CN116560184A - Photomask protective film assembly dismantling system and method - Google Patents
Photomask protective film assembly dismantling system and method Download PDFInfo
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- CN116560184A CN116560184A CN202210104404.XA CN202210104404A CN116560184A CN 116560184 A CN116560184 A CN 116560184A CN 202210104404 A CN202210104404 A CN 202210104404A CN 116560184 A CN116560184 A CN 116560184A
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- Prior art keywords
- protective film
- photomask
- film assembly
- plate
- heating plate
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- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 103
- 229920000297 Rayon Polymers 0.000 claims abstract description 8
- 239000004809 Teflon Substances 0.000 claims description 9
- 229920006362 Teflon® Polymers 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 32
- 230000001070 adhesive effect Effects 0.000 description 32
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 229910021529 ammonia Inorganic materials 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- -1 ammonia ions Chemical class 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001012 protector Effects 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
The invention provides a photomask protective film assembly dismantling system and a photomask protective film assembly dismantling method. The demolition system includes: the device comprises a supporting platform, a heating plate, a heating device, a temperature controller, a timer, two handles and two connecting rods; the heating plate is embedded in a groove of the supporting platform, the size of the heating plate is the same as that of a photomask plate of the protective film assembly to be removed, a thimble slide way and a fixing frame slide way for fixing the photomask plate to move are arranged on the supporting platform, and the thimble slide way and the fixing frame slide way extend from the outer side to be adjacent to the heating plate; each connecting rod is provided with a plurality of ejector pins, the positions of the ejector pins are matched with the positions of ejector pin holes on the protective film assembly, the heating device is in contact with the heating plate, the heating device is electrically connected with the temperature controller and the timer, the handles are connected with the connecting rods in one-to-one correspondence, each handle comprises a first part and a second part which are connected with each other, and the first part and the second part are not on the same straight line. The invention can avoid viscose residues and improve the dismantling efficiency of the protective film component.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a photomask protective film assembly dismantling system and method.
Background
In order to prevent the pollution to the graphic area of the photomask (Mask), a protective film (Pellicle) is arranged on the surface of the photomask for protecting the photomask. Generally, a photomask protective film assembly includes a protective Frame (Frame), a protective film (film) covering the protective Frame, and an adhesive, and the photomask protective film assembly is adhered to a photomask through the adhesive. In the use process of the photomask, the photomask needs to be maintained and cleaned regularly, and at the moment, the mask protection film component on the photomask needs to be removed.
The existing dismantling method generally heats the photomask with the protective film on the surface, so that the adhesive between the photomask and the protective film is roasted and softened, and then the protective module is dismantled, or the protective film module is directly dismantled by adopting a simple dismantling tool without heating (namely, the annular frame of the protective film and the protective film layer are dismantled together). However, in the process of removing the protective film in the above manner, the protective film layer is easy to break and fall on the pattern area of the photomask to pollute the photomask, the protective film frame is not easy to detach, the viscose at the adhesion part of the frame and the photomask can remain on the photomask, workers are required to manually remove the viscose by Acetone (acetate), and then the residual viscose of the photomask is cleaned by the mode of H2SO4 (sulfuric acid) +TMAH (tetramethylammonium hydroxide) +DI (deionized water) +DRY (drying) or H2SO4+SC1+DI+DRY, and in the cleaning process, the residual viscose or acid/ammonia can pollute a cleaning tank to pollute the photomask, thereby causing defects on the photomask or increasing acid/ammonia ions to be scrapped.
The mask protection subassembly that uses now commonly used tears utensil open and is a pair of handle of T type structure, puts on the photomask during the use, removes protection film subassembly from the frame both sides, but this kind of tool has following problem: 1. the forces on the two sides are uneven, so that the protective film is not easy to dismantle; 2. the residual glue of the photomask is easy to be caused; 3. the disassembling tool is placed on the photomask to easily scratch the photomask; 4. the protective film layer is easy to break and fall on the pattern area of the photomask, so that the photomask is scrapped.
Therefore, it is necessary to provide a method and a tool for removing a photomask and a mask protection assembly to solve the above-mentioned problems in the prior art.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a photomask protective film assembly removing system and method, which are used for solving the problems that in the prior art, the photomask protective film assembly removing jig and/or method are difficult to effectively remove the protective film assembly, and damage to the photomask or damage to the photomask due to residual glue or breakage of the protective film falls down in the pattern area of the photomask are easy to cause.
