CN116478098A - 聚酰亚胺前体、聚酰亚胺及其制备方法和应用 - Google Patents
聚酰亚胺前体、聚酰亚胺及其制备方法和应用 Download PDFInfo
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- CN116478098A CN116478098A CN202210051196.1A CN202210051196A CN116478098A CN 116478098 A CN116478098 A CN 116478098A CN 202210051196 A CN202210051196 A CN 202210051196A CN 116478098 A CN116478098 A CN 116478098A
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- Prior art keywords
- polyimide
- polyimide precursor
- diamine
- substituted
- unsubstituted
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 106
- 239000004642 Polyimide Substances 0.000 title claims abstract description 91
- 239000002243 precursor Substances 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 150000004985 diamines Chemical class 0.000 claims abstract description 55
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 35
- 125000003118 aryl group Chemical group 0.000 claims abstract description 18
- 239000000178 monomer Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims abstract description 10
- 238000004100 electronic packaging Methods 0.000 claims abstract description 5
- 238000007334 copolymerization reaction Methods 0.000 claims abstract description 3
- 238000012643 polycondensation polymerization Methods 0.000 claims abstract description 3
- -1 Aryl silicon Chemical compound 0.000 claims description 30
- 238000006116 polymerization reaction Methods 0.000 claims description 18
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 238000006068 polycondensation reaction Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 6
- 125000001072 heteroaryl group Chemical group 0.000 claims description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 claims description 4
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 claims description 4
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 4
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 claims description 4
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 claims description 4
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 claims description 4
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- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims description 4
- 229910052805 deuterium Inorganic materials 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
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- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 2
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 2
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 claims description 2
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims description 2
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 claims description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 2
