CN116489942A

CN116489942A - Heat dissipating device and electronic equipment

Info

Publication number: CN116489942A
Application number: CN202310304451.3A
Authority: CN
Inventors: 孙永富
Original assignee: XFusion Digital Technologies Co Ltd
Current assignee: XFusion Digital Technologies Co Ltd
Priority date: 2023-03-25
Filing date: 2023-03-25
Publication date: 2023-07-25

Abstract

The application provides a heat abstractor and electronic equipment for improve the radiating efficiency of electronic device, improve electronic equipment's reliability in use. The main heat spreader has a first surface for contacting the electronic device, a second surface disposed opposite the first surface, and at least one side between the first surface and the second surface. In the main radiator, a first radiating cavity is arranged in the first shell, and the first capillary structure is arranged on the cavity wall surface of the first radiating cavity. At least one secondary radiator is located on a side of the primary radiator adjacent to the second surface, and at least one secondary radiator is located on a side of the primary radiator adjacent to the side surface. In each pair of radiators, the second shell is connected with the first shell, a second radiating cavity is arranged in the second shell, the second radiating cavity is communicated with the first radiating cavity, and the second capillary structure is arranged on the cavity wall surface of the second radiating cavity and is connected with the first capillary structure in a guiding way. The cooling working medium is positioned in the first heat dissipation cavity and/or the second heat dissipation cavity.

Description

Heat dissipating device and electronic equipment

Technical Field

The application relates to the technical field of heat dissipation, in particular to a heat dissipation device and electronic equipment.

Background

Along with the continuous development of electronic equipment such as a server, the power of electronic devices in the electronic equipment is continuously increased, the packaging integration level of the electronic devices is continuously improved, the heat flux density of the electronic devices is continuously increased, the existing heat dissipation device cannot meet the heat dissipation requirement of the electronic devices, the electronic devices cannot work normally, and the use reliability of the electronic equipment is affected.

Disclosure of Invention

The embodiment of the application provides a heat abstractor and electronic equipment for improve the radiating efficiency to electronic device, guarantee that electronic device can normally work, improve electronic equipment's reliability in use.

In a first aspect, the present application provides a heat dissipating device for dissipating heat from an electronic device. The heat dissipation device comprises a main heat radiator, at least two auxiliary heat radiators and a cooling working medium.

The main radiator is provided with a first surface, a second surface and at least one side surface, the first surface is used for contacting an electronic device, the second surface is opposite to the first surface, at least one side surface is positioned between the first surface and the second surface, the main radiator comprises a first shell and a first capillary structure, a first radiating cavity is arranged in the first shell, and the first capillary structure is arranged on the cavity wall surface of the first radiating cavity;

The at least two auxiliary radiators comprise at least one first auxiliary radiator and at least one second auxiliary radiator, the first auxiliary radiator is positioned on one side, close to the second surface, of the main radiator, the second auxiliary radiator is positioned on one side, close to the side, of the main radiator, each auxiliary radiator comprises a second shell and a second capillary structure, the second shell is connected with the first shell, a second radiating cavity is arranged in the second shell, the second radiating cavity is communicated with the first radiating cavity, and the second capillary structure is arranged on the cavity wall surface of the second radiating cavity and is connected with the first capillary structure in a conducting mode;

the cooling medium is located in the first heat dissipation cavity and/or the second heat dissipation cavity.

When the heat dissipation device is used for dissipating heat of the electronic device positioned on one side, close to the first surface, of the main radiator, heat of the electronic device can be transmitted to one side, close to the second surface, of the main radiator and one side, close to the side, of the main radiator, and heat is dissipated by the aid of the at least two auxiliary radiators, heat dissipation area of the heat dissipation device is expanded, temperature uniformity heat dissipation capacity of the heat dissipation device is improved, heat dissipation efficiency of the heat dissipation device to the electronic device is improved, normal work of the electronic device is guaranteed, and use reliability of electronic equipment is improved.

In one possible implementation manner, the heat dissipating device further includes at least one heat dissipating fin, and the heat dissipating fin is sleeved on at least one auxiliary heat sink, so as to increase the heat dissipating area of the heat dissipating device, and help to improve the heat dissipating efficiency of the heat dissipating device on the electronic device.

In a possible embodiment, the heat dissipating device further comprises a heat conducting plate, the heat conducting plate being located at a side of the main heat sink close to the side face;

at least two second auxiliary radiators comprise at least one third auxiliary radiator and at least one fourth auxiliary radiator;

the heat dissipation fins are at least two and comprise at least one first heat dissipation fin and at least one second heat dissipation fin, the first heat dissipation fins are sleeved on the third auxiliary heat radiator and are abutted to the heat conduction plate, and the heat dissipation fins are sleeved on the fourth auxiliary heat radiator and are abutted to the heat conduction plate. The heat-conducting plate is added to increase the heat-radiating area of the heat-radiating device, so that the heat-radiating efficiency of the heat-radiating device to the electronic device is improved, and the heat-radiating effect among different auxiliary heat radiators can be balanced.

In one possible implementation manner, each of the second auxiliary heat sinks includes a free end far away from the main heat sink, and the heat dissipation fins can be sleeved on the free ends of the second auxiliary heat sinks so as to facilitate installation.

In a possible embodiment, the third and fourth sub-heat sinks are located on both sides of the heat conductive plate, respectively, in a thickness direction of the heat conductive plate.

