CN116504696A - PECVD transfer device and transfer method - Google Patents

PECVD transfer device and transfer method Download PDF

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Publication number
CN116504696A
CN116504696A CN202310776794.XA CN202310776794A CN116504696A CN 116504696 A CN116504696 A CN 116504696A CN 202310776794 A CN202310776794 A CN 202310776794A CN 116504696 A CN116504696 A CN 116504696A
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China
Prior art keywords
intercept
carrier
silicon wafer
guide rail
linear guide
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Granted
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CN202310776794.XA
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Chinese (zh)
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CN116504696B (en
Inventor
沈威
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Suzhou Chengtuo Intelligent Equipment Co ltd
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Suzhou Chengtuo Intelligent Equipment Co ltd
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Priority to CN202310776794.XA priority Critical patent/CN116504696B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a PECVD transfer device and a transfer method, wherein the PECVD transfer device comprises a base, a first frame arranged on the base, a first conveying line and a second conveying line which are arranged on the first frame in parallel, a first intercept changing mechanism corresponding to the first conveying line and a second intercept changing mechanism corresponding to the second conveying line arranged on the first frame, a first carrier sliding table mechanism corresponding to the first conveying line and a second carrier sliding table mechanism corresponding to the second conveying line arranged on the base, the second frame is also arranged on the base, the first carrier sliding table and the second carrier sliding table are both arranged below the second frame, a mechanical arm is arranged on the second frame, the first conveying line and the second conveying line are symmetrical relative to the mechanical arm, and the mechanical arm is used for switching silicon wafers between the first intercept changing mechanism and the first carrier sliding table mechanism and between the second intercept changing mechanism and between the second carrier sliding table mechanism and the second carrier sliding table mechanism. The advantages are that: the occupied area is smaller, and the efficiency is higher.

Description

PECVD transfer device and transfer method
Technical Field
The invention relates to the technical field of solar cells, in particular to a PECVD transfer device and a transfer method.
Background
The solar cell silicon wafer needs to be subjected to a series of processing procedures including cleaning, coating and the like in the manufacturing process, and the silicon wafer needs to be transferred between a graphite boat and a conveying line in each procedure. The existing transfer device adopts double conveyor lines to set up more, and wherein every transfer line corresponds a graphite boat moving mechanism, in this kind of setting, the arm is set up between two graphite boat moving mechanism, and the route of arm is restricted, and whole transfer device takes up an area of great for transfer inefficiency and take up an area of big.
In view of the foregoing, it is desirable to provide a PECVD transfer device and a transfer method.
Disclosure of Invention
The PECVD transfer device and the transfer method provided by the invention effectively solve the problems of large occupied area and low transfer efficiency of the existing transfer device.
The technical scheme adopted by the invention is as follows:
the utility model provides a PECVD transfer device, includes the base and sets up a frame on the base, still including setting up a transfer chain and No. two transfer chains on a frame side by side, set up a change intercept mechanism that corresponds with a transfer chain and No. two change intercept mechanisms that correspond with No. two transfer chains on a frame, set up a carrier slip table mechanism that corresponds with a transfer chain and No. two carrier slip table mechanisms that correspond with No. two transfer chains on the base, still be provided with No. two frames on the base, a carrier slip table and No. two carrier slip tables all are located No. two frame below, be provided with the arm on No. two frames, no. one transfer chain and No. two transfer chains are about the arm symmetry, the arm is used for switching the silicon chip between a change intercept mechanism and No. one carrier slip table mechanism and No. two carrier slip table mechanisms.
Further is: the first intercept changing mechanism and the second intercept changing mechanism are the same, the first conveying line and the second conveying line are the same in structure, the first conveying line comprises a first line A and a first line B which are arranged in parallel, the first intercept changing mechanism comprises an intercept changing component A and an intercept changing component B which are symmetrically arranged, the variable intercept component A comprises a first linear module arranged on a first frame along the Z direction, a first plate arranged at the output end of the first linear module, a first linear guide rail arranged on the first plate, clamping plates which are arranged at two ends of the first guide rail in a sliding manner and are symmetrical to each other, lifting columns arranged at one side opposite to the clamping plates, and a driving piece fixedly arranged on the first plate and used for driving the two clamping plates to move relatively or move back to back.