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 claims description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 2
- GCNKJQRMNYNDBI-UHFFFAOYSA-N [2-(hydroxymethyl)-2-(2-methylprop-2-enoyloxymethyl)butyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(CC)COC(=O)C(C)=C GCNKJQRMNYNDBI-UHFFFAOYSA-N 0.000 claims description 2
- TUOBEAZXHLTYLF-UHFFFAOYSA-N [2-(hydroxymethyl)-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CC)COC(=O)C=C TUOBEAZXHLTYLF-UHFFFAOYSA-N 0.000 claims description 2
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000003282 alkyl amino group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 claims description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 claims description 2
- 125000003367 polycyclic group Chemical group 0.000 claims description 2
- 125000004585 polycyclic heterocycle group Chemical group 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 2
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 17
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- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
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Classifications
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- C07D239/00—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings
- C07D239/02—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings
- C07D239/24—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings having three or more double bonds between ring members or between ring members and non-ring members
- C07D239/28—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings having three or more double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, directly attached to ring carbon atoms
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- C07D239/24—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings having three or more double bonds between ring members or between ring members and non-ring members
- C07D239/28—Heterocyclic compounds containing 1,3-diazine or hydrogenated 1,3-diazine rings not condensed with other rings having three or more double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, directly attached to ring carbon atoms
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- C07D403/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group C07D401/00 containing two hetero rings
- C07D403/12—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group C07D401/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
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- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
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- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
