JPH10202381A - Laser beam cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold a cutting cross section and the side surface of a metallic film in a constant and to improve cutting precision by measuring the position of a diamond heat sink material placed on a table and the position of its exposed part with an x-y-θ coordinate and an X-Y-Θ coordinate respectively and driving and controlling the table. SOLUTION: An object 51 to be worked is photographed with a high magnification camera 37 and the position data are delivered to an x-y-θ coordinate numerical value data processing part 13. The position of the object 51 to be worked is recognized as the X-Y-Θ coordinate with an X-Y-Θ coordinate numerical value data processing part 25. The coordinates of the object 51 to be worked are recognized from these two coordinates with an arithmetic processing part 14, and a signal is sent to a driving controller 27 via a CPU 21 so that the object 51 to be worked is positioned in the prescribed position. The table 50 is driven based on the signal sent from the arithmetic processing part 14 with the driving controller 27 to position the object 51 to be worked in the prescribed position. The object 51 to be worked is cut by moving the table 50 without changing the position of a laser beam 41.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting apparatus for manufacturing a diamond heat sink in which a surface of polycrystalline diamond is metallized, and more particularly, to a laser cutting apparatus having a smooth side surface and an electrical connection between upper and lower metal films. The present invention relates to a laser cutting device for manufacturing a diamond heat sink capable of sufficiently securing resistance.

[0002]

2. Description of the Related Art A heat sink (radiator) is used to efficiently dissipate heat generated during operation of a device such as a semiconductor laser diode, an LED (light emitting diode), and a semiconductor high frequency device. The material of the heat sink is selected according to the calorific value of the device to be used.

[0003] Diamond has the property of having a very high thermal conductivity. Therefore, a diamond heat sink using diamond is used as a heat radiating member of a device that generates a large amount of heat, for example, a high-power semiconductor laser. The present applicant has proposed a method for manufacturing this diamond heat sink in a prior patent application (Japanese Patent Application No. 8-955).

FIG. 23 is a process chart showing a method of manufacturing the diamond heat sink described in the above-mentioned application. With reference to FIG. 23, a first method for manufacturing a conventional diamond heat sink will be described. First, polycrystalline diamond is manufactured by a gas phase method or the like, and is processed into a flat plate shape (step 2020). Next, the flattened diamond is subjected to metallization. By this metallization process, a metal film is formed on the entire surface of the diamond (Step 2021). Next, a grid-like portion including at least the cutting position of the metal film is removed by etching. It goes without saying that masking is performed first before etching. As a result, a metal film is partially formed (Step 2022). Finally, the partially metallized diamond is cut by laser at the grid-like portions. This cutting completes the diamond heat sink (step 2023).

Next, a second method of manufacturing the diamond heat sink described in the above-mentioned application will be described. The polycrystalline diamond is manufactured by a gas phase method or the like, and is processed into a flat plate shape (step 2020). Next, the surface of the diamond except for at least the cutting position is subjected to metallization by a metal mask method, a lift-off method, or the like. By this metallization, a mesh-shaped metal film is formed on the surface of the diamond (Step 2024). Next, the diamond is cut by laser at a portion where the metal film is not formed. This cutting completes the diamond heat sink (step 202).
3).

Next, the first and second manufacturing methods will be described more specifically. FIG. 24 to FIG.
It is a perspective view which shows the manufacturing process of the conventional diamond heat sink. Referring to FIG. 24, a substrate 2001 made of a polycrystalline diamond is manufactured by a gas phase method or the like.

Referring to FIG. 25, in the first manufacturing method, the entire surface of substrate 2001 is subjected to metallization,
A metal film 2002 covering the substrate 2001 is formed.
This step is omitted in the second manufacturing method.

Referring to FIG. 26, in the first manufacturing method, at least the portion of the metal film including the cutting position on the upper surface of the metal film covering the entire surface of substrate 2001 is removed. In the second manufacturing method, a metal film is formed on the upper surface of the substrate 2001 except for at least the cutting position by a metal mask method, a lift-off method, or the like. Further, a metal film 2004 is formed on the entire lower surface of the substrate 2001. In this manner, the metal film 2003 and the diamond exposed portion 2012 with the diamond surface exposed are formed on the upper surface of the substrate 2001.

Referring to FIG. 27, a substrate 2001 is cut by a laser along the exposed diamond portion 2012. At this time, the side surface of the metal film 2003 is set so as not to be located on the cut surface by the laser. By this cutting, the diamond heat sink 2005 in which all four side surfaces are cut surfaces by the laser is completed.

[0010]

Here, the substrate 2001
The procedure for cutting the laser beam with a laser will be described. First,
The exposed diamond portion 2012 is observed with a low magnification camera. Next, a cutting line is visually set at a position apart from the side surface of the metal film 2003 based on the state of the diamond exposed portion 2012 observed by the low magnification camera. Finally, the substrate 2001 is cut by the laser along the cutting line.

However, in order to produce many diamond heat sinks from one substrate 2001, it is necessary to reduce the width of the diamond exposed portion 2012. Here, the width of the diamond exposed part 2012 is 0.1
mm or less, in the above-described method, the cutting line is set based on information visually obtained through a low-magnification camera, and the positioning of the substrate is manually performed. Therefore, high cutting accuracy could not be maintained because of errors.

Further, since the error calibration is performed visually, an offset error occurs between the laser cutting position and the virtual processing position on the image processing screen.

Further, since the xy axes on the image processing screen do not match the XY axes on the table on which the substrate is placed,
Even if you set the cutting line on the screen so that it passes through the center of the exposed part, you cannot actually cut along the cutting line,
The actual cutting line was sometimes inclined.

Further, when the substrate is cut in the X-axis direction, the table is rotated by 90 ° to cut the substrate in the Y-axis direction. At this time, since the center of rotation of the table is not known,
When cutting the substrate in a grid, first cut in the X-axis direction,
Next, it was necessary to perform positioning again when cutting in the Y-axis direction.

