CN116453997A - Chip positioning method and device - Google Patents

Chip positioning method and device Download PDF

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Publication number
CN116453997A
CN116453997A CN202310264662.9A CN202310264662A CN116453997A CN 116453997 A CN116453997 A CN 116453997A CN 202310264662 A CN202310264662 A CN 202310264662A CN 116453997 A CN116453997 A CN 116453997A
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Prior art keywords
chip
compensation amount
sensor
processed
line segment
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CN116453997B (en
Inventor
杜军
李俊杰
陈园园
朱强
李亚峰
周建国
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Tsingke Biotechnology Co Ltd
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Tsingke Biotechnology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention belongs to the technical field of biological DNA synthesis, and particularly relates to a chip positioning method and device. The chip positioning method comprises the following steps: acquiring the reference time of the mark line scanned to the reference chip according to a preset scanning step; after a reference chip is replaced by a chip to be processed provided with a marking line, acquiring a first detection time of the marking line of the chip to be processed according to a preset scanning step; determining an angle compensation amount according to the reference time and the first detection time, and moving the chip to be processed according to the angle compensation amount; acquiring a second detection time of the mark line of the chip to be processed according to a preset scanning step; and determining a displacement compensation amount according to the reference time and the second detection time, and moving the chip to be processed according to the displacement compensation amount. The chip positioning device can be used for the chip positioning method, can meet the production takt requirement of an automatic production line, is compatible with the requirements of precision and cost, and has higher cost performance.

Description

Chip positioning method and device
Technical Field
The invention belongs to the technical field of biological DNA synthesis, and particularly relates to a chip positioning method and device.
Background
With the development of the application field of the rear end of the biological DNA synthesis technology, the existing one-generation column method synthesis technology cannot meet the increasingly expanded market demands. On the premise of ensuring the synthesis efficiency and the synthesis length, the reduction of the synthesis cost while improving the synthesis flux gradually becomes one of the problems to be solved in the technical field of DNA synthesis. In the background of the market demand, a second generation DNA synthesis technology, namely a high-flux chip DNA synthesis technology, is generated. However, this technology was proposed in 2004, and by far, a large-scale commercial application has not yet been formed, and for this reason, we have found a technical problem of high-precision positioning of the synthesis sites on the chip from the standpoint of synthesis accuracy. The positioning accuracy of the synthesis sites on the chip is required to be on the order of a few micrometers or even nanometers. The conventional practice in the prior art is that manual positioning of the synthesis sites under a microscope is required after each chip placement. The alignment method not only needs expensive equipment such as a microscope or vision, but also has complicated operation and low efficiency. Only can meet the synthesis requirement of low efficiency of manual synthesis, and is difficult to meet the requirement of high-speed and high-efficiency automatic beat of an automatic production line.
There is another visual alignment mode in the market to meet the positioning requirement of the chip, but because the chip has angle deviation, two visual cameras are required to cooperate with complex algorithms, although the positioning speed and the positioning precision are improved, the use cost and the technical threshold are greatly improved. And because of the small chip size, the length and width of the chip are not more than 30x30mm. One lens size of a typical industrial camera can cover the chip surface. The two cameras are used for shooting the chips at the same time, which has severe requirements on the size of the cameras. And because the positioning accuracy is high and the requirement on the amplification factor of the camera is very strict, the camera with the amplification factor of more than 500 times can basically meet the requirement. Industrial cameras currently available on the market that meet both volume and magnification requirements are essentially absent, with only some consumer cameras such as super-eye. These civilian camera hairs are hot and have poor stability. Cannot be applied to the long-term operation requirement of automatic production.
Disclosure of Invention
The invention provides a chip positioning method and device, which are used for solving the technical problems of high cost, high implementation threshold, poor cost performance and the like under the condition of high positioning precision in the prior art.
The first aspect of the present invention provides a chip positioning method, which includes:
acquiring the reference time of the mark line scanned to the reference chip according to a preset scanning step;
after a reference chip is replaced by a chip to be processed provided with a marking line, acquiring a first detection time of the marking line of the chip to be processed according to a preset scanning step;
determining an angle compensation amount according to the reference time and the first detection time, and moving the chip to be processed according to the angle compensation amount;
acquiring a second detection time of the mark line of the chip to be processed according to a preset scanning step;
and determining a displacement compensation amount according to the reference time and the second detection time, and moving the chip to be processed according to the displacement compensation amount.
In an alternative aspect of the invention, the marking line comprises a first line segment, the first line segment of the reference chip extends along a first direction, and the preset scanning step comprises the following steps:
controlling the scanning device to have a first preset speed V 1 Translating along a second direction to scan to the first line segment, wherein the first direction is perpendicular to the second direction;
and controlling the scanning device to reset.
