CN116323725A - 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 - Google Patents

树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 Download PDF

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CN116323725A
CN116323725A CN202180062840.9A CN202180062840A CN116323725A CN 116323725 A CN116323725 A CN 116323725A CN 202180062840 A CN202180062840 A CN 202180062840A CN 116323725 A CN116323725 A CN 116323725A
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resin composition
compound
group
resin
styrene
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王谊群
斋藤宏典
井上博晴
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
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    • C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
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    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
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    • H05K1/02—Details
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

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  • Chemical & Material Sciences (AREA)
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  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202180062840.9A 2020-09-18 2021-09-10 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 Pending CN116323725A (zh)

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JP2020-157403 2020-09-18
JP2020157403 2020-09-18
PCT/JP2021/033408 WO2022059625A1 (ja) 2020-09-18 2021-09-10 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板

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Publication number Priority date Publication date Assignee Title
EP4501973A4 (en) * 2022-03-30 2026-05-06 Zeon Corp Hollow particles and production method therefor
WO2024095742A1 (ja) * 2022-11-02 2024-05-10 Ａｇｃ株式会社 硬化性組成物、樹脂シート、積層体、金属張積層板および配線基板
WO2024161859A1 (ja) * 2023-02-01 2024-08-08 Ａｇｃ株式会社 硬化性組成物、樹脂シート、積層体、金属張積層板および配線基板

Citations (5)

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JP2007131763A (ja) * 2005-11-11 2007-05-31 Showa Highpolymer Co Ltd （スチレン−アリールマレイミド）ブロック共重合体、その製造方法、およびそれを含む熱硬化性樹脂組成物
JP2010523788A (ja) * 2007-04-13 2010-07-15 エルジー・ケム・リミテッド 光学フィルム、位相差フィルムおよびそれを含む液晶表示装置
CN110366569A (zh) * 2017-03-02 2019-10-22 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
WO2020158849A1 (ja) * 2019-01-31 2020-08-06 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、積層板及びプリント配線板
CN115135715A (zh) * 2020-02-18 2022-09-30 松下知识产权经营株式会社 热固性树脂组合物、树脂片、具有树脂的金属箔、覆金属层压体和印刷线路板

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US20130187095A1 (en) * 2005-12-29 2013-07-25 Designer Molecules, Inc. Thermosetting adhesive compositions
WO2016117554A1 (ja) * 2015-01-19 2016-07-28 株式会社巴川製紙所 熱硬化性接着剤組成物、熱硬化性接着フィルム、および複合フィルム
TWI732764B (zh) * 2015-06-01 2021-07-11 日商富士軟片股份有限公司 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007131763A (ja) * 2005-11-11 2007-05-31 Showa Highpolymer Co Ltd （スチレン−アリールマレイミド）ブロック共重合体、その製造方法、およびそれを含む熱硬化性樹脂組成物
JP2010523788A (ja) * 2007-04-13 2010-07-15 エルジー・ケム・リミテッド 光学フィルム、位相差フィルムおよびそれを含む液晶表示装置
CN110366569A (zh) * 2017-03-02 2019-10-22 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
WO2020158849A1 (ja) * 2019-01-31 2020-08-06 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、積層板及びプリント配線板
CN115135715A (zh) * 2020-02-18 2022-09-30 松下知识产权经营株式会社 热固性树脂组合物、树脂片、具有树脂的金属箔、覆金属层压体和印刷线路板

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