Therefore, the present invention has been made to solve the above-described problems, and it is desirable to cut a diamond having a width of 0.1 mm or less with high precision to produce a diamond heat sink. It is an object of the present invention to provide a laser cutting device capable of performing the above.

[0016]

According to the present invention, there is provided a laser cutting apparatus in which a plurality of metal film patterns are arranged in a grid on a diamond substrate with an exposed portion having a width of 0.1 mm or less interposed therebetween. The heat sink material is to be cut by irradiating the exposed portion with laser light,
A first measuring unit, a second measuring unit, an arithmetic processing unit, and a drive control unit are provided.

The first measuring means measures the position of the diamond heat sink material placed on the table in xy-θ coordinates by means of a camera and image processing. The second measuring means measures the position of the exposed portion of the diamond heat sink material placed on the table in XY-Θ coordinates by NC control. The arithmetic processing means calculates the measured xy-θ coordinates and X-
The position control data is calculated by calculating the Y-Θ coordinates. The drive control means receives the position control data and drives the table.

In the laser cutting apparatus thus constructed, the position of the diamond heat sink material and the position of the exposed portion thereon are mechanically measured by the first and second measuring means. Then, the arithmetic processing means calculates position control data based on the position data of the exposed portion measured by the first and second measuring means. The position control data is obtained by associating the position data of the exposed part measured by the first measuring means with the position data of the exposed part measured by the second measuring means. Further, the position control data does not include an error caused by human observation. Therefore, based on this position control data, a cutting line is set in the same coordinate system as the XY-Θ coordinate system representing the position of the exposed portion. The table is driven along the cutting line by using the drive control means. By cutting in this manner, the diamond heat sink material is cut while keeping the cut surface and the side surface of the metal film at a certain distance. as a result,
A diamond heat sink material having an exposed portion having a width of 0.1 mm or less can be cut with high accuracy.

Further, it is preferable that the optical axis of the camera and the optical axis of the laser beam are coaxial. In this case, since the diamond heat sink material can be viewed from the direction in which the laser is irradiated, measurement errors by the camera can be prevented.

It is preferable that the arithmetic processing means converts the xy-θ coordinates into XY-Θ coordinates. in this case,
All the data at the xy-θ coordinates obtained by the first measuring means is converted to the XY-Θ coordinates. Therefore, the position data of the exposed part can be represented by XY-Θ coordinates. That is, the position data of the exposed part measured by the first measuring means and the position data of the exposed part measured by the second measuring means can be associated on the XY-Θ coordinates. As a result, since the XY-Θ coordinates are the coordinates on the table, if a cutting line is set on the XY-Θ coordinates, the table is driven, and the diamond is accurately aligned along the cutting line. The heat sink material can be cut.

It is preferable that the following relationship exists between the first control means, the arithmetic processing means and the drive control means.

The first control means recognizes the positions of the end faces in the X-axis direction of the plurality of metal patterns located on both sides of the cut portion on the exposed portion as xy-θ coordinates as a plurality of end face coordinates. The data is sent to the arithmetic processing means.

The arithmetic processing means calculates a midpoint of a plurality of end face coordinates represented by xy-θ coordinates, and converts the plurality of midpoints to XY-Θ coordinates. The arithmetic processing means calculates a cutting line by the least squares method based on a plurality of midpoints represented by XY-Θ coordinates, and calculates an angle β between the cutting line and the X-axis direction. And sends the data to the drive control means.

The substrate is cut after the drive control means rotates the substrate by an angle −β to make the cutting line parallel to the X axis.

In this case, a cutting line is set by the least square method based on the midpoint of the end face coordinates of the plurality of metal patterns. Therefore, even when the width of the exposed portion is reduced,
The diamond heat sink material can be cut accurately. After the cutting line is made parallel to the X axis, the substrate is moved in the X axis direction to cut the diamond heat sink material. Here, in general, when cutting a diamond heat sink material using a laser, cutting the material by moving only one axis of the table is more accurate than cutting the material by moving two axes of the table. Can be cut well. Therefore, in this device,
Since only the X axis is moved to cut the material, the material can be cut with high accuracy.

[0026]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic view showing a laser cutting apparatus according to the present invention. Referring to FIG. 1, a laser cutting device 1 includes:
Image processing device 10, NC control device 20, camera system 3
0, a laser system 40, a table 50, and AC servomotors 62 to 65.

The NC control device 20 includes a CPU 21, an operation panel 23, a halogen light source 24, and a drive control unit 27. The image processing device 10 and the NC control device 20 can exchange data with each other. The CPU 21 and the operation panel 23 are connected. CP from the operation panel 23
The program in U21 can be rewritten. All data passed from the image processing device 10 to the NC control device 20 is collected by the CPU 21. CP based on this data
U21 issues a command to the halogen light source 24 and the drive control unit 27.

The camera system 30 includes a monitor 31 and a switch 3
2, a high magnification camera 37, a mirror 38, and a low magnification camera 39. The information obtained by the high-magnification camera 37 is transferred to the image processing apparatus 10 and then displayed on the monitor 31. In the state shown in FIG. 1, the high-magnification camera 37 operates. When the mirror 38 is moved to the position shown by the dotted line in the figure and the switch 32 is further switched to the direction shown by the dotted line in the figure, an image obtained from the low-magnification camera 39 is displayed on the monitor 31 this time. That is, by moving the switch 32 and the mirror 38, the high-magnification camera 3
7 or the image obtained from the low magnification camera 39 is displayed on the monitor 3
1 can be displayed.

The laser system 40 includes a laser beam 41, a mirror 42, a condenser lens 43, and an illumination 44. The laser light 41 is a YAG laser. The wavelength of the laser light 41 is 1.06 μm. The mirror 42 reflects the laser light 41. The mirror 42 transmits visible light.
Therefore, the optical axis of the high magnification camera 37 and the low magnification camera 39 and the optical axis of the laser beam 41 can be made coaxial. The laser light 41 is reflected by the mirror 42 and is collected by the condenser lens 4.
Focus at 3. A ring-shaped illumination 44 is provided below the condenser lens 43. The lighting 44 is connected to the halogen light source 24.

