CN116487299A - Full-automatic four-wire die bonder - Google Patents
Full-automatic four-wire die bonder Download PDFInfo
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- CN116487299A CN116487299A CN202310631155.4A CN202310631155A CN116487299A CN 116487299 A CN116487299 A CN 116487299A CN 202310631155 A CN202310631155 A CN 202310631155A CN 116487299 A CN116487299 A CN 116487299A
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- 239000000463 material Substances 0.000 claims abstract description 87
- 230000005540 biological transmission Effects 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000003860 storage Methods 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The invention discloses a full-automatic four-wire die bonder in the technical field of semiconductor processing, which comprises a processing table, a mounting plate, a tablet transmission track, a wafer supply module and a chain type rotary bonding head, wherein the mounting plate is arranged on the processing table; the mounting plate is fixedly arranged at the top of the processing table; the tablet conveying tracks are arranged into four groups; the four groups of tablet conveying rails are fixedly arranged at the top of the processing table, and conveying clamps for conveying tablets are arranged on the tablet conveying rails; the wafer supply modules are arranged in four groups, and the four groups of wafer supply modules are respectively arranged at the sides of the four groups of material sheet conveying tracks; the invention can greatly improve the die bonding efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a full-automatic four-wire die bonder.
Background
The semiconductor industry is increasingly changing and the market demands are increasing. Enterprises have higher demands on equipment performance, but most of the enterprises depend on imported equipment at present because domestic equipment starts later and the machine performance is difficult to compare with foreign equipment. But the foreign equipment has high price, which severely restricts the development of small and medium enterprises. The method does not accord with the guidelines of the national great force supporting the development of the semiconductor industry.
The existing semiconductor die bonding equipment mainly uses single-track Shan Bang head or double-track double-bonding head mounting, has low production efficiency and is not beneficial to the mass production of semiconductors.
Based on the above, the invention designs a full-automatic four-wire die bonder to solve the above problems.
Disclosure of Invention
The invention aims to provide a full-automatic four-wire die bonder, which is used for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: a full-automatic four-wire die bonder comprises a processing table, a mounting plate, a material sheet transmission rail, a wafer supply module and a chain type rotary bonding head;
the mounting plate is fixedly arranged at the top of the processing table;
the tablet conveying tracks are arranged into four groups; the four groups of tablet conveying rails are fixedly arranged at the top of the processing table, and conveying clamps for conveying tablets are arranged on the tablet conveying rails;
the wafer supply modules are arranged in four groups, and the four groups of wafer supply modules are respectively arranged at the sides of the four groups of material sheet conveying tracks;
the chain type rotary head consists of a servo motor, a first sprocket, a first chain and a head; the servo motors are fixedly arranged at the top of the mounting plate, the number of the first chain wheels is four in rectangular distribution, the servo motors are used for driving the first chain wheels to rotate, and the first chains are in transmission connection with the four first chain wheels; the bang heads are arranged in a plurality, and the bang heads are fixedly arranged on the first chain.
As a further scheme of the invention, the camera comprises an image positioning module, wherein the image positioning module comprises an upward-looking camera, a crystal fixing camera and a wafer camera; the upward-looking camera, the die bonding camera and the wafer camera are all arranged into four groups.
As a further scheme of the invention, a feeding assembly is arranged on the processing table and comprises a rotating motor, a first belt conveying device and a conveying table; the rotary motor is in transmission connection with a rotary table, a material storage frame is fixedly installed on the rotary table, a second belt conveying device positioned below the material storage frame is installed on the rotary table, and a discharge hole is formed in the outer side of the material storage frame; the four groups of first belt conveying devices are distributed in a circumferential array with respect to the turntable, and the top ends of the four groups of first belt conveying devices are all positioned on the outer side of the turntable; the bottom ends of the four groups of first belt conveying devices are respectively positioned above the four tablet conveying tracks; the four conveying tables are fixedly connected with the processing table and are respectively positioned at the outer sides of the tablet conveying tracks; and the conveying tables are provided with conveying components.
