JPH08335612A - Prober and its method - Google Patents

Abstract

PURPOSE: To provide a prober capable of positioning between a probe and an electrode by a method wherein a prove position of a probe card is acquired as coordinates by first imaging means, and the first imaging means and second imaging means are positioned by a savable target, and a position of the elec trode of a substrate is acquired as coordinates by the second imaging means, and a position of the electrode with respect to the position of probe is acquired; and a probe method. CONSTITUTION: The position of a probe 2 of a probe card 1 is acquired as coordinates from imaging information of first imaging means 3, and the position of this first imaging means 3 is made coincident with the position of second imaging means 4 so that an electrode position of a wafer 5 is acquired by the second imaging means 4, and the position of electrode of the wafer 5 corresponding to the position of the probe 2 is calculated, and alignment of the probe 2 with the electrode is performed to inspect the wafer 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe apparatus for electrically connecting a probe to an electrode of a substrate, particularly a semiconductor wafer or an LCD substrate, to inspect electrical characteristics.

[0002]

2. Description of the Related Art Conventionally, a probe card is arranged on a surface facing a wafer, and a first imaging means for imaging the tip of the probe from the wafer side and a second imaging means for imaging the wafer surface from the probe side. A technique for aligning a wafer and a probe by using a means is disclosed in JP-A-1-94631 and JP-A-11190.
36, etc.

[0003]

In the conventional probe apparatus, the precision of the probe card mounting position and the precision of the XYZ stage relative to the alignment of the wafer are concepts that require absolute precision. It was For example, the position where the image of the wafer is picked up and the position where the substrate is actually inspected are considerably separated, and the positional relationship can only be guaranteed by the XYZ stage. However, when the probe is aligned with the position of the electrode on the wafer, even if the straightness, flatness, orthogonality, etc. of the rail for guiding the XY stage are accurately formed, if the temperature changes. Thermal deformation occurs and errors occur. Furthermore,
Due to the thermal expansion and contraction of the ball screw for driving the XYZ stage, an error of 20 to 30 μm per 100 mm occurs when the temperature changes by 10 ° C., for example.
Also, a probe card mounted on the head plate,
In terms of the positional relationship with the image pickup unit for picking up an image of the wafer, it was difficult to ensure a deviation in the unit of micron due to the temperature change. Also, it is customary to replace the probe card according to other causes, for example, depending on the type of substrate. At this time, the inner diameter of the hollow portion of the head plate and the probe card are replaced.
Due to the gap with the outer diameter of the probe, the position shifts every time the probe card is replaced. These deviations make it difficult to align the probe with the electrodes on the wafer.

An object of the present invention is to first obtain the position of the probe of the probe card as coordinates by the first image pickup means, and then use the target to determine the positional relationship between the first image pickup means and the second image pickup means. Then, the position of the electrode formed on the substrate by the second image pickup means is calculated as the coordinate, and the position of the probe and the electrode of the substrate are relatively aligned to enable highly accurate alignment. Another object of the present invention is to provide a probe device and a probe method.

[0005]

A probe device of the present invention is a first image pickup device for picking up an image of the probe by disposing a probe card provided with a probe on the opposite surface of a substrate. Means and second imaging means for imaging the substrate,
In a probe device for aligning the probe and the substrate, a target is provided between the substrate and the probe to align the first and second image pickup means, and then the target. The get is retracted from the above position.

Further, the present probe apparatus is provided with a mounting table which can be rotated around on a stage which can be moved in the horizontal and vertical directions, and the probe is mounted on the opposing surface of the substrate mounted on the mounting table. The first image pickup means for picking up an image of the probe, the second image pickup means for picking up the board, and the target removably provided between the board and the probe Professional
In a probe device for aligning the position of the substrate and the substrate, the first image pickup means and the retractable target are provided in a portion of the stage which does not rotate.

In the present probe apparatus, a probe card provided with a probe is arranged on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the substrate are picked up. In the probe apparatus for aligning the probe and the substrate by the second image pickup means, the first image pickup means is a moving mechanism side that moves horizontally and vertically with respect to the probe card. The second image pickup means is provided in a moving mechanism that moves in either the X-axis or the Y-axis direction with respect to the probe card.

Further, in this probe apparatus, a probe card provided with a probe is disposed on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the image of the substrate are picked up. In the probe device for aligning the probe and the substrate by the second image pickup means, at least three chips which are not aligned on the straight line of the substrate are selected, and the electrode position coordinates of these chips are selected. Then, the position coordinates of the probe and the substrate are aligned by comparing and calculating the position coordinates of the probe.