The workpiece 51 is placed on the table 50. The table 50 can be moved in the vertical, horizontal, and height directions, and can be rotated.

The drive control unit 27 receives an instruction from the CPU 21 and operates the AC servo motors 62 to 65. Each of the AC servomotors 62 to 65
Axial direction (horizontal), Y-axis direction (vertical), Z-axis direction (height), Θ
Move in the direction (rotation).

Next, the flow of data when the workpiece 51 is cut by such an apparatus will be described. FIG. 2 is a block diagram of a laser cutting device shown for explaining the flow of data when cutting a workpiece. Referring to FIG. 2, a laser cutting device 1 includes an image processing device 10 and an NC control device 2.
0, camera system 30, laser system 40, table 50
And

The image processing apparatus 10 includes an xy-θ coordinate numerical data processing unit 13 as first measuring means, and an arithmetic processing unit 14 as arithmetic processing means.

The NC control device 20 includes an XY-Θ coordinate numerical data processing unit 25 as a second measuring means, and a drive control unit 27. XY-Θ coordinate numerical data processing unit 25
The drive control unit 27 is arranged in the CPU 21 in FIG.

Camera system 30, high magnification camera 37, laser system 40, laser beam 41, mirror 42, condenser lens 43,
The table 50 and the workpiece 51 are the same as those shown in FIG.

When the workpiece 51 is cut by the laser cutting apparatus having the above-described configuration, first, the workpiece 51 is placed on the table 50. Next, the low magnification camera in FIG. 1 transfers the workpiece 51 to the monitor 31. The workpiece 51 is positioned so that the workpiece 51 is located at the center of the monitor 31. The high-magnification camera 37 projects the workpiece 51 and passes the position data to the xy-θ coordinate numerical data processing unit 13. The xy-θ coordinate numerical data processing unit 13 recognizes the position of the workpiece 51 as xy-θ coordinates. Further, the position of the workpiece 51 placed on the table 50 is defined as XY.
-The Θ coordinate numerical data processing unit 25 recognizes the coordinates as XY-Θ coordinates. The arithmetic processing unit 14 receives the position of the workpiece 51 from the xy-θ coordinate numerical data processing unit 13 as xy-θ coordinates. In addition, the arithmetic processing unit 14 sends the position of the workpiece 51 from the XY-Θ
Received as Y-Θ coordinates. The arithmetic processing unit 14 recognizes the coordinates of the workpiece 51 from these two coordinates, and controls the CP in FIG. 1 so that the workpiece 51 is positioned at a predetermined position.
A signal is sent to the drive control unit 27 via U21. The drive control unit 27 drives the table 50 based on the signal given from the arithmetic processing unit 14 and positions the workpiece 51 at a predetermined position. When the workpiece 51 is positioned at a predetermined position, the laser light 41 is reflected by the mirror 42, is focused via the condenser lens 43, and reaches the workpiece 51. Since the laser beam 41 that has reached the workpiece 51 passes through the workpiece 51, the workpiece 51 is cut by moving the table 50 without changing the position of the laser beam 41 in this state.
The completion of the cutting of the workpiece 51 indicates that the high-power camera 37
Alternatively, if it is confirmed by the low magnification camera 39, the output of the laser beam 41 becomes zero. Then, the workpiece 51 is positioned at another position and the same procedure is repeated to cut the workpiece 51.

The workpiece 51 is cut into a predetermined shape through the above series of steps. Next, a specific process for manufacturing a diamond heat sink by cutting a substrate made of polycrystalline diamond with the laser cutting device 1 shown in FIGS. 1 and 2 will be described. 3 to 6 are process diagrams showing a method for manufacturing a diamond heat sink. FIG.
FIG. 10 to FIG. 10 are plan views of the dummy substrate shown according to the manufacturing process of the diamond heat sink. FIGS. 11 to 21 are plan views of the substrate shown according to the steps of manufacturing the diamond heat sink. FIG. 22 is a perspective view showing the completed diamond heat sink.

Referring to FIGS. 3 and 7, before starting to cut the substrate made of polycrystalline diamond, first, dummy substrate 1001 is fixed on table 50 (step 100). The size of the table 50 is 150 mm x 150
mm. Table 50 is made of stainless steel. The dummy substrate 1001 is made of alumina. Dummy substrate 10
01 is fixed on the table 50 with an adhesive. The dummy substrate 1001 is placed so that the center point of rotation of the table 50 and the center point of the dummy substrate 1001 substantially match. FIG.
, The horizontal direction of the table 50 is the X-axis direction. In FIG. 7, the vertical direction of the table 50 is the Y-axis direction. In this state, the dummy substrate 1001 is irradiated with laser light. The laser light is a YAG laser, and the intensity varies depending on the thickness of the dummy substrate 1001. The maximum value of the intensity of the laser light is about 10 W. The width of the laser beam is 1.
Adjustment is possible in the range of 5 μm to 80 μm. The wavelength of the laser light is 1.06 μm. With the laser light penetrating the dummy substrate 1001, the table 50 is moved in the X-axis direction by a distance of ± 1 mm without changing the position of the laser light.
Here, moving the table 50 by the distance +1 mm in the X-axis direction means that the table 50 is moved by a distance 1 in the right direction in the drawing.
It means to move by mm. Moving the table 50 by a distance of -1 mm in the X-axis direction means moving the table 50 by a distance of 1 mm in the left direction in the figure. Thus, a cutting line 1002 having a length of 2 mm is formed on the dummy substrate 1001.