Further is: the first carrier sliding table mechanism comprises a second linear guide rail arranged on the base along the X direction, a sliding plate arranged on the second linear guide rail in a sliding manner, a second screw rod fixedly arranged on the base and used for driving the sliding plate to slide along the second linear guide rail, a third linear guide rail fixedly arranged on the sliding plate along the Y direction, a carrier plate arranged on the third linear guide rail in a sliding manner, a floating assembly arranged on the carrier plate, a graphite boat arranged on the floating assembly, a front clamping assembly, a rear clamping assembly and a left clamping assembly, wherein the front clamping assembly and the rear clamping assembly are arranged on the sliding plate and used for clamping the floating assembly.
Further is: the front-back clamping assembly comprises a front pushing part positioned at the front end of the sliding plate and a rear pushing part positioned at the rear end of the sliding plate, wherein the rear pushing part comprises a first vertical seat arranged on the sliding plate, a fourth linear guide arranged on the vertical seat along the Z direction, a lifting plate arranged on the fourth linear guide in a sliding manner, a first air cylinder fixedly arranged on the first vertical seat and used for driving the lifting plate to lift along the fourth linear guide, a second air cylinder arranged on the lifting plate along the X direction, a first connecting block fixedly arranged at the output end of the second air cylinder, and a plurality of first rolling shafts arranged on the first connecting block along the Z direction, and the front pushing part comprises a second vertical seat arranged on the sliding plate, a third air cylinder fixedly arranged on the second vertical seat, a second connecting block arranged at the output end of the third air cylinder, and a plurality of second rolling shafts arranged on the second connecting block.
Further is: the left clamping assembly and the right clamping assembly comprise a positioning piece positioned on one side of the sliding plate and a clamping pushing piece positioned on the other side of the sliding plate, wherein the clamping pushing piece comprises a fifth vertical seat arranged on the sliding plate, a fifth linear guide rail arranged on the fifth vertical seat along the Y direction, a pushing frame arranged on the fifth linear guide rail in a sliding manner and a fifth air cylinder fixedly arranged on the fifth vertical seat and used for driving the pushing frame to move along the fifth linear guide rail.
The PECVD transfer method comprises a PECVD transfer device, a first carrier sliding table mechanism conveys a silicon wafer to a position where the first carrier sliding table mechanism is in butt joint with a mechanical arm, a second carrier sliding table mechanism conveys the silicon wafer to a position where the second carrier sliding table mechanism is in butt joint with the mechanical arm, then the mechanical arm transfers the silicon wafer in the first carrier sliding table mechanism to a first intercept changing mechanism, the silicon wafer in the second carrier sliding table mechanism is transferred to a second intercept changing mechanism, then a first conveying line receives the silicon wafer in the first intercept changing mechanism, and a second conveying line receives the silicon wafer in the second intercept changing mechanism; or, the first carrier sliding table mechanism moves to a position convenient for receiving the silicon wafer in the mechanical arm, the second carrier sliding table mechanism moves to a position convenient for receiving the silicon wafer in the mechanical arm, meanwhile, the first intercept changing mechanism receives the silicon wafer in the first conveying line, the second intercept changing mechanism receives the silicon wafer in the second conveying line, then the mechanical arm transfers the silicon wafer in the first intercept changing mechanism to the first carrier sliding table mechanism, and the mechanical arm transfers the silicon wafer in the second intercept changing mechanism to the second carrier sliding table mechanism.
