CN116249311A - Mobile terminal heat dissipation device, mobile terminal heat dissipation method and mobile terminal - Google Patents
Mobile terminal heat dissipation device, mobile terminal heat dissipation method and mobile terminal Download PDFInfo
- Publication number
- CN116249311A CN116249311A CN202111485587.6A CN202111485587A CN116249311A CN 116249311 A CN116249311 A CN 116249311A CN 202111485587 A CN202111485587 A CN 202111485587A CN 116249311 A CN116249311 A CN 116249311A
- Authority
- CN
- China
- Prior art keywords
- heat
- mobile terminal
- temperature
- radiator
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 230000020169 heat generation Effects 0.000 claims abstract description 20
- 238000012546 transfer Methods 0.000 claims description 73
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 21
- 239000008213 purified water Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 230000033228 biological regulation Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 14
- 238000001816 cooling Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 230000003213 activating effect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000011895 specific detection Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a mobile terminal heat dissipation device, which comprises: the first radiator is arranged in the heat generation area of the mobile terminal; the second radiator is arranged in the non-heat generating area of the mobile terminal; the heat transmission pipeline is connected with the first radiator and the second radiator and is used for transmitting heat conduction medium exchange between the first radiator and the second radiator; the temperature detection device is used for detecting the temperature of the mobile terminal; the heat conduction medium driving device is used for adjusting the exchange speed of the heat conduction medium between the first radiator and the second radiator when detecting that the temperature of the mobile terminal exceeds a preset first temperature threshold value; the embodiment of the invention also provides a mobile terminal heat dissipation method, which comprises the following steps: when the temperature of the mobile terminal is detected to exceed a preset first temperature threshold, the heat conduction medium driving device is started to adjust the exchange speed of the heat conduction medium in the heat generation area and the heat conduction medium in the non-heat generation area, so that intelligent heat dissipation regulation and control can be realized according to the temperature change of the mobile terminal.
Description
Technical Field
The present invention relates to mobile terminals, and more particularly, to a mobile terminal heat dissipation device, a mobile terminal heat dissipation method, and a mobile terminal.
Background
With the development of electronic technology, the functions of the mobile terminal are more and more powerful, and the variety and quantity of information stored in the mobile terminal are more and more. For convenience in carrying and using, the mobile terminal is required to be light and thin. However, as the size of the mobile terminal is smaller and smaller, the functions to be realized are more and more powerful, and thus, the power consumption of the mobile terminal is increased. Therefore, how to solve the heat dissipation problem is a difficult problem in the industry, and although the design of using the heat dissipation plate is already in existence in the industry, the performance of the heat dissipation plate is positively related to the area and the thickness of the heat dissipation plate. Therefore, the desire to maximize the area of the heat dissipating plate is a goal, but due to the thinner and thinner design of the mobile terminal, the heat dissipating plate acts as a separate heat sink, which has the following problems:
(1) the radiator is accommodated by embedding and hollowing the middle frame, so that the strength of the middle frame can be reduced; if the strength of the middle frame is not reduced, the area of the heat dissipation plate can be reduced, and if the heat dissipation plate is too small, the cooling effect is too weak.
(2) The passive heat dissipation by simply relying on the heat dissipation plate cannot be intelligently regulated and controlled according to actual demands, and an ideal heat dissipation effect is difficult to achieve.
Disclosure of Invention
In order to at least solve the above technical problems, the embodiment of the invention provides a mobile terminal heat dissipation device which can conduct efficient and accurate regulation and control of intelligent heat dissipation according to temperature change of a mobile terminal.
To achieve the above object, an embodiment of the present invention provides a heat dissipation device for a mobile terminal, including:
the first radiator is arranged in the heat generation area of the mobile terminal;
the second radiator is arranged in the non-heat generating area of the mobile terminal;
the heat transmission pipeline is connected with the first radiator and the second radiator and is used for transmitting heat conduction medium exchange between the first radiator and the second radiator;
the temperature detection device is used for detecting the temperature of the mobile terminal;
and the heat conduction medium driving device is used for adjusting the exchange speed of the heat conduction medium between the first radiator and the second radiator when the temperature of the mobile terminal is detected to exceed the preset first temperature threshold value.
In order to achieve the above objective, an embodiment of the present invention further provides a mobile terminal heat dissipation method, including:
when the temperature of the mobile terminal exceeds a preset first temperature threshold value, starting a heat conduction medium driving device to adjust the exchange speed of the heat conduction medium of the heat generation area and the non-heat generation area.