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Abstract
本发明公开了聚酰亚胺前体、聚酰亚胺及其制备方法和应用。本发明还公开了一种柔性二胺,结构如式(I)所示。其中,聚酰亚胺前体由二胺和芳香族四羧酸二酐缩聚或共聚得到;二胺包括上述柔性二胺。聚酰亚胺由聚酰亚胺前体固化得到。本发明还公开了一种感光性树脂,包括聚酰亚胺前体和感光性单体。本发明以具有不同侧基和柔性桥联基团的碱性二胺为聚酰亚胺前体的反应单体,增加聚合物链的自由体积和自由度,更易与酸酐进行直接聚合或共聚,且显著提升聚酰亚胺前体在200℃条件下的亚胺化率。同时,不同自由体积和刚性的侧基能够调整聚合物分子链间的相互作用从而实现较高的热稳定性和良好的力学性能,满足聚酰亚胺在电子封装领域中的应用需求。
Description
技术领域
本发明涉及电子封装技术领域,尤其涉及一种聚酰亚胺前体、聚酰亚胺及其制备方法和应用。
背景技术
聚酰亚胺(Polyimide,PI)因具有优异的电绝缘性、耐化学性、机械性能和热稳定性而广泛用于半导体封装领域中,如ɑ粒子屏蔽层、应力缓冲层、层间介质材料或光敏再布线材料等,这些材料在现代微电子半导体产业中发挥着难以取代的重要作用。然而,传统的聚酰亚胺树脂需要在300-400℃下加热固化才能发挥理想的性能,但是一些电子元器件在超过200-250℃的环境下工作就会失效。此外,高温加工过程常常易引起塑封电路低熔焊锡的焊点开裂、脱落、重结晶等现象,破坏塑封器件的性能。在超薄晶圆器件中,高温处理过程产生的残余应力,易导致翘曲、剥离等严重问题,影响其使用可靠性。以往研究表明,降低固化温度可以改善由于线性热膨胀系数CTE导致的热膨胀系数错配问题引起的残余应力问题。因此,开发固化温度低于250℃,甚至低于200℃的聚酰亚胺材料尤为重要。
关于低温固化聚酰亚胺树脂的制备方法,目前常用的有三种方法。首先是一步法,该方法可以在低温下实现聚酰胺酸的酰亚胺化过程,通常将脱水剂和催化剂加入聚酰胺酸溶液中,常见的脱水剂为乙酸酐,催化剂为有机胺,包括吡啶、喹啉、异喹啉、β-皮考啉等(ref:Macromolecules 31(17)(1998)5771–5778.)。由于目前广泛应用的均苯、联苯类型的聚酰亚胺在有机溶剂(如N-甲基吡咯烷酮或N,N-二甲基乙酰胺)中的溶解性极差,难以加工,因此这种方法只适用于可溶性聚酰亚胺体系,而且常用的高沸点溶剂大多含有致癌物质,不能广泛使用。其二是采用化学固化剂促进聚酰胺酸在较低的温度下脱水闭环,完成亚胺化过程(Journal of Polymer Science Part a-Polymer Chemistry,1996,34,651-658;Chemistry Letters,2004,33,1156-1157;Journal of Photopolymer Science andTechnology,2017,30,139-146;J.Mater.Chem.C 8(42)(2020)14886–14894.)。化学固化剂主要包括羧酸类和叔胺类碱性催化剂,但是一般固化剂的用量是预聚物的1-2倍当量,固化剂的残留会对薄膜的力学性能造成严重的影响。其三是制备新型的二胺或者酸酐单体,通过引入各种化学官能团,使得亚胺化过程更容易进行,从而降低固化温度。这种方法有望解决低温固化聚酰亚胺树脂材料稀缺的现状,但是目前已报道的新型单体非常少,因此开发新型的二胺单体非常重要。
中国专利CN202011017412.8公开了一种聚酰亚胺前体树脂及其制备方法和应用,其中也包含了一系列具有低温固化效果的二胺单体,但是发明人在随后的论文(Polymer,2021,228(3):123963.)中指出所保护的二胺单体由于刚性过强,导致聚合物分子链运动受限,因此实施例中200℃条件下固化,亚胺化率只有60-70%左右。
发明内容
针对上述技术问题,本发明的目的在于提供聚酰亚胺前体、聚酰亚胺及其制备方法和应用。本发明以具有不同侧基和柔性桥联基团的碱性二胺为聚酰亚胺前体的反应单体,增加聚合物链的自由体积和自由度,更容易与酸酐进行直接聚合或者共聚,且显著提升了聚酰亚胺前体在200℃条件下的亚胺化率。同时,不同自由体积和刚性的侧基能够调整聚合物分子链间的相互作用从而实现较高的热稳定性和良好的力学性能,满足聚酰亚胺在电子封装领域中的应用需求。
为实现上述目的,本发明采取的技术方案为:
本发明第一方面提供一种柔性二胺,其结构如式(I)所示:
式(I)中,X1,X2各独立地选自C或N原子,且至少有一个为N原子;
R1、R2、R3和R4各独立地选自氢或氘、甲基或氘代甲基、取代甲基、卤素、取代或未取代的C2~C10直链或支链烷基、取代或未取代的C6~C30环烷基、取代或未取代的C5~C30杂环烷基、C1~C10烷氧基、C1~C10烷基氨基、取代或未取代的C1~C10硅烷基、取代或未取代的C6~C30芳基、C6~C30芳氧基、C6~C30芳硫基、C6~C30芳基硅基、C6~C30芳基氨基、取代或未取代的C6~C30杂芳基、取代或未取代的C6~C30杂芳氧基、取代或未取代的C6~C30杂芳硫基、取代或未取代的C6~C30杂芳硅基、取代或未取代的C6~C30杂芳氨基、单价非芳香族稠合多环基团、单价非芳香族稠合杂多环基团和乙酰基中的任一种;
L1、L2各独立地选自-O-、-S-、-CH2-、-SiH2-、-CO-、-NH-,-CO-O-、-CO-NH-、砜基、C2~C12直链和支链亚烷基中的任一种。
在本发明的技术方案中,所述芳基、芳氧基、芳硫基、芳基硅基、芳基氨基、杂芳基、杂芳氧基、杂芳硫基、杂芳硅基、杂芳氨基包括多环系统;所述多环系统具有2个或多个环;所述多环系统可以为其中2个邻近的环共用2个或多个碳(即稠环),其中至少1个环是芳族的,其它环可以是环烷基、杂环烷基、环烯基、杂环烯基和/或芳基;所述多环环系统也可以为联苯芳基、三联苯基等不共用碳原子的联苯基环系统。
在某些具体的实施方式中,具有式(I)所示的柔性二胺具体可列举出:
又一方面,本发明提供一种聚酰亚胺前体,所述聚酰亚胺前体由二胺和芳香族四羧酸二酐缩聚或者共聚得到;所述二胺包括上述柔性二胺。