Referring to FIG. 3 and FIG. 8, dummy substrate 1
After the cutting line 1002 is formed at 001, the cutting line 1
002 is irradiated with a laser beam. Next, the table 50 is moved in the Y-axis direction at a distance of ± 1 m without changing the position of the laser beam.
Move m. Here, moving the table 50 by the distance +1 mm in the Y-axis direction means moving the table 50 by the distance 1 mm in the upward direction in FIG. Also, Y
Moving the table 50 by a distance of -1 mm in the axial direction means moving the table 50 by a distance of 1 mm in the downward direction in FIG. Thus, a cutting line 1003 orthogonal to the cutting line 1002 is formed on the dummy substrate 1001. Thus, a cross is formed on the dummy substrate 1001 (Step 110). The length of the cutting line 1003 is 2 mm. The cutting line 1002 and the cutting line 1003 are orthogonal. The intersection of the cutting line 1002 and the cutting line 1003 is set as the origin of the coordinates on the table 50, that is, the origin of the XY-Θ coordinates. The X axis is parallel to the cutting line 1002, and the Y axis is parallel to the cutting line 1003.

Referring to FIG. 3 and FIG.
The cross formed at 0 is photographed by the high-magnification camera 37 in FIG.
The -θ coordinate numerical data processing unit 13 recognizes the position of the cross formed on the dummy substrate 1001 as xy-θ coordinates (step 120). Here, the xy-θ coordinates are
This is a coordinate system used when the xy-θ coordinate numerical data processing unit 13 recognizes a position via the high magnification camera 37. The coordinates of the center of the cross are (x, y) = (a ₁ , b ₁ ). The xy-θ coordinate numerical data processing unit 13 also measures the angle α between the cutting line 1002 and the x-axis via the high-magnification camera 37 (step 130). Here, cutting line 1
Since 002 is parallel to the X axis of the table, the angle α is an angle formed between the X axis and the x axis. Angle α is about 0.01 °
It is. The distance between the center of the cross and the center of the xy-θ coordinate is 1 mm or less.

Referring to FIG. 10A, dummy substrate 1
After recognizing the center of the cross on 001 as the coordinates (a ₁ , b ₁ ), the table 50 is rotated by 180 °. Accordingly, the dummy substrate 1001 moves from the position indicated by the dashed line in FIG. 10A to the position indicated by the solid line. The xy-θ coordinate numerical data processing unit 13 recognizes the center of the rotated cross via the high magnification camera 37. The coordinates of the center of the cross after rotation are recognized as (x, y) = (a ₂ , b ₂ ). The xy-θ coordinate numerical data processing unit 13 calculates the coordinates (a ₁ , b ₁ ) of the center of the cross before rotation and the coordinates (a ₂ , b ₂ ) of the center of the cross after rotation by the arithmetic processing unit 14. Send to From these data, the arithmetic processing unit 14 calculates the rotation center (a ₀ , b ₀ ) of the table according to the following equation (step 140).

[0043]

(Equation 1)

Here, (a ₀ , b ₀ ) is a point on the xy-θ coordinate. Next, the angle α recognized by the xy-θ coordinate numerical data processing unit 13 is sent to the arithmetic processing unit 14. With reference to FIG. 10B, the arithmetic processing unit 14 sets the rotation center (a ₀ , b ₀ ) obtained by calculation as the origin of the XY-Θ coordinates. Therefore, when the origin of the xy-θ coordinates is represented by XY-Θ coordinates (A ₀ , B ₀ ), the following is obtained.

[0045]

(Equation 2)

According to this equation, the center of rotation (a ₀ , b ₀ ) in the xy-θ coordinate becomes the origin of the XY-Θ coordinate, and
The origin (x, y) = (0, 0) on the y-θ coordinate is XY−
さ れ る Coordinates are represented as (A ₀ , B ₀ ) (step 1
50).

The arithmetic processing unit 14 converts the xy-θ coordinates into XY based on the coordinates (A ₀ , B ₀ ) calculated in step 150.
A calibration equation to be converted into coordinates is created as follows (step 160).

[0048]

(Equation 3)

Referring to FIGS. 3 and 11, a substrate 610 made of polycrystalline diamond having a vertical and horizontal dimension of 10 to 40 mm is placed on table 50 (step 170). The substrate 610 is fixed to the table 50 with an adhesive. A plurality of metal films 601 are arranged in a grid on the substrate 610.
To 609 are formed. The metal films 601 to 609 are formed by a metal mask method, a lift-off method, or the like, as in the related art. Although the material of the metal film is not limited, it is particularly preferable to use a metal having a good bonding property with diamond. Here, titanium, chromium, tungsten, or nickel can be given as a metal having good bonding properties with diamond. Further, FIG. 11 shows only three rows and three columns of the metal film, but the number of rows and columns of the metal film is not limited to this. The length of one side of one metal film 601 is 0.5 to 4 mm. The width between metal films is 20-10
0 μm. The thickness of the metal films 601 to 609 is 3 to 5 μm
m.

The camera system 30 shown in FIG.
9 is activated. In step 170, the table 50 is positioned so that the substrate 610 placed on the table 50 is projected on the center of the monitor 31. Next, the camera system 30 is set so that the high-magnification camera 37 operates. The arithmetic processing unit 14 passes a signal to the drive control unit 27 so that the edge of the metal film 601 falls within one field of view 37a of the high magnification camera 37, and the drive control unit
Drive. As a result, the edges L _{1 to} L ₄ of the metal film 601 appear in the field of view of the high magnification camera 37. The xy-θ coordinate numerical data processing unit 13 recognizes the coordinates of the edges L _{1 to} L ₄ of the metal film 601 as xy-θ coordinates via the high magnification camera 37. Here, in FIG. 11, only four edges of the metal film 601 are recognized, but the number is not limited, and it is preferable to recognize 100 or more edges in one visual field. The xy-θ coordinate numerical data processing unit 13 sends the xy-θ coordinates of the edges L _{1 to} L ₄ to the arithmetic processing unit 14. XY-Θ coordinate numerical data processing unit 2
5 sends data on the X axis and Y axis of the XY-Θ coordinates to the arithmetic processing unit 14. The arithmetic processing unit 14 calculates the edges L _{1 to} L ₄ according to these data and the calibration formula shown in (Equation 3).
Are converted to XY-Θ coordinates. Arithmetic processing unit 14
Regresses the coordinates of the edges L _{1 to} L ₄ converted into XY-Θ coordinates with a straight line using the least squares method. The equation of this straight line is A ₀ X + B ₀ Y + C ₀ = 0 (step 18)
0).

