JPWO2022181566A5 - - Google Patents

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JPWO2022181566A5
JPWO2022181566A5 JP2023502411A JP2023502411A JPWO2022181566A5 JP WO2022181566 A5 JPWO2022181566 A5 JP WO2022181566A5 JP 2023502411 A JP2023502411 A JP 2023502411A JP 2023502411 A JP2023502411 A JP 2023502411A JP WO2022181566 A5 JPWO2022181566 A5 JP WO2022181566A5
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JP2023502411A
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JPWO2022181566A1 (https=
JP7635360B2 (ja
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Priority claimed from PCT/JP2022/007045 external-priority patent/WO2022181566A1/ja
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JP2023502411A 2021-02-26 2022-02-21 熱デバイス Active JP7635360B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021031010 2021-02-26
JP2021031010 2021-02-26
PCT/JP2022/007045 WO2022181566A1 (ja) 2021-02-26 2022-02-21 熱デバイス

Publications (3)

Publication Number Publication Date
JPWO2022181566A1 JPWO2022181566A1 (https=) 2022-09-01
JPWO2022181566A5 true JPWO2022181566A5 (https=) 2023-11-16
JP7635360B2 JP7635360B2 (ja) 2025-02-25

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JP2023502411A Active JP7635360B2 (ja) 2021-02-26 2022-02-21 熱デバイス

Country Status (6)

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US (1) US20240230240A9 (https=)
EP (1) EP4300573A4 (https=)
JP (1) JP7635360B2 (https=)
KR (1) KR20230136162A (https=)
CN (1) CN116888424A (https=)
WO (1) WO2022181566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021263114A2 (en) * 2020-06-25 2021-12-30 Virginia Polytechnic Institute And State University Planar bridging-droplet thermal diode
JPWO2024204312A1 (https=) * 2023-03-28 2024-10-03
WO2025197761A1 (ja) * 2024-03-22 2025-09-25 京セラ株式会社 熱デバイス

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1467182A (en) 1973-12-26 1977-03-16 Burroughs Corp Gas discharge display panel
JPS5918631B2 (ja) * 1977-02-28 1984-04-28 日本特殊陶業株式会社 セラミックヒ−トパイプの製造方法
JPS53106135A (en) * 1977-02-28 1978-09-14 Ricoh Co Ltd Sealing method for head pipe roller
JPS5810370Y2 (ja) * 1977-08-26 1983-02-25 日本特殊陶業株式会社 電子回路装置塔載用セラミック基板
JPS5885555A (ja) * 1981-11-17 1983-05-21 Ngk Spark Plug Co Ltd セラミツクヒ−トシンク
US4437510A (en) * 1982-03-29 1984-03-20 The United States Of America As Represented By The Secretary Of The Navy Heat pipe control apparatus
JP2539663B2 (ja) * 1988-05-11 1996-10-02 株式会社フジクラ 高温用セラミックヒ―トパイプ
IL129448A (en) 1996-10-25 2003-05-29 Yuzhi Qu Superconducting heat transfer medium
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
JP4234621B2 (ja) * 2004-02-16 2009-03-04 株式会社日立製作所 液冷システムおよび電子装置
WO2007029359A1 (en) * 2005-09-01 2007-03-15 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
US20210310745A1 (en) * 2006-07-28 2021-10-07 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
US9586382B2 (en) * 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure
US20100294461A1 (en) 2009-05-22 2010-11-25 General Electric Company Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the same
JP2011096994A (ja) 2009-09-29 2011-05-12 Kyocera Corp 冷却器、配線基板、および発光体
JP2014017346A (ja) * 2012-07-09 2014-01-30 Seiko Epson Corp 電子部品パッケージ及び光学デバイス
US10175005B2 (en) * 2015-03-30 2019-01-08 Infinera Corporation Low-cost nano-heat pipe
JP6893160B2 (ja) * 2017-10-26 2021-06-23 新光電気工業株式会社 ヒートパイプ、ヒートパイプの製造方法
US10881034B2 (en) * 2017-11-21 2020-12-29 Syracuse University Passive nano-heat pipes for cooling and thermal management of electronics and power conversion devices
TWI658248B (zh) * 2018-02-13 2019-05-01 奇鋐科技股份有限公司 均溫板注水部封邊結構及其製造方法
JP7122461B2 (ja) * 2019-03-25 2022-08-19 京セラ株式会社 回路基体およびこれを備える放熱基体または電子装置
CN211297526U (zh) * 2020-01-20 2020-08-18 张文锦 均温板

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