The invention has the beneficial effects that: the mechanical arm is arranged on the second frame, the distance between the first carrier sliding table and the second carrier sliding table is shortened, the occupied area is smaller, the height of the mechanical arm is improved, the path of the mechanical arm for transferring the silicon wafer is shortened, and the working efficiency can be effectively improved.
Drawings
Fig. 1 is an overall schematic diagram of a PECVD transport apparatus according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a first-order intercept changing mechanism of a PECVD transport device according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a first carrier sliding table mechanism of a PECVD transport device according to an embodiment of the present disclosure.
Fig. 4 is a schematic view of a back pusher shoe of a PECVD transport apparatus according to an embodiment of the present disclosure.
Fig. 5 is a schematic diagram of a clamping and pushing member of a PECVD transport device according to an embodiment of the present application.
Fig. 6 is a schematic diagram of a front pusher shoe of a PECVD transport apparatus according to an embodiment of the present disclosure.
Marked in the figure as: 1. a base; 2. a first frame; 3. a first conveying line; 4. a second conveying line; 5. a first variable intercept mechanism; 6. a second variable intercept mechanism; 7. a first carrier sliding table mechanism; 8. a second carrier sliding table mechanism; 9. a second frame; 10. a mechanical arm; 31. line one A; 32. line one B; 51. a variable intercept component A; 52. a variable intercept component B; 511. a first straight line module; 512. a first plate; 513. a first linear guide rail; 514. a clamping plate; 515. a lifting column; 516. a driving member; 72. a slide plate; 73. a second screw rod; 74. a third linear guide rail; 75. a carrier plate; 76. a floating assembly; 77. a graphite boat; 781. a front pusher shoe; 782. a rear pusher shoe; 7821. a first vertical seat; 7822. a fourth linear guide rail; 7823. a lifting plate; 7824. a first air cylinder; 7825. a second cylinder; 7826. a first connecting block; 7827. a first rolling shaft; 7811. a second vertical seat; 7812. a third cylinder; 7813. a second connecting block; 7814. a second roller; 791. a positioning piece; 792. a clamping pushing piece; 7921. a fifth vertical seat; 7922. a fifth linear guide rail; 7923. a pushing frame; 7924. a fifth cylinder; 001. and (3) a silicon wafer.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings.
As shown in fig. 1, the PECVD transferring device provided by the embodiment of the application includes a base 1 and a first frame 2 disposed on the base 1, and further includes a first conveying line 3 and a second conveying line 4 disposed on the first frame 2 in parallel, a first intercept changing mechanism 5 disposed on the first frame 2 and corresponding to the first conveying line 3, a second intercept changing mechanism 6 disposed on the base 1 and corresponding to the second conveying line 4, a first carrier sliding table mechanism 7 disposed on the base 1 and corresponding to the first conveying line 3, and a second carrier sliding table mechanism 8 disposed on the base 1, a second frame 9 disposed on the base 1, wherein the first carrier sliding table and the second carrier sliding table are disposed below the second frame 9, a mechanical arm 10 is disposed on the second frame 9, the first conveying line 3 and the second conveying line 4 are symmetrical with respect to the mechanical arm 10, and the mechanical arm 10 is used for switching a silicon wafer 001 between the first intercept changing mechanism 5 and the second carrier sliding table mechanism 7 and between the second carrier sliding table mechanism 6 and the second carrier sliding table mechanism 8.
In actual use, after the first carrier sliding table mechanism 7 and the second carrier sliding table mechanism 8 move in the X direction, the mechanical arm 10 transfers the silicon wafer 001 between the first carrier sliding table mechanism 7 and the first intercept changing mechanism 5, and transfers the silicon wafer 001 between the second carrier sliding table mechanism 8 and the second intercept changing mechanism 6.
In the design, the mechanical arm 10 is arranged on the second frame 9, the distance between the first carrier sliding table 7 and the second carrier sliding table 8 is shortened, the occupied area is smaller, the height of the mechanical arm 10 is increased, the path of the mechanical arm 10 for transferring the silicon wafer 001 is shortened, and the working efficiency can be effectively improved.