In a possible embodiment, the first housing includes an upper housing and a lower housing, the upper housing and the lower housing being fixedly connected to each other;

the first auxiliary radiator is mounted on the upper shell, and the second auxiliary radiator is clamped between the upper shell and the lower shell.

In a possible embodiment, the upper housing is provided with a communication hole, and the communication hole penetrates through the upper housing along the thickness direction of the upper housing and is communicated with the first heat dissipation cavity;

in the first auxiliary radiator, the second shell is mounted on the upper shell and covers the communication hole, and the second radiating cavity is communicated with the communication hole.

In a possible implementation manner, in the first auxiliary radiator, the second housing includes a mounting end portion facing the main radiator, the mounting end portion is fixedly connected to the upper housing, and along a direction from the second surface to the first surface, a diameter of the mounting end portion is gradually increased, so as to increase a welding area between the mounting end portion and the upper housing, and improve connection stability between the mounting end portion and the upper housing.

In one possible implementation manner, the heat dissipating device further includes a first fixing ring, and the first fixing ring is sleeved on the second housing of the first auxiliary heat sink and is fixedly connected with the second housing and the upper housing of the first auxiliary heat sink.

In a possible implementation manner, along the direction from the second surface to the first surface, the diameter of the first fixing ring is gradually increased, so that the welding area between the first fixing ring and the upper shell is increased, the connection stability between the first fixing ring and the upper shell is improved, and the assembly stability between the second shell and the upper shell is further improved.

In a possible implementation manner, the heat dissipating device further includes a second fixing ring, where the second fixing ring is sleeved on the second housing of the second auxiliary heat sink and is fixedly connected with the second housing, the upper housing and the lower housing of the second auxiliary heat sink, so as to improve the assembly stability between the second housing and the first housing.

In a possible embodiment, at least two of the side surfaces include a third surface and a fourth surface, the third surface and the fourth surface being disposed opposite each other;

The second auxiliary heat sinks are at least two, at least one of the second auxiliary heat sinks is located on one side, close to the third surface, of the main heat sink, and at least one of the second auxiliary heat sinks is located on one side, close to the fourth surface, of the main heat sink.

When the heat dissipation device is used for dissipating heat of the electronic device positioned on one side, close to the first surface, of the main radiator, the main radiator can be used for dissipating heat of the electronic device, heat of the electronic device can be transmitted to one side, close to the second surface, of the main radiator, one side, close to the third surface, of the main radiator and one side, close to the fourth surface, of the main radiator, heat is dissipated by utilizing at least three auxiliary radiators, the heat dissipation area of the heat dissipation device is expanded, the temperature uniformity heat dissipation capacity of the heat dissipation device is improved, the heat dissipation efficiency of the heat dissipation device to the electronic device is improved, the electronic device can work normally, and the use reliability of electronic equipment is improved.

In a possible implementation manner, the main radiator is a temperature equalizing plate, and/or the auxiliary radiator is a heat pipe.

In a second aspect, the present application provides an electronic device, including an electronic component and a heat dissipating device according to any one of the above, where the electronic component is located on a side of the main heat sink close to the first surface and is in contact with the main heat sink.

In the electronic equipment shown in the application, when the heat dissipation device dissipates heat to the electronic device positioned on one side of the main radiator close to the first surface, the main radiator can be used for dissipating heat to the electronic device, heat of the electronic device can be transmitted to one side of the main radiator close to the second surface and one side of the main radiator close to the side face, and at least two auxiliary radiators are used for dissipating heat, so that the heat dissipation area of the heat dissipation device is expanded, the uniform temperature heat dissipation capacity of the heat dissipation device is improved, the heat dissipation efficiency of the heat dissipation device to the electronic device is further improved, normal work of the electronic device is guaranteed, and the use reliability of the electronic equipment is improved.

Drawings

In order to more clearly describe the technical solutions of the embodiments of the present application, the following description will describe the drawings that are required to be used in the embodiments of the present application.

Fig. 1 is a schematic structural diagram of a first electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic view of a partial structure of the electronic device shown in FIG. 1;

FIG. 3 is a schematic cycle diagram of the cooling medium in the heat dissipating device when the electronic device generates heat, taking the second auxiliary heat sink located on the third surface as an example in the electronic device shown in FIG. 2;

FIG. 4 is a schematic diagram of a heat dissipating device in the electronic device shown in FIG. 2 in an embodiment;

FIG. 5 is an exploded view of the heat sink of FIG. 4;

fig. 6 is a schematic partial structure of a second electronic device according to an embodiment of the present application;

fig. 7 is a schematic cycle diagram of the cooling medium in the heat dissipating device when the electronic device generates heat, taking the example that the second auxiliary radiator is located on the third surface and the fifth auxiliary radiator is located on the fourth surface in the electronic device shown in fig. 6.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a first electronic device 100 according to an embodiment of the present application.

The embodiment of the application provides an electronic device 100, where the electronic device 100 may be a computer, a router, a switch, a server, or other computing devices that need to perform information processing. Next, an example of the electronic device 100 will be described. By way of example, electronic device 100 may be a general purpose server of 2U (Unite) or more. Where "U" is a unit representing the external size of the server. Illustratively, 1U is 4.445cm.

The electronic apparatus 100 includes a housing 110, a circuit board 120, an electronic device 130, and a heat sink 140, and the circuit board 120, the electronic device 130, and the heat sink 140 are mounted on an inner side of the housing 110. The electronic device 130 is mounted on the circuit board 120, and the heat dissipation device 140 is located on a side of the electronic device 130 away from the circuit board 120 and is used for dissipating heat of the electronic device 130. Wherein there are two electronic devices 130 and heat sinks 140. The two electronic devices 130 are disposed at intervals, and the two heat dissipation devices 140 respectively dissipate heat of the two electronic devices 130. By way of example, the electronic device 130 may be a high power heat generating device such as a graphics processing unit (graphic processing unit, GPU) or a central processing unit (central processing unit, CPU).

