CN116799611A - Side pump module and semiconductor laser - Google Patents
Side pump module and semiconductor laser Download PDFInfo
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- CN116799611A CN116799611A CN202311083581.5A CN202311083581A CN116799611A CN 116799611 A CN116799611 A CN 116799611A CN 202311083581 A CN202311083581 A CN 202311083581A CN 116799611 A CN116799611 A CN 116799611A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 58
- 239000000110 cooling liquid Substances 0.000 claims abstract description 56
- 239000011229 interlayer Substances 0.000 claims abstract description 22
- 239000013078 crystal Substances 0.000 claims abstract description 12
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 6
- 239000012809 cooling fluid Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 7
- 239000002826 coolant Substances 0.000 description 9
- 238000005086 pumping Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The invention provides a side pump module and a semiconductor laser, comprising: the cooling liquid seat is provided with a through hole which penetrates through the cooling liquid seat, and an interlayer and a cooling liquid channel are arranged in the cooling liquid seat; the crystal bar is sleeved in the through hole; the micro-channel single bar is arranged in the interlayer, the light-emitting surface of the micro-channel single bar is opposite to the side surface of the crystal bar, and the micro-channel single bar is provided with a liquid inlet hole and a liquid outlet hole which are communicated with the cooling liquid channel; the electrode plate is arranged in the interlayer and used for leading out the positive electrode and the negative electrode of the micro-channel single bar. Compared with the macro-channel heat sink packaging bar used by the side pump semiconductor laser in the prior art, the micro-channel single bar is arranged in the interlayer of the cooling liquid seat, and the heat dissipation performance of the micro-channel single bar Jiang Yuhong channel heat sink packaging bar is higher than that of the macro-channel heat sink packaging bar, so that the micro-channel single bar has the advantages of better heat dissipation performance, higher efficiency and smaller occupied volume under the premise of equal output power.
Description
Technical Field
The invention relates to the technical field of lasers, in particular to a side pump module and a semiconductor laser.
Background
Semiconductor laser pumping solid state laser pumping can be classified into end pumping and side pumping. Side pumping is also called transverse pumping, and is called side pumping for short, and the surface of the pumping light entering the working substance is perpendicular to the laser output surface.
The side pump semiconductor laser is widely applied not only in the fields of optical communication, laser marking, measurement and the like, but also in important fields of scientific research, military, industry, medical treatment and the like. Currently, macro-channel heat sink package bars are commonly used for side-pump semiconductor lasers.
In carrying out the invention, the inventors have found that at least the following problems exist in the prior art: the side pump semiconductor laser commonly uses macro channel heat sink to package the bar, and has the problems of lower heat dissipation performance, lower efficiency, larger occupied volume, unfavorable long-term use and the like.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to a certain extent.
Therefore, the invention aims to provide a side pump module and a semiconductor laser, which solve the technical problems of lower heat dissipation performance and lower efficiency of the side pump semiconductor laser in the prior art.
To achieve the above object, a side pump module according to a first aspect of the present invention includes:
the cooling liquid seat is provided with a through hole which penetrates through the cooling liquid seat, and an interlayer and a cooling liquid channel are arranged in the cooling liquid seat;
the crystal bar is sleeved in the through hole;
the micro-channel single bar is arranged in the interlayer, the light-emitting surface of the micro-channel single bar is opposite to the side surface of the crystal bar, and the micro-channel single bar is provided with a liquid inlet hole and a liquid outlet hole which are communicated with the cooling liquid channel;
the electrode plate is arranged in the interlayer and used for leading out the positive electrode and the negative electrode of the micro-channel single bar.
According to the side pump module, the micro-channel single bar is arranged in the interlayer of the cooling liquid seat, and compared with the macro-channel heat sink packaging bar used by the side pump semiconductor laser in the prior art, the heat dissipation performance Jiang Yuhong of the micro-channel single bar is higher than that of the macro-channel heat sink packaging bar, and therefore the side pump module has the advantages of being good in heat dissipation performance, high in efficiency and small in occupied volume on the premise of equal output power.
According to one embodiment of the invention, the cooling liquid seat comprises an integrally formed upper seat, a base and a support column, wherein the support column is arranged in the interlayer, the interlayer is positioned between the upper seat and the base, the upper seat, the base and the support column are provided with first fixing holes in a penetrating manner, and the side wall of the support column is provided with second fixing holes.