Further, in the present probe apparatus, a probe card provided with a probe is arranged on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the image of the substrate are picked up. In the probe device for aligning the probe and the substrate by the second image pickup means, one of the first and second image pickup means is moved relative to the target. And focus.

In the present probe apparatus, a probe card provided with a probe is arranged on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the image of the substrate are picked up. In the probe device for aligning the probe and the substrate by the second image pickup means, the mutual position of the mounting table on which the substrate is placed, the first image pickup means and the target is determined. It moves in a fixed state to align the target on the focusing surface of the second image pickup means.

Further, in the probe method of the present invention, the probe card provided with the probe is disposed on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the substrate. In the probe method of aligning the probe and the substrate by the second image pickup means for picking up the image, the focusing surface of the first image pickup means is moved after the target is retracted. Moving the first imaging means so as to reach the probe, and obtaining the coordinates of the probe; and moving the second imaging means from the retracted position to under the probe.
The target is made to reach the in-focus surface of the second image pickup means standing by under the probe so that the first image pickup means and the second image pickup means
Aligning the position with the imaging means, moving the substrate so that the electrodes of the substrate reach the focusing surface of the second imaging means,
A step of obtaining the coordinates of the substrate, a step of returning the second image pickup means standing by under the probe to the retracted position, and a step of connecting the probe to the electrode of the substrate and inspecting the substrate Consists of.

In the present probe method, a probe card provided with a probe is arranged on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the substrate are picked up. In the probe method of aligning the probe and the substrate by the second image pickup means, the focusing surface of the first image pickup means reaches the probe after the target is retracted. So as to move the first image pickup means to obtain the coordinates of the probe, the step of moving the second image pickup means from the retracted position to below the probe, and the combination of the second image pickup means. Move the substrate so that the electrode of the substrate reaches the focal plane,
A step of obtaining the coordinates of the substrate; and a step of aligning the first image pickup means and the second image pickup means by causing the target to reach the focusing surface of the second image pickup means standing by under the probe. And a step of returning the second imaging means standing by under the probe to the retracted position, and the probe on the electrode of the substrate.
And the step of inspecting the substrate by connecting the cables.

In the present probe method, a probe card provided with a probe is arranged on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the substrate are picked up. In the probe method of aligning the probe and the substrate by the second image pickup means, the step of moving the second image pickup means from the retracted position to below the probe, and the probe. A step of arranging the first imaging means and the second imaging means to align the position of the target on the focusing surface of the second imaging means, which is on standby below The step of moving the substrate so that the electrodes of the substrate reach and obtaining the coordinates of the substrate, the step of returning the second image pickup means standing by under the probe to the retracted position, and the target being retracted After that, the focusing surface of the first image pickup means reaches the probe. Moving the serial first imaging means, pro -
The step of obtaining the coordinates of the probe, and
And the step of inspecting the substrate by connecting the cables.

In the present probe method, a probe card provided with a probe is arranged on the opposite surface of the substrate, and the first image pickup means for picking up the image of the probe and the image of the substrate are picked up. In the probe method of aligning the probe and the substrate by the second image pickup means, the step of moving the second image pickup means from the retracted position to below the probe; Moving the substrate so that the electrodes of the substrate reach the focusing surface of the image pickup means, and obtaining the coordinates of the substrate;
A step of bringing the target to reach the focusing surface of the second image pickup means which is on standby under the probe, and aligning the positions of the first image pickup means and the second image pickup means, and waiting under the probe. The step of returning the second image pickup means to the retracted position, and after the target is retracted, the focusing surface of the first image pickup means is changed to the professional plane.
Probe for moving the first imaging means so as to reach the probe and obtaining coordinates of the probe; and connecting the probe to the electrode of the substrate to inspect the substrate. Method.