In other embodiments, the electronic device 130 and the heat dissipation device 140 may be one or more than three, and/or the heat dissipation device 140 may also dissipate heat from one or more than two electronic devices 130, which is not limited in particular in the embodiments of the present application.

It should be understood that references to "and/or" in the examples of the present application are intended to mean both "and" or "cases. For example, a and/or B includes three cases where a only exists, B only exists, and a and B exist simultaneously, and the description of "and/or" will be understood identically hereinafter.

Referring to fig. 2, fig. 2 is a schematic diagram of a partial structure of the electronic device 100 shown in fig. 1. Of which fig. 2 shows only the circuit board 120, one electronic device 130, and one heat sink 140.

The heat sink 140 includes a primary heat sink 10, at least two secondary heat sinks 20, a cooling medium (not shown), and at least one heat radiating fin 30. The main heat sink 10 has a first surface 11a, a second surface 11b and at least one side. The first surface 11a and the second surface 11b are disposed opposite to each other. The first surface 11a is proximate to the electronic device and is for contacting the electronic device 130. The second surface 11b is disposed opposite to the first surface 11a, and is adjacent to the sub-radiator 20, and is used for connecting the sub-radiator 20. In this embodiment, there are four sides, which are a third surface 11c, a fourth surface 11d, a fifth surface (not shown), and a sixth surface (not shown), respectively. The third surface 11c and the fourth surface 11d are disposed opposite to each other and connected between the first surface 11a and the second surface 11 b. The fifth surface and the sixth surface are disposed opposite to each other and are connected between the first surface 11a and the second surface 11b and between the third surface 11c and the fourth surface 11 d.

The main radiator 10 includes a first housing 11 and a first capillary structure 12, a first heat dissipation cavity 111 is disposed in the first housing 11, and the first capillary structure 12 is disposed on a cavity wall surface of the first heat dissipation cavity 111 and covers the cavity wall surface of the first heat dissipation cavity 111. Wherein, the portion of the first housing 11 near the electronic device 130 is used for contacting the electronic device 130, and the portion of the first housing 11 near the sub-heat sink 20 is used for connecting the sub-heat sink 20.

Illustratively, the first capillary structure 12 includes a first capillary portion 121, a second capillary portion 122, a third capillary portion 123, and a fourth capillary portion 124. The first capillary portion 121 is adjacent to the first surface 11a. The second capillary portion 122 is spaced apart from and opposite to the first capillary portion 121 and is adjacent to the second surface 11b. The third capillary portion 123 and the fourth capillary portion 124 are each guided between the first capillary portion 121 and the second capillary portion 122, and are disposed at intervals and opposite to each other. Wherein the third capillary portion 123 is adjacent to the third surface 11c and the fourth capillary portion 124 is adjacent to the fourth surface 11d.

It should be noted that, when describing the capillary structure in the embodiments of the present application, reference to "conductive connection" refers to "conducting and connecting". For example, the connection of A and B means that A is connected with B and is conducted with B. Wherein, the connecting position of A and B is functionally equivalent to the other positions of A and B, and can generate capillary effect.

At least two sub-radiators 20 are each connected with the main radiator 10. At least one sub-radiator 20 is located on a side of the main radiator 10 near the second surface 11b, and is connected to the second surface 11b. At least one sub-radiator 20 is located at a side of the main radiator 10 near the side face and is connected to the side face. For convenience of description, the sub-radiator on the side near the second surface 11b may be referred to as a first sub-radiator, and the sub-radiator on the side near the side may be referred to as a second sub-radiator. Wherein each sub-radiator 20 comprises a second housing 21 and a second capillary structure 22. The second housing 21 is connected to the first housing 11, and a second heat dissipation chamber 211 is provided in the second housing 21, and the second heat dissipation chamber 211 communicates with the first heat dissipation chamber 111. The second capillary structure 22 is disposed on the wall surface of the second heat dissipation cavity 211, covers the wall surface of the second heat dissipation cavity 211, and is connected to the first capillary structure 12. Illustratively, the first and second capillary structures 12, 22 may be joined by overlapping and then integrally sintering.

Illustratively, the first secondary heat sink 20a is located on a side of the primary heat sink 10 proximate to the second surface 11b and is attached to the second surface 11b. In the first sub-radiator 20a, the second housing 21 is connected to the second surface 11b, and the second capillary structure 22 is connected to the second capillary portion 122. The second sub-radiator 20b is located at a side of the main radiator 10 near the third surface 11c, and is connected to the third surface 11c. In the second sub-radiator 20b, the second housing 21 is connected to the third surface 11c, and the second capillary structure 22 is connected to the third capillary portion 123.

In other embodiments, the second auxiliary radiator 20b is located on a side of the main radiator 10 near the fourth surface 11d and is connected to the fourth surface 11d, or the second auxiliary radiator 20b is located on a side of the main radiator 10 near the fifth surface and is connected to the fifth surface, or the second auxiliary radiator 20b is located on a side of the main radiator 10 near the sixth surface and is connected to the sixth surface, which is not limited in this embodiment.