As a further scheme of the invention, the material conveying assembly comprises two symmetrically arranged fixing plates, a plurality of driving wheels which are equidistantly distributed are rotationally connected to the two fixing plates, second chain wheels are fixedly connected to the rotating shafts of the driving wheels, third chain wheels positioned on the side edges of the second chain wheels are rotationally connected to the inside of the fixing plates, and the second chain wheels and the third chain wheels are in transmission connection through a second chain; the automatic belt conveyer is characterized in that a fourth sprocket is fixedly connected to a rotating shaft of the third sprocket, a fifth sprocket is connected to the fourth sprocket through third chain transmission, the fifth sprocket is rotationally connected with the conveying table, a first bevel gear is fixedly connected to the rotating shaft of the fifth sprocket, a second bevel gear is meshed with the first bevel gear, a sixth sprocket is fixedly connected to the rotating shaft of the second bevel gear, a seventh sprocket is connected to the sixth sprocket through fourth chain transmission, and the seventh sprocket is in transmission connection with the first belt conveyer.
As a further scheme of the invention, the fixed plate is slidably arranged on the conveying table, a sliding block is elastically and slidably connected on the conveying table, a tensioning wheel is rotatably connected on the sliding block, and the tensioning wheel is in transmission connection with a third chain; the rotary shaft of the second bevel gear is fixedly connected with a cylindrical cam, the cylindrical cam is provided with a cam groove, a sliding rod is slidably matched in the cam groove, and the sliding rod is fixedly connected with the fixing plate.
As a further scheme of the invention, a blanking area is arranged in the tablet conveying track, a feeding plate is connected to the tablet conveying track in a sliding manner, and a cylinder for driving the feeding plate to move is fixedly connected to the tablet conveying track; the material sheet conveying track is internally provided with a material pushing plate in an elastic sliding connection manner, and the material sheet conveying track is also provided with a driving assembly for driving the material pushing plate to move.
As a further scheme of the invention, the driving assembly comprises a wedge-shaped pushing block, and the wedge-shaped pushing block can push the pushing plate to move; the wedge-shaped pushing block is elastically and slidably arranged on the transmission clip, and a pushing plate for driving the wedge-shaped pushing block to move upwards and separate from the pushing plate is arranged on the side edge of the wedge-shaped pushing block.
As a further scheme of the invention, a discharging area communicated with the discharging area is arranged in the conveying table.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through the arrangement of the four groups of material sheet conveying tracks, the four groups of wafer supply modules and the chain type rotary bonding head, the die bonding work of the four material sheets can be simultaneously carried out, the die bonding efficiency can be greatly improved, and meanwhile, the production quality can be better controlled through the arrangement of the image positioning module, the die bonding period is greatly shortened, and the die bonding capacity is improved.
2. According to the invention, through the arrangement of the material conveying assembly, the material conveying assembly can circularly convey the material sheets to the four material sheet conveying tracks, so that workers do not need to move around a processing table, the material loading difficulty of the material sheets can be greatly reduced, and the die bonding efficiency can be greatly improved.
3. According to the invention, through the arrangement of the cylindrical cam, the cam groove and the slide bar, the driving wheel can enable the material sheet to be positioned at the right outer side of the material sheet conveying track when the material sheet is conveyed, the material sheet is prevented from being deviated during conveying, and the die bonding efficiency can be improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a schematic view of a portion of the structure of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3 at B;
FIG. 5 is a schematic cross-sectional view of the general structure of the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 6 at C;
FIG. 7 is a partial enlarged view of FIG. 6 at D;
FIG. 8 is a schematic cross-sectional view of a material handling assembly according to the present invention;
fig. 9 is a schematic front view of the cylindrical cam structure of the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
the processing table 1, the mounting plate 2, the web conveying track 3, the conveying clamp 301, the wafer supply module 4, the chain rotary bonding head 5, the servo motor 501, the first sprocket 502, the first chain 503, the bonding head 504, the upward vision camera 601, the solid crystal camera 602, the wafer camera 603, the rotating motor 7, the first belt conveying device 8, the conveying table 9, the turntable 10, the storage frame 11, the second belt conveying device 12, the discharge port 13, the fixed plate 14, the driving wheel 15, the second sprocket 16, the third sprocket 17, the second chain 18, the fourth sprocket 19, the third chain 20, the fifth sprocket 21, the first bevel gear 22, the fourth chain 23, the seventh sprocket 24, the sixth sprocket 25, the tensioning wheel 26, the cylindrical cam 27, the cam groove 28, the slide bar 29, the blanking area 30, the feeding plate 31, the cylinder 32, the pushing plate 33, the wedge pushing block 34, the pushing plate 35, the discharge area 36, and the second bevel gear 37.