[0015]

According to the present invention, the focus plane of the second image pickup means is positioned on the focus plane of the first image pickup means set at a position higher than the substrate surface by the target which can be set with extremely high reproducibility. As a result, the drive mechanism dedicated to the first image pickup means is unnecessary, and the positional relationship between the first image pickup means and the second image pickup means can be accurately adjusted without being affected by the absolute accuracy of the XYZ stage and thermal deformation. Will be possible. Further, according to the present invention, since the probe position of the probe card is obtained and the position of the electrode of the substrate is relatively obtained with respect to this position, the attachment position of the probe card is slightly different. Also, even if the relative position of the probe electrode and the substrate electrode shifts due to thermal expansion and contraction,
Highly accurate positioning is possible. Further, according to the present invention,
Since the second image pickup means can be moved in either the X-axis or Y-axis direction to stand by under the probe, the XY moving mechanism (stage) can be greatly reduced. That is, the device can be downsized. Further, according to the present invention, at least three chips which are not aligned on the straight line of the substrate are selected, and the electrode position coordinates of these chips and the position coordinates of the probe are compared and calculated. Since the probe and the substrate are aligned with each other, the position of the specific pattern of the substrate can be obtained, and the cumulative error of the mounting table, the orthogonal error, and the straightness can be corrected for this position. it can. Therefore, highly accurate alignment is possible.

[0016]

Embodiment 1 An embodiment of the probe device of the present invention will be described with reference to the drawings. As shown in FIG. 1, the principle of the probe device is that the position of the probe 2 of the probe card 1 (X
0, Y0, Z0) is obtained by the first image pickup means 3, the position of the first image pickup means 3 and the position of the second image pickup means 4 are matched, and then the second image pickup means 4 determines the position of the electrode of the wafer 5. The position (X1, Y0, Z0) of the probe 2 relative to the electrode position (X1,
Y1 and Z1) are calculated and the positions of the probe 2 and the electrode 5a are aligned. Here, the probe 2 may have any shape as long as it has a function of connecting to the electrode of the substrate. For example, a probe having a metal wire shape that is inclined with respect to the surface of a printed wiring board, or a diameter 70 that is erected perpendicularly to the board surface and uses buckling of a probe needle is used.
There are micron wire rod probes and gold bump electrode probes formed on a flexible film. The substrate includes a semiconductor wafer 5 and an LCD substrate.

As shown in FIG. 2, the probe device 6 is roughly classified into a loader unit 8 for transferring the wafer 5 to the measuring unit 7 and a transferred wafer 5 to measure the quality. And a measuring unit 7 that operates.

The former loader section 8 is provided in close contact with the side surface of the measuring section 7, for example, the right side surface. The multistage wafer cassettes 9 are internally provided on the same surface along the operation surface of the loader portion 8 in the stacking direction, and the wafer cassettes 9 can be taken out from the operation surface or from above.

The latter measuring unit 7 includes a fixing unit 13 formed of an insert ring 11 and a probe card 1 mounted on a head plate 12 of the main body of the probe apparatus 6, a mounting table 14, and XYZ axes and axes. A driving unit for driving and a moving unit 1 for moving the second imaging unit 4 from the standby position to below the probe card 1.
And 5. The head plate 12 is provided at the center of the sub head plate 12a. The sub head plate 12a is made of a base of the probe device 6, for example, a metal of 800 mm square by 80 mm thick. A pillar 16a is provided upright at four corners of the base 16, and a metal plate having a length and width of 800 mm square and a thickness of 40 mm is fixed on the pillar 16a. This head plate 12
An insert ring 11 is provided in the hollow portion of the above, and a probe card 1 is mounted in the hollow portion. here,
The probe card 1 is arranged so that the implanted probe 2 faces the wafer 5.

The moving section 15 is, as shown in FIG.
The first imaging means 3 is conveyed to the position of the probe 2
It is composed of a moving mechanism 21 and a second moving mechanism 22 that conveys the second image pickup means 4 below the probe card 1. The former first moving mechanism 21 moves the first imaging means 3 below the probe 2 planted in the probe card 1. Then, the wafer 5 is moved to the position of the probe 2,
The (X, Y, Z) coordinates of the stage at that time are (X0, Y0,
Z0) Obtained as coordinates. The latter second moving mechanism 22 moves the second image pickup means 4 in any one of the XY directions to reach the position below the probe card 1. Next, after the target 25 is projected to the position of the focusing surface 27 of the first image pickup means 3 and the first image pickup means 3 and the second image pickup means 4 are aligned with each other, the first moving mechanism described above is used. Second imaging means 4
Make sure the wafer surface is underneath. Therefore, the position of the electrode corresponding to the probe 2 is measured by the second image pickup means 4, and the (XYZ) coordinate of the stage at that time is calculated as (X1, Y
1, Z1)