In an alternative aspect of the invention, the method,
the scanning device comprises a first sensor and a second sensor, wherein the first sensor and the second sensor are arranged at intervals along a first direction, and the distance L1 between the first sensor and the second sensor is smaller than the length of a first line segment;
the reference time includes the time T when the first sensor and the second sensor scan the first line segment of the reference chip 1 T and T 2 ；
The first detection time includes the time T when the first sensor and the second sensor scan the first line segment of the chip to be processed 1’ T and T 2’ ；
The second detection time comprises the time T when the first sensor and the second sensor scan the first line segment of the chip to be processed 1” T and T 2” 。
In an alternative aspect of the present invention, determining the angle compensation amount according to the reference time and the first detection time includes: according to T 1 、T 2 、T 1’ 、T 2’ 、V 1 L1 determines the angle compensation amount.
In an alternative aspect of the present invention, determining the displacement compensation amount according to the reference time and the second detection time includes:
according to T 1 、T 1” V (V) 1 Determining a displacement compensation amount; or alternatively
According to T 2 、T 2” V (V) 1 Determining a displacement compensation amount; or alternatively
According to T 1 、T 1” V (V) 1 Determining a displacement first displacement compensation amount; according to T 2 、T 2” V (V) 1 Determining a displacement second displacement compensation amount; and determining the displacement compensation amount according to the displacement first displacement compensation amount and the displacement second displacement compensation amount.
In an alternative aspect of the present invention, the marking line further includes a second line segment, the second line segment of the reference chip extends along a second direction, and the preset scanning step further includes:
controlling the scanning device to have a second preset speed V 2 Translating along the first direction to scan a second line segment;
and controlling the scanning device to reset.
In an alternative aspect of the invention, the scanning device further comprises a third sensor, the first sensor and the third sensor are arranged at intervals along the second direction, and the distance L2 between the first sensor and the third sensor is smaller than the length of the second line segment;
the reference time also comprises the time T when the first sensor and the third sensor scan the second line segment of the reference chip 3 T and T 4 ；
The first detection time also comprises the time T when the first sensor and the third sensor scan the second line segment of the chip to be processed 3’ T and T 4’ ；
The second detection time also comprises the time T when the first sensor and the third sensor scan the second line segment of the chip to be processed 3” T and T 4” 。
In an alternative aspect of the present invention, determining the angle compensation amount according to the reference time and the first detection time includes:
according to T 1 、T 2 、T 1’ 、T 2’ 、V 1 And L1 determines a first angle compensation amount;
according to T 3 、T 4 、T 3’ 、T 4’ 、V 2 And L2 determines a second angle compensation amount;
and determining the angle compensation amount according to the first angle compensation amount and the second angle compensation amount.
In an alternative aspect of the present invention, the displacement compensation amount includes a first direction displacement compensation amount and a second direction displacement compensation amount, and determining the displacement compensation amount based on the reference time and the second detection time includes:
according to T 1 、T 1” V (V) 1 And/or T 2 、T 2” V (V) 1 Determining a second directional displacement compensation amount;
according to T 3 、T 3” V (V) 2 And/or T 4 、T 4” V (V) 2 A first directional displacement compensation amount is determined.
In an alternative aspect of the present invention, before acquiring the reference time of the mark line scanned to the reference chip according to the preset scanning step, the chip positioning method further includes:
the reference chip is calibrated such that the reference chip is located at a reference position, and in the case where the reference chip is located at the reference position, a first line segment of the reference chip is parallel to the first direction, and a second line segment of the reference chip is parallel to the second direction.
The second aspect of the invention provides a chip positioning device for realizing the positioning method, which comprises a horizontal table, a movable portal frame and a micro-motion platform; the movable gantry is arranged on the horizontal platform and connected with the scanning device, and the movable gantry is arranged to drive the scanning device to move relative to the horizontal platform so that the scanning device scans according to a preset scanning step; the micro-motion platform is arranged on the horizontal platform and located in the operation coverage area of the scanning device, and is used for placing the reference chip and the chip to be processed and is arranged to be used for moving the chip to be processed according to the angle compensation quantity and moving the chip to be processed according to the displacement compensation quantity so as to position the chip to be processed.
Compared with the prior art, the invention has the following beneficial effects:
the chip positioning device provided by the invention can be compatible with the requirements of precision and cost, and has higher cost performance. The device is used in cooperation with a chip provided with a marking line, the time for scanning the marking line on the chip is acquired by adopting a scanning device with lower cost, and the position of the marking line is fed back through the time.
And calibrating the reference position through the reference chip, sequentially acquiring the reference time of scanning the mark line on the reference chip and the detection time of the mark line on the chip to be processed, and calculating the compensation amount according to the reference time and the detection time, so that the chip to be processed can be moved by the compensation amount, and the chip to be processed is positioned at the reference position to finish micrometer-level positioning.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a chip positioning apparatus provided in accordance with one embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating a moving process of a chip to be processed relative to a reference chip according to one embodiment of the present invention; wherein fig. 2a is a schematic diagram of a reference chip in a reference position; FIG. 2b is a schematic diagram of the relative positions of the chip to be processed and the reference chip; FIG. 2c is a schematic diagram of the relative position of the chip to be processed and the reference chip after the chip to be processed moves by an angle compensation amount;
FIG. 3 is a block diagram illustrating a chip positioning method according to one embodiment of the present invention;
fig. 4 is a connection relation block diagram of a control module in a chip positioning device according to one embodiment of the present invention.