Detailed Description
Referring to fig. 1-9, the present invention provides a technical solution: a full-automatic four-wire die bonder comprises a processing table 1, a mounting plate 2, a material sheet transmission track 3, a wafer supply module 4 and a chain type rotary bonding head 5;
the mounting plate 2 is fixedly arranged at the top of the processing table 1;
the web conveying tracks 3 are arranged in four groups; the four groups of tablet conveying rails 3 are fixedly arranged at the top of the processing table 1, and conveying clips 301 for conveying tablets are arranged on the tablet conveying rails 3;
the wafer supply modules 4 are arranged in four groups, and the four groups of wafer supply modules 4 are respectively arranged at the sides of the four groups of material sheet conveying tracks 3;
the chain type rotary bonding head 5 consists of a servo motor 501, a first sprocket 502, a first chain 503 and a bonding head 504; the servo motors 501 are fixedly arranged at the top of the mounting plate 2, the number of the first chain wheels 502 is four in rectangular distribution, the servo motors 501 are used for driving the first chain wheels 502 to rotate, and the first chains 503 are in transmission connection with the four first chain wheels 502; the plurality of the bonding heads 504 is provided, and the plurality of bonding heads 504 are fixedly mounted on the first chain 503.
The device also comprises an image positioning module, wherein the image positioning module comprises an upward-looking camera 601, a die bonding camera 602 and a wafer camera 603; the upward-looking camera 601, the die bonding camera 602 and the wafer camera 603 are all arranged in four groups.
In specific operation, referring to fig. 1-2, a worker places a web outside of the web conveying track 3, then the conveying clip 301 moves to a receiving position along the web conveying track 3 to close and clamp the web, and then the conveying clip 301 is responsible for conveying the web to a die bonding position; then, the bonding head 504 located right above the wafer supply module performs a wafer sucking operation according to the position of the wafer sucking position given by the wafer camera; then, the servo motor 501 drives the first sprocket 502 to rotate, the first sprocket 502 drives the bonding head 504 and the chip to synchronously move through the first chain 503, when the bonding head 504 moves to the position right above the upward looking camera 601, the upward looking camera positions the chip on the bonding head 504, and meanwhile, the bonding head 504 positioned on the side edge of the bonding head 504 after the suction sheet rotates to the suction sheet position to suck the sheet; the first chain 504 drives the bonding head 504 after the first suction to move to the die bonding position, and the bonding head of the second suction moves to the upper view camera 601 to perform the chip position positioning work; the first suction tab's bonding head 504 will then secure the chip to the web; three bonding heads 504 on the first chain 504 are in a group in turn, one bonding head 504 of each group performs chip sucking work, one bonding head 504 moves to the position above the upward-looking camera 601 to perform chip positioning work after sucking chips, and one bonding head performs die bonding work, and the die bonding work of four material sheets can be performed simultaneously through the arrangement of the four material sheet conveying tracks 3 in turn, so that the die bonding efficiency can be greatly improved; after the bonding head 504 completes the die bonding operation once, the clip 301 is transferred to drive the web to move a distance to the side close to the bonding head 504, so that the web stays at the next die bonding position until the die bonding operation of the web is completed.
As a further scheme of the invention, a feeding assembly is arranged on the processing table 1, and the feeding assembly comprises a rotating motor 7, a first belt conveying device 8 and a conveying table 9; the rotary motor 7 is in transmission connection with a rotary table 10, a material storage frame 11 is fixedly installed on the rotary table 10, a second belt conveying device 12 positioned below the material storage frame 11 is installed on the rotary table 10, and a discharge hole 13 is formed in the outer side of the material storage frame 11; the four groups of the first belt conveying devices 8 are arranged, the four groups of the first belt conveying devices 8 are distributed in a circumferential array with respect to the turntable 10, and the top ends of the four groups of the first belt conveying devices 8 are all positioned on the outer side of the turntable 10; the bottom ends of the four groups of first belt conveying devices 8 are respectively positioned above the four tablet conveying tracks 3; the four conveying tables 9 are arranged, the four conveying tables 9 are fixedly connected with the processing table 1, and the four conveying tables 9 are respectively positioned at the outer sides of the tablet conveying tracks 3; and the conveying tables 9 are provided with conveying components.