To achieve the above and other related objects, the present invention provides a photomask protective film assembly removing system, comprising: the device comprises a supporting platform, a heating plate with a teflon layer on the surface, a heating device, a temperature controller, a timer, two handles and two connecting rods; the heating plate is embedded in the groove of the supporting platform, the size of the heating plate is the same as that of the photomask plate of the protective film assembly to be removed, the supporting platform is provided with thimble sliding ways which are matched with the thimbles in a one-to-one correspondence manner and fixing frame sliding ways for fixing the fixing frames of the photomask plate to move, and the thimble sliding ways and the fixing frame sliding ways extend from the outer side to be adjacent to the heating plate; each connecting rod is provided with a plurality of ejector pins, the positions of the ejector pins are matched with the positions of ejector pin holes on the protective film assembly, the heating device is in contact with the heating plate, the heating device is electrically connected with the temperature controller and the timer, the handles are connected with the connecting rods in a one-to-one correspondence mode, each handle comprises a first part and a second part which are connected with each other, the first part and the second part are not in the same straight line, and the protective film assembly can be erected through the connecting rods by pressing the first part.
Optionally, the heating plate comprises an aluminum plate, and the heating device is located in the heating plate.
Optionally, the support platform comprises a stainless steel plate.
Optionally, two ejector pins are arranged on each connecting rod, and the number of the fixed frame slide ways and the ejector pin slide ways is two.
Alternatively, the thickness of the teflon layer is 100 μm to 400 μm.
Optionally, the second portion of the handle extends obliquely upward in a direction away from the center, and the first portion is located above the second portion and extends obliquely upward toward the center.
Optionally, the diameter of the thimble is 1.7 plus or minus 0.1mm, and the vertical distance between the thimble and the heating plate is 1.75 plus or minus 0.01mm.
The invention also provides a photomask protective film assembly dismantling method using the photomask protective film assembly dismantling system in any scheme, which comprises the following steps:
placing a photomask plate of the protective film assembly to be removed right above the heating plate and attaching the photomask plate to the heating plate, and moving a fixing frame along a fixing frame slideway to the photomask plate so as to fix the photomask plate;
starting a heating device to heat the heating plate for a preset period of time until the viscose of the protective film component is softened;
moving the thimble along the thimble slideway towards the direction of the protective film assembly frame so as to insert the thimble into the hole of the protective film assembly frame;
the handle is pressed downward to erect the protective film assembly frame so that the protective film assembly is removed from the photomask.
Optionally, the heating temperature of the heating device is 50 ℃ to 150 ℃.
Optionally, the heating time of the heating device is 60s-1200s.
As described above, the photomask protective film assembly dismantling system and method of the invention have the following beneficial effects: the photomask protective film component dismantling system provided by the invention is used for dismantling the protective film component of the photomask, so that the dismantling tool can be prevented from touching the photomask, the damage of the photomask caused by the dismantling tool is avoided, and the problem of back scratch of the photomask can be solved; the adhesive of the protective film component is heated uniformly, the adhesive is easy to separate from the photomask, residual adhesive cannot be generated, the adhesive temperature error can be reduced by directly heating the protective film component, the optimal adhesive dismantling parameter can be found easily, the optimal adhesive dismantling parameter can be set according to the adhesive characteristics of various protective film components, the acetone adhesive removing and residual adhesive cleaning process by utilizing sulfuric acid is not needed, the opportunity that acid radical/ammonia radical chemicals contact the photomask can be reduced, the acid radical/ammonia radical residue of the photomask can be reduced, and the generation probability of defects (such as haze and fogging) can be reduced. The system is very convenient to use, and is beneficial to improving the dismantling efficiency of the protective film assembly and reducing the dismantling cost.
Drawings
Fig. 1 is a schematic top view of a photomask protective film assembly removal system according to the present invention.
Fig. 2 is a schematic side view of a photomask protective film assembly removal system according to the present invention.
FIG. 3 is a schematic diagram of a photomask protective film assembly removal system according to the present invention when the protective film assembly is removed.
FIG. 4 is a schematic view showing the positional relationship of the ejector pins of the removal system for a photomask protective film assembly according to the present invention.
FIG. 5 is a schematic diagram showing the electrical connection of the heating device, temperature controller and timer of the photomask protective film assembly removal system according to the present invention.
Description of element reference numerals
11. Supporting platform
12. Heating plate
13. Handle grip
131. First part
132. Second part
14. Connecting rod
15. Heating device
16. Temperature controller
17. Time-piece
18. Thimble
19. Thimble slideway
20. Fixing frame
21. Fixing rack slideway
22. Overheat protector
231. Temperature display
232. Timing display
24. Pressing spring
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of this application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex. In order to make the illustration as concise as possible, not all structures are labeled in the drawings.