To achieve the above object, an embodiment of the present invention further provides a mobile terminal, including: the heat dissipation method or the heat dissipation device is adopted.
The mobile terminal radiating device comprises a first radiator, a second radiator, a heat transmission pipeline and a temperature detection device, wherein the first radiator is arranged in a heat generation area of a mobile terminal, the second radiator is arranged in a non-heat generation area of the mobile terminal, the heat transmission pipeline is connected with the first radiator and the second radiator and is used for transmitting heat conduction medium exchange between the first radiator and the second radiator, the temperature detection device is used for detecting the temperature of the mobile terminal, the heat conduction medium driving device is used for adjusting the heat conduction medium exchange speed between the first radiator and the second radiator when detecting that the temperature of the mobile terminal exceeds a preset first temperature threshold; through the special design of the middle frame of the mobile terminal, the combination of the passive heat dissipation radiator and the active heat dissipation driving device can perform perfect combination of passive heat dissipation and active cooling according to the temperature change of the mobile terminal, and simultaneously can perform intelligent cooling grade regulation and control according to actual requirements; the integrated design of the middle frame and the radiator fuses the advantages of the active and passive heat dissipation schemes, and increases the heat dissipation area on the premise of ensuring the strength of the middle frame, so that the heat dissipation effect of the mobile terminal is improved, and the use experience of a user is further improved.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a heat dissipating device for a mobile terminal according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a radiator structure of a mobile terminal heat dissipating device according to an embodiment of the present invention in a heat source device area;
fig. 3 is a schematic flow chart of a heat dissipation method of a mobile terminal according to an embodiment of the present invention;
fig. 4 is a schematic diagram of an association structure of a heat dissipating device for a mobile terminal according to an embodiment of the present invention.
Reference numerals illustrate:
101-a mobile terminal; 102/201/401-first heat sink; 103/402-a second heat sink; 104/403-heat transfer tubing; 105/202-heat source device; 106/203/404-temperature detecting means; 107/405-thermally conductive media drive means; 108-a middle frame of the mobile terminal.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the following description of the embodiments accompanied with the accompanying drawings will be given in detail. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be arbitrarily combined with each other.
The technical scheme of the invention will be described in detail with reference to the accompanying drawings.
The embodiment of the invention also provides a mobile terminal heat dissipation device, which comprises:
the first radiator is arranged in the heat generation area of the mobile terminal;
the second radiator is arranged in the non-heat generating area of the mobile terminal;
the heat transmission pipeline is connected with the first radiator and the second radiator and is used for transmitting heat conduction medium exchange between the first radiator and the second radiator;
the temperature detection device is used for detecting the temperature of the mobile terminal;
and the heat conduction medium driving device is used for adjusting the exchange speed of the heat conduction medium between the first radiator and the second radiator when the temperature of the mobile terminal is detected to exceed the preset first temperature threshold value.
According to the mobile terminal heat dissipation device, the advantages of the active and passive heat dissipation schemes are combined, the heat dissipation area is increased, the heat dissipation effect of the mobile terminal is improved, and meanwhile the use experience of a user is further improved.
Example 1
Fig. 1 is a schematic structural diagram of an embodiment of a mobile terminal heat dissipating device according to an embodiment of the present invention, and fig. 2 is a schematic structural diagram of a heat sink of a mobile terminal heat dissipating device according to an embodiment of the present invention, where the mobile terminal heat dissipating device according to an embodiment of the present invention is described in detail below with reference to fig. 1-2.
The mobile terminal heat dissipation device of the embodiment of the invention can include, but is not limited to: the heat sink comprises a first heat sink 102/201, a second heat sink 103, a heat transfer conduit 104, a temperature detection device 106/203, and a heat transfer medium driving device 107.
In some exemplary embodiments, the mobile terminal 101 in the embodiments of the present invention is described in detail by taking a mobile phone as an example, and the mobile terminal 101 is merely used to illustrate the embodiments of the present invention by taking a mobile phone as an example, and is not limited to a mobile phone, for example, the mobile terminal 101 may also be a tablet.
In some exemplary embodiments, the first heat sink 102/201 may be disposed in a heat generating region of the mobile phone, for example, the heat source device 105/202 generating a heat source for expanding a heat radiating area for the heat generating region of the mobile phone.