The arithmetic processing unit 14 determines the angle β ₀ between the straight line A ₀ X + B ₀ Y + C ₀ = 0 obtained in step 180 and the X axis.
Is calculated. Next, the arithmetic processing unit 14 sends a signal to the drive control unit 27 to rotate the table 50 by the angle −β ₀ . The drive control unit 27 receiving this signal causes the table 50
Is rotated by an angle −β ₀ (step 190).

Referring to FIGS. 4 and 12, arithmetic processing unit 14 sends a signal to drive control unit 27 to move table 50 in the downward direction in the figure. The drive controller 27 receives this signal and moves the table 50 downward in the figure. As a result, the metal film 601 is placed in one view 37a of the high-magnification camera 37.
And the edge of the metal film 604 are reflected. xy-
The θ coordinate numerical data processing unit 13 detects the edge M of the metal film 601.
And ₁ ~M _4, recognizes the position of the edge M ₅ ~M ₈ of the metal film 604 in x-y-theta coordinates (step 200).

The xy-θ coordinate numerical data processing unit 13
Edge M recognized by xy-θ coordinates ₁~ M₈Perform the coordinates of
It is sent to the arithmetic processing unit 14. XY-Θ coordinate numerical data processing unit
25 represents data on the X-axis and Y-axis of the XY-Θ coordinates.
It is sent to the arithmetic processing unit 14. The arithmetic processing unit
From the equation shown in (Equation 3), the edge M₁~ M₈Coordinates of XY
-Convert to coordinates. The arithmetic processing unit 14 is M₁M_FiveWhile M
_TwoM₆While M_ThreeM₇While M_FourM₈Calculate the distance between them.
By averaging these four distances, the metal films 601 and 60
Width W between 4₁(Step 210).

Referring to FIGS. 4 and 13, arithmetic processing unit 14 sends a signal to drive control unit 27 to move table 50 in the upward direction in the figure. The drive control unit 27 receives this signal and moves the table 50 upward in the figure. As a result, the metal film 60 is placed in one visual field 37a of the high-magnification camera 37.
1 edge is reflected. XY-Θ coordinate numerical data processing unit 2
5 recognizes the amount of movement of the table 50 by XY-Θ coordinates. The xy-θ coordinate numerical data processing unit 13 uses the metal film 60
The edges N _{1 to} N ₃ of ₁ are recognized by xy-θ coordinates.

Next, the arithmetic processing unit 14 sends a signal to the drive control unit 27 to move the table 50 to the left in the figure. The drive control unit 27 receives this signal and
To the left in the figure. Thereby, the high magnification camera 3
7, the edge of the metal film 602 is reflected in one visual field 37a. X-
The Y-Θ coordinate numerical data processing unit 25 recognizes the amount of movement of the table 50 by XY-Θ coordinates. The xy-θ coordinate numerical data processing unit 13 recognizes the positions of the edges N _{4 to} N ₆ of the metal film 602 by the xy-θ coordinates.

Next, the arithmetic processing unit 14 sends a signal to the drive control unit 27 to move the table 50 to the left in the figure. The drive controller 27 receives this signal and moves the table 50 to the left in the figure. Thereby, the high-magnification camera 37
The edge of the metal film 603 is reflected in the one field of view 37a. X-
The Y-Θ coordinate numerical data processing unit 25 recognizes the amount of movement of the table 50 by XY-Θ coordinates. The xy-θ coordinate numerical data processing unit 13 recognizes the positions of the edges N _{7 to} N ₉ of the metal film 603 as xy-θ coordinates.

The xy-θ coordinate numerical data processing unit 13 calculates x
The data regarding the positions of the edges N _{1 to} N ₉ recognized by the −y−θ coordinates are sent to the arithmetic processing unit 14. The XY-Θ coordinate numerical data processing unit 25 passes data relating to the movement amount of the table 50 to the arithmetic processing unit 14. The arithmetic processing unit 14 converts the coordinates of the edges N _{1 to} N ₉ into XY-Θ coordinates using these data and the equation shown in (Equation 3). Arithmetic processing unit 14
Regresses the coordinates of edges N _{1 to} N ₉ represented by XY-Θ coordinates on a straight line 611 using the least squares method. The equation of this straight line 611 becomes A ₁ X + B ₁ Y + C ₁ = 0 (step 220).

The arithmetic processing unit 14 calculates an angle β ₁ between the straight line 611 (A ₁ X + B ₁ Y + C ₁ = 0) obtained in step 220 and the X axis. The arithmetic processing unit 14 includes a table 50
Is transmitted to the drive control unit 27 so that is rotated by the angle −β ₁ . Drive control unit 27 rotates the table 50 receives this signal by the angle-beta ₁ (step 230).

Referring to FIG. 4 and FIG. 14, an arithmetic processing unit calculates an equation of a straight line (rotated straight line) obtained by rotating a straight line 611 (A ₁ X + B ₁ Y + C ₁ = 0) about the origin by an angle −β _1. 14 asks. After rotation, the straight line is parallel to the X axis. Arithmetic processing unit 14 a distance 1 / 2W ₁ apart position parallel to the straight line after the through rotating the straight line from the rotating post straight, i.e. obtaining the cutting line. The cutting line is parallel to the X axis. Arithmetic processing unit 14
Sends a signal to the drive control unit 27 to position the table 50 so that the laser beam 41 is irradiated to the right end of the cutting line. The drive controller 27 receives this signal and positions the table 50. The XY-Θ coordinate numerical data processing unit 25 recognizes the movement amount of the table 50 by the XY-Θ coordinates.

Referring to FIG. 4 and FIG.
1 is applied to the right end of the cutting line, and the laser light 41 is applied to the substrate 610.
Through. In this state, the table 50 is moved rightward in the figure without changing the position of the laser beam 41. Thereby, the first row of the substrate 610 is cut (step 24).
0). The distance between the cut surface and the metal films 601 to 603 is 5 to 1
0 μm.