Please refer to fig. 1 to 5.
As shown in fig. 1 to 5, the present invention provides a photomask protective film assembly removal system, comprising: the heating device comprises a supporting platform 11, a heating plate 12 with a teflon layer on the surface, a heating device 15, a temperature controller 16, a timer 17, two handles 13 and two connecting rods 14; the heating plate 12 is embedded in the groove of the supporting platform 11, the size of the heating plate 12 is consistent with the size of the groove, so that the upper surface of the heating plate 12 and the upper surfaces of the supporting platform 11 except the groove are positioned on the same horizontal plane, namely, the heating plate 12 fills up the groove of the supporting platform 11, the size of the heating plate 12 is the same as the size of a photomask plate of a protective film assembly to be removed, the photomask plate is completely positioned on the heating plate 12 in the process of removing the protective film assembly, the supporting platform 11 is provided with thimble slide ways 19 which are matched with the thimbles 18 in a one-to-one correspondence manner and are used for moving thimble 18 and a fixing frame slide way 21 which is used for moving a fixing frame 20 for fixing the photomask plate, the thimble slide ways 19 and the fixing frame slide way 21 extend from the outer side to be adjacent to the heating plate 12 (the horizontal extending direction of each slide way is perpendicular to the surface adjacent to the heating plate 12), and the setting slide ways are beneficial to accurate moving alignment of each structure; each connecting rod 14 is provided with a plurality of (two or more) ejector pins 18, the positions of the ejector pins 18 are matched with the positions of ejector pin holes on the protective film component, the heating device 15 is in contact with the heating plate 12, the heating device 15 is electrically connected with the temperature controller 16 and the timer 17, the handles 13 are in one-to-one correspondence with the connecting rods 14, for example, the handles 13 are connected through pressing springs 24, the handles 13 comprise a first part 131 and a second part 132 which are mutually connected, the first part 131 and the second part 132 are not on the same straight line, the protective film component can be erected through the connecting rods 14 by pressing the first part 131, namely, the protective film component is dismounted by utilizing the lever principle, and compared with the straight line design in the prior art, the handle design can enable the two sides of the protective film component frame to be easily dismounted due to balanced stress, and the damage of the photomask caused by oblique sliding in the dismounting process is avoided. An exemplary process for photomask protective film assembly removal using the photomask protective film assembly removal system provided by the present invention is: placing a photomask plate of a protective film assembly to be removed right above the heating plate 12 and attaching the photomask plate to the heating plate 12 (an area I in fig. 2 is an area for placing the photomask plate, and an area II is an area for placing a protective film frame of the protective film assembly), and moving a fixing frame 20 along fixing frame slide ways 21 on two sides of the heating plate 12 to fix the photomask plate; starting a heating device 15 to heat the heating plate 12 for a preset period of time until the adhesive of the protective film component is softened; moving the ejector pins 18 along ejector pin slides 19 on both sides of the heating plate 12 toward the protective film assembly frame to insert the ejector pins 18 into holes on opposite ends of the protective film assembly frame (refer to fig. 3); the handle 13 is pressed downward to erect the pellicle assembly frame so that the pellicle assembly is removed from the reticle. Compared with the prior art, the photomask protective film assembly dismantling system provided by the invention is used for dismantling the protective film assembly of the photomask, so that the dismantling tool can be prevented from touching the photomask, the damage of the photomask caused by the dismantling tool can be avoided, and the problem of scratching the back surface of the photomask can be solved; the adhesive of the protective film component is heated uniformly, the adhesive is easy to separate from the photomask, residual adhesive cannot be generated, the adhesive temperature error can be reduced by directly heating the protective film component, the optimal adhesive dismantling parameter can be found easily, the optimal adhesive dismantling parameter can be set according to the adhesive characteristics of various protective film components, the acetone adhesive removing and residual adhesive cleaning process by utilizing sulfuric acid is not needed, the opportunity that acid radical/ammonia radical chemicals contact the photomask can be reduced, the acid radical/ammonia radical residue of the photomask can be reduced, and the generation probability of defects (such as haze and fogging) can be reduced. The system is very convenient to use, and is beneficial to improving the dismantling efficiency of the protective film assembly and reducing the dismantling cost.
The heating plate 12 is preferably an aluminum plate, but not limited thereto, but may be other materials having good thermal conductivity, and the heating device 15 may be located in the heating plate 12 to heat the heating plate 12 better.
The supporting platform 11 is made of a material with a certain hardness, and has a smooth surface, and the material includes, but is not limited to, stainless steel plate.
