CN116397126B - 一种高耐腐蚀性的金刚石增强铝基复合材料的制备方法 - Google Patents
一种高耐腐蚀性的金刚石增强铝基复合材料的制备方法 Download PDFInfo
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 129
- 239000010432 diamond Substances 0.000 title claims abstract description 129
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 83
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 83
- 239000002131 composite material Substances 0.000 title claims abstract description 74
- 230000007797 corrosion Effects 0.000 title claims abstract description 36
- 238000005260 corrosion Methods 0.000 title claims abstract description 36
- 239000011159 matrix material Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000002245 particle Substances 0.000 claims abstract description 60
- 238000000034 method Methods 0.000 claims abstract description 49
- 239000011248 coating agent Substances 0.000 claims abstract description 42
- 238000000576 coating method Methods 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 238000009715 pressure infiltration Methods 0.000 claims abstract description 23
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 21
- 239000012298 atmosphere Substances 0.000 claims abstract description 17
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 238000004544 sputter deposition Methods 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 32
- 230000008595 infiltration Effects 0.000 claims description 30
- 238000001764 infiltration Methods 0.000 claims description 30
- 238000005303 weighing Methods 0.000 claims description 12
- 238000000265 homogenisation Methods 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 238000011065 in-situ storage Methods 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 239000002905 metal composite material Substances 0.000 claims description 3
- 229910018125 Al-Si Inorganic materials 0.000 claims description 2
- 229910018520 Al—Si Inorganic materials 0.000 claims description 2
- 229910019064 Mg-Si Inorganic materials 0.000 claims description 2
- 229910019406 Mg—Si Inorganic materials 0.000 claims description 2
- 229910018594 Si-Cu Inorganic materials 0.000 claims description 2