The above-mentioned first moving mechanism 21 will be described in more detail. The first moving mechanism 21 includes a mounting table 14 on which the wafer 5 is mounted, which is rotatable, a flat plate 24 fixed to a portion of the mounting table 14 which is not rotated, and a Z-up mechanism 19 for moving the mounting table 14 up and down. The XY stage 18 for moving the Z-up mechanism 19 in the XY directions, and the XY stage 1
8 and a drive unit (not shown) for moving the unit 8. The flat plate 24 is integrally provided with the first image pickup means 3 and a retractable target 25. The first image pickup means 3 is provided at a position apart from the mounting table axis center by several tens of millimeters, for example, 130 millimeters in the Y-axis direction. Where X
The assembly in which the Y stage 18 and the Z-up mechanism 19 are combined is called an XYZ mechanism 20.

As shown in FIG. 4A, the target 25 is an object which can be recognized by the first image pickup means.
For example, a circular metal film, for example, a metal film 26 having a diameter of 140 microns is vapor-deposited on a transparent glass plate 25a. As shown in FIG. 4B, there is a step of adjusting the position of the metal film 26 so as to match the focusing surface 27 of the first image pickup means 3. Next, as shown in FIG. 4 (c), after the target 25 is evacuated from the top of the first image pickup means 3, the reference probe 2 is combined with the first image pickup means 3. There is a step of moving the first image pickup means 3 by the XYZ mechanism 20 so as to reach the focal plane 27 and recognizing the probe 2 under the probe card.

Next, as shown in FIG.
The get 25 is projected with good reproducibility, for example, with a reproducibility of 1 to 2 microns onto the first image pickup means 3, and the second image pickup means 4 is provided.
The target 2 is moved by the XYZ mechanism 20 of the mounting table 14 so that the metal film 26 of the target 25 is aligned with the in-focus surface 27 of the target 2.
Move 5 Next, as shown in FIG. 4 (e), the target 25 is retracted from above the first imaging means 3,
The mounting table 14 is moved by the XYZ mechanism 20 so that the focusing surface of the second image pickup means 4 reaches a predetermined electrode surface of the wafer 5.

Next, the operation will be described. The main operations are (1) an operation of obtaining the position coordinates of the probe 2 serving as a reference, (2) an operation of aligning the first image pickup means 3 and the second image pickup means 4, and (3) a wafer 5 There is an operation of obtaining the position coordinates of the electrode of. The operation of (1) above will be described in detail. As shown in FIG. 5, the target 25 is projected in advance on the first image pickup means 3 and is aligned with the focusing surface 27 of the first image pickup means 3. It has already been described that the position of the target 25 is adjusted so as to do so. Following this state, the target 25 is retracted from the first image pickup means 3,
The first image pickup means 3 is made to reach below the probe 2, which is generally known in advance, by the XYZ stage 20. Further, the focusing surface 27 is searched so as to catch the probe 2,
This position is image-recognized. Then, the image recognition professional
Adjust the position of knob 2 to the center of the screen. As a result, the coordinates of the XYZ stage 20 when the probe 2 is captured at the center of the screen are the origin (X0, Y0, Z0).

Next, the operation (2) will be described. Sixth
As shown in the figure, the first image pickup means 3 is made to reach below the second image pickup means 4 which has moved below the probe card 1 and stands by,
The target 25 is projected above the first imaging means 3 with good reproducibility. Here, by aligning the focusing surface 27 of the second image pickup means 4 with the metal film 26 of the target 25 projected by the image recognition, the alignment between the first image pickup means 3 and the second image pickup means 4 is completed. Become. After this alignment, the first
The target 25 on the image pickup means 3 is attached to the first image pickup means 3
Evacuate from.

Next, the operation of the above (3) will be described. Seventh
As shown in FIG. 7A, the XYZ mechanism 20 is driven so that the wafer 5 on the mounting table reaches below the second image pickup means 4, and then as shown in FIG. Positioning is performed by image recognition so that the electrode corresponding to the probe 2 of the wafer 5 comes to the focusing surface 27 of the image pickup means 4. The position of the electrode corresponding to the recognized probe 2 is coordinate (X1, Y1, Z
1) By this, the coordinates (X1, Y1, Z1) of the electrode position of the wafer with respect to (X0, Y0, Z0) in FIG. 7C are obtained.