In some exemplary embodiments, the first heat sink 102/201 may be fully overlaid on the heat source device 105/202 of the mobile phone, and the area of the first heat sink 102/201 is larger than the area of the heat source device 105/202.
In some exemplary embodiments, the heat source device 105/202 may also include a PCB (Printed Circuit Board ) or other suitable heat generating device.
In some exemplary embodiments, the second heat sink 103 may be disposed at a non-heat generating region of the mobile phone, for example, a region where no heat is generated, or a region where heat is generated less than a preset value.
In some exemplary embodiments, the first heat sink 102/201 and the second heat sink 103 may be integrally formed with the middle frame of the mobile phone, and the specific manner of integral forming is not limited.
In some exemplary embodiments, the first heat sink 102/201 and the second heat sink 103 may be connected by a heat transfer conduit 104, further expanding the heat dissipation area of the heat generating region.
In some exemplary embodiments, the heat transfer conduit 104 may also be integrally designed with the first heat sink 102/201 or the second heat sink 103.
In some exemplary embodiments, the heat transfer conduit 104 may also be independent of the first heat sink 102/201 and the second heat sink 103, i.e., the heat transfer conduit 104 may be retrofitted to a subsequent application.
In some exemplary embodiments, the heat transfer pipe 104 may be made of metal or non-metal that can safely carry the heat transfer medium.
In some exemplary embodiments, the areas of the first heat sink 102/201 and the second heat sink 103 may be set to different heat sink surface areas depending on the actual product requirements.
In some exemplary embodiments, the first heat sink 102/201, the second heat sink 103, and the heat transfer conduit 104 together comprise a single circulation conduit.
In some exemplary embodiments, a heat transfer medium is disposed in the heat transfer conduit 104.
In some exemplary embodiments, the thermally conductive medium comprises a gas-liquid mixture.
In some exemplary embodiments, the heat transfer medium comprises purified water or diethyl ether.
In some exemplary embodiments, a temperature detection device 106/203 is also provided, and the temperature detection device 106/203 may include a NTC (Negative Temperature Coefficient Sensor) temperature sensor.
In some exemplary embodiments, the temperature sensing device 106/203 is located on the PCB for monitoring the temperature of the PCB in real time.
In some exemplary embodiments, the temperature detecting device 106/203 may also intermittently detect the local temperature of the mobile terminal at preset time intervals, and the specific detection manner and location are not limited.
In some exemplary embodiments, when the mobile terminal temperature is below a preset first temperature threshold, heat is dissipated by virtue of the temperature difference between the first heat sink 102/201 and the second heat sink 103, passively by virtue of the flow or transfer of the heat transfer medium.
In some exemplary embodiments, when the mobile terminal is in a working state, the first radiator 102/201 spreads heat generated by the PCB, so as to quickly relieve a temperature concentration point, and when the gas occupies a relatively large area, as the heat transmission pipeline 104 is transported to the second radiator 103, the second radiator 103 performs gas-liquid conversion because the current temperature of the second radiator 103 is lower than the temperature of the heat transmitted by the second radiator 103, so as to achieve a further heat dissipation effect; the cooled heat transfer medium is then returned to the first heat sink 102/201 via the return line of the heat transfer line 104.
In some exemplary embodiments, the preset first temperature threshold may be set according to the heat of actual product power consumption (heat generated by the PCB) and the environment.
In some exemplary embodiments, a thermally conductive media drive 107 is also provided in the heat transfer conduit 104.
In some exemplary embodiments, the thermally conductive media drive 107 includes a liquid-cooled micropump (Liquid cooled micropump) for activating when the temperature of the mobile terminal is above a preset first temperature threshold to accelerate the flow rate of the thermally conductive media (i.e., active heat dissipation).
In some exemplary embodiments, when the temperature of the mobile phone exceeds a preset first temperature threshold, the heat conducting medium driving device is started according to the temperature level to adjust the exchange speed of the heat conducting medium of the heat generating area and the non-heat generating area.
In some exemplary embodiments, the above-mentioned adjusting the heat transfer medium exchange speed between the heat generating area and the non-heat generating area according to the temperature level by activating the heat transfer medium driving device may be to adjust the rotation speed of the heat transfer medium driving device 107 step by step; the corresponding rotational speed of the heat transfer medium driving device 107 may also be selected according to the actual temperature.