Referring to FIGS. 6 and 16, metal film 60 is formed.
Edge P ₄ of the first edge P ₁ to P ₃ and the metal film 604 to P
_The arithmetic processing unit 14 sends a signal to move the drive control unit 27 so that ₆ appears in one field of view 37 a of the high magnification camera 37. The drive control unit that has received this signal moves the table 50. As a result, the edges P _{1 to} P ₆ of the metal films 601 and 604 appear in one field of view 37 a of the high magnification camera 37. xy
The position of the edge P ₁ to P ₃ of -θ coordinate numerical data processing unit 13 is a metal film 601, the edge P ₄ to P ₆ of the metal film 604
Is recognized in xy-θ coordinates (step 25).
1). The XY-Θ coordinate numerical data processing unit 25 recognizes the movement amount of the table 50 by the XY-Θ coordinates.

Next, the arithmetic processing unit 14 sends a signal to the drive control unit 27 to move the table to the left in the figure. The drive control unit 27 receives this signal and moves the table 50 to the left in the figure. As a result, the edges of the metal films 602 and 605 appear in one field of view 37a of the high magnification camera 37. The xy-θ coordinate numerical data processing unit 13 recognizes the positions of the edges P _{7 to} P ₉ of the metal film 602 and the positions of the edges P _{10 to} P ₁₂ of the metal film 605 by the xy-θ coordinates (step). 25
2). The XY-Θ coordinate numerical data processing unit 25 recognizes the movement amount of the table 50 by the XY-Θ coordinates.

The arithmetic processing unit 14 sends a signal to the drive control unit 27 to move the table 50 to the left in the figure. The drive control unit 27 receives this signal and moves the table 50 to the left in the figure. As a result, the edges of the metal films 603 and 606 appear in one field of view 37a of the high magnification camera 37. The xy-θ coordinate numerical data processing unit 13 recognizes the positions of the edges P _{13 to} P ₁₅ of the metal film 603 and the positions of the edges P _{16 to} P ₁₈ of the metal film 606 as xy-θ coordinates (step). 25
3). The XY-Θ coordinate numerical data processing unit 25 recognizes the movement amount of the table 50 by the XY-Θ coordinates. Steps 251 to 253 constitute step 250.

Referring to FIG. 4, the xy-θ coordinate numerical data processing unit 13 determines edges P ₁ and P
₄ midpoint between the Q _1, P ₂ and P ₅ midpoint between Q ₂ ... P ₁₅ and P ₁₈
Determined by calculation the position of the middle point Q ₉ and (Step 26
0).

Here, as a method of calculating the midpoint, there is a method of adding the coordinates of two edges and dividing the sum by two. The midpoints Q _{1 to} Q ₉ are represented by xy-θ coordinates.

The xy-θ coordinate numerical data processing unit 13 passes data on the midpoints Q _{1 to} Q ₉ to the arithmetic processing unit 14.
The XY-Θ coordinate numerical data processing unit 25 includes a table 50
Is transferred to the arithmetic processing unit 14. Arithmetic processing unit 14, the coordinates of the middle point Q ₁ to Q ₉ converts the X-Y-Θ coordinate using the equation shown by the these data (number 3) (step 270).

Referring to FIG. 5 and FIG. 17, the arithmetic processing unit 14 calculates the midpoints Q _{1 to} Q ₁ represented by the XY-Θ coordinates.
₉ is regressed in a straight line using the method of least squares. Thus, the processing unit 14 obtains the cutting line 612. Cutting line 6
12 is represented by A ₂ X + B ₂ Y + C ₂ = 0 (step 280).

The arithmetic processing unit 14 calculates the value in step 280.
Cutting line 612 (A_TwoX + B_TwoY + C _Two= 0) and the X axis
Angle β_TwoIs obtained by calculation (step 29).
0).

The arithmetic processing unit 14 sets the table 50 to the angle -β
_A signal is sent to the drive control unit 27 to make _two rotations. The drive control unit 27 receives this signal and sets the table 50 at an angle minus
It rotated by beta ₂ (step 300). The cutting line 612 after rotation is parallel to the X axis.

The arithmetic processing unit 14 controls the table 50 so that the right end of the rotated cutting line 612 is irradiated with the laser beam 41.
Is supplied to the drive control unit 27 so as to position the.
The drive control unit 27 receives this signal and positions the table 50 at a position where the right end of the cutting line 612 is irradiated with the laser beam 41. The XY-Θ coordinate numerical data processing unit 25 includes:
The movement amount of the table 50 is recognized based on the XY-Θ coordinates. The right end of the rotated cutting line 612 is irradiated with the laser light 41 so that the laser light 41 passes through the substrate 610. In this state, the arithmetic processing unit 14 sends a signal to the drive control unit 27 so as to move the table 50 rightward in the drawing without changing the position of the laser beam 41. The drive controller 27 receives this signal and moves the table 50 to the right in the figure. Thereby, the second row of the substrate 610 is cut (step 31).
0).