Effects of this embodiment. Since the focus plane of the second image pickup means is aligned with the focus plane of the first image pickup means set at a position higher than the wafer surface by the target which can be set with extremely high reproducibility, the first image pickup means A dedicated drive mechanism is unnecessary, and the positional relationship between the first image pickup means and the second image pickup means can be accurately adjusted without being affected by the absolute accuracy of the XYZ stage, thermal deformation, and the like. Further, the probe position of the probe card is obtained, and the position of the electrode of the wafer corresponding to this position is relatively obtained.
Even if the mounting position of the bud is slightly displaced or the relative position of the probe electrode and the wafer electrode is displaced due to thermal expansion and contraction, highly accurate alignment is possible. Further, the second image pickup means moves in one of the X and Y directions and is aligned by a movable target (also referred to as a moving target) provided on the first image pickup means side, and the electrodes of the wafer are attached. Since the configuration is such that imaging is performed, the XY movement mechanism can be greatly reduced. That is, the device can be downsized.

[0028]

[Embodiment 2] An embodiment of alignment using a plurality of chips of the probe device of the present invention will be described with reference to the drawings. As shown in FIG. 8, there are a plurality of chips on the wafer 5, for example, five-point chips (a, b, c, d, e). Considering in the X-axis direction, three-point chips (a, b, c). There is. In this structure, the b chips are located near the center of the wafer 5, and the a and c chips are located at equal intervals, for example, 1/2 L, from the b chips. The alignment of the present invention will be described in the above chip arrangement. The center of the wafer is located below the second imaging means which is on standby below the probe card. The b chip is located near this center. Next, in FIG. 9, the X-coordinates of the a-chip and the c-chip are measured, and the X-coordinate of the intermediate chip
When the coordinates are interpolated by proportional distribution, the maximum positional deviation Δx1 occurs in the X direction, for example, in chip b. However, a b chip is provided between the a chip and the c chip, and a
If the X-coordinates of the chip and the b-chip are actually measured and the X-coordinates of the chips between them are interpolated by proportional distribution, for example, the maximum deviation Δx2 occurs in the seventh chip, but it is practically Δ
It is known that x2 <Δx1, and the alignment accuracy is improved. Also, Δx1 is extremely small as compared with the error of the conventional probe device due to an error depending on the linearity of the positional accuracy of the chip on the wafer between the a chip and the c chip and the accuracy of the moving mechanism. Although the above description has been made with respect to the X-axis direction, the same applies to the case of considering the Y-axis direction, for example, (d, b, e). Similarly, it is possible to correct the orthogonality of the XY stage by using three points on the wafer, which have components in the XY axis directions orthogonal to each other, like an abe chip. An example of the above recognition procedure is shown in FIGS.
Briefly referring to the drawing, the position of the electrode corresponding to the probe 2 of the b chip in the center of the wafer is recognized by changing the magnification of the second image pickup means between macro and micro.
Further, if the wafer is aligned for each 1/4 area, fine alignment becomes possible. For example, it is possible to perform highly accurate alignment by correcting the feed error by the above method in the area of 1/4 surrounded by the a chip, the b chip, and the e chip. Moreover, the inspection area of the wafer is made finer, for example, 1/4 side surrounded by f chips, b chips, and i chips.
If the position of the quadrangle portion of L is adjusted by the above-described method, the position can be adjusted with higher accuracy.

Effects of this embodiment. X, Y of the above wafer
Since at least three chips on the axis are selected and the electrode position coordinates of these chips and the position coordinates of the probe are compared and calculated, the probe and the wafer are aligned with each other. It is possible to determine the position of the negative side and correct the accumulated error of the mounting table, the orthogonal error, the straightness, etc. to this position. Therefore, highly accurate alignment is possible.

[0030]

[Embodiment 3] An embodiment of the probe method of the present invention will be described with reference to FIG. A state in which the target is arranged in advance on the first image pickup means, the target is adjusted so as to be located on the focusing surface of the first image pickup means, and the target is retracted from above the first image pickup means. I am doing it. Then, XY station
The first and second image pickup means are moved in XYZ by the Z and Z-up mechanism, the probe position is image-recognized on the focusing surface, and the position of the image-recognized reference probe is set as reference coordinates (X0, Y0, Z0) ( Step a). The second image pickup means is driven by a fixed portion, for example, a second moving mechanism provided on the head plate to drive the probe camera.
It is made to stand by below (step b). The first image pickup means is moved below the standby second image pickup means. And
The target is projected above the first image pickup means, and the target is
By aligning the first imaging means and the second imaging means by aligning the focusing surface of the second imaging means with the position of the get, the target is retracted again (step c). Then, the wafer is placed below the second image pickup means, and the coordinates (X1, Y1, Z1) of the electrodes of the wafer are obtained (step d). The second image pickup means below the probe card is returned to the retracted position (step e). The probe is electrically connected to the electrodes of the wafer to inspect the wafer (step f).