In some exemplary embodiments, the temperature level can be designed to be one degree celsius, can be set to be two degrees celsius, and can be adjusted according to actual needs; each level corresponds to a respective rotational speed of the heat transfer medium drive 107.
In some exemplary embodiments, it may be designed to adjust the rotation speed of the corresponding heat transfer medium driving device 107 step by step from the first temperature threshold value when it is detected that the current temperature of the mobile terminal exceeds the preset first temperature threshold value.
In some exemplary embodiments, it may also be designed to directly execute the rotation speed of the heat transfer medium driving device 107 corresponding to the current temperature when it is detected that the current temperature of the mobile terminal exceeds the preset first temperature threshold.
In some exemplary embodiments, when it is detected that the current temperature of the mobile terminal does not exceed the preset first temperature threshold, the heat transfer medium driving device 107 is turned off, and the heat transfer medium automatically flows to dissipate heat (i.e., passively dissipates heat) depending on the temperature difference between the first heat sink 102/201 and the second heat sink 103.
In some exemplary embodiments, for example, the preset first temperature threshold is 25 degrees celsius, when the mobile phone is in the on state and not more than 25 degrees celsius, the heat conduction medium flows by itself, that is, the current mobile phone is in the passive heat dissipation state, depending on the temperature difference between the first heat sink 102/201 and the second heat sink 103.
In some exemplary embodiments, when the temperature of each stage (temperature level) is two degrees celsius added in steps, for example: the first level is 27 degrees celsius, the second level is 29 degrees celsius, the third level is 31 degrees celsius, and so on.
In some exemplary embodiments, each stage corresponds to a different rotational speed of the thermally conductive media drive 107; for example: the liquid cooling micropump is started at 25.1 ℃ and the corresponding heat conduction medium driving device 107 at the first stage rotates; when the temperature of the mobile phone reaches 27 ℃, the second-stage corresponding heat conduction medium driving device 107 is started to rotate.
In some exemplary embodiments, the thermally conductive media drive 107 includes, but is not limited to, a liquid-cooled micropump.
The rotational speed of the liquid-cooled micropump in some exemplary embodiments may also be set according to different heat transfer mediums; for example, when the heat transfer medium is purified water and the heat transfer medium is diethyl ether, the cooling effect or speed of the two is different, and the rotation speed of the liquid cooling micropump is different.
The embodiment of the invention provides a mobile terminal heat dissipation method, which is applied to the mobile terminal heat dissipation device and comprises the following steps:
when the temperature of the mobile terminal exceeds a preset first temperature threshold value, starting a heat conduction medium driving device to adjust the exchange speed of the heat conduction medium of the heat generation area and the non-heat generation area.
Example 2
Fig. 3 is a schematic flow chart of a mobile terminal heat dissipation method according to an embodiment of the present invention, and the mobile terminal heat dissipation method according to an embodiment of the present invention will be described in detail with reference to fig. 3.
In step 301, a temperature detection device detects the temperature of a mobile terminal.
In some exemplary embodiments, the temperature of the mobile terminal is detected by a temperature detection device.
In some exemplary embodiments, the temperature detection device may include a NTC (Negative Temperature Coefficient Sensor) temperature sensor.
In some exemplary embodiments, the current temperature of the mobile terminal may be represented by detecting the local temperature of the mobile terminal by a temperature detection device; for example by detecting a heat generating area to represent the temperature of the mobile terminal.
In some exemplary embodiments, the heat generating region comprises a PCB board.
In step 302, when the temperature of the mobile terminal exceeds the preset first temperature threshold, the heat conduction medium driving device is started to adjust the exchange speed of the heat conduction medium in the heat generation area and the non-heat generation area.
In some exemplary embodiments, a first heat sink is provided in a heat generating region (i.e., a heat source device region) of the mobile terminal, and a second heat sink is provided in a non-heat generating region.
In some exemplary embodiments, the first heat sink and the second heat sink are each integrally formed with the center frame of the mobile terminal.
In some exemplary embodiments, the first heat sink and the second heat sink are connected by a heat transfer conduit having a heat transfer medium disposed therein.
In some exemplary embodiments, the thermally conductive medium comprises a gas-liquid mixture.
In some exemplary embodiments, the heat transfer medium comprises purified water or diethyl ether.
In some exemplary embodiments, a heat transfer medium drive is also provided in the heat transfer conduit, which drive is used to drive the transfer rate of the heat transfer medium.