In a preferred embodiment, two pins 18 are provided on each link 14, two pins 21 and 19 are provided on each link, and four pins 18 on two links 14 are preferably located at four corners of a rectangle, which helps to further improve the force balance during the removal process. Of course, in other examples, the number of the ejector pins 18 may be selected, and it is important that the ejector pins correspond to the ejector pin holes on the protective film frame one by one, and the pitch between the ejector pins 18 corresponds to the pitch of the ejector pin holes on the protective film frame. For example, as shown in FIG. 4, in one example, the diameter A of the pins 18 is 1.7+ -0.1 mm, the vertical distance B of the pins 18 from the heater plate 12 is 1.75+ -0.01 mm, and the spacing C between the pins 18 on the two links 14 on opposite sides of the protective film assembly is 104.00+ -0.10 mm when the protective film assembly is removed.
The teflon layer generally covers the entire surface of the heating plate 12, and its thickness needs to be carefully set, and too thick may affect heating, and too thin may cause the teflon layer to be easily damaged. The inventors have found through extensive experimentation that the thickness of the teflon layer is preferably between 100 μm and 400 μm (inclusive, where the description refers to a range of values, unless otherwise specified, all inclusive are included herein).
As shown in fig. 2, in an example, the second portion 132 of the handle 13 extends obliquely upward in a direction away from the center, and the first portion 131 is located above the second portion 132 and extends obliquely upward toward the center. Of course, this state is a state in a non-dismantling operation, when the protective film assembly is dismantled, the first portion 131 is pressed outwards and downwards, the second portion 132 supports the connecting rod 14 under the leverage, and the ejector pin 18 on the connecting rod 14 lifts the protective film frame, so that the protective film assembly is dismantled.
As shown in fig. 5, the photomask protective film assembly removing system may further include a temperature display 231 electrically connected to the temperature controller 16 for displaying the heating temperature of the heating plate 12 in real time and a timing display 232 electrically connected to the timer 17 for displaying the heating time in real time, and may further be provided with an overheat protector 22 electrically connected to the heating device 15.
The invention also provides a photomask protective film assembly dismantling method, which is carried out by using the photomask protective film assembly dismantling system in any scheme. For a detailed description of the photomask protective film assembly, please refer to the foregoing, and a detailed description is omitted for brevity. The dismantling method comprises the following steps:
placing a photomask plate of the protective film assembly to be removed right above the heating plate 12 and attaching the photomask plate to the heating plate 12, and moving the fixing frames 20 to the photomask plate along fixing frame slide ways 21 positioned on two opposite sides of the heating plate 12 to fix the photomask plate;
starting a heating device 15 to heat the heating plate 12 for a preset period of time until the adhesive of the protective film component is softened;
moving the ejector pins 18 along ejector pin slides 19 at opposite ends of the heating plate 12 toward the protective film assembly frame to insert the ejector pins 18 into holes of the protective film assembly frame;
the handle 13 is pressed downward to erect the pellicle assembly frame from opposite ends so that the pellicle assembly is removed from the reticle.
In a preferred example, the heating temperature of the heating device is 50-150 ℃, and the heating time of the heating device is preferably 60-1200 s, so that the parameter setting can meet the dismantling of the protective film component of most types of photomasks.
The method for removing the protective film component of the photomask is very simple and convenient to operate, can avoid damage and viscose residues of the photomask without cleaning with acetone and sulfuric acid, can reduce acid radical/ammonia radical residues, and can greatly reduce the removal cost.