Reference numerals
100. A chip positioning device; 110. a horizontal stand; 120. moving the portal frame; 121. an X-direction linear module; 122. a Y-direction linear module; 123. a portal frame; 130. a micro-motion platform; 140. a scanning device; 141. a first sensor; 142. a second sensor; 143. third sensor
200. A control module;
11. a reference chip; 12. and (5) processing the chip.
Detailed Description
To further clarify the above and other features and advantages of the present invention, a further description of the invention will be rendered by reference to the appended drawings. It should be understood that the specific embodiments presented herein are for purposes of explanation to those skilled in the art and are intended to be illustrative only and not limiting.
Fig. 1 is a schematic diagram of a chip positioning apparatus according to one embodiment of the present invention. Referring to fig. 1, in one aspect, the present invention provides a chip positioning apparatus 100, which includes a horizontal stand 110, a moving gantry 120, and a micro-motion platform 130.
The mobile gantry 120 is disposed on the horizontal table 110 and connected to the scanning device 140, and the mobile gantry 120 is configured to drive the scanning device 140 to move relative to the horizontal table 110, so that the scanning device 140 scans according to a preset scanning procedure. The micro-motion stage 130 is disposed on the horizontal stage 110 and is located in the working coverage area of the scanning device 140.
Referring to fig. 1, in the present disclosure, a three-dimensional coordinate system is constructed based on a horizontal table 110, and the moving gantry 120 is configured to have at least an X-direction translational degree of freedom and a Y-direction translational degree of freedom in the three-dimensional coordinate system, so as to drive the scanning device 140 to move along the X-direction and the Y-direction, so that the scanning device 140 can scan a chip placed on the micro-motion platform 130.
In particular applications, the mobile gantry 120 includes an X-direction linear module 121, a Y-direction linear module 122, and a gantry 123. The number of the Y-direction linear modules 122 is 2 and are arranged on the horizontal table 110 at intervals along the X-direction, the Y-direction linear modules 122 have a Y-direction translational degree of freedom, and the gantry 123 is connected to the Y-direction linear modules 122, so that the gantry 123 has a Y-direction translational degree of freedom.
The X-direction linear module 121 is disposed on a beam (disposed along the X-direction) of the gantry 123 and has an X-direction translational degree of freedom, and the scanning device 140 is connected to the X-direction linear module 121, so that the scanning device 140 has an X-direction translational degree of freedom and a Y-direction translational degree of freedom.
It should be noted that, the micro-motion stage 130 may use a stage device with a micro-motion function, and in this disclosure, the micro-motion stage 130 includes an X-direction translational degree of freedom, a Y-direction translational degree of freedom, and a Z-direction rotational degree of freedom.
In the present disclosure, the micro stage 130 is used for placing the reference chip 11 and the chip 12 to be processed and is configured for moving the chip 12 to be processed according to the angle compensation amount and for moving the chip 12 to be processed according to the displacement compensation amount to position the chip 12 to be processed.
In a specific application, the micro-motion platform 130 compensates the deflection angle of the chip 12 to be processed by driving the chip 12 to be processed to rotate around the Z direction, and the micro-motion platform 130 compensates the deflection displacement of the chip 12 to be processed by driving the chip 12 to be processed to translate along the X direction or the Y direction.
In the present disclosure, the table top of the horizontal table 110 has a good levelness, so that the moving gantry 120 and the micro-motion stage 130 are guaranteed to move in the XY plane, and accordingly, the chips placed on the micro-motion stage 130 are limited to move in the XY plane. In a specific application, the horizontal stage 110 may employ, for example, an optical stage or a marble horizontal tabletop, etc., without limitation.
Fig. 4 is a connection block diagram of the control module 200 in the chip positioning apparatus 100 according to one embodiment of the present invention. Referring to fig. 4, the control module 200 is connected to the moving gantry 120, the micro-motion platform 130 and the scanning device 140, and the control module 200 can control the moving gantry 120 and the micro-motion platform 130 to move and acquire data from the scanning device 140.
Specifically, the control module 200 controls the moving gantry 120 to move, and further drives the scanning device 140 to move according to a preset moving step, so as to obtain the relative positions of the reference chip 11 and the chip 12 to be processed. The control module 200 further controls the micro-motion platform 130 to move according to the relative positions of the two, so that the position of the chip 12 to be processed is overlapped with the position of the reference chip 11, and the chip 12 to be processed is positioned.
In a specific application, the control module 200 is a control module designed based on a Programmable Logic Controller (PLC); or a control module designed based on a singlechip, and is not particularly limited.