Referring to FIG. 5 and FIG.
Steps 250 to 310 are executed for the third to n-th rows (Step 320). Thereby, the third to n-th rows of the substrate 610 are cut. Metal film 607
The arithmetic processing section 14 sends a signal to the drive control section 27 in order to position the table 50 so that the edge of the table 50 falls within one field of view 37a of the high magnification camera 37. The drive control unit 27 receives this signal, and the edge of the metal film 607 is
The table 50 is positioned so as to enter the one field of view 37a. The XY-Θ coordinate numerical data processing unit 25 recognizes the movement amount of the table 50 by the XY-Θ coordinates. Metal film 60
The positions of the edges R _{1 to} R ₃ of _No. 7 are recognized by the xy-θ coordinate numerical data processing unit 13 as xy-θ coordinates. The arithmetic processing unit 1 moves the table 50 to the left in FIG.
4 supplies a signal to the drive control unit 27. The drive controller 27 receives this signal and moves the table 50 to the left in FIG. Thereby, one field of view 37a of the high magnification camera 37
The edge of the metal film 608 is reflected. The XY-Θ coordinate numerical data processing unit 25 calculates the amount of movement of the table 50 by XY-Θ.
Recognize by coordinates. xy-θ coordinate numerical data processing unit 13
Denote the positions of the edges R _{1 to} R ₃ of the metal film 607 as xy-θ.
Recognize by coordinates. The arithmetic processing unit 14 sends a signal to the drive control unit 27 to move the table 50 to the left in the figure.
The drive controller 27 receives this signal and moves the table 50 to the left in the figure. Thereby, one of the high magnification cameras 37
The edge of the metal film 608 is reflected in the visual field 37a. XY-
The Θcoordinate numerical data processing unit 25 recognizes the movement amount of the table 50 by XY-Ｙ coordinates. The xy-θ coordinate numerical data processing unit 13 recognizes the positions of the edges R _{4 to} R ₆ as xy-θ coordinates. The arithmetic processing unit 14 sends a signal to the drive control unit 27 to move the table 50 to the left in the figure. The drive controller 27 receives this signal and moves the table 50 to the left in FIG. As a result, the edge of the metal film 609 is reflected in one field of view 37a of the high magnification camera 37.
The XY-Θ coordinate numerical data processing unit 25 includes a table 50
Is recognized by XY-Ｙ coordinates. The xy-θ coordinate numerical data processing unit 13 converts the edges R _{7 to} R
The position of No. ₉ is recognized as xy-θ coordinates.

The xy-θ coordinate numerical data processing unit 13 calculates x
R expressed in -y-θ coordinates₁~ R ₉Perform coordinate data
It is passed to the arithmetic processing unit 14. XY-Ｘ coordinate numerical data
The processing unit 25 performs data relating to the amount of movement of the table 50.
It is passed to the arithmetic processing unit 14. Arithmetic processing based on these data
The unit 14 calculates the edge R₁~ R₉of
Convert the coordinates to XY-Θ coordinates. Change to XY-Θ coordinates
Transformed R₁~ R₉Coordinates using a least squares method
By regression, a straight line 613 (A_ThreeX + B_ThreeY + C_Three
= 0) by the arithmetic processing unit 14 (step 33).
0).

The straight line 613 (A _{3
X + B 3 Y + C 3} = 0) and the angle beta ₃ arithmetic processing unit 14 of the X-axis is determined. The arithmetic processing unit 14 sends a signal to the drive control unit 27 to rotate the table 50 by the angle −β ₃ . It receives this signal, the drive control unit 27 rotates the angle-beta ₃ only Table 50 Table 50 (step 340). The rotated straight line 613 is parallel to the X axis.

Referring to FIG. 5 and FIG.
Distance 1 / 2W from line 613₁Calculation processing at a distance
The unit 14 sets a cutting line. The cutting line is parallel to the X axis
You. W ₁Is W obtained in step 210₁With the same value as
You. The right end of this cutting line is irradiated with laser light 41.
Processing unit 14 to position table 50
Sends a signal to the drive control unit 27. The drive control unit 27 is disconnected
Table so that the right end of the line is irradiated with laser light 41
Position 50. Laser light 41 is at the right end of the cutting line
Irradiated, the laser light 41 penetrates the substrate 610. this
In this state, the arithmetic processing unit 14 does not change the position of the laser light 41 and
Drive the table 50 so as to move it to the right in FIG.
A signal is sent to the motion control unit 27. The drive control unit 27 outputs this signal
Is moved to the right in the figure. This
As a result, the (n + 1) th row of the substrate 610 is cut (step
350).

Referring to FIGS. 5 and 20, table 5
The arithmetic processing unit 14 gives a signal to the drive control unit 27 so that 0 is rotated by 90 °. The drive controller 27 receives this signal and rotates the table 50 by 90 °. Thereby, as shown in FIG. 20, the first column to the (n + 1) th column of the substrate 610 are cut, and the first row to the (n + 1) th row of the substrate 610 are not cut (step 360).

Referring to FIG. 5 and FIG.
Steps 180 to 350 are executed for the first to (n + 1) th rows. This cuts all rows and columns of substrate 610 (step 370).

Referring to FIG. 22, diamond heat sink 650 is completed. These steps 100-37
0 produces a diamond heat sink.

The advantages obtained by the laser cutting apparatus of the present invention described above are as follows.

In step 160, based on the data obtained in steps 100 to 150, the xy-θ coordinates on the camera are converted to the XY-Θ coordinates on the table.
A calibration formula to convert to coordinates has been created. Therefore, all data can be converted into XY-Θ coordinates.
Therefore, if the cutting line is calculated based on the XY-Θ coordinates, the cutting line can be obtained with high accuracy.

If the optical axis of the camera and the optical axis of the laser beam are not coaxial, a plane containing the camera coordinate system (xy-
The plane containing the θ coordinate) and the plane containing the stage coordinate system (the plane containing the XY-Ｘ coordinates in the text) are not parallel, and the coordinate conversion is a three-dimensional conversion.

By making the camera optical axis and the laser light optical axis (adjusted to be perpendicular to the stage) coaxial, both planes of the camera coordinate system and the stage coordinate system can be made parallel. Both coordinate transformations are two-dimensional transformations. Therefore, the amount of calculation can be reduced, which contributes to a reduction in the cost of equipment.

The cutting lines in the first column and the (n + 1) th column are set at positions separated by a distance 1 / 2W ₁ from the edge. Therefore, if the substrate is cut along the cutting line, the distance between the cut surface and the side surface of the metal film can be kept constant. Therefore, the production yield of the diamond heat sink can be improved. For the second to n-th rows of the substrate, a cutting line is obtained from the midpoint of the edge, and the substrate is cut based on this cutting line. Therefore, the distance between the cut surface and the side surface of the metal film can be kept constant. Therefore, the production yield of the diamond heat sink can be increased.