In some exemplary embodiments, the thermally conductive media drive includes, but is not limited to, a liquid-cooled micropump (Liquid cooled micropump).
In some exemplary embodiments, a temperature detection device is also provided, the temperature detection device comprising a NTC (Negative Temperature Coefficient Sensor) temperature sensor.
In some exemplary embodiments, when the temperature monitoring device detects that the current temperature of the mobile terminal exceeds the preset first temperature threshold, the exchange speed of the heat conduction medium is adjusted step by step (i.e. active heat dissipation) according to the temperature level.
In some exemplary embodiments, the temperature level may be one degree celsius to one level, and may also be set to two degrees celsius to one level, and the temperature level may be adjusted according to actual needs.
In some exemplary embodiments, when it is detected that the current temperature of the mobile terminal does not exceed the preset first temperature threshold, the driving device is turned off, and the heat transfer medium automatically flows to dissipate heat (i.e., passively dissipates heat) depending on the temperature difference between the first heat sink and the second heat sink.
In some exemplary embodiments, for example, the preset first temperature threshold is 25 degrees celsius, when the mobile phone is in the on state and not more than 25 degrees celsius, the heat conduction medium flows by itself, that is, the current mobile phone is in the passive heat dissipation state, depending on the temperature difference between the first heat sink 102/201 and the second heat sink 103.
In some exemplary embodiments, when the temperature of each stage (temperature level) is two degrees celsius added in steps, for example: the first level is 27 degrees celsius, the second level is 29 degrees celsius, the third level is 31 degrees celsius, and so on.
In some exemplary embodiments, each stage corresponds to a different heat transfer medium drive speed; for example: the liquid cooling micropump is started at 25.1 ℃ and the rotation speed of the corresponding heat conduction medium driving device at one level is maintained; when the temperature of the mobile phone reaches 27 ℃, the rotating speed of the heat conduction medium driving device corresponding to the second stage is started.
In some exemplary embodiments, the thermally conductive media drive includes, but is not limited to, a liquid-cooled micropump.
The rotational speed of the liquid-cooled micropump in some exemplary embodiments may also be set according to different heat transfer mediums; for example, when the heat transfer medium is purified water and the heat transfer medium is diethyl ether, the cooling effect or speed of the two is different, and the rotation speed of the liquid cooling micropump is different.
The embodiment of the invention also provides a mobile terminal heat dissipation device, which comprises:
the first radiator is arranged in the heat generation area of the mobile terminal;
the second radiator is arranged in the non-heat generating area of the mobile terminal;
the heat transmission pipeline is connected with the first radiator and the second radiator and is used for transmitting heat conduction medium exchange between the first radiator and the second radiator;
the temperature detection device is used for detecting the temperature of the mobile terminal;
and the heat conduction medium driving device is used for adjusting the exchange speed of the heat conduction medium between the first radiator and the second radiator when the temperature of the mobile terminal is detected to exceed the preset first temperature threshold value.
According to the mobile terminal heat dissipation device, the advantages of the active and passive heat dissipation schemes are combined, the heat dissipation area is increased, the heat dissipation effect of the mobile terminal is improved, and meanwhile the use experience of a user is further improved.
Example 3
Fig. 4 is a schematic diagram of an association structure of a mobile terminal heat dissipation device according to an embodiment of the present invention, and the following describes in detail the association structure of the mobile terminal heat dissipation device according to an embodiment of the present invention with reference to fig. 4.
The mobile terminal heat dissipation device of the embodiment of the invention can include, but is not limited to: a first heat sink 401, a second heat sink 402, a heat transfer conduit 403, a temperature detection device 404, and a thermally conductive media drive device 405.
In some exemplary embodiments, the mobile terminal in the embodiments of the present invention is described in detail by taking a mobile phone as an example, and the mobile terminal is merely used to illustrate the embodiments of the present invention by taking the mobile phone as an example, and is not limited to the mobile phone, for example, the mobile terminal may be a tablet.
In some exemplary embodiments, the first heat sink 401 may be disposed at a heat generating area of the mobile phone, for example, a heat source device generating a heat source for expanding a heat radiating area of the heat generating area of the mobile phone.
In some exemplary embodiments, the first heat sink 401 may be entirely covered over the heat source device of the cell phone.
In some exemplary embodiments, the area of the first heat sink 401 is larger than the area of the heat source device.
In some exemplary embodiments, the heat source device may include a PCB (Printed Circuit Board ) or other suitable heat generating device.