作为优选地实施方式,式(I)中,X1和X2为N原子;R1、R2、R3和R4各独立地选自氢或氘、甲基或氘代甲基、三氟甲基、巯甲基、卤素、乙基、正丙基、异丙基、正丁基、巯乙基、甲氧基、乙氧基、丙氧基、三甲基硅基或氘代三甲基硅基、苯基、萘基、蒽基和乙酰基中的任一种;L1、L2分别独立的取自-O-、-S-、-CH2-、-SiH2-、-CO-、-NH-和砜基中的任一种。
在某些具体的实施方式中,所述二胺选自上述柔性二胺中的任意一种或多种。
在某些具体的实施方式中,所述二胺还包括如下所示的二胺中的任意一种或多种:
在本发明的技术方案中,所述芳香族四羧酸二酐具有如式(II)所示的结构:
式(II)中,Ar3选自下列结构中的任意一种:
又一方面,本发明提供上述聚酰亚胺前体的制备方法,包括如下步骤:
将所述二胺和芳香族四羧酸二酐直接进行缩聚反应;或者将所述二胺和芳香族四羧酸二酐进行二元或三元共聚;
优选地,所述缩聚反应、二元或三元共聚的温度为0~80℃;
优选地,所述缩聚反应、二元或三元共聚的时间为1~24h;
优选地,所述缩聚反应二元或三元共聚在保护气氛中进行;
在某些具体的实施例中,所述缩聚反应、二元或三元共聚在溶剂中进行;所述溶剂优选为N,N-二甲基乙酰胺或者N-甲基吡咯烷酮。
又一方面,本发明提供一种感光树脂,所述感光树脂包括上述聚酰亚胺前体和感光性单体。
作为优选地实施方式,所述感光性单体选自二甲基丙烯酸三缩四乙二醇酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、四乙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、四乙二醇二甲基丙烯酸、三羟甲基丙烷二丙烯酸酯、三羟甲基丙烷三丙烯酸酯、三羟甲基丙烷二甲基丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、季戊四醇三烯酸酯、季戊四醇四丙烯酸酯、季戊四醇三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、苯乙烯、二乙烯基苯、4-乙烯基甲苯、4-乙烯基吡啶、N-乙烯基吡咯烷酮、甲基丙烯酸羟基乙酯、丙烯酸2-羟基乙酯、1,3-丙烯酰氧基-2-羟基丙烷、1,3-甲基丙烯酰氧基-2-羟基丙烷、亚甲基双丙烯酰胺、N,N-二甲基丙烯酰胺和N-羟甲基丙烯酰胺中的任意一种或几种。
又一方面,本发明提供一种聚酰亚胺,所述聚酰亚胺由上述聚酰亚胺前体固化得到。
又一方面,本发明提供上述柔性二胺、感光树脂或上述聚酰亚胺在制备光刻胶、半导体器件、显示器件、照明器件以及在电子封装领域中的应用。
上述技术方案具有如下优点或者有益效果:
本发明以具有不同侧基和柔性桥联基团的碱性二胺为聚酰亚胺前体的反应单体,包含碱性的不对称氮杂芳环,可以在加热固化的聚酰亚胺前体中发生自催化反应,加速亚胺化的反应进程;同时,引入不同自由体积和刚性的侧基和柔性桥联基团,可以调整聚合物分子链之间的相互作用,综合调控聚酰亚胺薄膜的热稳定性和力学性能。这种二胺单体可以提高聚酰亚胺前体树脂在低于250℃、甚至低于200℃的低温下的亚胺化率,实现聚酰亚胺前体的低温固化,同时具备较好的热稳定性和力学性质,从而满足微电子芯片材料、封装材料、层间介电层的应用需求。
附图说明
图1是实施例1、3、5、9中的聚酰亚胺前体在不同温度下固化的ATR-FTIR光谱对比图。
图2是实施例2、4、6、7以及对比例中的聚酰亚胺断裂应力对比图。
具体实施方式
下述实施例仅仅是本发明的一部分实施例,而不是全部的实施例。因此,以下提供的本发明实施例中的详细描述并非旨在限制要求保护的本发明的范围,而是仅仅表示本发明的选定实施例。基于本发明的实施例,本领域技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例,都属于本发明的保护范围。
在本发明中,若非特指,所有的设备和原料等均可从市场购得或是本行业常用的。下述实施例中的方法,如无特别说明,均为本领域的常规方法。
制造例1:
4,4'-((6-甲基嘧啶-2,4-二基)双(氧基))二苯胺,结构如下所示:
具体合成过程如下:
(1)首先,将2,4-二氯-6-甲基嘧啶(1eq.)、对硝基苯酚(2.5eq.)、碳酸钾(2.5eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入超干的N,N-二甲基甲酰胺溶剂,150℃反应12小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅黄色产物中间体1,产率85%,核磁数据:1H NMR(400MHz,DMSO-d6),δ8.44-8.08(m,4H),7.67-7.35(m,4H),6.97(s,1H),2.41(s,3H);
(2)称取中间体1(1eq.),钯/碳10%(0.1eq.)依次加入三口圆底烧瓶,加入超干四氢呋喃,氮气氛围下,加热至回流,逐滴加入水合肼85%(5eq.),回流反应12小时,冷却至室温,过滤出钯碳催化剂,旋干有机相,柱层析提纯,得到白色产物,产率78%,核磁数据:1HNMR(400MHz,DMSO-d6),δ6.90-6.72(m,4H),6.57(dd,J=16.8,8.8Hz,4H),6.34(s,1H),5.11(s,2H),4.98(s,2H),2.25(s,3H)。
制造例2:
4,4'-((5-甲基嘧啶-2,4-二基)双(氧基))二苯胺,结构如下所示:
具体合成过程如下:
(1)首先,将2,4-二氯-5-甲基嘧啶(1eq.)、对硝基苯酚(2.5eq.)、碳酸钾(2.5eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入超干的N,N-二甲基甲酰胺溶剂,150℃反应1小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅黄色产物中间体1,产率88%,核磁数据:1H NMR(400MHz,DMSO-d6),δ8.46(s,1H),8.27(dd,J=25.4,9.1Hz,4H),7.53(d,J=9.1Hz,2H),7.42(d,J=9.2Hz,2H),2.27(s,3H);