As is clear from steps 240, 310, and 350, the substrate is cut by moving the table only in the X-axis direction. here,
When the table is moved only in the X-axis direction to cut the substrate, the substrate can be cut more accurately than when the table is moved in the X- and Y-axis directions to cut the substrate. Therefore, according to the present invention, the substrate can be cut along the cutting line, and the production yield of the diamond heat sink can be increased.

After cutting all the rows of the substrate in steps 180 to 350 and rotating the table by 90 ° in step 360, steps 180 to 350 are further repeated (step 370). Therefore, the program amount can be reduced.

In a series of steps, there is no step in which a human visually recognizes coordinates and the like. Therefore, an error caused by human intervention does not occur.

Although the embodiment of the present invention has been described, it should be understood that the embodiment disclosed herein is illustrative in all aspects and not restrictive. Therefore, the embodiment shown here can be variously modified. For example, in each embodiment, in this embodiment, only a few edges of the metal film were recognized,
It is preferable to recognize 100 or more edges of the metal film. Further, the material of the metal film and the output of the laser can be variously modified as needed. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a laser cutting device according to the present invention.

FIG. 2 is a block diagram of a laser cutting apparatus shown for explaining a flow of data when cutting a workpiece.

FIG. 3 is a process chart showing a method for manufacturing a diamond heat sink.

FIG. 4 is a process chart showing a method for manufacturing a diamond heat sink.

FIG. 5 is a process chart showing a method for manufacturing a diamond heat sink.

FIG. 6 is a process chart showing a method for manufacturing a diamond heat sink.

FIG. 7 is a plan view of a dummy substrate shown for describing a first step of the method for manufacturing a diamond heat sink.

FIG. 8 is a plan view of a dummy substrate shown for explaining a second step of the method for manufacturing a diamond heat sink.

FIG. 9 is a plan view of a dummy substrate shown for describing a third step of the method for manufacturing a diamond heat sink.

FIG. 10 shows a fourth method of manufacturing the diamond heat sink.
It is a top view of a dummy substrate shown for explaining a process.

FIG. 11 shows a fifth method of manufacturing a diamond heat sink.
FIG. 4 is a plan view of a substrate shown for explaining a process.

FIG. 12 shows a sixth method of manufacturing the diamond heat sink.
FIG. 4 is a plan view of a substrate shown for explaining a process.

FIG. 13 shows a seventh method of manufacturing the diamond heat sink.
FIG. 4 is a plan view of a substrate shown for explaining a process.

FIG. 14 shows the eighth method of manufacturing the diamond heat sink.
FIG. 4 is a plan view of a substrate shown for explaining a process.

FIG. 15 is a ninth method of manufacturing a diamond heat sink.
FIG. 4 is a plan view of a substrate shown for explaining a process.

FIG. 16 shows a first method of manufacturing a diamond heat sink.
FIG. 3 is a plan view of a substrate shown for explaining a zero process.

FIG. 17 shows a first method of manufacturing a diamond heat sink.
FIG. 4 is a plan view of the substrate shown for explaining one step.

FIG. 18 shows a first method of manufacturing a diamond heat sink.
FIG. 3 is a plan view of a substrate shown for describing two steps.

FIG. 19 shows a first method of manufacturing a diamond heat sink.
It is a top view of a substrate shown for explaining three processes.

FIG. 20 shows a first method of manufacturing a diamond heat sink.
It is a top view of the substrate shown for explaining 4 processes.

FIG. 21 shows a first method of manufacturing a diamond heat sink.
It is a top view of the substrate shown for explaining 5 processes.

FIG. 22 is a perspective view showing a completed diamond heat sink.

FIG. 23 is a process chart showing a conventional method for manufacturing a diamond heat sink.

FIG. 24 is a perspective view showing a first step of a conventional method for manufacturing a diamond heat sink.

FIG. 25 is a perspective view showing a second step of the conventional method for manufacturing a diamond heat sink.

FIG. 26 is a perspective view showing a third step of the conventional method for manufacturing a diamond heat sink.

FIG. 27 is a perspective view showing a fourth step of the conventional method for manufacturing a diamond heat sink.

[Explanation of symbols]

 Reference Signs List 1 laser cutting device 13 xy-θ coordinate numerical data processing unit 14 arithmetic processing unit 25 XY-Θ coordinate numerical data processing unit 27 drive control unit 41 laser beam 50 table 601 to 609 metal film 610 diamond substrate

Claims (4)

[Claims] 1. A method of irradiating a laser light to a diamond heat sink material in which a plurality of metal film patterns are arranged in a lattice on a diamond substrate with an exposed portion having a width of 0.1 mm or less interposed therebetween. A laser cutting device for cutting the position of a diamond heat sink material placed on a table by xy-θ coordinates using a camera and image processing; and The position of the exposed portion of the diamond heat sink material is controlled by NC control to XY-Θ.
Second measurement means for measuring coordinates, calculation processing means for calculating position control data by calculating the measured xy-θ coordinates and the XY-Θ coordinates, and the position control data And a drive control means for driving the table upon receipt of the laser cutting device. 2. The laser cutting apparatus according to claim 1, wherein an optical axis of the camera and an optical axis of the laser beam are coaxial. 3. The arithmetic processing unit converts the xy-θ coordinates into the XY-Θ coordinates.
The laser cutting device according to claim 1. 4. The method according to claim 1, wherein the first measuring unit includes a plurality of Xs of the plurality of metal patterns located on both sides of the cut portion on the exposed portion.
The position of the end face in the axial direction is referred to as x-
The data is recognized as y-θ coordinates and the data is sent to arithmetic processing means. The arithmetic processing means calculates a plurality of midpoints of the end face coordinates and calculates the plurality of midpoints as the XY-Θ coordinates. And calculates a cutting line by the least squares method based on a plurality of midpoints represented by the XY-Ｘ coordinates, and calculates an angle β between the cutting line and the X-axis direction. The laser cutting apparatus according to claim 1, wherein the data is sent to the drive control means, and the substrate is cut after the drive control means rotates the substrate by an angle -β.