[0031]

[Embodiment 4] A first embodiment of another embodiment of the probe method of the present invention.
This will be described with reference to FIG. The target is arranged in advance on the first image pickup means, the target is adjusted so as to be located on the focusing surface of the first image pickup means, and the target is retracted from above the first image pickup means. It is in a state. Then, XY
The first image pickup means is moved in XYZ by the stage and Z-up mechanism, the probe position is image-recognized on the focusing surface, and the position of the image-recognized reference probe is reference coordinates (X0, Y0, Z0).
(Step a). By driving the second moving mechanism provided on the head plate, the second image pickup means is made to stand by below the probe card (step b). After that, the wafer is placed below the second imaging means, and the coordinates (X
1, Y1, Z1) is calculated (step d). The first image pickup means is moved below the standby second image pickup means. Then, the target is projected above the first image pickup means, and the focusing surface of the second image pickup means is matched with the position of this target, thereby aligning the first image pickup means and the second image pickup means. After this, the target is saved again (step c). The second image pickup means below the probe card is returned to the retracted position (step e). The probe is electrically connected to the electrodes of the wafer to inspect the wafer (step f).

[0032]

[Embodiment 5] A first embodiment of the probe method of the present invention
This will be described with reference to FIG. The target is arranged in advance on the first image pickup means, the target is adjusted so as to be located on the focusing surface of the first image pickup means, and the target is retracted from above the first image pickup means. It is in a state. Subsequently, the second moving mechanism provided on the head plate drives the second imaging means to stand by below the probe card (step b). The first image pickup means is moved below the standby second image pickup means. Then, the target is projected above the first image pickup means, and the focusing surface of the second image pickup means is matched with the position of this target, thereby aligning the first image pickup means and the second image pickup means. After this, the target is saved again (step c). After that, the wafer is placed below the second image pickup means, and the coordinates (X1, Y) of the electrodes of the wafer are placed.
1, Z1) is calculated (step d). The second image pickup means below the probe card is returned to the retracted position (step e). The first imaging means is moved in XYZ by the XY stage and the Z-up mechanism, the probe position is image-recognized on the focusing surface, and the position of the image-recognized reference probe is the reference coordinate (X
0, Y0, Z0) (step a). The probe is electrically connected to the electrodes of the wafer to inspect the wafer (step f).

[0033]

[Embodiment 6] Another embodiment of the probe method of the present invention
This will be described with reference to FIG. The target is arranged in advance on the first image pickup means, the target is adjusted so as to be located on the focusing surface of the first image pickup means, and the target is retracted from above the first image pickup means. It is in a state. Subsequently, the second moving mechanism provided on the head plate drives the second imaging means to stand by below the probe card (step b). Then, the wafer is placed below the second image pickup means, and the coordinates (X1, Y1, Z1) of the electrodes of the wafer are obtained (step d). Below the waiting second image pickup means, the first
The imaging means is moved. Then, the target is projected above the first image pickup means, and the focusing surface of the second image pickup means is matched with the position of this target, thereby aligning the first image pickup means and the second image pickup means. After this, the target is saved again (step c). The second image pickup means below the probe card is returned to the retracted position (step e). The first imaging means is moved in XYZ by the XY stage and the Z-up mechanism, the probe position is image-recognized on the focusing surface, and the position of the image-recognized reference probe is the reference coordinate (X
0, Y0, Z0) (step a). The probe is electrically connected to the electrodes of the wafer to inspect the wafer (step f).

[0034]