- 229910008465 Si—Cu Inorganic materials 0.000 claims description 2
- 229910007565 Zn—Cu Inorganic materials 0.000 claims description 2
- 239000012300 argon atmosphere Substances 0.000 claims description 2
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 238000004100 electronic packaging Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- 238000011160 research Methods 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
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Abstract
一种高耐腐蚀性的金刚石增强铝基复合材料的制备方法,涉及一种金刚石增强铝基复合材料的制备方法。为了解决金刚石颗粒增强铝基复合材料在复杂服役环境中的腐蚀失效问题,抑制界面产物Al4C3的生成。方法:金刚石颗粒表面镀覆:对金刚石颗粒在保护气氛下进行分段加热处理,利用磁控溅射法在金刚石颗粒表面再制备一层均匀的金属镀层,将金刚石颗粒填充至装配好的模具进行气压浸渗。本发明方法获得的金刚石/铝复合材料相比无镀层及处理的金刚石/铝复合材料的腐蚀速率降低了80%以上,说明本发明方法制备的金刚石颗粒增强铝基复合材料具有优异的抗腐蚀性能,能够提高复合材料使用寿命,可以应用于电子封装用热管理材料,应用前景广阔。
Description
技术领域
本发明涉及一种金刚石增强铝基复合材料的制备方法。
背景技术
铝基复合材料由于具有高比强度、比模量、热膨胀系数小等优异的性能,近些年对其研究日渐迅速,且应用范围不断扩大;而金刚石作为自然界中热导率最高的材料,其在室温下热导率高达2200W/(m·K),热膨胀系数为0.8×10-6/K,且制备的封装材料不存在各向异性,是最有发展潜力的热管理材料之一。由此发展起来的金刚石颗粒增强铝基复合材料成为电子封装散热材料的代表。
作为电子封装用热管理材料,其无可避免地面临各种苛刻的使用环境,这就对其耐蚀性提出了更高的要求。由于金刚石颗粒的加入,基体中界面不连续,在腐蚀性环境介质中,如盐雾、海洋性气氛,金刚石增强铝基复合材料中的铝基体与金刚石可能组成腐蚀原电池,从而造成电子器件的损坏及功能的失效。因此,金刚石增强铝基复合材料的耐蚀性和稳定性对其实用价值和使用范围有着极大的限制。铝基复合材料受腐蚀的影响因素主要包括析出相、界面反应产物、孔隙、增强体与基体界面处的高位错以及增强相类型等。复合材料内成分较复杂,相比纯金属而言,往往具有更大的腐蚀倾向。目前关于铝基复合材料的研究多集中与复合材料的工艺优化及界面改性,对于提高金刚石增强铝基复合材料耐腐蚀性能的研究较少。
发明内容
本发明为解决金刚石颗粒增强铝基复合材料在复杂服役环境中的腐蚀失效问题,抑制界面产物Al4C3的生成,提供一种高耐腐蚀性的金刚石增强铝基复合材料的制备方法。
本发明高耐腐蚀性的金刚石增强铝基复合材料的制备方法按照以下步骤进行:
一、金刚石颗粒表面镀覆:
利用磁控溅射法在金刚石颗粒表面制备W镀层;
所述磁控溅射法的工艺为:选用纯度为99.99%的圆形钨靶材,溅射气压为4×10-3~9×10-3Pa,溅射电压为600V,在300~500℃的溅射温度下溅射180~540min,超声波振动频率为30kHz;
所述W镀层的厚度为100~300nm;
二、高温处理:
对步骤一所得金刚石颗粒在保护气氛下进行分段加热处理:首先以10℃/min的速度加热至350~500℃进行保温,实现镀层均匀化处理;随后以20℃/min的速度加热至800~1100℃保温,在金刚石表面原位生成碳化物,并采用分级工艺冷却;
三、制备金刚石复合镀层:
利用磁控溅射法在步骤二所得金刚石颗粒表面再制备一层均匀的金属镀层;
所述金属镀层为Ti、Cr、Mo或W;
所述金属镀层的厚度为50~200nm;
四、称料:
按照体积分数称取55~70%的金刚石颗粒及30~45%的铝块;
五、复合材料制备:
将步骤三所述金刚石颗粒填充至装配好的模具中,然后将铝锭及填装后的模具置于浸渗炉的炉腔内,将气压浸渗炉抽至真空状态以排除多余气体,随后进行气压浸渗,浸渗完成后以小于2℃/min的速度冷却至室温,进行脱模处理,即完成。
本发明具有如下有益效果:
1.本发明方法利用分段加热的方式对镀W金刚石颗粒进行处理,第一步低温加热实现了金刚石表面镀层的均匀化处理;第二步高温加热促进金属W与金刚石颗粒在界面处形成碳化物,进一步实现了两者之间的紧密连接。加热后采用分级冷却方式一方面避免冷速过快在镀层与金刚石之间产生热应力,另一方面可以调控生成碳化物的晶粒尺寸及形态,使中间层更加致密。