Specifically: as shown in fig. 1 and fig. 2, the first intercept changing mechanism 5 and the second intercept changing mechanism 6 are the same, the first conveying line 3 and the second conveying line 4 are the same in structure, the first conveying line 3 includes a first line a31 and a first line B32 which are arranged in parallel, the first intercept changing mechanism 5 includes a symmetrical intercept changing component a51 and an intercept changing component B52, the intercept changing component a51 includes a first linear module 511 arranged on the first frame 2 along the Z direction, a first plate 512 arranged at the output end of the first linear module 511, a first linear guide rail 513 arranged on the first plate 512, clamping plates 514 which are arranged at two ends of the first guide rail and are symmetrical to each other in a sliding manner, lifting columns 515 arranged at opposite sides of the clamping plates 514, and a driving member 516 fixedly arranged on the first plate 512 and used for driving the two clamping plates 514 to move relatively or move reversely.
In actual use, the silicon wafer 001 is provided to the first conveying line 3 or received in the first conveying line 3 through the first intercept changing mechanism 5, and the silicon wafer 001 is provided to the second conveying line 4 or received in the second conveying line 4 through the second intercept changing mechanism 6. The working principle of the first intercept changing mechanism 5 is the same as that of the second intercept changing mechanism 6, and the working principle of the first intercept changing mechanism 5 is as follows: the first plate 512 is driven to lift by the first linear module 511, and the two clamping plates 514 are driven to move relatively or reversely by the driving piece 516, so that the corresponding lifting column 515 is convenient for placing the silicon wafer 001, and the first plate 512 is driven to lift by the first linear module 511 in the process of transferring the silicon wafer 001, so that the first plate 512 lifts and lifts, and the silicon wafer 001 to be transferred corresponds to the corresponding lifting column 515.
In the above design, the structural design and the specific embodiment of the first-size intercept changing mechanism 5 and the second-size intercept changing mechanism 6 can effectively center and transfer the silicon wafer 001.
Specifically: as shown in fig. 3, the first carrier sliding table mechanism 7 includes a second linear guide rail disposed on the base 1 along the X direction, a slide plate 72 slidably disposed on the second linear guide rail, a second screw rod 73 fixedly disposed on the base 1 for driving the slide plate 72 to slide along the second linear guide rail, a third linear guide rail 74 fixedly disposed on the slide plate 72 along the Y direction, a carrier plate 75 slidably disposed on the third linear guide rail 74, a floating assembly 76 disposed on the carrier plate 75, a graphite boat 77 disposed on the floating assembly 76, a front and rear clamping assembly and a left and right clamping assembly disposed on the slide plate 72 for clamping the floating assembly 76.
In actual use, graphite boat 77 is placed on slide plate 72, front and back clamping assembly clamps graphite boat 77 back and forth, left and right clamping assembly is used for clamping graphite boat 77 left and right, and second screw rod 73 drives slide plate 72 to move along second linear guide rail, so that slide plate 72 moves along X direction, and graphite boat 77 is moved to a position convenient for transferring silicon wafer 001 or receiving silicon wafer 001.
In the above design, the structural design of the first carrier sliding table mechanism 7 can effectively position the graphite boat 77 and ensure that the graphite boat 77 can accurately move to a proper position so as to be convenient for receiving the silicon wafer 001 or transferring the silicon wafer 001.
Specifically: as shown in fig. 3, 4 and 6, the front and rear clamping assembly includes a front pusher 781 located at the front end of the slide plate 72 and a rear pusher 782 located at the rear end of the slide plate 72, the rear pusher 782 includes a first upright 7811 provided on the slide plate 72, a fourth linear guide 7822 provided on the upright in the Z direction, a lifting plate 7813 provided on the fourth linear guide 7822 in a sliding manner, a first cylinder 7824 fixedly provided on the first upright 7821 for driving the lifting plate 7823 to lift along the fourth linear guide 7822, a second cylinder 7825 provided on the lifting plate 7823 in the X direction, a first connecting block 7826 fixedly provided at the output end of the second cylinder 7825, and a plurality of rollers 7827 provided on the first connecting block 7816 in the Z direction, and the front pusher 781 includes a second upright 7811 provided on the slide plate 72, a third cylinder 7812 fixedly provided on the second upright 7811, a second roller 7813 provided on the second connecting block 7813, and a plurality of rollers 7813 provided on the second connecting block 7813.