According to the present invention, the position of the probe is obtained by the first image pickup unit every time the inspection is started, and the position of the substrate is obtained by the second image pickup unit with reference to this position, and the probe position is obtained. Because it is a structure that aligns with the electrodes of the board, the temperature during use changes,
Even if a feed error of the moving mechanism occurs due to a change in the temperature of the probe device, it is possible to move with a feed amount corresponding to this error, and a probe device for performing highly accurate positioning, and a probe device. You can get the way. Actually, when the test head is mounted on the head plate of the probe apparatus to inspect the substrate, the temperature of the moving mechanism portion may rise to about 30 ° C. Even in this case, it is possible to obtain a probe device and a probe method for performing highly accurate alignment. Further, there is a case where a heavy test head is mounted to inspect the substrate. Even if the probe device is distorted by mounting the above-mentioned heavy weight test head, the position of the substrate is determined on the basis of the position of the probe obtained, and the probe and the electrode of the substrate are Since the alignment is performed, it is possible to obtain a probe device and a probe method for performing highly accurate alignment. Further, according to the present invention, the second image pickup means is moved in one of the X and Y axis directions, and is aligned by a movable target (also referred to as a movable target) provided on the first image pickup means side. However, since the specific pattern of the substrate is imaged, it is possible to perform highly accurate alignment without being affected by the reproducibility of the position due to the movement of the second imaging means. Further, at least three chips on the X and Y axes of the substrate are selected, and the position coordinates of the probe and the substrate are aligned by comparing and calculating the electrode position coordinates of these chips and the position coordinates of the probe. With this configuration, the position of the specific pattern on the substrate can be obtained, and the cumulative error of the mounting table, the orthogonal error, and the straightness can be corrected for this position. Therefore, highly accurate alignment is possible. Furthermore, since the second image pickup means can be moved under the probe, the probe device can be downsized.

[Brief description of drawings]

FIG. 1 is a principle diagram showing the principle of a probe device of the present invention.

FIG. 2 is an overall configuration diagram of a probe device of the present invention.

FIG. 3 is a first diagram for explaining a moving part with respect to a fixed part of the present invention.
It is a 2nd moving part explanatory view.

FIG. 4 is an operation explanatory diagram of the target of the present invention.

FIG. 5 is an explanatory view of the operation of searching the probe needle by the first image pickup means of the present invention.

FIG. 6 is an explanatory diagram for aligning the first imaging means and the second imaging means of the present invention.

FIG. 7 is a diagram illustrating a second image pickup means of the present invention, in which electrodes of a wafer are supported.
FIG.

FIG. 8 is an explanatory diagram for explaining alignment of a chip for checking five points according to the present invention.

FIG. 9 is an explanatory diagram for explaining an error correction of the present invention using a wafer.

FIG. 10 is a flowchart of the probe method of the present invention.

FIG. 11 is another flowchart of the probe method of the present invention.

FIG. 12 is another flowchart of the probe method of the present invention.

FIG. 13 is another flowchart of the probe method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1: Probe card 2: Probe 3: 1st imaging means 4: 2nd imaging means 5: Wafer 13: Fixed part 14: Mounting table 18: XY stage 19: Z up mechanism 20: XYZ stage -Di (also referred to as XYZ mechanism) 25: target 26: target metal film 27: focusing surface 24: flat plate

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Haruhiko Yoshioka 1 2381 Kitashitajo, Fujii-cho, Nirasaki-shi, Yamanashi Tokyo Electron Yamanashi Co., Ltd.

Claims (10)