The material conveying assembly comprises two symmetrically arranged fixed plates 14, a plurality of driving wheels 15 which are equidistantly distributed are rotationally connected to the two fixed plates 14, second chain wheels 16 are fixedly connected to the rotating shafts of the driving wheels 15, third chain wheels 17 positioned on the side edges of the second chain wheels 16 are rotationally connected to the inside of the fixed plates 14, and a plurality of the second chain wheels 16 and the third chain wheels 17 are in transmission connection through second chains 18; the rotary shaft of the third sprocket 17 is fixedly connected with a fourth sprocket 19, the fourth sprocket 19 is in transmission connection with a fifth sprocket 21 through a third chain 20, the fifth sprocket 21 is in rotary connection with the conveying table 9, the rotary shaft of the fifth sprocket 21 is fixedly connected with a first bevel gear 22, the first bevel gear 22 is meshed with a second bevel gear 37, the rotary shaft of the second bevel gear 37 is fixedly connected with a sixth sprocket 25, the sixth sprocket 25 is in transmission connection with a seventh sprocket 24 through a fourth chain 23, and the seventh sprocket 24 is in transmission connection with the first belt conveying device 8.
In specific work, as shown in fig. 5 and 6, a worker superimposes and places the material sheets into the material storage frame 11, the rotating motor 7 drives the turntable 10 and the material storage frame 11 to synchronously rotate, and the second belt conveying device 12 drives the material sheets at the bottommost part to move out of the material outlet 13 after each rotation of the turntable 10 and the material storage frame 11 by 90 degrees until the material sheets are completely moved out of the material outlet 13, at the moment, the material sheets can move onto the first belt conveying device 8, and then the first belt conveying device 8 can convey the material sheets onto the conveying table 9; as shown in fig. 2 and 8, the first belt conveying device 8 drives the seventh sprocket 24 to synchronously rotate while working, the first sprocket drives the sixth sprocket 25 to synchronously rotate through the fourth chain 23, the sixth sprocket drives the second bevel gear 37, the second bevel gear 37 drives the first bevel gear 22 to synchronously rotate, the first bevel gear 22 drives the fifth sprocket 21 to rotate, the fifth sprocket 21 drives the fourth sprocket 19 to rotate through the third chain 20, the fourth sprocket 19 drives the third sprocket 17 to synchronously rotate, and the third sprocket 17 drives all the second sprockets 16 to synchronously rotate through the second chain 18; the second sprocket 16 drives the driving wheel 15 to rotate, and when the driving wheel 14 rotates, the material sheet between the two fixing plates 14 is driven to move to the side close to the material sheet conveying track 3 by friction force until the material sheet moves to the position capable of conveying the material sheet to the material sheet conveying track 3, and then the conveying clamp 301 can convey the material sheet to the die bonding position; according to the invention, through the arrangement of the material conveying assembly, the material conveying assembly can circularly convey the material sheets to the four material sheet conveying tracks 3, so that workers do not need to move around the processing table 1, the material loading difficulty of the material sheets can be greatly reduced, and the die bonding efficiency can be greatly improved.
As a further scheme of the invention, the fixed plate 14 is slidably arranged on the conveying table 9, a sliding block is elastically and slidably connected on the conveying table 9, a tensioning wheel 26 is rotatably connected on the sliding block, and the tensioning wheel 26 is in transmission connection with the third chain 20; the rotating shaft of the second bevel gear 37 is fixedly connected with a cylindrical cam 27, the cylindrical cam 27 is provided with a cam groove 28, a sliding rod 29 is slidably matched with the cam groove 28, and the sliding rod 29 is fixedly connected with the fixed plate 14.