Fig. 3 is a block flow diagram of steps of a chip positioning method according to one embodiment of the present invention. Referring to fig. 3, another aspect of the present invention further provides a chip positioning method, which can be applied to the control module 200 and includes the following steps.
Step S301, acquiring a reference time of the mark line scanned to the reference chip 11 according to a preset scanning step.
Specifically, the reference chip 11 is used to provide a reference position, and thus, before step S301, the chip positioning method further includes calibrating the reference chip 11 so that the reference chip 11 is located at the reference position.
In a specific application, the reference chip 11 is calibrated using a tool (e.g., a microscope) such that the reference chip 11 is located at a reference position. It can be seen that in the present disclosure, the reference position of the reference chip 11 is fed back by acquiring the reference time.
In addition, in the actual production process, the marking line is provided on the chip by an etching process, but it is needless to say that the marking line is not limited thereto, and may be provided by an engraving process or the like, for example.
In an alternative embodiment, the marking line includes a first line segment M1, and after calibrating the reference chip 11, the first line segment M1 of the reference chip 11 extends along the first direction, and the preset scanning step includes:
the scanning device 140 is controlled to have a first preset speed V 1 Translating along a second direction to scan the first line segment M1, wherein the first direction is perpendicular to the second direction;
the scanning device 140 is controlled to reset.
In order to facilitate understanding of the present embodiment, in the present disclosure, the first direction and the second direction are parallel to the X-direction and the Y-direction, respectively, in the three-dimensional coordinate system constructed based on the horizontal table 110, and a repetitive description will not be made in the following embodiments.
The position before the scanning device 140 is not operated is the initial position, and the scanning device 140 is controlled to reset, i.e., the scanning device 140 is controlled to return to the initial position.
Fig. 2 is a schematic diagram illustrating a moving process of a chip 12 to be processed relative to a reference chip 11 according to one embodiment of the present invention. Referring to fig. 1 and 2, the scanning device 140 is located above the chip in the initial position, and it is required to ensure that the scanning device 140 can intersect the first line segment M1 when translating in the Y direction from the initial position, so as to ensure that the first line segment M1 is scanned.
In an alternative embodiment, the scanning device 140 includes a first sensor 141 and a second sensor 142, where the first sensor 141 and the second sensor 142 are spaced apart along the first direction and a distance L1 therebetween is less than a length of the first line segment M1. The layout sensor ensures that both the first sensor 141 and the second sensor 142 can scan the first line segment M1.
In a specific application, the sensor in the scanning device 140 generates a rising edge signal when scanning the mark line, and the control module 200 determines the time when scanning the mark line by capturing the rising edge signal. Of course, not limited thereto, for example, the sensor may generate a falling edge signal in the event that a marking line is scanned, and the control module 200 determines the time when the marking line is scanned by capturing the falling edge signal.
Fig. 2a is a schematic illustration of the reference chip 11 in a reference position. Referring to fig. 2a, the scanning device 140 moves according to a predetermined scanning procedure to scan the first line segment M1 of the reference chip 11, and determines the time for scanning the first line segment M1. It can be seen that in the present disclosure, the reference time includes the time T at which the first sensor 141 and the second sensor 142 scan the first line segment M1 of the reference chip 11 1 T and T 2 。
In step S302, after the chip 12 to be processed provided with the mark line is replaced with the reference chip 11, the first detection time of the mark line scanned to the chip 12 to be processed is obtained according to the preset scanning step.
In the present disclosure, the reference chip 11 and the chip 12 to be processed have the same structure, i.e., are provided with the marking lines, in other words, the chip 12 to be processed is also provided with the first line segment M1 at the same position. Fig. 2b is a schematic diagram of the relative positions of the chip 12 to be processed and the reference chip 11. Referring to fig. 2b, after the chip 12 to be processed is replaced with the reference chip 11, the position of the chip 12 to be processed and the position of the reference chip 11 cannot be guaranteed to be coincident, and the positions of the two chips have deviation.
After the scanning device 140 is controlled to move according to the preset scanning steps, the first line segment M1 of the chip 12 to be processed can be scanned, and the time for scanning the first line segment M1 is determined. It can be seen that, in the present disclosure, the first detection time includes a time T when the first sensor 141 and the second sensor 142 scan the first line segment M1 of the chip 12 to be processed 1’ T and T 2’ 。
In step S303, an angle compensation amount θ is determined according to the reference time and the first detection time, and the chip 12 to be processed is moved according to the angle compensation amount θ.
Specifically, step S303 includes the step of following T 1 、T 2 、T 1’ 、T 2’ 、V 1 And L1 determines an angle compensation amount θ. Referring to fig. 2b, the angle compensation amount θ can be determined according to the following formula.
[(T 1 -T 1’ )*V 1 -(T 2 -T 2’ )*V 1 ]/L1＝tanθ
It can be understood that the deflection angle of the chip 12 to be processed relative to the reference chip 11 is an angle compensation amount θ, and in the present disclosure, the angle compensation amount θ is the deflection angle of the first line segment M1 on the chip 12 to be processed compared to the first line segment M1 on the reference chip 11.