In some exemplary embodiments, the second heat sink 402 may be disposed in a non-heat generating area of the mobile phone, for example, an area where no heat is generated, or an area where heat is generated less than a preset value, or an area where heat is generated less than a heat source generating device.
In some exemplary embodiments, the first heat spreader 401 and the second heat spreader 402 may be integrally formed with the middle frame of the mobile phone, and the specific way of integrally forming is not limited.
In some exemplary embodiments, the first heat sink 401 and the second heat sink 402 may be connected by a heat transfer pipe 403, further expanding the heat dissipation area of the heat generation region.
In some exemplary embodiments, the first heat sink 401, the second heat sink 402, and the heat transfer conduit 403 form a cyclic heat dissipating closed loop structure.
In some exemplary embodiments, the heat transfer conduit 403 may also be integrally designed with the first heat sink 401 or the second heat sink 402.
In some exemplary embodiments, the heat transfer conduit 403 may also be independent of the first heat sink 401 and the second heat sink 402, i.e., the heat transfer conduit 403 may be retrofitted to a subsequent application.
In some exemplary embodiments, the heat transfer tube 403 may be made of a metal material, or may be made of a non-metal material that can safely carry a heat transfer medium.
In some exemplary embodiments, the areas of the first heat sink 401 and the second heat sink 402 may be set to different heat sink surface areas according to actual product requirements.
In some exemplary embodiments, a heat transfer medium is disposed in the heat transfer conduit 403.
In some exemplary embodiments, the heat transfer medium comprises purified water or diethyl ether.
In some exemplary embodiments, a temperature detection device 404 is also provided, and the temperature detection device 404 may include a NTC (Negative Temperature Coefficient Sensor) temperature sensor.
In some exemplary embodiments, the temperature detection device 404 is located on the PCB for monitoring the temperature of the PCB in real time.
In some exemplary embodiments, the temperature detecting device 404 may also intermittently detect the local temperature of the mobile terminal at preset time intervals, and the specific detection manner and location are not limited.
In some exemplary embodiments, when the mobile terminal temperature is below a preset first temperature threshold, heat is dissipated by means of a temperature difference between the first heat sink 401 and the second heat sink 402, passively by means of a flow or transfer of a heat transfer medium.
In some exemplary embodiments, when the mobile terminal is in a working state, the first radiator 401 spreads heat generated by the PCB to quickly relieve a temperature concentration point, and when the heat conduction medium in the first radiator 401 generates gas-liquid change and the gas occupies a relatively large area, as the heat transmission pipeline 403 is transported to the second radiator 402, the second radiator 402 performs gas-liquid conversion because the current temperature of the second radiator 402 is lower than the temperature of the transmitted heat, so as to achieve the effect of further heat dissipation; the cooled heat transfer medium is then returned to the first heat sink 401 via a return line of the heat transfer line 403.
In some exemplary embodiments, the preset first temperature threshold may be set according to the heat of actual product power consumption (heat generated by the PCB) and the environment.
In some exemplary embodiments, a thermally conductive media drive 405 is also provided in the heat transfer conduit 403.
In some exemplary embodiments, the thermally conductive media drive 405 includes a liquid-cooled micro-pump (Liquid cooled micropump) for activating when the temperature of the mobile terminal is above a preset first temperature threshold to accelerate the flow rate of the thermally conductive media (i.e., active heat dissipation).
In some exemplary embodiments, when the temperature of the mobile phone exceeds a preset first temperature threshold, the heat conducting medium driving device is started according to the temperature level to adjust the exchange speed of the heat conducting medium of the heat generating area and the non-heat generating area.
In some exemplary embodiments, the above-mentioned adjusting the heat transfer medium exchange speed between the heat generating area and the non-heat generating area according to the temperature level by activating the heat transfer medium driving device may be to adjust the rotation speed of the heat transfer medium driving device 405 step by step; the corresponding rotational speed of the heat transfer medium driving device 405 may also be selected according to the actual temperature.
In some exemplary embodiments, the temperature level can be designed to be one degree celsius, can be set to be two degrees celsius, and can be adjusted according to actual needs; each level corresponds to a respective heat transfer medium drive 405 rotational speed.
In some exemplary embodiments, it may be designed to adjust the rotation speed of the corresponding heat transfer medium driving device 405 step by step from the first temperature threshold value when it is detected that the current temperature of the mobile terminal exceeds the preset first temperature threshold value.