2.本发明金刚石颗粒的处理及复合材料制备均在保护气氛中进行,避免材料发生氧化。此外,加热处理后金刚石表面形成WC后,再在其表面镀覆金属镀层,在金刚石表面形成了“WC+金属”复合镀层结构。制备复合材料时,后镀覆的金属镀层与铝优先反应。保护金刚石表面原位形成的WC层,有效阻止了金刚石与铝的接触,抑制Al4C3形成,使复合材料在潮湿环境及腐蚀介质中具有良好的稳定性。
3.本发明方法获得的金刚石/铝复合材料相比无镀层及处理的金刚石/铝复合材料的腐蚀速率降低了80%以上,说明本发明方法制备的金刚石颗粒增强铝基复合材料具有优异的抗腐蚀性能,能够提高复合材料使用寿命,可以应用于电子封装用热管理材料,应用前景广阔。
附图说明
图1为实施例1所得金刚石/铝复合材料腐蚀后的断口显微组织形貌照片;
图2为对比例金刚石/铝复合材料腐蚀后的断口显微组织形貌照片。
具体实施方式
具体实施方式一:本实施方式高耐腐蚀性的金刚石增强铝基复合材料的制备方法按照以下步骤进行:
一、金刚石颗粒表面镀覆:
利用磁控溅射法在金刚石颗粒表面制备W镀层;
所述磁控溅射法的工艺为:选用纯度为99.99%的圆形钨靶材,溅射气压为4×10-3~9×10-3Pa,溅射电压为600V,在300~500℃的溅射温度下溅射180~540min,超声波振动频率为30kHz;在磁控溅射法中增加超声波振动能够翻滚颗粒,使镀层更均匀;
所述W镀层的厚度为100~300nm;
二、高温处理:
对步骤一所得金刚石颗粒在保护气氛下进行分段加热处理:首先以10℃/min的速度加热至350~500℃进行保温,实现镀层均匀化处理;随后以20℃/min的速度加热至800~1100℃保温,在金刚石表面原位生成碳化物,并采用分级工艺冷却;
三、制备金刚石复合镀层:
利用磁控溅射法在步骤二所得金刚石颗粒表面再制备一层均匀的金属镀层;
所述金属镀层为Ti、Cr、Mo或W;
所述金属镀层的厚度为50~200nm;
四、称料:
按照体积分数称取55~70%的金刚石颗粒及30~45%的铝块;
五、复合材料制备:
将步骤三所述金刚石颗粒填充至装配好的模具中,然后将铝锭及填装后的模具置于浸渗炉的炉腔内,将气压浸渗炉抽至真空状态以排除多余气体,随后进行气压浸渗,浸渗完成后以小于2℃/min的速度冷却至室温,进行脱模处理,即完成。
1.本实施方式方法利用分段加热的方式对镀W金刚石颗粒进行处理,第一步低温加热实现了金刚石表面镀层的均匀化处理;第二步高温加热促进金属W与金刚石颗粒在界面处形成碳化物,进一步实现了两者之间的紧密连接。加热后采用分级冷却方式一方面避免冷速过快在镀层与金刚石之间产生热应力,另一方面可以调控生成碳化物的晶粒尺寸及形态,使中间层更加致密。
2.本实施方式金刚石颗粒的处理及复合材料制备均在保护气氛中进行,避免材料发生氧化。此外,加热处理后金刚石表面形成WC后,再在其表面镀覆金属镀层,在金刚石表面形成了“WC+金属”复合镀层结构。制备复合材料时,后镀覆的金属镀层与铝优先反应。保护金刚石表面原位形成的WC层,有效阻止了金刚石与铝的接触,抑制Al4C3形成,使复合材料在潮湿环境及腐蚀介质中具有良好的稳定性。
3.本实施方式方法获得的金刚石/铝复合材料相比无镀层及处理的金刚石/铝复合材料的腐蚀速率降低了80%以上,说明本实施方式方法制备的金刚石颗粒增强铝基复合材料具有优异的抗腐蚀性能,能够提高复合材料使用寿命,可以应用于电子封装用热管理材料,应用前景广阔。
具体实施方式二:本实施方式与具体实施方式一不同的是:步骤一所述金刚石颗粒的粒径为50~500μm。
具体实施方式三:本实施方式与具体实施方式一或二不同的是:步骤二所述保护气氛为真空气氛、氮气气氛、氩气气氛中的一种。
具体实施方式四:本实施方式与具体实施方式一至三之一不同的是:步骤二所述分段加热处理的工艺为:以10℃/min的速度加热至350~500℃,保温0.5~2h,实现镀层均匀化处理;随后以20℃/min的速度加热至700~900℃时,保温1~5h。
具体实施方式五:本实施方式与具体实施方式一至四之一不同的是:步骤二所述分级冷却工艺为:以5~15℃/min的速度冷却至500~600℃保温0.5~1h,再以5~10℃/min的速度冷却至200~300℃保温0.5~1h,最后随炉冷却至室温。
具体实施方式六:本实施方式与具体实施方式一至五之一不同的是:步骤三所述磁控溅射工艺为:选用纯度为99.99%的圆形靶材,溅射气压为4×10-3~9×10-3Pa,溅射电压为400~600V,在300~500℃的溅射温度下溅射90~360min,超声波振动频率为30kHz。
具体实施方式七:本实施方式与具体实施方式一至六之一不同的是:步骤四所述铝块为纯铝或铝合金。
具体实施方式八:本实施方式与具体实施方式七不同的是:步骤四所述铝合金为Al-Si、Al-Mg-Si、Al-Si-Cu、Al-Zn-Cu中的一种或其中几种的组合。