[Claims] 1. A probe card provided with a probe is disposed on an opposing surface of a substrate, and a first image capturing means for capturing an image of the probe and a second image capturing means for capturing an image of the substrate are provided.
A probe device for aligning the probe and the substrate, wherein a target is provided between the substrate and the probe.
And the second image pickup means are aligned with each other, and then the target is retracted from the position. 2. A mounting table which is capable of circumferential rotation is provided on a stage which is movable in the horizontal and vertical directions, and a probe card is arranged on the facing surface of a substrate mounted on the mounting table. , Professional
The position of the probe and the board is aligned by the first image pickup means for picking up an image of the probe, the second image pickup means for picking up the board, and the target provided so as to be retractable between the board and the probe. A probe apparatus for performing the probe apparatus, wherein the first image pickup means and the retractable target are provided in a portion of the stage that does not rotate. 3. A probe card provided with a probe is arranged on the opposite surface of the substrate, and a first image pickup means for picking up the image of the probe and a second image pickup means for picking up the image of the substrate are provided. In the probe device for aligning the probe and the substrate, the first image pickup means is provided on the side of a moving mechanism that moves horizontally and vertically with respect to the probe card, and the second image pickup means is provided. A probe device, characterized in that the means is provided in a moving mechanism for moving in either the X or Y axis direction with respect to the probe card. 4. A probe card provided with a probe is arranged on the opposite surface of a substrate, and a first image capturing means for capturing an image of the probe and a second image capturing means for capturing an image of the substrate are provided. In a probe device for aligning the probe and the substrate, at least three chips which are not aligned on the straight line of the substrate are selected, and the electrode position coordinates of these chips and the probe position. A probe device for aligning the probe and the substrate by comparing and calculating position coordinates. 5. A probe card provided with a probe is arranged on the opposite surface of the substrate, and a first image capturing means for capturing an image of the probe and a second image capturing means for capturing an image of the substrate are provided. In a probe device for aligning the probe and the substrate, either one of the first and second image pickup means is moved relative to the target for focusing. A probe device. 6. A probe card provided with a probe is disposed on an opposite surface of a substrate, and a first image capturing means for capturing an image of the probe and a second image capturing means for capturing an image of the substrate are provided. In a probe device for aligning the probe and the substrate, a mounting table on which the substrate is mounted, the first imaging means, and a target.
It moves with the position relative to the get fixed,
A probe apparatus for aligning the target with the focusing surface of the image pickup means. 7. A probe card provided with a probe is disposed on the opposite surface of the substrate, and a first image capturing means for capturing an image of the probe and a second image capturing means for capturing an image of the substrate are provided. In a probe method for aligning the probe and the substrate, the first imaging means is arranged so that the focusing surface of the first imaging means reaches the probe after the target is retracted. Of the probe, the step of obtaining the coordinates of the probe, the step of moving the second image pickup means from the retracted position to under the probe, and the step of moving the second image pickup means waiting under the probe. When the target reaches the focal plane, the first imaging means and the second
The step of aligning the position of the image pickup means, the step of moving the board so that the electrodes of the board reach the focusing surface of the second image pickup means, and obtaining the coordinates of the board, and waiting under the probe. A probe method comprising a step of returning the second imaging means to the retracted position and a step of inspecting the substrate by connecting the probe to the electrode of the substrate. 8. A probe card provided with a probe is disposed on an opposite surface of a substrate, and a first image capturing means for capturing an image of the probe and a second image capturing means for capturing an image of the substrate are provided. In a probe method for aligning the probe and the substrate, the first imaging is performed so that the focusing surface of the first imaging means reaches the probe after the target is retracted. Moving the means to obtain the coordinates of the probe, the step of moving the second image pickup means from the retracted position to under the probe, and the electrode of the substrate on the focusing surface of the second image pickup means. The step of moving the substrate so as to reach it, and obtaining the coordinates of the substrate; and the step of moving the substrate to the in-focus surface of the second image pickup means standing by under the probe so as to reach the first image pickup means and the first image pickup means. Two
The step of aligning the position of the image pickup means, the step of returning the second image pickup means standing by under the probe to the retracted position, and the inspection of the substrate by connecting the probe to the electrode of the substrate A probe method comprising the steps of: 9. A probe card provided with a probe is disposed on an opposite surface of a substrate, and a first image capturing means for capturing an image of the probe and a second image capturing means for capturing an image of the substrate are provided. In a probe method for aligning the probe and the substrate, a step of moving the second image pickup means from the retracted position to under the probe, and a second step of waiting under the probe When the target reaches the focusing surface of the image pickup means, the first image pickup means and the second image pickup means
The step of aligning the position of the image pickup means, the step of moving the board so that the electrodes of the board reach the focusing surface of the second image pickup means, and obtaining the coordinates of the board, and waiting under the probe. A step of returning the second image pickup means to the retracted position; and after the target is retracted, the first image pickup means is moved so that the focusing surface of the first image pickup means reaches the probe. A probe method comprising a step of obtaining coordinates of the probe and a step of connecting the probe to the electrode of the substrate and inspecting the substrate. 10. A first probe for picking up an image of the probe by arranging a probe card provided with the probe on an opposite surface of a substrate.
In a probe method for aligning the probe and the substrate by an image capturing means and a second image capturing means for capturing an image of the substrate, the second image capturing means is moved from the retracted position to under the probe. And a step of moving the substrate so that the electrodes of the substrate reach the focusing surface of the second image pickup means to obtain the coordinates of the substrate, and a focusing surface of the second image pickup means standing by under the probe. The target to reach the first image pickup means and the second image pickup means.
The step of aligning the position of the image pickup means, the step of returning the second image pickup means standing by under the probe to the retracted position, the step of retracting the target, and the focusing of the first image pickup means From the step of moving the first image pickup means so that the surface reaches the probe and obtaining the coordinates of the probe, and the step of connecting the probe to the electrode of the substrate and inspecting the substrate. Probe method.