In some exemplary embodiments, it may also be designed to directly execute the rotation speed of the heat conduction medium driving device 405 corresponding to the current temperature when it is detected that the current temperature of the mobile terminal exceeds the preset first temperature threshold.
In some exemplary embodiments, when it is detected that the current temperature of the mobile terminal does not exceed the preset first temperature threshold, the heat transfer medium driving device 405 is turned off, and the heat transfer medium automatically flows to dissipate heat (i.e., passively dissipates heat) depending on the temperature difference between the first heat sink 401 and the second heat sink 402.
In some exemplary embodiments, for example, the preset first temperature threshold is 25 degrees celsius, when the mobile phone is in the on state and not more than 25 degrees celsius, the heat conduction medium flows by itself, that is, the current mobile phone is in the passive heat dissipation state, depending on the temperature difference between the first heat sink 401 and the second heat sink 402.
In some exemplary embodiments, when the temperature of each stage (temperature level) is two degrees celsius added in steps, for example: the first level is 27 degrees celsius, the second level is 29 degrees celsius, the third level is 31 degrees celsius, and so on.
In some exemplary embodiments, each stage corresponds to a different rotational speed of the thermally conductive media drive 405; for example: the liquid cooling micropump is started at 25.1 ℃ and the corresponding heat conduction medium driving device 405 rotating speed at one stage is maintained; when the temperature of the mobile phone reaches 27 ℃, the second-stage corresponding heat conduction medium driving device 405 is started to rotate.
In some exemplary embodiments, the thermally conductive media drive 405 includes, but is not limited to, a liquid-cooled micropump.
The rotational speed of the liquid-cooled micropump in some exemplary embodiments may also be set according to different heat transfer mediums; for example, when the heat transfer medium is purified water and the heat transfer medium is diethyl ether, the cooling effect or speed of the two is different, and the rotation speed of the liquid cooling micropump is different.
Example 4
The embodiment of the invention also provides a mobile terminal which can be a mobile phone, but is not limited to the mobile phone, for example, the mobile terminal can also be a tablet or the like.
In some exemplary embodiments, the mobile terminal includes the above heat dissipation method or includes the above heat dissipation device.
Although the embodiments of the present invention are described above, the embodiments are only used for facilitating understanding of the present invention, and are not intended to limit the present invention. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is to be determined by the appended claims.
Claims (11)
1. A mobile terminal heat sink, comprising:
the first radiator is arranged in the heat generation area of the mobile terminal;
a second heat sink disposed at a non-heat generating region of the mobile terminal;
a heat transfer conduit connecting the first heat sink and the second heat sink for transferring exchange of a heat transfer medium between the first heat sink and the second heat sink;
a temperature detection device for detecting the temperature of the mobile terminal;
and the heat conduction medium driving device is used for adjusting the exchange speed of the heat conduction medium between the first radiator and the second radiator when the temperature of the mobile terminal exceeds the preset first temperature threshold value.
2. The apparatus of claim 1, wherein the first heat sink and the second heat sink are each integrally designed with a center frame of the mobile terminal.
3. The apparatus of claim 1, wherein the heat transfer conduit is integrally designed with the first heat sink or the second heat sink.
4. The apparatus of claim 1, wherein the thermally conductive media drive comprises a liquid-cooled micropump.
5. The apparatus of claim 1, wherein the thermally conductive medium comprises purified water or diethyl ether.
6. The apparatus of claim 1, wherein the heat generating region comprises a PCB board.
7. A mobile terminal heat dissipation method applied to the mobile terminal heat dissipation device as set forth in any one of claims 1 to 7, comprising:
when the temperature of the mobile terminal exceeds a preset first temperature threshold value, starting a heat conduction medium driving device to adjust the exchange speed of the heat conduction medium in the heat generation area and the non-heat generation area.
8. The method of claim 7, wherein the thermally conductive media drive is turned off when the temperature of the mobile terminal is detected to not exceed a preset first temperature threshold.
9. The method of claim 7, wherein adjusting the exchange rate of the heat transfer medium between the heat generating region and the non-heat generating region comprises:
and when the temperature of the mobile terminal exceeds the preset first temperature threshold, adjusting the exchange speed of the heat conduction medium of the heat generation area and the non-heat generation area according to the temperature grade.