The cooling medium is located in the first heat dissipation chamber 111 and/or the second heat dissipation chamber 211. Wherein the cooling medium has a liquid state and a gaseous state. When the cooling working medium is in a liquid state, the cooling working medium can absorb heat and evaporate into gas so as to be in a gas state. When the cooling working medium is in a gas state, the cooling working medium can release heat for liquefaction so as to be in a liquid state.

At least one heat radiating fin 30 is sleeved on the auxiliary heat radiator 20. In this embodiment, there are at least two heat dissipation fins 30. The at least two heat radiating fins 30 include at least one first heat radiating fin 30a and at least one second heat radiating fin 30b. At least one first heat dissipating fin 30a is located on a side of the main heat sink 10 near the second surface 11b, and is sleeved on the second housing 21 of the first sub heat sink 20a, and contacts the second housing 21 of the first sub heat sink 20 a. At least one second heat dissipation fin 30 is located at a side of the main heat sink 10 near the side surface, and is sleeved on the second housing 21 of the second sub heat sink 20b, and is in contact with the second housing 21 of the second sub heat sink 20 b.

It should be noted that, in other embodiments, only one heat dissipating fin 30 may be provided, where the heat dissipating fin 30 is sleeved on the second housing 21 of the first auxiliary heat sink 20a and contacts with the second housing 21 of the first auxiliary heat sink 20a, or the heat dissipating fin 30 is sleeved on the second housing 21 of the second auxiliary heat sink 20b and contacts with the second housing 21 of the second auxiliary heat sink 20b, and the number of heat dissipating fins 30 is not limited in particular.

Referring to fig. 2 and fig. 3, fig. 3 is a schematic diagram illustrating a circulation of the cooling medium in the heat dissipating device 140 when the electronic device 130 generates heat, taking the second sub-heat sink 20b located on the third surface 11c as an example in the electronic device 100 shown in fig. 2. Wherein the arrow boxes represent the heat of the electronic device 130, the thin solid lines with arrows represent the flow paths of the vaporized cooling medium, and the thick solid lines with arrows represent the flow paths of the liquefied cooling medium.

The electronic device 130 is located on a side of the main heat spreader 10 near the first surface 11 a. When the electronic device 130 does not start to work, the temperatures of the first heat dissipation cavity 111 and the second heat dissipation cavity 211 are lower, and the cooling working medium is in a liquid state. When the electronic device 130 is in operation, heat generated by the electronic device 130 can enter the first heat dissipation cavity 111 through the first surface 11a, the cooling medium in a liquid state absorbs the heat and evaporates into gas, a high-temperature and high-pressure area is formed in the first heat dissipation cavity 111 near the first surface 11a, and the cooling medium in a gas state automatically flows to low-temperature and low-pressure areas in the first heat dissipation cavity 111 and the second heat dissipation cavity 211. The cooling working medium in a gas state mainly flows from a high-temperature high-pressure region to a low-temperature low-pressure region in three parts of a first part, a second part and a third part.

The cooling medium, the first part of which is in a gaseous state, flows from the high temperature and high pressure region to the low temperature and low pressure region (such as the region near the second surface 11b, the third surface 11c and the fourth surface 11 d) in the first heat dissipation chamber 111, and releases the heat to liquefy in the low temperature and low pressure region in the first heat dissipation chamber 111, and the liquefied cooling medium flows from the second capillary portion 122, the third capillary portion 123 and the fourth capillary portion 124 to the first capillary portion 121 by the capillary force of the first capillary structure 12 to form the heat circulation inside the main heat sink 10.

The second part of the cooling medium in a gaseous state flows from the high-temperature high-pressure region to the second heat dissipation chamber 211 of the first sub-radiator 20a through the first heat dissipation chamber 111, and releases the heat to liquefy in the second heat dissipation chamber 211 of the first sub-radiator 20 a. In the liquefied cooling medium, a part of the liquefied cooling medium flows from the second capillary structure 22, the second capillary portion 122, and the fourth capillary portion 124 of the first sub-radiator 20a to the first capillary portion 121, and the other part flows from the second capillary structure 22, and the third capillary portion 123 of the first sub-radiator 20a to the first capillary portion 121 by the capillary forces of the first capillary structure 12, the second capillary structure 22 of the first sub-radiator 20a, and the second capillary structure 22 of the second sub-radiator 20b to form a heat cycle inside the main radiator 10, the first sub-radiator 20a, and the second sub-radiator 20 b.

The third part of the cooling medium in a gaseous state flows from the high-temperature and high-pressure area to the second heat dissipation cavity 211 of the second auxiliary heat sink 20b through the first heat dissipation cavity 111, and the heat is released to liquefy in the second heat dissipation cavity 211 of the second auxiliary heat sink 20 b. The liquefied cooling medium flows from the second capillary structure 22 and the third capillary portion 123 of the second sub-radiator 20b to the first capillary portion 121 by the capillary force of the second capillary structure 22 of the first and second sub-radiators 12 and 20b to form a heat cycle inside the main radiator 10 and the second sub-radiator 20 b.

In this embodiment, when the heat dissipating device 140 dissipates heat of the electronic device 130 located on one side of the main heat sink 10 close to the first surface 11a, the heat dissipating device 10 can be used to dissipate heat of the electronic device 130, and heat of the electronic device 130 can be transferred to one side of the main heat sink 10 close to the second surface 11b and one side of the main heat sink 10 close to the side, and the first auxiliary heat sink 20a and the second auxiliary heat sink 20b are used to dissipate heat respectively, so that the heat dissipating area of the heat dissipating device 140 is expanded, the temperature-equalizing heat dissipating capability of the heat dissipating device 140 is improved, the heat dissipating efficiency of the heat dissipating device 140 to the electronic device 130 is further improved, the electronic device 130 can work normally, and the use reliability of the electronic apparatus 100 is improved. In addition, the heat dissipating device 140 further includes a heat dissipating fin 30, and the heat dissipating fin 30 can further increase the heat dissipating area of the heat dissipating device 140, thereby increasing the heat dissipating capability of the heat dissipating device 140.