In specific operation, the second bevel gear 37 rotates and drives the cylindrical cam 27 to synchronously rotate, and the cylindrical cam 27 drives the fixed plate 14 to move through the cooperation of the cam groove 28 and the slide bar 29; as shown in fig. 9, the cam groove 28 has a segment arranged in a circular arc shape; when the two fixing plates 14 move towards each other, the material sheet positioned in the middle of the two fixing plates can be pushed to approach the middle of the conveying table 9, when the slide bar 29 moves in the arc-shaped notch of the cam groove 28, the material sheet is positioned in the middle of the conveying table, and at the moment, the driving wheel 15 can drive the material sheet to move towards the side approaching the material sheet conveying track 3; the fixing plate 14 drives the fourth chain wheel 19 to synchronously move in the moving process, and the tensioning wheel 26 can keep the third chain 20 in a tensioning state all the time; the invention can make the driving wheel 15 to be positioned at the right outer side of the tablet conveying track 3 when the tablet is conveyed by arranging the cylindrical cam 27, the cam groove 28 and the sliding rod 29, thereby avoiding the deviation of the tablet when the tablet is conveyed and improving the die bonding efficiency.
As a further scheme of the invention, a blanking area 30 is arranged in the tablet conveying track 3, a feeding plate 31 is connected to the tablet conveying track 3 in a sliding manner, and an air cylinder 32 for driving the feeding plate 31 to move is fixedly connected to the tablet conveying track 3; the material sheet conveying track 3 is also elastically and slidably connected with a material pushing plate 33, and the material sheet conveying track 3 is also provided with a driving assembly for driving the material pushing plate 33 to move.
The driving assembly comprises a wedge-shaped pushing block 34, and the wedge-shaped pushing block 34 can push the pushing plate 33 to move; the wedge-shaped push block 34 is elastically and slidably arranged on the transmission clamp 301, and a push plate 35 for driving the wedge-shaped push block 34 to move upwards and separate from the pushing plate 33 is arranged on the side edge of the wedge-shaped push block 34.
In specific work, as shown in fig. 5 and 7, when the material sheet completes the die bonding work, the material sheet stays on the feeding plate 31, then the air cylinder 32 can shrink, and the air cylinder 32 can drive the feeding plate 31 to move downwards; the feeding plate 31 moves downwards until the top surface of the feeding plate is level with the bottom surface of the blanking area; it should be noted that, as shown in fig. 3 and fig. 4, when the conveying clip 301 drives the material sheet to move to the die bonding position, the conveying clip 301 drives the wedge-shaped pushing block 34 to move synchronously, and when the material sheet completes die bonding, the wedge-shaped pushing block 34 moves to the inner side of the pushing plate 33; then, when the conveying clamp 301 moves to the side close to the conveying table 9 to receive the material sheets, the material pushing plate 33 is driven to move synchronously, and the material pushing plate 33 pushes the material sheets on the material feeding plate 31 after die bonding to move synchronously; when the transmission clamp 301 drives the wedge-shaped push block 34 to move to be in contact with the push plate 35, the push plate 35 drives the wedge-shaped push block 34 to move upwards until the wedge-shaped push block 34 is out of contact with the push plate 33, then the push plate 33 can quickly return to the initial position under the action of a spring, and then the air cylinder 32 can extend upwards to drive the feeding plate 31 to return to the initial position; according to the invention, through the arrangement of the blanking area 30, the feeding plate 31, the pushing plate 33, the wedge-shaped pushing block 34 and the pushing plate 35, the blanking of the material sheet can be automatically carried out in the process of completing the die bonding, the material sheet after the die bonding can be ensured not to influence the movement of a new material sheet on the material sheet conveying track 3, and the die bonding efficiency can be greatly improved.
As a further scheme of the invention, a discharging area 36 communicated with the discharging area 30 is arranged in the conveying table 9.
In particular operation, the die-bonded material sheet removed from the blanking area 30 is moved into the discharging area 36 for storage, thereby facilitating the staff to take out the material sheet.