具体实施方式九:本实施方式与具体实施方式一至八之一不同的是:步骤五所述气压浸渗的温度为700~850℃,浸渗时间为1~2h,浸渗完成后保压1~3h。
具体实施方式十:本实施方式与具体实施方式一至九之一不同的是:步骤五所述气压浸渗时的气压为5~20MPa。
实施例1:
本实施例高耐腐蚀性的金刚石增强铝基复合材料的制备方法按照以下步骤进行:
一、金刚石颗粒表面镀覆:
利用磁控溅射法在金刚石颗粒表面制备W镀层;
所述磁控溅射法的工艺为:选用纯度为99.99%的圆形钨靶材,溅射气压为8×10- 3Pa,溅射电压为600V,在300℃的溅射温度下溅射180min,超声波振动频率为30kHz;
所述W镀层的厚度为100nm;
所述金刚石颗粒的平均粒径为100μm;
二、高温处理:
对步骤一所得金刚石颗粒在保护气氛下进行分段加热处理:首先以10℃/min的速度加热至300℃进行保温1h,实现镀层均匀化处理;随后以20℃/min的速度加热至900℃保温1h,在金刚石表面原位生成碳化物,并采用分级工艺冷却;
所述保护气氛为真空气氛;
所述分级冷却工艺为:以2℃/min的速度冷却至500℃保温0.5h,再以5℃/min的速度冷却至300℃保温0.5h,最后随炉冷却至室温;
三、制备金刚石复合镀层:
利用磁控溅射法在步骤二所得金刚石颗粒表面再制备一层均匀的金属镀层;
所述金属镀层为W;
所述金属镀层的厚度为50nm;
所述磁控溅射工艺为:选用纯度为99.99%的圆形W靶材,溅射气压为9×10-3Pa,溅射电压为600V,在300℃的溅射温度下溅射90min,超声波振动频率为30kHz;
四、称料:
按照体积分数称取60%的金刚石颗粒及40%的铝块;
所述铝块为1060纯铝;
五、复合材料制备:
将步骤三所述金刚石颗粒填充至装配好的模具中,然后将铝锭及填装后的模具置于浸渗炉的炉腔内,将气压浸渗炉抽至真空状态以排除多余气体,随后进行气压浸渗,浸渗完成后以小于2℃/min的速度冷却至室温,进行脱模处理,即完成;
所述气压浸渗的温度为700℃,浸渗时间为1h,浸渗完成后保压1h;
所述气压浸渗的气压为5MPa。
将本实施例制备的金刚石/铝复合材料置于3.5wt%的NaCl溶液中腐蚀7天,经计算,平均腐蚀速率为0.07mm/a,相比对比例1制备的无镀层金刚石/铝复合材料腐蚀速率减少了92.4%。
实施例2:
本实施例高耐腐蚀性的金刚石增强铝基复合材料的制备方法按照以下步骤进行:
一、金刚石颗粒表面镀覆:
利用磁控溅射法在金刚石颗粒表面制备W镀层;
所述磁控溅射法的工艺为:选用纯度为99.99%的圆形钨靶材,溅射气压为8×10- 3Pa,溅射电压为600V,在300℃的溅射温度下溅射180min,超声波振动频率为30kHz;
所述W镀层的厚度为100nm;
所述金刚石颗粒的平均粒径为100μm;
二、高温处理:
对步骤一所得金刚石颗粒在保护气氛下进行分段加热处理:首先以10℃/min的速度加热至400℃进行保温2h,实现镀层均匀化处理;随后以20℃/min的速度加热至950℃保温3h,在金刚石表面原位生成碳化物,并采用分级工艺冷却;
所述保护气氛为真空气氛;
所述分级冷却工艺为:以5℃/min的速度冷却至600℃保温1h,再以10℃/min的速度冷却至300℃保温1h,最后随炉冷却至室温;
三、制备金刚石复合镀层:
利用磁控溅射法在步骤二所得金刚石颗粒表面再制备一层均匀的金属镀层;
所述金属镀层为W;
所述金属镀层的厚度为150nm;
所述磁控溅射工艺为:选用纯度为99.99%的圆形W靶材,溅射气压为9×10-3Pa,溅射电压为600V,在300℃的溅射温度下溅射270min,超声波振动频率为30kHz;
四、称料:
按照体积分数称取60%的金刚石颗粒及40%的铝块;
所述铝块为1060纯铝;
五、复合材料制备:
将步骤三所述金刚石颗粒填充至装配好的模具中,然后将铝锭及填装后的模具置于浸渗炉的炉腔内,将气压浸渗炉抽至真空状态以排除多余气体,随后进行气压浸渗,浸渗完成后以小于2℃/min的速度冷却至室温,进行脱模处理,即完成;
所述气压浸渗的温度为750℃,浸渗时间为1h,浸渗完成后保压1h;
所述气压浸渗的气压为10MPa。
将本实施例制备的金刚石/铝复合材料置于3.5wt%的NaCl溶液中腐蚀7天,经计算,平均腐蚀速率为0.11mm/a,相比对比例2制备的无镀层金刚石/铝复合材料腐蚀速率减少了88.0%。
对比例1:
本对比例1金刚石增强铝基复合材料的制备方法按照以下步骤进行:
按照体积分数称取60%的金刚石颗粒及40%的铝块;铝块为1060纯铝,金刚石颗粒的平均粒径为100μm;将金刚石颗粒填充至装配好的模具中,然后将铝锭及填装后的模具置于浸渗炉的炉腔内,将气压浸渗炉抽至真空状态以排除多余气体,随后进行气压浸渗,浸渗完成后以小于2℃/min的速度冷却至室温,进行脱模处理,即完成;所述气压浸渗的温度为700℃,浸渗时间为1h,浸渗完成后保压1h;所述气压浸渗的气压为5MPa。