Referring to fig. 4 and 5, fig. 4 is a schematic structural diagram of the heat sink 140 in the electronic device 100 shown in fig. 2 in an embodiment, and fig. 5 is an exploded structural diagram of the heat sink 140 shown in fig. 4.

In the present embodiment, the main radiator 10 is a vapor chamber (vapor chamber). The main radiator 10 is flat. The first housing 11 of the main radiator 10 is illustratively made of copper. In other embodiments, the first housing 11 of the main heat sink 10 may be made of other heat conductive materials with high thermal conductivity. The first housing 11 includes an upper housing 13 and a lower housing 14, and the upper housing 13 and the lower housing 14 are fixedly connected to each other and enclose a first heat dissipation chamber 111 (as shown in fig. 2). For example, the upper case 13 and the lower case 14 may be fixedly coupled to each other by a screw or a fixing member such as a screw.

The upper case 13 is provided with a plurality of communication holes 131, and the plurality of communication holes 131 are disposed at intervals from each other. Each communication hole 131 penetrates the upper case 13 in the thickness direction of the upper case 13 and communicates with the first heat dissipation chamber 111. Illustratively, the communication hole 131 is a circular hole. In other embodiments, the upper housing 13 may be provided with only one communication hole 131, and the number of communication holes 131 is not particularly limited in the embodiment of the present application.

The first sub-radiator 20a is a heat pipe (heat pipe). The second housing 21 of the first sub-radiator 20a is made of copper, for example. In other embodiments, the second housing 21 of the secondary heat sink 20 may be made of other thermally conductive materials with high thermal conductivity. The first auxiliary radiator 20a is in a long and straight strip shape, and the extending direction of the first auxiliary radiator 20a is perpendicular to the main radiator 10. It should be noted that, in the embodiments of the present application, the definitions of relative positional relationships such as vertical and the like are all defined with respect to the current state of the art, not strictly defined in a mathematical sense, and a small deviation is allowed, both approximately parallel and approximately vertical. For example, A is perpendicular to B, meaning that A is perpendicular or approximately perpendicular to B, and the included angle between A and B is between 80 degrees and 100 degrees.

In the present embodiment, there are a plurality of first sub-radiators 20a, and the plurality of first sub-radiators 20a are mounted on the upper case 13 at intervals. Specifically, the second housing 21 of each first sub-radiator 20a is mounted to the upper housing 13. The second heat dissipation chamber 211 of each first sub-heat sink 20a communicates with one communication hole 131. Illustratively, there are ten first sub-heat sinks 20 a.

The second housing 21 of each of the first sub-radiators 20a includes a mounting end portion (not shown) which is located at a side of the second housing 21 adjacent to the upper housing 13 and is fixedly connected to the upper housing 13 such that the second housing 21 is mounted to the upper housing 13. The mounting end is fixedly connected to the upper housing 13, illustratively by welding.

In one embodiment, the diameter of the mounting end portion gradually increases in the direction from the first sub-radiator 20a to the main radiator 10. In other words, the mounting end portion is horn-shaped to increase the welding area of the mounting end portion and the upper case 13, contributing to an improvement in the welding stability of the mounting end portion and the upper case 13. For example, during the assembly process of the heat dissipating device 140, after the mounting end portion of the first auxiliary heat sink 20a abuts against the upper housing 13 of the main heat sink 10, the mounting end portion may be welded and fixed to the upper housing 13 by means of copper paste or diffusion welding.

In another embodiment, the heat dissipating device 140 further includes a plurality of first fixing rings 40, and each of the first fixing rings 40 is sleeved on the mounting end portion of one of the first auxiliary heat sinks 20a and fixedly connected to the upper housing 13 and the mounting end portion. Illustratively, the first retaining ring 40 is made of copper, i.e., the first retaining ring 40 is a copper ring. The diameter of the first fixing ring 40 gradually increases in the direction of the first sub-radiator 20a toward the main radiator 10. In other words, the first fixing ring 40 is horn-shaped to increase the welding area between the first fixing ring 40 and the upper housing 13, which is helpful for improving the welding stability between the first fixing ring 40 and the upper housing 13, and further for improving the assembling stability between the mounting end and the upper housing 13. For example, in the assembly process of the heat sink 140, after the first fixing ring 40 is sleeved on the mounting end portion of the first auxiliary heat sink 20a, the first fixing ring may be welded and fixed to the mounting end portion and the upper housing 13 by means of the height Zhou Bohan.

In addition, the heat dissipating device 140 further includes a plurality of first conductive members (not shown), each of which is disposed through one of the communication holes 131 and is conductive between the first capillary structure 12 of the main heat sink 10 and the second capillary structure 22 of the first sub-heat sink 20a, so as to achieve conductive connection between the first capillary structure 12 of the main heat sink 10 and the second capillary structure 22 of the first sub-heat sink 20 a. The first conductive member may be a mesh (mesh) or a fiber (fiber) material.