After the angle compensation amount θ is determined, the micro-motion platform 130 is controlled to rotate around the Z direction by the angle compensation amount θ, so that the orientation of the chip 12 to be processed can be adjusted, and the first line segment M1 on the chip 12 to be processed is parallel to the first line segment M1 on the reference chip 11.
Step S304, obtaining a second detection time of the mark line of the chip 12 to be processed according to the preset scanning step.
Fig. 2c is a schematic diagram showing the relative positions of the chip 12 to be processed and the reference chip 11 after being moved by the angle compensation amount θ. Referring to fig. 2c, after the chip 12 to be processed moves by the angle compensation amount θ, the first line segments M1 on the two chips are arranged at intervals in the Y direction.
After the chip 12 to be processed moves by the angle compensation amount θ, the scanning device 140 is moved according to a predetermined scanning procedure, so as to scan the first line segment M1 of the chip 12 to be processed, and determine the time for scanning the first line segment M1. It can be seen that, in the present disclosure, the second detection time includes a time T when the first sensor 141 and the second sensor 142 scan the first line segment M1 of the chip 12 to be processed 1” T and T 2” 。
In step S305, a displacement compensation amount is determined according to the reference time and the second detection time, and the chip 12 to be processed is moved according to the displacement compensation amount.
Specifically, step S305 includes:
according to T 1 、T 1” V (V) 1 Determining a displacement compensation amount; or alternatively
According to T 2 、T 2” V (V) 1 Determining a displacement compensation amount; or alternatively
According to T 1 、T 1” V (V) 1 Determining the first position of displacementA motion compensation amount; according to T 2 、T 2” V (V) 1 Determining a displacement second displacement compensation amount; and determining a displacement compensation amount according to the displacement first displacement compensation amount and the displacement second displacement compensation amount.
After the chip 12 to be processed is rotated by the preset angle, the first line segment M1 on the chip 12 to be processed is parallel to the first line segment M1 on the reference chip 11. In an alternative embodiment, the first sensor 141 detects the time difference (T 1 -T 1” ) With a first preset speed V 1 The product of (2) is the displacement compensation amount. Alternatively, the second sensor 142 detects the time difference (T 2 -T 2” ) With a first preset speed V 1 The product of (2) is the displacement compensation amount.
In another alternative embodiment, the first sensor 141 detects the time difference (T 1 -T 1” ) With a first preset speed V 1 The product of (a) is a first displacement compensation amount, and the second sensor 142 detects a time difference (T 2 -T 2” ) With a first preset speed V 1 The product of (2) is a second displacement compensation amount, which is the average of the first displacement compensation amount and the second displacement compensation amount in order to improve the accuracy.
As can be seen from the above, the displacement compensation amount is a displacement offset of the first line segment M1 of the chip 12 to be processed in the Y direction, i.e., a displacement compensation amount in the second direction, with respect to the first line segment M1 of the reference chip 11. In practice, however, the chip 12 to be processed does not generate a displacement offset only in the second direction.
Thus, in an alternative embodiment, the marking line further comprises a second line segment M2, the second line segment M2 of the reference chip 11 extending in the second direction, i.e. in the Y-direction. Referring to fig. 2a, in the present disclosure, when the reference chip 11 is located at the reference position, the first line segment M1 is parallel to the X direction, and the second line segment is parallel to the Y direction.
In addition, the preset scanning step further includes:
controlling the scanning device 140 to be a secondPreset speed V 2 Translating along the first direction to scan the second line segment M2;
the scanning device 140 is controlled to reset.
That is, the preset scanning step includes two scanning processes, wherein one scanning process is to control the scanning device 140 to translate along the Y direction to scan the first line segment M1, and the other scanning process is to control the scanning device 140 to translate along the X direction to scan the second line segment M2, and after each scanning process is completed, the scanning device 140 needs to be controlled to reset for the next scanning. Note that the order of the two scanning processes is not limited.
Further, the scanning device 140 further includes a third sensor 143, where the first sensor 141 and the third sensor 143 are spaced apart along the second direction, and a distance L2 between the first sensor and the third sensor 143 is smaller than a length of the second line segment M2. Such an arrangement ensures that the first sensor 141 and the third sensor 143 can scan the second line segment M2.
Since the preset scanning step includes two scanning processes, after the control scanning device 140 moves according to the preset scanning step, the reference time further includes a time T when the first sensor 141 and the third sensor 143 scan the second line segment M2 of the reference chip 3 T and T 4 . The first detection time further comprises a time T when the first sensor 141 and the third sensor 143 scan the second line segment M2 of the chip 12 to be processed 3’ T and T 4’ . The second detection time also includes a time T when the first sensor 141 and the third sensor 143 scan the second line segment M2 of the chip 12 to be processed 3” T and T 4” 。
Thus, in step S303, it includes:
according to T 1 、T 2 、T 1’ 、T 2’ 、V 1 And L1 determines a first angle compensation amount;
according to T 3 、T 4 、T 3’ 、T 4’ 、V 2 And L2 determines a second angle compensation amount;
and determining the angle compensation amount according to the first angle compensation amount and the second angle compensation amount.