According to one embodiment of the invention, the side wall of the support column is provided with a third fixing hole and a fourth fixing hole.
According to one embodiment of the invention, a first liquid outlet communicated with the liquid inlet and a first liquid inlet communicated with the liquid outlet are arranged on the side wall of the support column, and the first liquid outlet and the first liquid inlet are communicated with the cooling liquid channel.
According to one embodiment of the invention, the number of micro-channels is 4, the cross-section of the support columns is substantially triangular, and the number of support columns is 2.
According to one embodiment of the invention, the cooling liquid channel is provided with a vertical pipe penetrating through the cooling liquid seat, a port of the vertical pipe on the cooling liquid seat comprises a second liquid inlet and a second liquid outlet, the second liquid inlet is communicated with the first liquid outlet, and the second liquid outlet is communicated with the first liquid inlet.
According to one embodiment of the invention, the support posts are symmetrically arranged along both sides of the through hole.
According to one embodiment of the invention, the electrode plates comprise a first electrode plate, a second electrode plate and a third electrode plate, wherein the first electrode plate is fixedly connected with the support column and the micro-channel single bar respectively, the second electrode plate is used for connecting two first electrode plates positioned on the same support column, and the third electrode plate is used for connecting the micro-channel single bars respectively positioned on different support columns in series.
According to one embodiment of the invention, the device further comprises a pressure block arranged between the microchannel monoblock and the second electrode plate, the pressure block being a conductor.
A second aspect of the present invention proposes a semiconductor laser including a plurality of the side pump modules of the first aspect, an upper cover plate fixed above the uppermost side pump module, a lower cover plate fixed below the lowermost side pump module, and a fourth electrode sheet for connecting adjacent side pump modules in series.
According to the semiconductor laser, the side pump modules are combined in series, so that compared with the macro-channel heat sink packaging bar used in the side pump semiconductor laser in the prior art, the macro-channel heat sink packaging bar needs to be packaged in multiple stages to package the bar on the macro-channel heat sink, and the side pump modules in the semiconductor laser can be connected in series according to the output power, so that the installation is simpler and the configuration is more convenient.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. Wherein:
fig. 1 is a schematic structural diagram of a side pump module according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of the structure of the microchannel monobar of fig. 1.
Fig. 3 is a schematic view of the cooling fluid seat in fig. 1.
Fig. 4 is a schematic side view of the coolant seat of fig. 1.
Fig. 5 is a cross-sectional view taken along line A-A of fig. 4.
Fig. 6 is a sectional view taken along line B-B of fig. 4.
FIG. 7 is a schematic diagram of a combination of the electrode, the compact, and the microchannel monobar of FIG. 1.
Fig. 8 is a schematic diagram of an exploded structure of the electrode, the compact, and the microchannel monobar of fig. 7.
Fig. 9 is a schematic structural diagram of a semiconductor laser according to another embodiment of the present invention.
Reference numerals illustrate:
the cooling liquid seat comprises a cooling liquid seat body, a cooling liquid seat 11-second liquid inlet, a cooling liquid seat 12-second liquid outlet, a cooling liquid seat 13-first fixing hole, a cooling liquid seat 14-through hole, a cooling liquid seat 15-second fixing hole, a cooling liquid seat 16-first liquid outlet, a cooling liquid seat 17-first liquid inlet, a cooling liquid seat 18-third fixing hole, a cooling liquid seat 19-fourth fixing hole, a cooling liquid seat 20-crystal bar, a cooling liquid seat 30-first electrode plate, a cooling liquid seat 40-micro-channel single bar, a cooling liquid seat 41-single bar heat sink 42-bar, a cooling liquid seat 43-negative electrode plate, a cooling liquid seat 44-liquid inlet, a cooling liquid seat 45-fifth fixing hole 46-liquid outlet hole 47-sixth fixing hole 50-pressing block 60-second electrode plate 70-third electrode plate 80-upper cover plate 90-lower cover plate 100-side pump module 101-supporting column upper seat 102-upper seat base 103-base 105-fastener and fourth electrode plate.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention. On the contrary, the embodiments of the invention include all alternatives, modifications and equivalents as may be included within the spirit and scope of the appended claims.