The second sub-radiator 20b is a heat pipe. The second housing 21 of the second sub-radiator 20b is made of copper, for example. The second auxiliary radiator 20b is in a curved strip shape, and the second auxiliary radiator 20b is curved and extends from the main radiator 10 to a direction away from the main radiator 10. In the present embodiment, there are a plurality of second sub-heat sinks 20b, and the plurality of second sub-heat sinks 20b are sandwiched between the upper case 13 and the lower case 14, and are fixedly connected to the upper case 13 and the lower case 14, and are disposed at intervals. Specifically, the second housing 21 of each second sub-radiator 20b is sandwiched between the upper housing 13 and the lower housing 14, and is fixedly connected to both the upper housing 13 and the lower housing 14. Illustratively, the second sub-radiator 20b has four.

The second housing 21 of each second sub-radiator 20b includes a fixed end 213, a free end 214, and a connection end 215. The fixed end 213 is located at a side of the second housing 21 facing the first housing 11, and is clamped between the upper housing 13 and the lower housing 14, and is fixedly connected to both the upper housing 13 and the lower housing 14. The free end 214 is located on the side of the second housing 21 remote from the fixed end 213, and the connecting end 215 is connected between the fixed end 213 and the free end 214. Wherein the connecting end 215 is in a curved strip shape.

The fixed end 213 is fixedly connected to the upper and lower cases 13 and 14 by welding, for example. In addition, the heat dissipating device 140 further includes a plurality of second fixing rings (not shown), and each second fixing ring is sleeved on the fixing end 213 of one second auxiliary heat sink 20b and is fixedly connected to the fixing end 213, the upper housing 13 and the lower housing 14. Illustratively, the second securing ring is made of copper, i.e., the second securing ring is a copper ring. The diameter of the second fixing ring gradually increases in the direction of the second sub-radiator 20b toward the main radiator 10. In other words, the second fixing ring is horn-shaped to increase the welding area of the second fixing ring and the upper and lower cases 13 and 14, which helps to improve the welding stability of the second fixing ring and the upper and lower cases 13 and 14, and further helps to improve the assembly stability between the fixing end 213 and the upper and lower cases 13 and 14. For example, during the assembly process of the heat dissipating device 140, after the second fixing ring is sleeved on the fixing end 213 of the second auxiliary heat sink 20b, the second fixing ring may be welded and fixed to the fixing end 213, the upper housing 13 and the lower housing 14 by high Zhou Bohan or flame welding.

In the present embodiment, the heat radiating fins may include a plurality of first heat radiating fins 30a and a plurality of second heat radiating fins 30b. Each of the first heat dissipation fins 30a is provided with a plurality of first through holes 301a, the plurality of first through holes 301a are arranged at intervals, and each of the first through holes 301a penetrates through the first heat dissipation fin 30a along the thickness direction of the first heat dissipation fin 30a. Specifically, the plurality of first heat dissipation fins 30a are stacked on the second surface 11b and are sleeved on at least one first sub-radiator 20a. Wherein, each first sub-radiator 20a is disposed through the first through holes 301a of the plurality of first radiating fins 30a.

Each of the second heat dissipation fins 30b is provided with a second through hole 301b, and the second through hole 301b is located at the middle of the second heat dissipation fin 30b and penetrates the second heat dissipation fin 30b along the thickness direction of the second heat dissipation fin 30b. Specifically, the plurality of second heat dissipation fins 30b are stacked on the side surface and are sleeved on at least one second auxiliary heat sink 20b. Each of the second sub-heat sinks 20b is disposed through the second through holes 301b of the plurality of second heat dissipation fins 30b.

In some embodiments, the heat sink 140 further includes a heat conductive plate 50 and a plurality of second conductive connectors (not shown). The heat conductive plate 50 is located at a side of the main radiator 10 near the side. The heat conductive plate 50 may be a copper plate or a temperature equalizing plate, for example.

Each second conductive member is connected between the first capillary structure 12 of the main heat spreader 10 and the second capillary structure 22 of the second sub heat spreader 20b, so as to realize the conductive connection between the first capillary structure 12 of the main heat spreader 10 and the second capillary structure 22 of the second sub heat spreader 20 b. The second conductive member may be a mesh fabric (mesh) or a fiber (fiber) material.

At this time, there are at least two second sub-heat sinks 20b including at least one third sub-heat sink 21b and at least one fourth sub-heat sink 22b. The free end 214 of one third sub radiator 21b and the free end 214 of one fourth sub radiator 22b are spaced apart. Illustratively, the free end 214 of one third sub-radiator 21b and the free end 214 of one fourth sub-radiator 22b are parallel to each other.

Accordingly, the plurality of second heat radiating fins 30b may include at least one third heat radiating fin 31b and at least one fourth heat radiating fin 32b. The free ends 214 of the third heat dissipation fins 31b and the third auxiliary heat sink 21b are located on the same side of the heat conduction plate 50, and are sleeved on the free ends 214 of the third auxiliary heat sink 21b and are abutted against the surface of the heat conduction plate 50. The free ends 214 of the fourth heat radiation fins 32b and the fourth sub-heat radiator 22b are located on the same side of the heat conduction plate 50, and are fitted over the free ends 214 of the fourth sub-heat radiator 22b and contact the surface of the heat conduction plate 50. The free end 214 of the third sub-radiator 21b is inserted into the second through hole 301b of the third heat radiating fin 31b, and the free end 214 of the fourth sub-radiator 22b is inserted into the second through hole 301b of the fourth heat radiating fin 32b.