Working principle: referring to fig. 1-2, a worker places a web outside of web transfer rail 3, then transfer clip 301 will move along web transfer rail 3 to a receiving position to close and clamp the web, and then transfer clip 301 will be responsible for transporting the web to a die bonding position; then, the bonding head 504 located right above the wafer supply module performs a wafer sucking operation according to the position of the wafer sucking position given by the wafer camera; then, the servo motor 501 drives the first sprocket 502 to rotate, the first sprocket 502 drives the bonding head 504 and the chip to synchronously move through the first chain 503, when the bonding head 504 moves to the position right above the upward looking camera 601, the upward looking camera positions the chip on the bonding head 504, and meanwhile, the bonding head 504 positioned on the side edge of the bonding head 504 after the suction sheet rotates to the suction sheet position to suck the sheet; the first chain 504 drives the bonding head 504 after the first suction to move to the die bonding position, and the bonding head of the second suction moves to the upper view camera 601 to perform the chip position positioning work; the first suction tab's bonding head 504 will then secure the chip to the web; three bonding heads 504 on the first chain 504 are in a group in turn, one bonding head 504 of each group performs chip sucking work, one bonding head 504 moves to the position above the upward-looking camera 601 to perform chip positioning work after sucking chips, and one bonding head performs die bonding work, and the die bonding work of four material sheets can be performed simultaneously through the arrangement of the four material sheet conveying tracks 3 in turn, so that the die bonding efficiency can be greatly improved; after the bonding head 504 completes the die bonding operation once, the clip 301 is transferred to drive the web to move a distance to the side close to the bonding head 504, so that the web stays at the next die bonding position until the die bonding operation of the web is completed.
Claims (8)
1. A full-automatic four-wire die bonder is characterized in that: comprises a processing table (1), a mounting plate (2), a tablet conveying track (3), a wafer supply module (4) and a chain type rotary bonding head (5);
the mounting plate (2) is fixedly arranged at the top of the processing table (1);
the tablet conveying tracks (3) are arranged into four groups; the four groups of tablet conveying rails (3) are fixedly arranged at the top of the processing table (1), and conveying clips (301) for conveying tablets are arranged on the tablet conveying rails (3);
the wafer supply modules (4) are arranged in four groups, and the four groups of wafer supply modules (4) are respectively arranged at the sides of the four groups of material sheet conveying tracks (3);
the chain type rotary bonding head (5) consists of a servo motor (501), a first sprocket (502), a first chain (503) and a bonding head (504); the servo motors (501) are fixedly arranged at the top of the mounting plate (2), the number of the first chain wheels (502) is four in rectangular distribution, the servo motors (501) are used for driving the first chain wheels (502) to rotate, and the first chains (503) are in transmission connection with the four first chain wheels (502); the plurality of the bonding heads (504) are arranged, and the plurality of bonding heads (504) are fixedly arranged on the first chain (503).
2. The fully automatic four-wire die bonder as defined in claim 1, wherein: the device also comprises an image positioning module, wherein the image positioning module comprises an upward-looking camera (601), a crystal fixing camera (602) and a wafer camera (603); the upward-looking camera (601), the crystal fixing camera (602) and the wafer camera (603) are all arranged into four groups.
3. The fully automatic four-wire die bonder as defined in claim 1, wherein: the processing table (1) is provided with a feeding assembly, and the feeding assembly comprises a rotating motor (7), a first belt conveying device (8) and a conveying table (9); the rotary motor (7) is in transmission connection with a rotary table (10), a material storage frame (11) is fixedly installed on the rotary table (10), a second belt conveying device (12) positioned below the material storage frame (11) is installed on the rotary table (10), and a discharge hole (13) is formed in the outer side of the material storage frame (11); the four groups of first belt conveying devices (8) are distributed in a circumferential array with respect to the turntable (10), and the top ends of the four groups of first belt conveying devices (8) are all positioned at the outer side of the turntable (10); the bottom ends of the four groups of first belt conveying devices (8) are respectively positioned above the four tablet conveying tracks (3); the four conveying tables (9) are arranged, the four conveying tables (9) are fixedly connected with the processing table (1), and the four conveying tables (9) are respectively positioned at the outer sides of the tablet conveying tracks (3); and the conveying tables (9) are provided with conveying components.