Specifically, according to the following two general principlesDetermining the first angle compensation quantity theta respectively 1 Second angle compensation quantity theta 2 。
[(T 1 -T 1’ )*V 1 -(T 2 -T 2’ )*V 1 ]/L1＝tanθ 1
[(T 3 -T 3’ )*V 2 -(T 4 -T 4’ )*V 2 ]/L2＝tanθ 2
From the above, the first angle compensation amount θ 1 Is the angle of deflection of the first line segment M1 on the chip 12 to be processed compared to the first line segment M1 on the reference chip 11. As can be seen from the combination of fig. 2b, the second angle compensation amount θ 2 Is the angle of deflection of the second line segment M2 on the chip 12 to be processed compared to the second line segment M2 on the reference chip 11.
In an alternative embodiment, the angle compensation amount θ is a first angle compensation amount θ 1 Or a second angle compensation amount theta 2 The method comprises the steps of carrying out a first treatment on the surface of the In order to improve the accuracy, in another alternative embodiment, the angle compensation amount θ is a first angle compensation amount θ 1 Or a second angle compensation amount theta 2 Is a mean value of (c).
Referring to fig. 2c, the displacement compensation amounts include a first direction displacement compensation amount Δs1 and a second direction displacement compensation amount Δs2, where the first direction compensation amount Δs1 is a displacement offset of the second line segment M2 on the chip 12 to be processed in the X direction relative to the second line segment M2 on the reference chip 11, and the second direction compensation amount Δs2 is a displacement offset of the first line segment M1 on the chip 12 to be processed in the Y direction relative to the first line segment M1 on the reference chip 11.
In addition, step S305 includes:
step (1), according to T 1 、T 1” V (V) 1 And/or T 2 、T 2” V (V) 1 Determining a second direction displacement compensation amount delta S2;
step (2), according to T 3 、T 3” V (V) 2 And/or T 4 、T 4” V (V) 2 A first directional displacement compensation amount Δs1 is determined.
Further, step (1) includes:
according to T 1 、T 1” V (V) 1 Determining a second direction displacement compensation amount delta S2; or alternatively
According to T 2 、T 2” V (V) 1 Determining a second direction displacement compensation amount delta S2; or alternatively
According to T 1 、T 1” V (V) 1 Determining a second direction displacement by a first compensation amount delta S21;
according to T 2 、T 2” V (V) 1 Determining a second direction displacement by a second compensation amount deltas 22;
the second direction displacement compensation amount Δs2 is determined according to the second direction displacement first compensation amount Δs21 and the second direction displacement second compensation amount Δs22.
Specifically, in an alternative embodiment, the second direction displacement compensation amount Δs2 is a time difference (T 1 -T 1” ) With a first preset speed V 1 Is a product of (2); alternatively, the second direction displacement compensation Δs2 is a time difference (T 2 -T 2” ) With a first preset speed V 1 Is a product of (a) and (b).
To improve accuracy, in another alternative embodiment, the second direction displacement by the first compensation amount Δs21 is the time difference (T 1 -T 1” ) With a first preset speed V 1 Is a product of (2); the second offset Δs22 is a time difference (T) between two times before and after the second sensor 142 detects the first line segment M1 2 -T 2” ) With a first preset speed V 1 Is a product of (a) and (b). The second direction displacement compensation amount Δs2 is the average value of the second direction displacement first compensation amount Δs21 and the second direction displacement second compensation amount Δs22.
Further, step (2) includes:
according to T 3 、T 3” V (V) 2 Determining a first directional displacement compensation amount deltas 1; or alternatively
According to T 4 、T 4” V (V) 2 Determining a first partyA displacement compensation amount Δs1; or alternatively
According to T 3 、T 3” V (V) 2 Determining a first direction displacement by a first compensation amount deltas 11;
according to T 4 、T 4” V (V) 2 Determining a first directional displacement second compensation amount deltas 12;
the second direction compensation amount Δs1 is determined based on the first direction displacement compensation amount Δs11 and the second direction displacement compensation amount Δs12.
Specifically, in an alternative embodiment, the first directional displacement compensation amount Δs1 is a time difference (T 3 -T 3” ) And a second preset speed V 2 Is a product of (2); alternatively, the first direction displacement compensation amount Δs1 is a time difference (T 4 -T 4” ) And a second preset speed V 2 Is a product of (a) and (b).
To improve accuracy, in an alternative embodiment, the first direction displacement first compensation amount Δs11 is a time difference (T 3 -T 3” ) And a second preset speed V 2 Is a product of (2); the first-direction displacement second compensation amount Δs12 is a time difference (T 4 -T 4” ) And a second preset speed V 2 Is a product of (a) and (b). The first direction displacement compensation amount Δs1 is the average of the first direction displacement first compensation amount Δs11 and the first direction displacement second compensation amount Δs12.