In actual use, front pusher shoe 781 and rear pusher shoe 782 act on the front side and rear side of graphite boat 77, respectively, and rear pusher shoe 782 acts as follows: the first cylinder 7824 drives the lifting plate 7823 to lift to a position where the first roller 7827 is in contact with the graphite boat 77, and then the second cylinder 7825 drives the first connecting block 7826 to move toward the side of the graphite boat 77 so that the first roller 7827 abuts against the graphite boat 77. The front pusher shoe 781 acts as follows: the third cylinder 7812 drives the second connection block 7813 to move toward the front side of the graphite boat 77 so that the second roller 7814 contacts the graphite boat 77.
In the above design, the structural design of the front pusher shoe 781 and the rear pusher shoe 782 can facilitate the front-back clamping of the graphite boat 77, and the structural design of the first roller 7827 and the second roller 7814 can facilitate the left-right clamping assembly to adjust the left-right position of the graphite boat 77 in the process of clamping the graphite boat 77 front-back.
Specifically: as shown in fig. 3 and 5, the left and right clamping assemblies include a positioning member 791 located at one side of the sliding plate 72 and a clamping pushing member 792 located at the other side of the sliding plate 72, and the clamping pushing member 792 includes a No. five stand 7921 provided on the sliding plate 72, a No. five linear rail 7922 provided on the No. five stand 7921 along the Y direction, a pushing rack 7923 slidably provided on the No. five linear rail 7922, and a No. five air cylinder 7924 fixedly provided on the No. five stand 7921 for driving the pushing rack 7923 to move along the No. five linear rail 7922.
In actual use, the clip pusher 792 acts: the pushing frame 7923 is driven to move to one side of the positioning piece 791 along the No. five linear guide rail 7922 by the No. five air cylinder 7924, so that two sides of the graphite boat 77 respectively abut against the pushing frame 7923 and the positioning piece 791.
In the above design, the structural design of the left and right clamping assemblies facilitates left and right clamping of graphite boat 77.
A PECVD transfer method comprises a PECVD transfer device, a first carrier sliding table mechanism 7 conveys a silicon wafer 001 to a position in butt joint with a mechanical arm 10, a second carrier sliding table mechanism 8 conveys the silicon wafer 001 to a position in butt joint with the mechanical arm 10, then the mechanical arm 10 transfers the silicon wafer 001 in the first carrier sliding table mechanism 7 to a first intercept changing mechanism 5, the silicon wafer 001 in the second carrier sliding table mechanism 8 to a second intercept changing mechanism 6, then a first conveying line 3 receives the silicon wafer 001 in the first intercept changing mechanism 5, and a second conveying line 4 receives the silicon wafer 001 in the second intercept changing mechanism 6. Or, the first carrier sliding table mechanism 7 is moved to a position convenient for receiving the silicon wafer 001 in the mechanical arm 10, the second carrier sliding table mechanism 8 is moved to a position convenient for receiving the silicon wafer 001 in the mechanical arm 10, meanwhile, the first intercept changing mechanism 5 receives the silicon wafer 001 in the first conveying line 3, the second intercept changing mechanism 6 receives the silicon wafer 001 in the second conveying line 4, then the mechanical arm 10 transfers the silicon wafer 001 in the first intercept changing mechanism 5 to the first carrier sliding table mechanism 7, and the mechanical arm 10 transfers the silicon wafer 001 in the second intercept changing mechanism 6 to the second carrier sliding table mechanism 8.
