CN116730274A - 微振动器的安装结构 - Google Patents

微振动器的安装结构 Download PDF

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Publication number
CN116730274A
CN116730274A CN202310202688.0A CN202310202688A CN116730274A CN 116730274 A CN116730274 A CN 116730274A CN 202310202688 A CN202310202688 A CN 202310202688A CN 116730274 A CN116730274 A CN 116730274A
Authority
CN
China
Prior art keywords
electrode
mounting substrate
wiring
micro vibrator
vibrator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310202688.0A
Other languages
English (en)
Chinese (zh)
Inventor
原田翔太
伊藤启太郎
西川英昭
稻垣优辉
后藤胜昭
吉田贵彦
川合祐辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Original Assignee
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, Toyota Motor Corp, Mirise Technologies Corp filed Critical Denso Corp
Publication of CN116730274A publication Critical patent/CN116730274A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
    • G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional [3D] vibrators, e.g. wine glass-type vibrators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
    • G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
CN202310202688.0A 2022-03-08 2023-03-06 微振动器的安装结构 Pending CN116730274A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-035318 2022-03-08
JP2022035318A JP7673671B2 (ja) 2022-03-08 2022-03-08 微小振動体の実装構造

Publications (1)

Publication Number Publication Date
CN116730274A true CN116730274A (zh) 2023-09-12

Family

ID=87908570

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310202688.0A Pending CN116730274A (zh) 2022-03-08 2023-03-06 微振动器的安装结构

Country Status (3)

Country Link
US (1) US12287203B2 (https=)
JP (1) JP7673671B2 (https=)
CN (1) CN116730274A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024077035A1 (en) * 2022-10-04 2024-04-11 Enertia Microsystems Inc. Vibratory gyroscopes with resonator attachments

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150336790A1 (en) * 2014-04-04 2015-11-26 Analog Devices, Inc. Fabrication of Tungsten MEMS Structures
CN105540530A (zh) * 2015-12-18 2016-05-04 东南大学 微玻璃半球谐振陀螺及其圆片级制备方法
CN107055457A (zh) * 2016-12-12 2017-08-18 北京自动化控制设备研究所 一种熔融石英微半球陀螺敏感结构
JP2018152838A (ja) * 2017-03-10 2018-09-27 Tdk株式会社 振動デバイス
CN110828389A (zh) * 2018-08-07 2020-02-21 东芝存储器株式会社 半导体装置及其制造方法
CN111049488A (zh) * 2018-10-12 2020-04-21 三星电机株式会社 体声波谐振器
US20220049959A1 (en) * 2019-11-13 2022-02-17 National University Of Defense Technology Micro hemispherical resonator gyroscope, and an assembly method and wafer fixture
CN114105075A (zh) * 2021-11-12 2022-03-01 中国电子科技集团公司第二十六研究所 一种曲面电极的微半球陀螺结构及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4157041A (en) * 1978-05-22 1979-06-05 General Motors Corporation Sonic vibrating bell gyro
JP4591000B2 (ja) * 2004-09-16 2010-12-01 株式会社デンソー 半導体力学量センサおよびその製造方法
WO2017101813A1 (zh) * 2015-12-18 2017-06-22 东南大学 微三维壳体谐振陀螺
CN108883927B (zh) 2016-02-29 2023-06-13 密歇根大学董事会 制造三维微结构器件的方法
US11703330B2 (en) 2019-04-01 2023-07-18 The Regents Of The University Of California Fused quartz dual shell resonator and method of fabrication
JP7533193B2 (ja) * 2020-12-16 2024-08-14 株式会社デンソー 微小振動体の把持構造、慣性センサの製造方法
JP7456412B2 (ja) * 2021-03-30 2024-03-27 株式会社デンソー 慣性センサ
JP7452492B2 (ja) * 2021-05-21 2024-03-19 株式会社デンソー 慣性センサおよびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150336790A1 (en) * 2014-04-04 2015-11-26 Analog Devices, Inc. Fabrication of Tungsten MEMS Structures
CN105540530A (zh) * 2015-12-18 2016-05-04 东南大学 微玻璃半球谐振陀螺及其圆片级制备方法
CN107055457A (zh) * 2016-12-12 2017-08-18 北京自动化控制设备研究所 一种熔融石英微半球陀螺敏感结构
JP2018152838A (ja) * 2017-03-10 2018-09-27 Tdk株式会社 振動デバイス
CN110828389A (zh) * 2018-08-07 2020-02-21 东芝存储器株式会社 半导体装置及其制造方法
CN111049488A (zh) * 2018-10-12 2020-04-21 三星电机株式会社 体声波谐振器
US20220049959A1 (en) * 2019-11-13 2022-02-17 National University Of Defense Technology Micro hemispherical resonator gyroscope, and an assembly method and wafer fixture
CN114105075A (zh) * 2021-11-12 2022-03-01 中国电子科技集团公司第二十六研究所 一种曲面电极的微半球陀螺结构及其制备方法

Also Published As

Publication number Publication date
US20230288203A1 (en) 2023-09-14
JP7673671B2 (ja) 2025-05-09
JP2023130812A (ja) 2023-09-21
US12287203B2 (en) 2025-04-29

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