In the chip positioning method provided by the present disclosure, calibration is performed on the reference chip 11 to locate at the reference position, and then the scanning device 140 is controlled to move in the X-direction and the Y-direction respectively to perform two scans to obtain the time of scanning the mark line, i.e. the reference time, and the reference position is fed back through the reference time.
Next, the reference chip 11 is replaced by the chip 12 to be processed, the scanning process is repeated to obtain a first detection time, the original position of the chip 12 to be processed is fed back through the first detection time, and the angular deflection of the chip 12 to be processed relative to the reference chip 11, namely the angular compensation amount θ, can be determined by comparing the first detection time with the reference time.
Then, after the chip 12 to be processed is rotated by the angle offset θ, the scanning process is repeated to obtain a second detection time, the position of the chip 12 to be processed after rotation is fed back through the second detection time, and displacement deflection, i.e. displacement compensation, of the chip 12 to be processed relative to the reference chip 11 can be determined by comparing the second detection time with the reference time.
Then, the chip 12 to be processed is moved by the displacement compensation amount, so that the chip 12 to be processed is positioned at the reference position, and positioning is completed.
In the present disclosure, the error requirement of the micrometer level can be basically satisfied by two scans and two fine adjustments, and in order to improve the accuracy, the steps S302 to S305 can be repeated to perform multiple scans and multiple fine adjustments.
In the above embodiment, the first sensor 141, the second sensor 142, and the third sensor 143 are all laser sensors, but the present invention is not limited to this, and may be, for example, photoelectric sensors. Of course, the number of sensors in the scanning device 140 may be greater than three.
In the present disclosure, the repeated positioning accuracy of the moving gantry 120 is 1 micrometer, the repeated positioning of the micro-motion stage 130 is 0.5 micrometer, the response speed of the laser sensor is 15us, the processing speed of the control module 200 is within 20ms, and the adjustment time of the micro-motion stage 130 is within 1S.
In order to ensure the measurement accuracy, the moving speed of the moving gantry 120 to drive the scanning device 140 is 15mm/S, the scanning device 140 needs to move about 60mm (the length and width of the chip is 30mmX and 30mm, and the scanning device 140 is positioned at the middle position of the chip), the time is about 4S, and the positioning can be completed in less than 6S. At present, the takt time of the automated gene production line is generally more than 5 minutes, so the chip positioning device 100 completely meets the requirement of the automated takt time.
In addition, scanning chip mark line triggered edge signal by laser sensorAnd (5) performing position location at the triggering time. Since the laser sensors of the scan reference chip 11 and the chip 12 to be processed which needs to be aligned at this time are not changed, the corresponding speed of the laser sensor is 15us, and the response time error is required to be within 15 us. According to 15mm/s calculated error at 15mm/s 15 x 10 -6 =0.2 microns. The repeated positioning error of the moving gantry 120 is 1 micron. The overall error is within 2 microns. While chip positioning errors are required to be within 5 microns. Completely meets the positioning precision requirement.
The present disclosure employs low cost laser sensors, typically a few hundred cost, more than one thousand expensive. The price of the similar vision or microscope is about 5-15W, and the cost is greatly reduced.
In summary, the chip positioning device 100 provided by the present disclosure can meet the production takt requirement of an automatic production line, can be compatible with the precision and cost requirements, and has a higher cost performance.
Those of ordinary skill in the art will appreciate that the steps of the methods of the present application may be accomplished by a computer program, which may be stored in a non-transitory computer readable storage medium, that instructs related hardware, such as a computer device or a processor, to perform the steps of the methods of the present application when the computer program is executed. Any reference herein to memory, storage, database, or other medium may include non-volatile and/or volatile memory, as the case may be. Examples of nonvolatile memory include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), flash memory, magnetic tape, floppy disk, magneto-optical data storage, hard disk, solid state disk, and the like. Examples of volatile memory include Random Access Memory (RAM), external cache memory, and the like.
The technical features described above may be arbitrarily combined. Although not all possible combinations of features are described, any combination of features should be considered to be covered by the description provided that such combinations are not inconsistent.
While the present application has been described in conjunction with the embodiments, it is to be understood by those skilled in the art that the foregoing description and drawings are illustrative only and not limiting, and that the present application is not limited to the disclosed embodiments. Various modifications and variations are possible without departing from the spirit of the application.

Claims (11)

1. A chip positioning method, comprising:
acquiring the reference time of the mark line scanned to the reference chip according to a preset scanning step;
after a chip to be processed provided with a mark line is replaced by the reference chip, acquiring a first detection time of the mark line of the chip to be processed according to the preset scanning step;
determining an angle compensation amount according to the reference time and the first detection time, and moving the chip to be processed according to the angle compensation amount;
acquiring a second detection time of the mark line of the chip to be processed according to the preset scanning step;
and determining a displacement compensation amount according to the reference time and the second detection time, and moving the chip to be processed according to the displacement compensation amount.