It should be understood that the foregoing description is only illustrative of the present invention and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Claims (6)

1. The utility model provides a PECVD transfer device, includes base (1) and sets up frame (2) on base (1), its characterized in that: still including setting up transfer chain (3) and No. two transfer chain (4) on a frame (2) side by side, set up on a frame (2) with a No. one become intercept mechanism (5) that transfer chain (3) corresponds and with No. two second become intercept mechanism (6) that transfer chain (4) corresponds, set up on base (1) with a carrier slip table mechanism (7) that transfer chain (3) corresponds and with No. two carrier slip table mechanism (8) that transfer chain (4) corresponds, still be provided with No. two frame (9) on base (1), no. one carrier slip table and No. two carrier slip tables all are located No. two frame (9) below, no. two be provided with arm (10) on frame (9), no. one transfer chain (3) and No. two transfer chain (4) are symmetrical about arm (10), arm (10) are used for changing silicon chip (001) between No. one intercept mechanism (5) and No. one carrier slip table mechanism (7) and No. two carrier slip tables mechanism (8) and No. two carrier slip tables (8) change mechanism between No. 8.
2. The PECVD transport apparatus according to claim 1, wherein: the utility model discloses a variable intercept mechanism, including a frame (2), a conveyor line (3), a conveyor line (4), a variable intercept mechanism (5), a variable intercept mechanism (6) are the same, a conveyor line (3) is the same with No. two conveyor lines (4) structures, a conveyor line (3) is including a line A (31) and a line B (32) that set up side by side, a variable intercept subassembly A (51) and a variable intercept subassembly B (52) that variable intercept mechanism (5) set up including the symmetry, variable intercept subassembly A (51) include along Z direction set up on a frame (2) a straight line module (511), set up a panel (512) of a straight line module (511) output, set up a linear guide rail (513) on a panel (512), slide set up splint (514) at a guide rail both ends and mutual symmetry, set up lift post (515) on a panel (512) opposite side be used for driving two splint (514) relative motion or back of the body of the back of the body.
3. The PECVD transport apparatus according to claim 1, wherein: the first carrier sliding table mechanism (7) comprises a second linear guide rail arranged on the base (1) along the X direction, a sliding plate (72) arranged on the second linear guide rail in a sliding manner, a second screw rod (73) fixedly arranged on the base (1) and used for driving the sliding plate (72) to slide along the second linear guide rail, a third linear guide rail (74) fixedly arranged on the sliding plate (72) along the Y direction, a carrier plate (75) arranged on the third linear guide rail (74) in a sliding manner, a floating assembly (76) arranged on the carrier plate (75), a graphite boat (77) arranged on the floating assembly (76), a front-back clamping assembly and a left-right clamping assembly which are arranged on the sliding plate (72) and used for clamping the floating assembly (76).
4. A PECVD transport apparatus according to claim 3, wherein: the front-back clamping assembly comprises a front pushing part (781) positioned at the front end of a sliding plate (72) and a back pushing part (782) positioned at the rear end of the sliding plate (72), wherein the back pushing part (782) comprises a first vertical seat (7811) arranged on the sliding plate (72), a fourth linear guide rail (7822) arranged on the vertical seat along the Z direction, a lifting plate (7823) arranged on the fourth linear guide rail (7822) in a sliding manner, a first cylinder (7824) fixedly arranged on the first vertical seat (7821) and used for driving the lifting plate (7823) to lift along the fourth linear guide rail (7822), a second cylinder (7815) arranged on the lifting plate (7813) along the X direction, a first connecting block (7816) fixedly arranged at the output end of the second cylinder (7815) and a plurality of first rollers (7827) arranged on the first connecting block (7816) along the Z direction, and the front pushing part (781) comprises a second vertical seat (7811) arranged on the sliding plate (72), a first roller (7813) fixedly arranged on the second vertical seat (7811) and a plurality of rollers (7813) fixedly arranged on the second vertical seat (7816) and a plurality of rollers (7816) arranged on the second connecting block (7816).