对比例2:
金刚石增强铝基复合材料的制备方法按照以下步骤进行:
按照体积分数称取60%的金刚石颗粒及40%的铝块;铝块为1060纯铝,金刚石颗粒的平均粒径为100μm;将金刚石颗粒填充至装配好的模具中,然后将铝锭及填装后的模具置于浸渗炉的炉腔内,将气压浸渗炉抽至真空状态以排除多余气体,随后进行气压浸渗,浸渗完成后以小于2℃/min的速度冷却至室温,进行脱模处理,即完成;所述气压浸渗的温度为750℃,浸渗时间为1h,浸渗完成后保压1h;所述气压浸渗的气压为10MPa。
图1为实施例1所得金刚石/铝复合材料腐蚀后的断口显微组织形貌照片;图2为对比例1金刚石/铝复合材料腐蚀后的断口显微组织形貌照片。均在3.5wt%的NaCl溶液中腐蚀7天,能够看出本实施例制备的复合镀层金刚石/铝复合材料具有更好的界面结合。说明镀层的引入及分段加热处理形成的碳化物会抑制有害界面产物Al4C3的形成。金刚石与铝之间通过碳化物及金属间化合物具有良好的界面结合,因此复合材料的耐腐蚀性能提高。
Claims (9)
1.一种高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:高耐腐蚀性的金刚石增强铝基复合材料的制备方法按照以下步骤进行:
一、金刚石颗粒表面镀覆:
利用磁控溅射法在金刚石颗粒表面制备W镀层;
所述磁控溅射法的工艺为:选用纯度为99.99%的圆形钨靶材,溅射气压为4×10-3~9×10-3Pa,溅射电压为600V,在300~500℃的溅射温度下溅射180~540min,超声波振动频率为30kHz;
所述W镀层的厚度为100~300nm;
二、高温处理:
对步骤一所得金刚石颗粒在保护气氛下进行分段加热处理:首先以10℃/min的速度加热至350~500℃进行保温,保温0.5~2h,实现镀层均匀化处理;随后以20℃/min的速度加热至800~1100℃保温,保温1~5h,在金刚石表面原位生成碳化物,并采用分级冷却工艺;
步骤二所述分级冷却工艺为:以5~15℃/min的速度冷却至500~600℃保温0.5~1h,再以5~10℃/min的速度冷却至200~300℃保温0.5~1h,最后随炉冷却至室温;
三、制备金刚石复合镀层:
利用磁控溅射法在步骤二所得金刚石颗粒表面再制备一层均匀的金属镀层,在金刚石表面形成了“WC+金属”复合镀层结构;
所述金属镀层为Ti、Cr、Mo或W;
所述金属镀层的厚度为50~200nm;
四、称料:
按照体积分数称取55~70%的金刚石颗粒及30~45%的铝块;
五、复合材料制备:
将步骤三所述金刚石颗粒填充至装配好的模具中,然后将铝锭及填装后的模具置于浸渗炉的炉腔内,将气压浸渗炉抽至真空状态以排除多余气体,随后进行气压浸渗,浸渗完成后以小于2℃/min的速度冷却至室温,进行脱模处理,即完成。
2.根据权利要求1所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤一所述金刚石颗粒的粒径为50~500μm。
3.根据权利要求1所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤二所述保护气氛为真空气氛、氮气气氛、氩气气氛中的一种。
4.根据权利要求1所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤二所述分段加热处理的工艺为:以10℃/min的速度加热至350~500℃,保温0.5~2h,实现镀层均匀化处理;随后以20℃/min的速度加热至700~900℃时,保温1~5h。
5.根据权利要求1所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤三所述磁控溅射法为:选用纯度为99.99%的圆形靶材,溅射气压为4×10-3~9×10-3Pa,溅射电压为400~600V,在300~500℃的溅射温度下溅射90~360min,超声波振动频率为30kHz。
6.根据权利要求1所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤四所述铝块为纯铝或铝合金。
7.根据权利要求6所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤四所述铝合金为Al-Si、Al-Mg-Si、Al-Si-Cu、Al-Zn-Cu中的一种或其中几种的组合。
8.根据权利要求1所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤五所述气压浸渗的温度为700~850℃,浸渗时间为1~2h,浸渗完成后保压1~3h。
9.根据权利要求1所述的高耐腐蚀性的金刚石增强铝基复合材料的制备方法,其特征在于:步骤五所述气压浸渗时的气压为5~20MPa。
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