(2)称取中间体1(1eq.)、钯/碳10%(0.1eq.)依次加入三口圆底烧瓶,加入超干四氢呋喃,氮气氛围下,加热至回流,逐滴加入水合肼85%(5eq.),回流反应16小时,冷却至室温,过滤出钯碳催化剂,旋干有机相,柱层析提纯,得到白色产物,产率75%,核磁数据:1HNMR(400MHz,DMSO-d6),δ8.14(d,J=0.8Hz,1H),6.85(d,J=8.8Hz,2H),6.75(d,J=8.8Hz,2H),6.55(dd,J=24.9,8.8Hz,4H),5.05(s,2H),4.98(s,2H),2.15(s,3H)。
制造例3:
4,4'-((5-(三氟甲基)嘧啶-2,4-二基)双(氧基))二苯胺,结构如下所示:
具体合成过程如下:
(1)首先,将2,4-二氯-5-(三氟甲基)嘧啶(1eq.)、对硝基苯酚(2.5eq.)、碳酸钾(2.5eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入超干的N,N-二甲基甲酰胺溶剂,150℃反应1小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅黄色产物中间体1,产率88%,核磁数据:1H NMR(500MHz,CDCl3),δ8.35–8.26(m,2H),8.18–8.11(m,2H),8.08(s,1H),7.54–7.43(m,2H),7.08–6.96(m,2H);
(2)称取中间体1(1eq.)、钯/碳10%(0.1eq.)依次加入三口圆底烧瓶,加入超干四氢呋喃,氮气氛围下,加热至回流,逐滴加入水合肼85%(5eq.),回流反应12小时,冷却至室温,过滤出钯碳催化剂,旋干有机相,柱层析提纯,得到白色产物,产率80%,核磁数据:δ1HNMR(500MHz,CDCl3),8.08(s,1H),6.60-6.55(m,8H),5.5(s,4H)。
制造例4:
4,4'-((5,6-二甲氧基嘧啶-2,4-二基)双(氧基))二苯胺,结构如下所示:
具体合成过程如下:
(1)首先,将2,4-二氯-5,6-二甲氧基嘧啶(1eq.)、对硝基苯酚(2.5eq.)、碳酸钾(2.5eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入超干的N,N-二甲基甲酰胺溶剂,150℃反应1小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅黄色产物中间体1,产率88%,核磁数据:1H NMR(500MHz,CDCl3)δ8.38–8.24(m,2H),8.21–8.07(m,2H),7.55–7.42(m,2H),7.10–6.92(m,2H),4.06(s,3H),3.92(s,3H);
(2)称取中间体1(1eq.),钯/碳10%(0.1eq.)依次加入三口圆底烧瓶,加入超干四氢呋喃,氮气氛围下,加热至回流,逐滴加入水合肼85%(5eq.),回流反应12小时,冷却至室温,过滤出钯碳催化剂,旋干有机相,柱层析提纯,得到白色产物,产率80%,核磁数据:δ1HNMR(500MHz,CDCl3),8.40-8.32(m,8H),5.29(s,4H),4.06(s,3H),3.83(s,3H)。
制造例5:
4,4'-((6-(蒽-2-基)嘧啶-2,4-二基)双(氧基))二苯胺,结构如下所示:
具体合成过程如下:
(1)首先,将4-溴-2,6-二氯嘧啶(1eq.)、2-硼酸蒽(1.05eq.)、碳酸钾(2.5eq.)Pd(PPh3)4(0.01eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入甲苯、乙醇、水(体积比为2:1:1)回流搅拌12小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅白色产物中间体1,产率91%,核磁数据:1HNMR(500MHz,CDCl3),δ8.87(t,J=3.0Hz,1H),8.45(dt,J=14.9,2.9Hz,2H),8.33(dd,J=15.0,2.9Hz,1H),8.01(ddd,J=11.0,7.0,3.0Hz,2H),7.91(dd,J=15.0,3.1Hz,1H),7.54(dd,J=11.1,6.9Hz,2H),7.13(s,1H);
(2)将中间体1(1eq.)、对硝基苯酚(2.5eq.)、碳酸钾(2.5eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入超干的N,N-二甲基甲酰胺溶剂,150℃反应1小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅黄色产物中间体2,产率68%,核磁数据:1H NMR(500MHz,CDCl3),δ8.87(t,J=3.0Hz,1H),8.45(dt,J=14.9,2.9Hz,2H),8.37–8.26(m,3H),8.20–8.10(m,2H),8.01(s,2H),7.91(dd,J=15.0,3.1Hz,1H),7.63–7.38(m,4H),7.08–6.97(m,2H),6.56(s,1H);
(3)称取中间体2(1eq.)、钯/碳10%(0.1eq.)依次加入三口圆底烧瓶,加入超干四氢呋喃,氮气氛围下,加热至回流,逐滴加入水合肼85%(5eq.),回流反应12小时,冷却至室温,过滤出钯碳催化剂,旋干有机相,柱层析提纯,得到白色产物,产率67%,核磁数据:1HNMR(500MHz,CDCl3),δ8.87(t,J=3.0Hz,1H),8.45(dt,J=14.9,2.9Hz,2H),8.33(dd,J=15.0,2.9Hz,1H),8.01(ddd,J=11.0,7.0,3.0Hz,2H),7.91(dd,J=15.0,3.1Hz,1H),7.54(dd,J=11.1,6.9Hz,2H),6.96(s,2H),6.56(s,1H),6.50(s,8H),5.12(s,2H)。
制造例6:
4,4'-((5-(4-(三苯基硅基)苯基)嘧啶-2,4-二基)双(氧基))二苯胺,结构如下所示:
具体合成过程如下:
(1)首先,将5-溴-2,4-二氯嘧啶(1eq.)、4-(三苯基硅基)苯基)硼酸(1.05eq.)、碳酸钾(2.5eq.)、Pd(PPh3)4(0.01eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入甲苯、乙醇、水(体积比为2:1:1)回流搅拌12小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅白色产物中间体1,产率86%,核磁数据:1H NMR(500MHz,CDCl3),δ9.40(s,1H),7.87(d,J=13.2Hz,2H),7.65(d,J=14.3Hz,2H),7.46-7.38(m,15H);
(2)将中间体1(1eq.)、对硝基苯酚(2.5eq.)、碳酸钾(2.5eq.)依次加入三口圆底烧瓶,通入氮气,在氮气保护下加入超干的N,N-二甲基甲酰胺溶剂,150℃反应1小时,冷却至室温,用500mL水和300mL二氯甲烷萃取反应物至有机相,减压旋蒸除去有机溶剂,柱层析,得到浅黄色产物中间体2,产率61%,核磁数据:1H NMR(500MHz,CDCl3),δ8.52(s,1H),8.30(m,2H),8.14(m,2H),7.87(m,2H),7.65(d,J=13.2Hz,2H),7.48(d,J=3.4Hz,2H),7.46–7.38(m,15H),7.02(d,J=8.6Hz,2H);
(3)称取中间体2(1eq.)、钯/碳10%(0.1eq.)依次加入三口圆底烧瓶,加入超干四氢呋喃,氮气氛围下,加热至回流,逐滴加入水合肼85%(5eq.),回流反应12小时,冷却至室温,过滤出钯碳催化剂,旋干有机相,柱层析提纯,得到白色产物,产率62%,核磁数据:1HNMR(500MHz,CDCl3),δ8.96(s,1H),8.67(m,2H),8.42(m,2H),8.21-8.09(m,15H),7.60-7.55(m,8H),5.03(s,4H)。
实施例
下述实施例中的聚酰亚胺的制备方法如下:
(1)预处理二酐和二胺,除去水分和其中杂质;然后在低温或者室温下,在烧瓶中倒入适量一种或多种二胺,加入极性有机溶剂混合均匀,随后通氮气,保持体系处于氮气气氛下,再分批加入二酐(二胺与二酐的摩尔比为0.9~1),间隔10~30分钟加入,并连续搅拌5~24h以获得聚酰胺酸(PAA)溶液,即聚酰亚胺前体;
(2)通过旋涂或者刮涂等方式将聚酰胺酸溶液均匀平铺在平板上,在热板上软烤几分钟除去部分有机溶剂;
(3)最后在氮气或者空气氛下进行热亚胺化,主要采用阶梯升温的方式,然后冷却至室温,得到聚酰亚胺树脂。
实施例1
(1)首先,预处理二酐和二胺除去其中水分和杂质,二胺在60℃真空烘箱下处理3h,二酐在160℃真空烘箱下处理4h;然后在室温下,在烧瓶中将4,4'-((6-甲基嘧啶-2,4-二基)双(氧基))二苯胺10mmol溶于超干N,N-二甲基乙酰胺(DMAc)溶液中,然后在氮气氛下,冰浴条件下分两次加入均苯四甲酸二酐(PMDA,10mmol)并搅拌24h获得PAA-1溶液;
(2)然后,通过旋涂的方式将聚酰胺酸溶液均匀平铺在光滑铜面上,转速为1000转/s,时间为30s,在80℃的热板上软烤十分钟除去部分有机溶剂;
(3)最后在氮气氛下进行热亚胺化,主要采用阶梯升温的方式:
升温程序为以5℃/每分钟的升温速率升温至100℃保温1小时(100℃/1小时);再以5℃/每分钟的升温速率升温至200℃保温3小时(200℃/3小时),然后冷却至室温,得到低温固化聚酰亚胺PI-11;
升温程序为5℃/每分钟,100℃/1小时,200℃/1小时,250℃/2小时,然后冷却至室温,得到低温固化聚酰亚胺PI-12;
升温程序改为5℃/每分钟,100℃/1小时,200℃/1小时,300℃/1小时,350℃/1小时,升温速率为5℃/每分钟,然后冷却至室温,得到低温固化聚酰亚胺PI-13。
实施例2
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-((6-甲基嘧啶-2,4-二基)双(氧基))二苯胺和4,4'-二氨基二苯醚(ODA)的混合二胺,混合摩尔比为1mmol:9mmol,聚合得到PAA-2;然后通过阶梯升温固化得到聚酰亚胺分别为PI-21、PI-22、PI-23。
实施例3
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-((6-甲基嘧啶-2,4-二基)双(氧基))二苯胺和4,4'-二氨基二苯醚(ODA)的混合二胺,混合摩尔比为2mmol:8mmol,聚合得到PAA-3;然后通过阶梯升温固化得到聚酰亚胺分别为PI-31,PI-31,PI-33。
实施例4
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-((6-甲基嘧啶-2,4-二基)双(氧基))二苯胺和4,4'-二氨基二苯醚(ODA)的混合二胺,混合摩尔比为3mmol:7mmol,聚合得到PAA-4;然后通过阶梯升温固化得到聚酰亚胺分别为PI-41、PI-42、PI-43。
实施例5
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-((5-甲基嘧啶-2,4-二基)双(氧基))二苯胺,与均苯四甲酸二酐(PMDA)聚合获得PAA-5;然后通过接替升温固化得到聚酰亚胺分别为PI-51、PI-52、PI-53。
实施例6
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-((5-(三氟甲基)嘧啶-2,4-二基)双(氧基))二苯胺,与均苯四甲酸二酐(PMDA)聚合获得PAA-6,然后通过阶梯升温固化得到聚酰亚胺分别为PI-61、PI-62、PI-63。
实施例7
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-((5,6-二甲氧基嘧啶-2,4-二基)双(氧基))二苯胺,与均苯四甲酸二酐(PMDA)聚合获得PAA-7;然后通过阶梯升温固化得到聚酰亚胺分别为PI-71、PI-72、PI-73。
实施例8
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-((6-(蒽-2-基)嘧啶-2,4-二基)双(氧基))二苯胺,与均苯四甲酸二酐(PMDA)聚合获得PAA-8;然后通过阶梯升温固化得到聚酰亚胺分别为PI-81、PI-82、PI-83。
实施例9