5. The PECVD transport apparatus according to claim 4, wherein: the left clamping assembly and the right clamping assembly comprise a positioning piece (791) positioned on one side of a sliding plate (72) and a clamping pushing piece (792) positioned on the other side of the sliding plate (72), wherein the clamping pushing piece (792) comprises a fifth vertical seat (7921) arranged on the sliding plate (72), a fifth linear guide rail (7922) arranged on the fifth vertical seat (7921) along the Y direction, a pushing frame (7923) arranged on the fifth linear guide rail (7922) in a sliding manner, and a fifth air cylinder (7924) fixedly arranged on the fifth vertical seat (7921) and used for driving the pushing frame (7923) to move along the fifth linear guide rail (7922).
6. A PECVD transport method comprising the PECVD transport apparatus of claim 5, wherein: the first carrier sliding table mechanism (7) conveys the silicon wafer (001) to a position in butt joint with the mechanical arm (10), the second carrier sliding table mechanism (8) conveys the silicon wafer (001) to a position in butt joint with the mechanical arm (10), then the mechanical arm (10) transfers the silicon wafer (001) in the first carrier sliding table mechanism (7) to the first intercept changing mechanism (5), the silicon wafer (001) in the second carrier sliding table mechanism (8) is transferred to the second intercept changing mechanism (6), then the first conveying line (3) receives the silicon wafer (001) in the first intercept changing mechanism (5), and the second conveying line (4) receives the silicon wafer (001) in the second intercept changing mechanism (6); or, the first carrier sliding table mechanism (7) moves to a position convenient for receiving the silicon wafer (001) in the mechanical arm (10), the second carrier sliding table mechanism (8) moves to a position convenient for receiving the silicon wafer (001) in the mechanical arm (10), meanwhile, the first intercept changing mechanism (5) receives the silicon wafer (001) in the first conveying line (3), the second intercept changing mechanism (6) receives the silicon wafer (001) in the second conveying line (4), then the mechanical arm (10) transfers the silicon wafer (001) in the first intercept changing mechanism (5) to the first carrier sliding table mechanism (7), and the mechanical arm (10) transfers the silicon wafer (001) in the second intercept changing mechanism (6) to the second carrier sliding table mechanism (8).
CN202310776794.XA 2023-06-29 2023-06-29 PECVD transfer device and transfer method Active CN116504696B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185736A (en) * 2015-08-20 2015-12-23 东莞市启天自动化设备有限公司 Full-automatic railboat feeding and blanking machine
CN105374730A (en) * 2015-10-23 2016-03-02 河北晶龙阳光设备有限公司 Mechanical arm for transferring solar cell piece basket and double-head transfer device for transferring solar cell piece basket
CN107039324A (en) * 2017-04-14 2017-08-11 东莞市启天自动化设备股份有限公司 A kind of Full-automatic tube-type PECVD charging ＆ discharging machines and method
CN107887314A (en) * 2017-11-07 2018-04-06 河北晶龙阳光设备有限公司 A kind of silicon chip transhipment loading attachment and the silicon chip transhipment stowage based on it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185736A (en) * 2015-08-20 2015-12-23 东莞市启天自动化设备有限公司 Full-automatic railboat feeding and blanking machine
CN105374730A (en) * 2015-10-23 2016-03-02 河北晶龙阳光设备有限公司 Mechanical arm for transferring solar cell piece basket and double-head transfer device for transferring solar cell piece basket
CN107039324A (en) * 2017-04-14 2017-08-11 东莞市启天自动化设备股份有限公司 A kind of Full-automatic tube-type PECVD charging ＆ discharging machines and method
CN107887314A (en) * 2017-11-07 2018-04-06 河北晶龙阳光设备有限公司 A kind of silicon chip transhipment loading attachment and the silicon chip transhipment stowage based on it

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