Referring to fig. 1 to 8, a first aspect of an embodiment of the present invention proposes a side pump module 100. The side pump module 100 includes a coolant seat 10, a boule 20, a microchannel monoblock 40, and an electrode plate.
The coolant seat 10 has a through hole 14 therethrough, and the inside of the coolant seat 10 has an interlayer and a coolant passage, in other words, the coolant seat 10 is hollow. The coolant seat 10 is made of an insulating material, and mainly plays a supporting role and provides a coolant channel. In one embodiment, the coolant base 10 is made of PEEK (polyetheretherketone) and has excellent electrical insulation, solvent resistance, and workability.
The ingot 20 is nested within the through-hole 14. Both ends of the ingot 20 protrude from the through-hole 14. The boule 20 is configured for use with a gain medium. In one embodiment, the crystal rod 20 is made of YAG crystals, and has the advantages of good optical uniformity, good mechanical properties, high physical and chemical stability, good thermal conductivity and the like.
The micro-channel single bar 40 is arranged in the interlayer, the light-emitting surface of the micro-channel single bar 40 is opposite to the side surface of the crystal bar 20, the micro-channel single bar 40 is provided with a liquid inlet hole 44 and a liquid outlet hole 46, and the liquid inlet hole 44 and the liquid outlet hole 46 are communicated with the cooling liquid channel. The number of the micro-channel single bars 40 in the interlayer can be designed according to actual needs, and under the condition that the number of the micro-channel single bars 40 is multiple, the micro-channel single bars 40 are connected in series, the number is different, and the output power is also different. The micro-channel single bar 40 can be fixed on the cooling liquid seat 10 through a fastener, and the installation is convenient. In addition, a plurality of cooling liquid seats can also be assembled to form the side pump module that the output power is bigger, and scalability is good.
Referring to fig. 2, the micro-channel mono-bar 40 has a mono-bar heat sink 41 and a negative plate 43, the mono-bar heat sink 41 also being configured for the positive electrode of the micro-channel mono-bar 40. A bar 42 is mounted between the single bar heat sink 41 and the negative plate 43. The bar 42 is a semiconductor edge-emitting laser that, upon power up, emits laser light toward the sides of the microchannel monoblock 40. The electrode sheets are disposed in the interlayer for leading out the positive and negative electrodes of the microchannel monoblock 40.
According to the side pump module provided by the embodiment of the invention, the micro-channel single bar is arranged in the interlayer of the cooling liquid seat, so that compared with the macro-channel heat sink packaging bar used by the side pump semiconductor laser in the prior art, the heat dissipation performance Jiang Yuhong of the micro-channel single bar is higher than that of the macro-channel heat sink packaging bar, and the side pump module provided by the invention has the advantages of better heat dissipation performance, higher efficiency and smaller occupied volume under the premise of equal output power.
In some embodiments, the cooling liquid seat 10 includes an integrally formed upper seat 102, a base 103 and a support column 101, the support column 101 is disposed in an interlayer, the interlayer is located between the upper seat 102 and the base 103, the upper seat 102, the base 103 and the support column 101 are provided with first fixing holes 13 in a penetrating manner, and the side wall of the support column 101 is provided with second fixing holes 15. The first fixing holes 13 are used to fix the plurality of side pump modules together through fasteners. The second fixing hole 15 is used for penetrating the fastener to make the electrode plate and the upper seat 102 and the base 103 in one example have the same shape, and are both cuboid, so that the electrode plate is placed on the optical platform conveniently.
As shown in fig. 2 and 3, the side wall of the support column 101 is provided with a third fixing hole 18 and a fourth fixing hole 19. The micro-channel single bar 40 is provided with a fifth fixing hole 45 and a sixth fixing hole 47 which penetrate through. The fifth fixing hole 45 is located between the liquid inlet hole 44 and the liquid outlet hole 46. The number of the sixth fixing holes 47 is two, and is disposed at a side away from the bar 42. The third fixing hole 18 is matched with the fifth fixing hole 45, the fourth fixing hole 19 is matched with the sixth fixing hole 47, and the micro-channel single bar 40 and the support column 101 can be fixedly connected together through a fastener.