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为4、4'-((5-(4-(三苯基硅基)苯基)嘧啶-2,4-二基)双(氧基))二苯胺,与均苯四甲酸二酐(PMDA)聚合获得PAA-9;然后通过阶梯升温固化得到聚酰亚胺分别为PI-91、PI-92、PI-93。
实施例10
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为3,3,4,4-二苯基砜四羧酸二酸酐(DSDA),直接聚合获得PAA-10;然后通过阶梯升温固化得到聚酰亚胺分别为PI-101、PI-102、PI-103。
实施例11
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为3,3',4,4'-二苯甲酮四甲酸二酐(BTDA),直接聚合获得PAA-11,然后通过阶梯升温固化得到聚酰亚胺分别为PI-111、PI-112、PI-113。
实施例12
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为3,3',4,4'-联苯四羧酸二酐(BPDA),直接聚合获得PAA-12,然后通过阶梯升温固化得到聚酰亚胺分别为PI-121,PI-122、PI-123。
实施例13
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为4,4'-氧双邻苯二甲酸酐(ODPA),直接聚合获得PAA-13,然后通过阶梯升温固化得到聚酰亚胺分别为PI-131,PI-132、PI-133。
实施例14
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为双酚A型二醚二酐(BPADA),直接聚合获得PAA-14,然后通过阶梯升温固化得到聚酰亚胺分别为PI-141,PI-142、PI-143。
实施例15
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为六氟二酐(6FDA),直接聚合获得PAA-15,然后通过阶梯升温固化得到聚酰亚胺分别为PI-151,PI-152、PI-153。
实施例16
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为六氟二酐(6FDA)和PMDA的混合二酐,混合摩尔比为1mmol:9mmol,直接聚合获得PAA-16,然后通过阶梯升温固化得到聚酰亚胺分别为PI-161、PI-162、PI-163。
实施例17
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为六氟二酐(6FDA)和PMDA的混合二酐,混合摩尔比为2mmol:8mmol,直接聚合获得PAA-17,然后通过阶梯升温固化得到聚酰亚胺分别为PI-171、PI-172、PI-173。
实施例18
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为六氟二酐(6FDA)和PMDA的混合二酐,混合摩尔比为3mmol:7mmol,直接聚合获得PAA-18,然后通过阶梯升温固化得到聚酰亚胺分别为PI-181、PI-182、PI-183。
实施例19
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为六氟二酐(6FDA)、DSDA和PMDA的混合二酐,混合摩尔比为1mmol:1mmol:8mmol,直接聚合获得PAA-19,然后通过阶梯升温固化得到聚酰亚胺分别为PI-191、PI-192、PI-193。
实施例20
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二酐替换为六氟二酐(6FDA)、DSDA和PMDA的混合二酐,混合摩尔比为2mmol:1mmol:7mmol,直接聚合获得PAA-20,然后通过阶梯升温固化得到聚酰亚胺分别为PI-201、PI-202、PI-203。
实施例21
本实施例中将实施例2中制备的聚酰亚胺前体PAA-2 350g(固含量15%)中加入200mL N,N-二甲基乙酰胺进行稀释,然后在氮气氛围下缓慢加入7.5mL三氟乙酸酐,并将温度升至50℃反应2h;之后加入15g甲基丙烯酸羟基乙酯并在50℃下搅拌过夜;将得到的产物在甲醇中沉淀析出,抽滤干燥得到灰黄色固体,即感光性树脂。
采用上述感光性树脂配制光刻胶,具体配方如下:1.0重量份感光性树脂、0.03重量份四乙基米氏酮、0.06重量份邻氯代六芳基双咪唑、0.02重量份2-巯基苯并恶唑、30重量份N-甲基吡咯烷酮。
光刻胶的光刻性能测试:在紫外曝光机(EVG610)下,曝光量为370mJ/cm2,显影时间为20s(显影液KS5400),可以得到15μm/15μm线宽/线距的图案。通过扫描电子显微镜(SEM,NanoSEM 450)对所述图案进行测试。
对比例1
本实施例的制备方法与实施例1的区别在于,将步骤(1)的二胺替换为4,4'-二氨基二苯醚,与均苯四甲酸二酐(PMDA)聚合获得PAA-0,然后通过阶梯升温固化得到聚酰亚胺分别为PI-01、PI-02、PI-03。
效果实施例
1、本发明对上述实施例以及对比例中制备的聚酰亚胺的亚胺化程度进行了测试,测试方法为:对比红外光谱图中聚酰亚胺环的C-N伸缩振动峰和苯环的C-C伸缩振动峰的峰面积之比,通过将350℃下得到的该比值作为参比,计算公式如下:
Imidization Degree(ID)=(SC-N/SC-C)T/(SC-N/SC-C)350;
其中,SC-N为C-N伸缩振动峰面积,SC-C为C-C伸缩振动峰面积。
实施例1-9以及对比例中的聚酰亚胺的亚胺化程度测试结果见表1:
表1
实施例 | 聚酰胺酸 | 200℃亚胺化率 | 250℃亚胺化率 |
实施例1 | PAA-1 | 97% | 98% |
实施例2 | PAA-2 | 94% | 97% |
实施例3 | PAA-3 | 94% | 96% |
实施例4 | PAA-4 | 98% | 99% |
实施例5 | PAA-5 | 95% | 98% |
实施例6 | PAA-6 | 93% | 98% |
实施例7 | PAA-7 | 94% | 97% |
实施例8 | PAA-8 | 93% | 99% |
实施例9 | PAA-9 | 94% | 98% |