Illustratively, there are a plurality of third heat dissipating fins 31b and fourth heat dissipating fins 32 b. The plurality of third heat radiating fins 31b are sleeved on the free end 214 of one third auxiliary heat radiator 21b, and the plurality of fourth heat radiating fins 32b are sleeved on the free end 214 of one fourth auxiliary heat radiator 22 b.

It will be appreciated that the third and fourth sub-radiators 21b and 22b may be located on the same side or different sides of the heat conductive plate in the direction along the thickness of the heat conductive plate. The heat-conducting plate is added to increase the heat-radiating area of the heat-radiating device, so that the heat-radiating efficiency of the heat-radiating device to the electronic device is improved, and the heat-radiating effect among different auxiliary heat radiators can be balanced.

Referring to fig. 6, fig. 6 is a schematic partial structure of a second electronic device 100 according to an embodiment of the present application. Of which fig. 6 shows only the circuit board 120, one electronic device 130, and one heat sink 140.

The electronic device 100 according to the present embodiment is different from the electronic device 100 according to the above embodiment in that at least three sub-heat sinks 20 are provided in the heat dissipating device 140, and at least one sub-heat sink 20 is located on a side of the main heat sink 10 near the second surface 11b and is connected to the second surface 11b. At least two sub-radiators 20 are respectively located at both sides of the main radiator 10 near both sides and are respectively connected to both sides.

Illustratively, at least one secondary heat sink 20 is located on a side of the primary heat sink 10 proximate to the third surface 11c and is connected to the third surface 11c. At least one sub-radiator 20 is located on a side of the main radiator 10 near the fourth surface 11d, and is connected to the fourth surface 11d.

Illustratively, the at least three secondary heat sinks 20 include at least one first secondary heat sink 20a, at least one second secondary heat sink 20b, and at least one fifth secondary heat sink 20c. The first sub-radiator 20a is located on a side of the main radiator 10 near the second surface 11b, and is connected to the second surface 11b. In the first sub-radiator 20a, the second housing 21 is connected to the second surface 11b, and the second capillary structure 22 is connected to the second capillary portion 122. The second sub-radiator 20b is located at a side of the main radiator 10 near the third surface 11c, and is connected to the third surface 11c. In the second sub-radiator 20b, the second housing 21 is connected to the third surface 11c, and the second capillary structure 22 is connected to the third capillary portion 123. The fifth sub-radiator 20c is located on a side of the main radiator 10 near the fourth surface 11d, and is connected to the fourth surface 11d. In the fifth sub-radiator 20c, the second housing 21 is connected to the fourth surface 11d, and the second capillary structure 22 is led to the fourth capillary portion 124. The structure of the fifth auxiliary radiator 20c and the matching relationship between the fifth auxiliary radiator 20c and the main radiator 10 can refer to the related description of the second auxiliary radiator 20b in the above embodiment, and will not be repeated here.

In other embodiments, when the fifth sub-radiator is located on the fourth surface, the second sub-radiator 20b may be located on a side of the main radiator 10 close to the fifth surface and connected to the fifth surface, or the second sub-radiator 20b may be located on a side of the main radiator 10 close to the sixth surface and connected to the sixth surface; alternatively, when the second sub-radiator is located on the third surface, the fifth sub-radiator 20c may be located on a side of the main radiator 10 close to the fifth surface and connected to the fifth surface, or the fifth sub-radiator 20c may be located on a side of the main radiator 10 close to the sixth surface and connected to the sixth surface; alternatively, the second auxiliary radiator 20b is located at a side of the main radiator 10 near the fifth surface and is connected to the fifth surface, and the fifth auxiliary radiator 20c is located at a side of the main radiator 10 near the sixth surface and is connected to the sixth surface.

In this embodiment, there are at least three heat dissipation fins 30. The at least three heat radiating fins 30 include at least one first heat radiating fin 30a, at least one second heat radiating fin 30b, and at least one fifth heat radiating fin 30c. At least one first heat radiating fin 30a is sleeved on the second housing 21 of the first sub-radiator 20a and contacts with the second housing 21 of the first sub-radiator 20 a. At least one second heat radiating fin 30b is sleeved on the second housing 21 of the second auxiliary heat radiator 20b and contacts with the second housing 21 of the second auxiliary heat radiator 20 b. At least one fifth heat radiating fin 30c is sleeved on the second housing 21 of the fifth sub-radiator 20c and contacts with the second housing 21 of the fifth sub-radiator 20 c. The structure of the fifth heat dissipating fin 30c, and the fifth heat dissipating fin 30c and the fifth sub-heat sink 20c can refer to the related description of the second heat dissipating fin 30b in the above embodiment, and will not be repeated here.

Referring to fig. 6 and fig. 7, fig. 7 is a schematic diagram illustrating a circulation of the cooling medium in the heat dissipating device 140 when the electronic device 130 generates heat, taking the second sub-heat sink 20b located on the third surface 11c and the fifth sub-heat sink 20c located on the fourth surface 11d as an example in the electronic device 100 shown in fig. 6. Wherein the arrow boxes represent the heat of the electronic device 130, the thin solid lines with arrows represent the flow paths of the vaporized cooling medium, and the thick solid lines with arrows represent the flow paths of the liquefied cooling medium.

When the electronic device 130 is in operation, the cooling medium in a gaseous state mainly flows from the high-temperature high-pressure region to the low-temperature low-pressure region in the four parts of the first part, the second part, the third part and the fourth part. The flow path of the cooling medium in the gas state of the first portion is the same as the flow path of the cooling medium in the gas state of the first portion in the above embodiment, and the flow path of the cooling medium in the gas state of the third portion is the same as the flow path of the cooling medium in the gas state of the third portion in the above embodiment, which is not described here again.

