * 1996-10-25 2002-01-15 ク，ユズイ 超伝導熱伝達媒質
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
JP4035155B1 (ja) * 2006-07-28 2008-01-16 株式会社渕上ミクロ ヒートパイプ及びその製造方法
US20100294461A1 (en) * 2009-05-22 2010-11-25 General Electric Company Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same
JP2011096994A (ja) * 2009-09-29 2011-05-12 Kyocera Corp 冷却器、配線基板、および発光体

Also Published As

Publication number Publication date
EP4300573A4 (en) 2025-02-12
US20240230240A9 (en) 2024-07-11
CN116888424A (zh) 2023-10-13
US20240133636A1 (en) 2024-04-25
EP4300573A1 (en) 2024-01-03
JP7635360B2 (ja) 2025-02-25
WO2022181566A1 (ja) 2022-09-01
KR20230136162A (ko) 2023-09-26

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