对比例1 | PAA-01 | 82% | 86% |
图1为为实施例1、3、5、9中制备的聚酰亚胺前体PAA-1、PAA-3、PAA-5、PAA-9在不同温度下固化的ATR-FTIR光谱对比图。结果表明,相比对比例1中制备的聚酰亚胺前体,实施例1-9中的二胺单体采取共聚或者直接聚合得到的聚酰亚胺前体PAA-1到PAA-9在200℃和250℃下均实现了90%以上的亚胺化率。
2、本发明对上述实施例以及对比例中制备的聚酰亚胺的力学性能和热力学性能进行了测试。测试结果见表2:
表2
其中,力学性能的测试方法为:通过动态力学热分析仪(TA,DMAQ800),将实施例中固化得到的聚酰亚胺薄膜裁剪成3mm×5mm的条状进行测试,得到的断裂应力对比图如图2所示。从图2中可知,实施例2、4、6、7相对于对比例1中的聚酰亚胺薄膜的力学性能特别是实施例2大幅度提升,其中,实施例2中制备的聚酰亚胺前体在200℃固化形成的聚酰亚胺薄膜的断裂伸长率为61%,断裂应力为138MPa,杨氏模量3.03GPa,相比于对比例1中200℃固化形成的聚酰亚胺薄膜的断裂伸长率为50%,断裂应力为124MPa,杨氏模量2.75GPa,因此采用含嘧啶的柔性二胺单体得到的聚酰亚胺前体在低温固化下形成的聚酰亚胺薄膜,相对于不含氮的普通聚酰亚胺前体树脂低温固化得到的聚酰亚胺薄膜具有更优的力学性能。
从表2中的性能数据对比可以看出,本发明提供的聚酰亚胺前体树脂在200℃固化形成的聚酰亚胺薄膜热学性能相比已知的二胺ODA和二酐PMDA聚合得到的聚酰亚胺薄膜热力学性能和力学性能都得到了提升。表明二胺中,大体积侧基基团和嘧啶环碱性的结合,既提高低温固化的亚胺化率,又可以保证薄膜具有良好的热稳定性和力学稳定性。
申请人声明,本发明通过上述实施例来说明本发明的一种聚酰亚胺前体树脂及其制备方法和应用,但本发明并不局限于上述工艺步骤,即不意味着本发明必须依赖上述工艺步骤才能实施。所属技术领域的技术人员应该明了,对本发明的任何改进,对本发明所选用原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本发明的保护范围和公开范围之内。
Claims (10)
1.一种柔性二胺,其结构如式(I)所示:
式(I)中,X1,X2各独立地选自C或N原子,且至少有一个为N原子;
R1、R2、R3和R4各独立地选自氢或氘、甲基或氘代甲基、取代甲基、卤素、取代或未取代的C2~C10直链或支链烷基、取代或未取代的C6~C30环烷基、取代或未取代的C5~C30杂环烷基、C1~C10烷氧基、C1~C10烷基氨基、取代或未取代的C1~C10硅烷基、取代或未取代的C6~C30芳基、C6~C30芳氧基、C6~C30芳硫基、C6~C30芳基硅基、C6~C30芳基氨基、取代或未取代的C6~C30杂芳基、取代或未取代的C6~C30杂芳氧基、取代或未取代的C6~C30杂芳硫基、取代或未取代的C6~C30杂芳硅基、取代或未取代的C6~C30杂芳氨基、单价非芳香族稠合多环基团、单价非芳香族稠合杂多环基团和乙酰基中的任一种;
L1、L2各独立地选自-O-、-S-、-CH2-、-SiH2-、-CO-、-NH-,-CO-O-、-CO-NH-、砜基、C2~C12直链和支链亚烷基中的任一种。
2.一种聚酰亚胺前体,其特征在于,所述聚酰亚胺前体由二胺和芳香族四羧酸二酐缩聚或者共聚得到;所述二胺包括权利要求1所述的柔性二胺。
3.根据权利要求2所述的聚酰亚胺前体,其特征在于,式(I)中,X1和X2为N原子;R1、R2、R3和R4各独立地选自氢或氘、甲基或氘代甲基、三氟甲基、巯甲基、卤素、乙基、正丙基、异丙基、正丁基、巯乙基、甲氧基、乙氧基、丙氧基、三甲基硅基或氘代三甲基硅基、苯基、萘基、蒽基和乙酰基中的任一种;L1、L2分别独立的取自-O-、-S-、-CH2-、-SiH2-、-CO-、-NH-和砜基中的任一种。
4.根据权利要求2所述的聚酰亚胺前体,其特征在于,所述二胺选自权利要求1中所述柔性二胺中的任意一种或多种。
5.根据权利要求2所述的聚酰亚胺前体,其特征在于,所述二胺还包括如下所示的二胺中的任意一种或多种:
6.根据权利要求2所述的聚酰亚胺前体,其特征在于,所述芳香族四羧酸二酐具有如式(II)所示的结构:
式(II)中,Ar3选自下列结构中的任意一种:
7.权利要求2-6任一所述的聚酰亚胺前体的制备方法,其特征在于,包括如下步骤:将所述二胺和芳香族四羧酸二酐直接进行缩聚反应;或者将所述二胺单体和芳香族四羧酸二酐进行二元或者三元共聚;
优选地,所述缩聚反应、二元或三元共聚的温度为0~80℃;
优选地,所述缩聚反应、二元或三元共聚的时间为1~24h;
优选地,所述缩聚反应二元或三元共聚在保护气氛中进行。
8.一种感光树脂,其特征在于,所述感光树脂包括权利要求2-6任一所述的聚酰亚胺前体和感光性单体;
优选地,所述感光性单体选自二甲基丙烯酸三缩四乙二醇酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、四乙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、四乙二醇二甲基丙烯酸、三羟甲基丙烷二丙烯酸酯、三羟甲基丙烷三丙烯酸酯、三羟甲基丙烷二甲基丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、季戊四醇三烯酸酯、季戊四醇四丙烯酸酯、季戊四醇三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、苯乙烯、二乙烯基苯、4-乙烯基甲苯、4-乙烯基吡啶、N-乙烯基吡咯烷酮、甲基丙烯酸羟基乙酯、丙烯酸2-羟基乙酯、1,3-丙烯酰氧基-2-羟基丙烷、1,3-甲基丙烯酰氧基-2-羟基丙烷、亚甲基双丙烯酰胺、N,N-二甲基丙烯酰胺和N-羟甲基丙烯酰胺中的任意一种或几种。
9.一种聚酰亚胺,其特征在于,所述聚酰亚胺由权利要求2-6任一所述的聚酰亚胺前体固化得到。
10.权利要求1所述的柔性二胺或权利要求2-6任一所述的聚酰亚胺前体或权利要求8所述的感光树脂或权利要求9所述的聚酰亚胺在制备光刻胶、半导体器件、显示器件、照明器件以及电子封装领域中的应用。
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