The second part of the cooling medium in a gaseous state flows from the high-temperature high-pressure region to the second heat dissipation chamber 211 of the first sub-radiator 20a through the first heat dissipation chamber 111, and releases the heat to liquefy in the second heat dissipation chamber 211 of the first sub-radiator 20 a. In the liquefied cooling medium, a part of the liquefied cooling medium flows from the second capillary structure 22, the second capillary portion 122, the second capillary structure 22 and the fourth capillary portion 124 of the first sub-radiator 20a to the first capillary portion 121, and the other part flows from the second capillary structure 22, the second capillary structure 22 and the third capillary portion 123 of the second sub-radiator 20b to the first capillary portion 121 of the first sub-radiator 20a to form a heat cycle inside the main radiator 10, the first sub-radiator 20a, the second sub-radiator 20b and the fifth sub-radiator 20c by the capillary forces of the first capillary structure 12, the second capillary structure 22 of the first sub-radiator 20a, the second capillary structure 22 of the second sub-radiator 20b and the second capillary structure 22 of the fifth sub-radiator 20 c.

The fourth part of the cooling medium in a gaseous state flows from the high-temperature high-pressure region to the second heat dissipation chamber 211 of the fifth sub-radiator 20c through the first heat dissipation chamber 111, and releases the heat to liquefy in the second heat dissipation chamber 211 of the fifth sub-radiator 20 c. The liquefied cooling medium flows from the second capillary structure 22 and the fourth capillary portion 124 of the second sub-radiator 20b to the first capillary portion 121 by the capillary force of the second capillary structure 22 of the first and fifth sub-radiators 12 and 20c to form a heat cycle inside the main radiator 10 and the fifth sub-radiator 20 c.

In this embodiment, when the heat dissipating device 140 dissipates heat of the electronic device 130 located on one side of the main heat sink 10 close to the first surface 11a, the heat dissipating device 10 can be used to dissipate heat of the electronic device 130, and heat of the electronic device 130 can be transferred to one side of the main heat sink 10 close to the second surface 11b and two sides of the main heat sink 10 close to the side, and the first auxiliary heat sink 20a, the second auxiliary heat sink 20b and the fifth auxiliary heat sink 20c are used to dissipate heat respectively, so that the heat dissipating area of the heat dissipating device 140 is expanded, the temperature equalizing heat dissipating capability of the heat dissipating device 140 is improved, the heat dissipating efficiency of the heat dissipating device 140 to the electronic device 130 is further improved, the electronic device 130 can work normally, and the reliability of the electronic device 100 is improved.

The foregoing description is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and should be covered in the scope of the present application; embodiments of the present application and features of embodiments may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The heat dissipating device is characterized by comprising a main heat radiator, at least two auxiliary heat radiators and a cooling working medium;

the main radiator is provided with a first surface, a second surface and at least one side surface, the first surface is used for contacting an electronic device, the second surface is opposite to the first surface, the at least one side surface is positioned between the first surface and the second surface, the main radiator comprises a first shell and a first capillary structure, a first radiating cavity is arranged in the first shell, and the first capillary structure is arranged on the cavity wall surface of the first radiating cavity;

2. The heat sink of claim 1, further comprising at least one heat sink fin, wherein the heat sink fin is sleeved on at least one of the secondary heat sinks.

3. The heat sink of claim 2, further comprising a thermally conductive plate positioned on a side of the main heat sink proximate the side surface;

the heat dissipation fins comprise at least two heat dissipation fins and at least one fourth heat dissipation fin, the third heat dissipation fins are sleeved on the third auxiliary heat radiator and abut against the heat conduction plate, and the fourth heat dissipation fins are sleeved on the fourth auxiliary heat radiator and abut against the heat conduction plate.

4. A heat sink according to any one of claims 1 to 3, wherein the first housing comprises an upper housing and a lower housing, the upper housing and the lower housing being fixedly connected to each other;

5. The heat dissipating device of claim 4, wherein the upper housing is provided with a communication hole that penetrates the upper housing in a thickness direction thereof and communicates with the first heat dissipating chamber;

6. The heat sink of claim 5, wherein the second housing includes a mounting end portion facing the main heat sink, the mounting end portion being fixedly connected to the upper housing, the mounting end portion having a diameter that gradually increases in a direction along the second surface toward the first surface.

7. The heat dissipating device of claim 5 further comprising a first retaining ring that is sleeved on said second housing of said first secondary heat sink and fixedly connected to said second housing and said upper housing of said first secondary heat sink.

8. The heat sink of claim 7, wherein the diameter of the first retaining ring increases gradually in a direction of the second surface toward the first surface.

9. The heat dissipating device of any one of claims 4 to 8, further comprising a second securing ring that is sleeved on the second housing of the second auxiliary heat sink and fixedly connected to the second housing, the upper housing, and the lower housing of the second auxiliary heat sink.

10. The heat sink according to any one of claims 1 to 9, wherein at least two of the side surfaces comprise a third surface and a fourth surface, the third surface and the fourth surface being disposed opposite each other;

11. The heat sink according to any one of claims 1 to 10, wherein the primary heat sink is a temperature equalizing plate and/or the secondary heat sink is a heat pipe.

12. An electronic device comprising an electronic component and a heat dissipating apparatus as claimed in any one of claims 1 to 11, the electronic component being located on a side of the main heat sink adjacent to the first surface and in contact with the main heat sink.