CN116529076A - 高频介电加热用粘接剂、结构体及结构体的制造方法 - Google Patents

高频介电加热用粘接剂、结构体及结构体的制造方法 Download PDF

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Publication number
CN116529076A
CN116529076A CN202180080955.0A CN202180080955A CN116529076A CN 116529076 A CN116529076 A CN 116529076A CN 202180080955 A CN202180080955 A CN 202180080955A CN 116529076 A CN116529076 A CN 116529076A
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Prior art keywords
adhesive
dielectric heating
frequency
adherends
frequency dielectric
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CN202180080955.0A
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English (en)
Chinese (zh)
Inventor
田矢直纪
土渕晃司
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Lintec Corp
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Lintec Corp
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    • C09J201/00—Adhesives based on unspecified macromolecular compounds
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
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    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • C09J2425/00—Presence of styrenic polymer
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00—Presence of graft polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
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CN109890925A (zh) * 2016-10-27 2019-06-14 琳得科株式会社 介电加热粘接膜、及使用了介电加热粘接膜的粘接方法
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