In summary, the present invention provides a photomask protective film assembly removal system and method. The demolition system includes: the device comprises a supporting platform, a heating plate with a teflon layer on the surface, a heating device, a temperature controller, a timer, two handles and two connecting rods; the heating plate is embedded in the groove of the supporting platform, the size of the heating plate is the same as that of the photomask plate of the protective film assembly to be removed, the supporting platform is provided with thimble sliding ways which are matched with the thimbles in a one-to-one correspondence manner and fixing frame sliding ways for fixing the fixing frames of the photomask plate to move, and the thimble sliding ways and the fixing frame sliding ways extend from the outer side to be adjacent to the heating plate; each connecting rod is provided with a plurality of ejector pins, the positions of the ejector pins are matched with the positions of ejector pin holes on the protective film assembly, the heating device is in contact with the heating plate, the heating device is electrically connected with the temperature controller and the timer, the handles are connected with the connecting rods in a one-to-one correspondence mode, each handle comprises a first part and a second part which are connected with each other, the first part and the second part are not in the same straight line, and the protective film assembly can be erected through the connecting rods by pressing the first part. The photomask protective film component dismantling system provided by the invention is used for dismantling the protective film component of the photomask, so that the dismantling tool can be prevented from touching the photomask, the damage of the photomask caused by the dismantling tool is avoided, and the problem of back scratch of the photomask can be solved; the adhesive of the protective film component is heated uniformly, the adhesive is easy to separate from the photomask, residual adhesive cannot be generated, the adhesive temperature error can be reduced by directly heating the protective film component, the optimal adhesive dismantling parameter can be found easily, the optimal adhesive dismantling parameter can be set according to the adhesive characteristics of various protective film components, the acetone adhesive removing and residual adhesive cleaning process by utilizing sulfuric acid is not needed, the opportunity that acid radical/ammonia radical chemicals contact the photomask can be reduced, the acid radical/ammonia radical residue of the photomask can be reduced, and the generation probability of defects (such as haze and fogging) can be reduced. The system is very convenient to use, and is beneficial to improving the dismantling efficiency of the protective film assembly and reducing the dismantling cost. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A photomask protective film assembly removal system, comprising: the device comprises a supporting platform, a heating plate with a teflon layer on the surface, a heating device, a temperature controller, a timer, two handles and two connecting rods; the heating plate is embedded in the groove of the supporting platform, the size of the heating plate is the same as that of the photomask plate of the protective film assembly to be removed, the supporting platform is provided with thimble sliding ways which are matched with the thimbles in a one-to-one correspondence manner and fixing frame sliding ways for fixing the fixing frames of the photomask plate to move, and the thimble sliding ways and the fixing frame sliding ways extend from the outer side to be adjacent to the heating plate; each connecting rod is provided with a plurality of ejector pins, the positions of the ejector pins are matched with the positions of ejector pin holes on the protective film assembly, the heating device is in contact with the heating plate, the heating device is electrically connected with the temperature controller and the timer, the handles are connected with the connecting rods in a one-to-one correspondence mode, each handle comprises a first part and a second part which are connected with each other, the first part and the second part are not in the same straight line, and the protective film assembly can be erected through the connecting rods by pressing the first part.
2. The photomask guard film assembly removal system of claim 1, wherein the heating plate comprises an aluminum plate and the heating device is located within the heating plate.
3. The photomask guard film assembly removal system of claim 1, wherein the support platform comprises a stainless steel plate.
4. The photomask protective film assembly removal system of claim 1, wherein two ejector pins are provided on each link, and the two ejector pin slides are respectively provided on the mount slide and the ejector pin slide.
5. The photomask protective film assembly removal system of claim 1, wherein the teflon layer has a thickness of 100 μm to 400 μm.
6. The photomask guard film assembly removal system of claim 1, wherein the second portion of the handle extends obliquely upward in a direction away from the center, and the first portion is located above the second portion and extends obliquely upward toward the center.
7. The photomask protective film assembly removal system of claim 1, wherein the diameter of the ejector pins is 1.7±0.1mm, and the vertical distance of the ejector pins from the heating plate is 1.75±0.01mm.
8. A photomask protective film assembly removal method using the photomask protective film assembly removal system according to any of claims 1 to 7, comprising the steps of:
placing a photomask plate of the protective film assembly to be removed right above the heating plate and attaching the photomask plate to the heating plate, and moving a fixing frame along a fixing frame slideway to the photomask plate so as to fix the photomask plate;
starting a heating device to heat the heating plate for a preset period of time until the viscose of the protective film component is softened;
moving the thimble along the thimble slideway towards the direction of the protective film assembly frame so as to insert the thimble into the hole of the protective film assembly frame;
the handle is pressed downward to erect the protective film assembly frame so that the protective film assembly is removed from the photomask.
9. The dismantling method as claimed in claim 8, wherein the heating temperature of the heating device is 50-150 ℃.
10. The dismantling method as claimed in claim 8, wherein the heating time of the heating device is 60s to 1200s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210104404.XA CN116560184A (en) | 2022-01-28 | 2022-01-28 | Photomask protective film assembly dismantling system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210104404.XA CN116560184A (en) | 2022-01-28 | 2022-01-28 | Photomask protective film assembly dismantling system and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117682161A (en) * | 2024-02-02 | 2024-03-12 | 深圳市龙图光罩股份有限公司 | Film attaching method, device, terminal equipment and storage medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117682161A (en) * | 2024-02-02 | 2024-03-12 | 深圳市龙图光罩股份有限公司 | Film attaching method, device, terminal equipment and storage medium |
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