As shown in fig. 2, 3 and 5, the side wall of the support column 101 is provided with a first liquid outlet 16 for communicating with the liquid inlet 44, and a first liquid inlet 17 for communicating with the liquid outlet 46, and the first liquid outlet 16 and the first liquid inlet 17 are communicated with the cooling liquid channel. The cooling liquid channel is also provided with a vertical pipe penetrating through the cooling liquid seat 10, a port of the vertical pipe on the cooling liquid seat 10 comprises a second liquid inlet 11 and a second liquid outlet 12, the second liquid inlet 11 is communicated with the first liquid outlet 16, and the second liquid outlet 12 is communicated with the first liquid inlet 17. A communicated transverse pipe is arranged between the vertical pipe and the first liquid outlet 16 and the first liquid inlet 17. The flow path of the cooling liquid in the cooling liquid channel is as follows: the cooling liquid enters a vertical pipe from a second liquid inlet 11 on the end surface of the cooling liquid seat 10, then enters a transverse pipe and flows out from a first liquid outlet 16, enters a liquid inlet 44 of the micro-channel single bar 40, flows out from a liquid outlet 46 after cooling the micro-channel single bar 40, enters another transverse pipe through a first liquid inlet 17, and flows into a second liquid outlet 12 from another vertical pipe. The above-mentioned one-time circulation process of cooling liquid is completed.
In some embodiments, as shown in connection with fig. 3, 5 and 6, the number of micro-channel mono-bars 40 is 4, the cross-section of the support columns 101 is substantially triangular, and the number of support columns 101 is 2. One vertex of the triangle is located at a position penetrated by the through hole 14, resulting in a unfilled corner. The three sides of the triangle are located at the side wall of the support column 101. The support columns 101 are symmetrically arranged along both sides of the through hole 14. One side wall of the support column 101 adjacent to the unfilled corner is fixedly provided with one micro-channel bar 40.
Referring to fig. 7 and 8, the electrode sheet includes a first electrode sheet 30, a second electrode sheet 60 and a third electrode sheet 70, where the first electrode sheet 30 is fixedly connected with a support column 101 and a micro-channel single bar 40, the second electrode sheet 60 is used to connect two first electrode sheets 30 located on the same support column 101, and the third electrode sheet 70 is used to connect the micro-channel single bars 40 located on different support columns 101 in series. Alternatively, the number of the first electrode plates 30 is 4, and each first electrode plate 30 is V-shaped overall, so as to be convenient for attaching to the side wall of the support column 101. The number of the second electrode pieces 60 is 2, and has a bevel. The third electrode sheet 70 is a straight sheet, and the first electrode sheets 30 on the same side are connected by the fastener 105.
The side pump module further comprises a press block 50, the press block 50 being arranged between the microchannel monoblock 40 and the second electrode plate 60, the press block 50 being a conductor. The function of the press block is on the one hand to fix the monoblock to the water seat and on the other hand to conduct electricity. The connection of the compact 50 and the microchannel monoblock 40 is accomplished by fasteners 105.
In view of the above-mentioned objects, as shown in fig. 9, a second aspect of the embodiment of the present invention proposes a semiconductor laser, which includes a plurality of side pump modules 100 according to the first aspect, an upper cover plate 80, a lower cover plate 90, and a fourth electrode sheet 106, wherein the upper cover plate 80 is fixed above the side pump module located at the uppermost position, the lower cover plate 90 is fixed below the side pump module located at the lowermost position, and the fourth electrode sheet 106 is used to connect adjacent side pump modules in series.
After the semiconductor laser is energized, pump light emitted from the micro-channel single beam 40 enters from the side surface of the crystal rod 20 as a gain medium, and the pump light oscillates along the axial direction of the crystal rod 20, and finally, laser light is output.
According to the semiconductor laser provided by the embodiment of the invention, the side pump modules are combined in series, so that compared with the prior art that the side pump semiconductor laser uses the macro-channel heat sink to package the bar, the macro-channel heat sink to package the bar can be packaged on the macro-channel heat sink in multiple stages, and the side pump modules in the semiconductor laser provided by the invention can be connected in series according to the output power requirement, so that the installation is simpler and the configuration is more convenient.