4. A fully automatic four-wire die bonder as claimed in claim 3, wherein: the conveying assembly comprises two symmetrically arranged fixing plates (14), a plurality of equidistant driving wheels (15) are rotationally connected to the two fixing plates (14), second chain wheels (16) are fixedly connected to the rotating shafts of the driving wheels (15), third chain wheels (17) located on the side edges of the second chain wheels (16) are rotationally connected to the inside of the fixing plates (14), and a plurality of the second chain wheels (16) are in transmission connection with the third chain wheels (17) through second chains (18); the novel belt conveyer is characterized in that a fourth sprocket (19) is fixedly connected to the rotating shaft of the third sprocket (17), a fifth sprocket (21) is connected to the fourth sprocket (19) through a third chain (20) in a transmission mode, the fifth sprocket (21) is rotationally connected with the conveying table (9), a first bevel gear (22) is fixedly connected to the rotating shaft of the fifth sprocket (21), a second bevel gear (37) is meshed with the first bevel gear (22), a sixth sprocket (25) is fixedly connected to the rotating shaft of the second bevel gear (37), a seventh sprocket (24) is connected to the sixth sprocket (25) through a fourth chain (23) in a transmission mode, and the seventh sprocket (24) is in transmission connection with the first belt conveyer (8).
5. The fully automatic four-wire die bonder as claimed in claim 4, wherein: the fixed plate (14) is slidably arranged on the conveying table (9), a sliding block is elastically and slidably connected to the conveying table (9), a tensioning wheel (26) is rotatably connected to the sliding block, and the tensioning wheel (26) is in transmission connection with the third chain (20); the rotary shaft of the second bevel gear (37) is fixedly connected with a cylindrical cam (27), the cylindrical cam (27) is provided with a cam groove (28), the cam groove (28) is slidably matched with a sliding rod (29), and the sliding rod (29) is fixedly connected with the fixed plate (14).
6. The fully automatic four-wire die bonder as defined in claim 5, wherein: a blanking area (30) is formed in the tablet conveying track (3), a feeding plate (31) is connected to the tablet conveying track (3) in a sliding mode, and an air cylinder (32) for driving the feeding plate (31) to move is fixedly connected to the tablet conveying track (3); the material sheet conveying track (3) is also elastically and slidably connected with a material pushing plate (33), and the material sheet conveying track (3) is also provided with a driving assembly for driving the material pushing plate (33) to move.
7. The fully automatic four-wire die bonder as defined in claim 6, wherein: the driving assembly comprises a wedge-shaped pushing block (34), and the wedge-shaped pushing block (34) can push the pushing plate (33) to move; the wedge-shaped pushing block (34) is elastically and slidably arranged on the transmission clamp (301), and a pushing plate (35) for driving the wedge-shaped pushing block (34) to move upwards and separate from the pushing plate (33) is arranged on the side edge of the wedge-shaped pushing block.
8. The fully automatic four-wire die bonder as defined in claim 7, wherein: a discharging area (36) communicated with the discharging area (30) is arranged in the conveying table (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310631155.4A CN116487299A (en) | 2023-05-31 | 2023-05-31 | Full-automatic four-wire die bonder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310631155.4A CN116487299A (en) | 2023-05-31 | 2023-05-31 | Full-automatic four-wire die bonder |
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| CN116487299A true CN116487299A (en) | 2023-07-25 |
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| CN202310631155.4A Pending CN116487299A (en) | 2023-05-31 | 2023-05-31 | Full-automatic four-wire die bonder |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153750A (en) * | 2023-10-30 | 2023-12-01 | 山东誉正自动化科技有限公司 | Double-rail feeding system and method for semiconductor packaging and die bonder of double-rail feeding system and method |
-
2023
- 2023-05-31 CN CN202310631155.4A patent/CN116487299A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153750A (en) * | 2023-10-30 | 2023-12-01 | 山东誉正自动化科技有限公司 | Double-rail feeding system and method for semiconductor packaging and die bonder of double-rail feeding system and method |
| CN117153750B (en) * | 2023-10-30 | 2024-01-30 | 山东誉正自动化科技有限公司 | Double-rail feeding system and method for semiconductor packaging and die bonder of double-rail feeding system and method |
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