CN116323733A - 酯化合物及树脂组合物 - Google Patents

酯化合物及树脂组合物 Download PDF

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Publication number
CN116323733A
CN116323733A CN202180068035.7A CN202180068035A CN116323733A CN 116323733 A CN116323733 A CN 116323733A CN 202180068035 A CN202180068035 A CN 202180068035A CN 116323733 A CN116323733 A CN 116323733A
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group
ring
fluorine
resin composition
resin
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CN202180068035.7A
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Chinese (zh)
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小椋一郎
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
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  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN202180068035.7A 2020-10-07 2021-10-06 酯化合物及树脂组合物 Pending CN116323733A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-170098 2020-10-07
JP2020170098 2020-10-07
PCT/JP2021/037063 WO2022075382A1 (ja) 2020-10-07 2021-10-06 エステル化合物及び樹脂組成物

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CN116323733A true CN116323733A (zh) 2023-06-23

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CN202180068035.7A Pending CN116323733A (zh) 2020-10-07 2021-10-06 酯化合物及树脂组合物

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US (1) US20230242705A1 (https=)
EP (1) EP4227337A4 (https=)
JP (1) JPWO2022075382A1 (https=)
KR (1) KR20230080422A (https=)
CN (1) CN116323733A (https=)
TW (1) TWI899344B (https=)
WO (1) WO2022075382A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1702094A (zh) * 2004-05-28 2005-11-30 株式会社日本触媒 透明树脂材料
JP2006307150A (ja) * 2005-03-29 2006-11-09 Chisso Corp 重合性液晶組成物および光学異方性薄膜
US20060278851A1 (en) * 2005-06-09 2006-12-14 Chisso Corporation And Chisso Petrochemical Corporation Polymerizable liquid crystal composition and polymer thereof
JP2007126366A (ja) * 2005-11-01 2007-05-24 Nippon Shokubai Co Ltd フッ素化芳香族化合物及びその用途
US20090206330A1 (en) * 2008-02-19 2009-08-20 Samsung Electronics Co., Ltd. Organic insulator composition, organic insulating layer including the composition, and organic thin film transistor including the same
JP2010074087A (ja) * 2008-09-22 2010-04-02 Seiko Epson Corp 有機半導体装置、有機半導体装置の製造方法、電子デバイス、電子機器および絶縁層形成組成物
JP2010074088A (ja) * 2008-09-22 2010-04-02 Seiko Epson Corp 有機半導体装置、有機半導体装置の製造方法、電子デバイス、電子機器および絶縁層形成組成物
CN110621716A (zh) * 2017-05-12 2019-12-27 Dic株式会社 活性酯化合物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098223B2 (ja) * 2005-06-09 2012-12-12 Ｊｎｃ株式会社 重合性液晶組成物およびその重合体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1702094A (zh) * 2004-05-28 2005-11-30 株式会社日本触媒 透明树脂材料
JP2006307150A (ja) * 2005-03-29 2006-11-09 Chisso Corp 重合性液晶組成物および光学異方性薄膜
US20060278851A1 (en) * 2005-06-09 2006-12-14 Chisso Corporation And Chisso Petrochemical Corporation Polymerizable liquid crystal composition and polymer thereof
JP2007126366A (ja) * 2005-11-01 2007-05-24 Nippon Shokubai Co Ltd フッ素化芳香族化合物及びその用途
US20090206330A1 (en) * 2008-02-19 2009-08-20 Samsung Electronics Co., Ltd. Organic insulator composition, organic insulating layer including the composition, and organic thin film transistor including the same
JP2010074087A (ja) * 2008-09-22 2010-04-02 Seiko Epson Corp 有機半導体装置、有機半導体装置の製造方法、電子デバイス、電子機器および絶縁層形成組成物
JP2010074088A (ja) * 2008-09-22 2010-04-02 Seiko Epson Corp 有機半導体装置、有機半導体装置の製造方法、電子デバイス、電子機器および絶縁層形成組成物
CN110621716A (zh) * 2017-05-12 2019-12-27 Dic株式会社 活性酯化合物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
STN（REGISTRY，CASREACT，CAPLUS), 31 August 2016 (2016-08-31), pages 1 - 24 *

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KR20230080422A (ko) 2023-06-07
EP4227337A4 (en) 2024-12-04
TW202222962A (zh) 2022-06-16
US20230242705A1 (en) 2023-08-03
WO2022075382A1 (ja) 2022-04-14
JPWO2022075382A1 (https=) 2022-04-14
EP4227337A1 (en) 2023-08-16
TWI899344B (zh) 2025-10-01

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