It should be noted that in the description of the present invention, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present invention, the azimuth or positional relationship indicated by the terms "left", "right", "front", "rear", etc., are based on the azimuth or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and further implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (10)
1. A side pump module, comprising:
a cooling liquid seat (10), wherein the cooling liquid seat (10) is provided with a through hole (14) penetrating through, and an interlayer and a cooling liquid channel are arranged inside the cooling liquid seat (10);
the crystal bar (20) is sleeved in the through hole (14);
the micro-channel single bar (40) is arranged in the interlayer, the light-emitting surface of the micro-channel single bar (40) is opposite to the side surface of the crystal bar (20), the micro-channel single bar (40) is provided with a liquid inlet hole (44) and a liquid outlet hole (46), and the liquid inlet hole (44) and the liquid outlet hole (46) are communicated with the cooling liquid channel;
and the electrode plate is arranged in the interlayer and is used for leading out the positive electrode and the negative electrode of the micro-channel single bar (40).
2. The side pump module according to claim 1, wherein the cooling liquid seat (10) comprises an integrally formed upper seat (102), a base (103) and a support column (101), the support column (101) is arranged in the interlayer, the interlayer is positioned between the upper seat (102) and the base (103), the upper seat (102), the base (103) and the support column (101) are provided with first fixing holes (13) in a penetrating manner, and the side wall of the support column (101) is provided with second fixing holes (15).
3. Side pump module according to claim 2, characterized in that the side wall of the support column (101) is provided with a third fixing hole (18) and a fourth fixing hole (19).
4. Side pump module according to claim 2, characterized in that a first liquid outlet (16) for communicating with the liquid inlet hole (44) and a first liquid inlet (17) communicating with the liquid outlet hole (46) are provided on a side wall of the support column (101), the first liquid outlet (16) and the first liquid inlet (17) being in communication with the cooling liquid channel.
5. Side pump module according to claim 2, characterized in that the number of micro-channels monoblock (40) is 4, the cross-section of the support columns (101) is substantially triangular, and the number of support columns (101) is 2.
6. The side pump module according to claim 4, characterized in that the cooling fluid channel has a standpipe penetrating the cooling fluid seat (10), the port of the standpipe on the cooling fluid seat (10) comprising a second inlet (11) and a second outlet (12), the second inlet (11) being in communication with the first outlet (16), the second outlet (12) being in communication with the first inlet (17).
7. Side pump module according to claim 5, characterized in that the support columns (101) are symmetrically arranged along both sides of the through hole (14).
8. The side pump module according to claim 5, wherein the electrode plates comprise a first electrode plate (30), a second electrode plate (60) and a third electrode plate (70), the first electrode plate (30) is fixedly connected with the support column (101) and the micro-channel monoblock (40), respectively, the second electrode plate (60) is used for connecting two first electrode plates (30) located on the same support column (101), and the third electrode plate (70) is used for connecting the micro-channel monoblocks (40) respectively located on different support columns (101) in series.
9. The side pump module according to claim 8, further comprising a press block (50), the press block (50) being arranged between the microchannel monoblock (40) and the second electrode sheet (60), the press block (50) being a conductor.
10. A semiconductor laser, characterized by comprising a plurality of side pump modules according to any one of claims 1 to 9, an upper cover plate (80), a lower cover plate (90) and a fourth electrode sheet (106), the upper cover plate (80) being fixed above the uppermost side pump module, the lower cover plate (90) being fixed below the lowermost side pump module, the fourth electrode sheet (106) being for connecting adjacent side pump modules in series.
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|---|---|---|---|
| CN202311083581.5A CN116799611B (en) | 2023-08-28 | 2023-08-28 | Side pump module and semiconductor laser |
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| CN202311083581.5A CN116799611B (en) | 2023-08-28 | 2023-08-28 | Side pump module and semiconductor laser |
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| CN104577688A (en) * | 2015-01-20 | 2015-04-29 | 中国工程物理研究院激光聚变研究中心 | Wide temperature annular laser diode pumping laser and designing method thereof |
| CN112821185A (en) * | 2020-12-31 | 2021-05-18 | 中国电子科技集团公司第十三研究所 | Semiconductor laser and semiconductor laser side pump module |
| CN114361934A (en) * | 2022-01-07 | 2022-04-15 | 无锡亮源激光技术有限公司 | Novel high-power semiconductor laser device |
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