2. The chip positioning method according to claim 1, wherein the marking line includes a first line segment, the first line segment of the reference chip extends along a first direction, and the preset scanning step includes:
controlling the scanning device to have a first preset speed V 1 Translating along a second direction to scan the first line segment, wherein the first direction is perpendicular to the second direction;
and controlling the scanning device to reset.
3. The method for positioning a chip according to claim 2, wherein,
the scanning device comprises a first sensor and a second sensor, wherein the first sensor and the second sensor are arranged at intervals along the first direction, and the distance L1 between the first sensor and the second sensor is smaller than the length of the first line segment;
the reference time comprises the time T when the first sensor and the second sensor scan to the first line segment of the reference chip 1 T and T 2 ；
The first detection time includes a time T when the first sensor and the second sensor scan a first line segment of the chip to be processed 1’ T and T 2’ ；
The second detection time includes a time T when the first sensor and the second sensor scan a first line segment of the chip to be processed 1” T and T 2” 。
4. The chip positioning method according to claim 3, wherein determining an angle compensation amount based on the reference time and the first detection time includes: according to T 1 、T 2 、T 1’ 、T 2’ 、V 1 And L1 determines the angle compensation amount.
5. The chip positioning method according to claim 3, wherein determining a displacement compensation amount based on the reference time and the second detection time includes:
according to T 1 、T 1” V (V) 1 Determining the displacement compensation amount; or alternatively
According to T 2 、T 2” V (V) 1 Determining the displacement compensation amount; or alternatively
According to T 1 、T 1” V (V) 1 Determining a displacement first displacement compensation amount; according to T 2 、T 2” V (V) 1 Determining a displacement second displacement compensation amount; and determining the displacement compensation amount according to the displacement first displacement compensation amount and the displacement second displacement compensation amount.
6. The chip positioning method according to claim 3, wherein the marking line further includes a second line segment, the second line segment of the reference chip extends along a second direction, and the preset scanning step further includes:
controlling the scanning device to a second preset speed V 2 Translating along a first direction to scan the second line segment;
and controlling the scanning device to reset.
7. The chip positioning method according to claim 6, wherein the scanning device further comprises a third sensor, the first sensor and the third sensor are arranged at intervals along the second direction, and a distance L2 between the first sensor and the third sensor is smaller than a length of the second line segment;
the reference time also comprises the time T from the first sensor to the second line segment of the reference chip 3 T and T 4 ；
The first detection time also comprises the time T when the first sensor and the third sensor scan the second line segment of the chip to be processed 3’ T and T 4’ ；
The second detection time also comprises the time T when the first sensor and the third sensor scan the second line segment of the chip to be processed 3” T and T 4” 。
8. The chip positioning method according to claim 7, wherein determining an angle compensation amount based on the reference time and the first detection time includes:
according to T 1 、T 2 、T 1’ 、T 2’ 、V 1 And L1 determines a first angle compensation amount;
according to T 3 、T 4 、T 3’ 、T 4’ 、V 2 And L2 determines a second angle compensation amount;
and determining the angle compensation amount according to the first angle compensation amount and the second angle compensation amount.
9. The chip positioning method according to claim 7, wherein the displacement compensation amount includes a first direction displacement compensation amount and a second direction displacement compensation amount, and determining the displacement compensation amount based on the reference time and the second detection time includes:
according to T 1 、T 1” V (V) 1 And/or T 2 、T 2” V (V) 1 Determining the second direction displacement compensation amount;
according to T 3 、T 3” V (V) 2 And/or T 4 、T 4” V (V) 2 The first directional displacement compensation amount is determined.
10. The chip positioning method according to claim 6, wherein before acquiring the reference time of scanning the mark line of the reference chip according to the preset scanning step, the chip positioning method further comprises:
the reference chip is calibrated so that the reference chip is located at a reference position, a first line segment of the reference chip is parallel to a first direction, and a second line segment of the reference chip is parallel to a second direction when the reference chip is located at the reference position.
11. A chip positioning device, characterized in that the chip positioning device is used for realizing the positioning method of any one of claims 2-9, and comprises a horizontal table, a movable portal frame and a micro-motion platform;
the movable gantry is arranged on the horizontal table and connected with the scanning device, and the movable gantry is arranged to drive the scanning device to move relative to the horizontal table so as to enable the scanning device to scan according to the preset scanning step;
the micro-motion platform is arranged on the horizontal platform and located in the operation coverage area of the scanning device, and is used for placing the reference chip, the chip to be processed and the chip to be processed, and moving the chip to be processed according to the angle compensation quantity and the displacement compensation quantity so as to position the chip to be processed.
CN202310264662.9A 2023-03-17 2023-03-17 Chip positioning method and device Active CN116453997B (en)

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