JP7673671B2 - 微小振動体の実装構造 - Google Patents

微小振動体の実装構造 Download PDF

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Publication number
JP7673671B2
JP7673671B2 JP2022035318A JP2022035318A JP7673671B2 JP 7673671 B2 JP7673671 B2 JP 7673671B2 JP 2022035318 A JP2022035318 A JP 2022035318A JP 2022035318 A JP2022035318 A JP 2022035318A JP 7673671 B2 JP7673671 B2 JP 7673671B2
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Japan
Prior art keywords
micro
vibrator
electrode
mounting substrate
mounting
Prior art date
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Application number
JP2022035318A
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English (en)
Japanese (ja)
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JP2023130812A (ja
JP2023130812A5 (https=
Inventor
翔太 原田
啓太郎 伊藤
英昭 西川
優輝 稲垣
勝昭 後藤
貴彦 吉田
祐輔 川合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Original Assignee
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, Toyota Motor Corp, Mirise Technologies Corp filed Critical Denso Corp
Priority to JP2022035318A priority Critical patent/JP7673671B2/ja
Priority to US18/169,438 priority patent/US12287203B2/en
Priority to CN202310202688.0A priority patent/CN116730274A/zh
Publication of JP2023130812A publication Critical patent/JP2023130812A/ja
Publication of JP2023130812A5 publication Critical patent/JP2023130812A5/ja
Application granted granted Critical
Publication of JP7673671B2 publication Critical patent/JP7673671B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
    • G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
    • G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional [3D] vibrators, e.g. wine glass-type vibrators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
JP2022035318A 2022-03-08 2022-03-08 微小振動体の実装構造 Active JP7673671B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022035318A JP7673671B2 (ja) 2022-03-08 2022-03-08 微小振動体の実装構造
US18/169,438 US12287203B2 (en) 2022-03-08 2023-02-15 Mounting structure of micro vibrator
CN202310202688.0A CN116730274A (zh) 2022-03-08 2023-03-06 微振动器的安装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022035318A JP7673671B2 (ja) 2022-03-08 2022-03-08 微小振動体の実装構造

Publications (3)

Publication Number Publication Date
JP2023130812A JP2023130812A (ja) 2023-09-21
JP2023130812A5 JP2023130812A5 (https=) 2024-05-29
JP7673671B2 true JP7673671B2 (ja) 2025-05-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022035318A Active JP7673671B2 (ja) 2022-03-08 2022-03-08 微小振動体の実装構造

Country Status (3)

Country Link
US (1) US12287203B2 (https=)
JP (1) JP7673671B2 (https=)
CN (1) CN116730274A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024077035A1 (en) * 2022-10-04 2024-04-11 Enertia Microsystems Inc. Vibratory gyroscopes with resonator attachments

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006084326A (ja) 2004-09-16 2006-03-30 Denso Corp 半導体力学量センサおよびその製造方法
US20180188030A1 (en) 2015-12-18 2018-07-05 Southeast University Micro three-dimensional shell resonator gyroscope

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4157041A (en) * 1978-05-22 1979-06-05 General Motors Corporation Sonic vibrating bell gyro
US9878901B2 (en) * 2014-04-04 2018-01-30 Analog Devices, Inc. Fabrication of tungsten MEMS structures
CN105540530B (zh) * 2015-12-18 2017-03-15 东南大学 微玻璃半球谐振陀螺及其圆片级制备方法
CN108883927B (zh) 2016-02-29 2023-06-13 密歇根大学董事会 制造三维微结构器件的方法
CN107055457A (zh) * 2016-12-12 2017-08-18 北京自动化控制设备研究所 一种熔融石英微半球陀螺敏感结构
JP7006017B2 (ja) * 2017-03-10 2022-01-24 Tdk株式会社 振動デバイス
JP2020025019A (ja) * 2018-08-07 2020-02-13 キオクシア株式会社 半導体装置
KR102172636B1 (ko) * 2018-10-12 2020-11-03 삼성전기주식회사 체적 음향 공진기
US11703330B2 (en) 2019-04-01 2023-07-18 The Regents Of The University Of California Fused quartz dual shell resonator and method of fabrication
CN110749315A (zh) * 2019-11-13 2020-02-04 中国人民解放军国防科技大学 一种微半球谐振陀螺结构、装配方法及圆片夹具
JP7533193B2 (ja) * 2020-12-16 2024-08-14 株式会社デンソー 微小振動体の把持構造、慣性センサの製造方法
JP7456412B2 (ja) * 2021-03-30 2024-03-27 株式会社デンソー 慣性センサ
JP7452492B2 (ja) * 2021-05-21 2024-03-19 株式会社デンソー 慣性センサおよびその製造方法
CN114105075B (zh) * 2021-11-12 2025-07-15 中国电子科技集团公司第二十六研究所 一种曲面电极的微半球陀螺结构及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006084326A (ja) 2004-09-16 2006-03-30 Denso Corp 半導体力学量センサおよびその製造方法
US20180188030A1 (en) 2015-12-18 2018-07-05 Southeast University Micro three-dimensional shell resonator gyroscope

Also Published As

Publication number Publication date
US20230288203A1 (en) 2023-09-14
JP2023130812A (ja) 2023-09-21
US12287203B2 (en) 2025-04-29
CN116730274A (zh) 2023-09-12

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