10. The method of claim 7, wherein a heat sink integrally designed with a center frame of the mobile terminal is provided at the heat generating region and the non-heat generating region of the mobile terminal.
11. A mobile terminal, characterized in that the mobile terminal comprises a heat dissipating device according to any of claims 1-6 or that the mobile terminal employs a heat dissipating method according to any of claims 7-10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111485587.6A CN116249311A (en) | 2021-12-07 | 2021-12-07 | Mobile terminal heat dissipation device, mobile terminal heat dissipation method and mobile terminal |
| PCT/CN2022/116854 WO2023103489A1 (en) | 2021-12-07 | 2022-09-02 | Mobile terminal heat dissipation device, mobile terminal heat dissipation method, and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111485587.6A CN116249311A (en) | 2021-12-07 | 2021-12-07 | Mobile terminal heat dissipation device, mobile terminal heat dissipation method and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116249311A true CN116249311A (en) | 2023-06-09 |
Family
ID=86626413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111485587.6A Pending CN116249311A (en) | 2021-12-07 | 2021-12-07 | Mobile terminal heat dissipation device, mobile terminal heat dissipation method and mobile terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116249311A (en) |
| WO (1) | WO2023103489A1 (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4201762B2 (en) * | 2004-12-17 | 2008-12-24 | 富士通株式会社 | Electronics |
| JP4773260B2 (en) * | 2006-04-25 | 2011-09-14 | 株式会社日立製作所 | COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME |
| CN201413489Y (en) * | 2009-04-21 | 2010-02-24 | 联想(北京)有限公司 | Cooling system and a computer provided with same |
| CN105974962A (en) * | 2016-05-05 | 2016-09-28 | 天津瑞鑫科技咨询有限公司 | Intelligent electronic controllable temperature regulator |
| CN109375747B (en) * | 2018-11-08 | 2023-03-31 | 努比亚技术有限公司 | Heat dissipation structure, mobile terminal and heat dissipation method |
| CN209168016U (en) * | 2018-11-16 | 2019-07-26 | 贵州财经大学 | A kind of built-in notebook computer radiating device with high heat dispersion |
| CN110418549B (en) * | 2019-06-18 | 2021-01-29 | 华为技术有限公司 | Heat dissipation assembly and electronic equipment |
| CN110989803A (en) * | 2019-11-25 | 2020-04-10 | 华为技术有限公司 | Heat dissipation method and electronic equipment |
| CN215187960U (en) * | 2021-03-19 | 2021-12-14 | 广安市亿格电子有限公司 | Detachable mobile phone heat dissipation device |
-
2021
- 2021-12-07 CN CN202111485587.6A patent/CN116249311A/en active Pending
-
2022
- 2022-09-02 WO PCT/CN2022/116854 patent/WO2023103489A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023103489A1 (en) | 2023-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7086452B1 (en) | Method and an apparatus for cooling a computer | |
| US8522570B2 (en) | Integrated circuit chip cooling using magnetohydrodynamics and recycled power | |
| US20030005201A1 (en) | Potable computer with enhanced performance management | |
| US7978474B2 (en) | Liquid-cooled portable computer | |
| US8453467B2 (en) | Hybrid heat exchanger | |
| CN104519722A (en) | Liquid cooling device and server with same | |
| US6724626B1 (en) | Apparatus for thermal management in a portable electronic device | |
| JP7096786B2 (en) | Heat dissipation module and its heat dissipation method | |
| CN113407017B (en) | Control method of semiconductor heat sink, semiconductor heat sink and storage medium | |
| CN207706609U (en) | It is a kind of can quick conductive Switching Power Supply radiator | |
| US20160161998A1 (en) | Actively Cooled Liquid Cooling System | |
| CN111556692A (en) | Server liquid cooling system utilizing thermoelectric power generation for heat dissipation and control method thereof | |
| CN110146956A (en) | A kind of inside thermotransport micro-structure of optical module | |
| CN116156830A (en) | Cooling device and electronic equipment | |
| US11510346B2 (en) | Method and system for enhancing electronics cooling using a thermoelectric element | |
| CN116249311A (en) | Mobile terminal heat dissipation device, mobile terminal heat dissipation method and mobile terminal | |
| CN107979948B (en) | Heat dissipation system and network communication equipment | |
| CN210630126U (en) | Heat dissipation device and electronic equipment | |
| US20130198501A1 (en) | Electronic device and speed-up booting module and method thereof | |
| CN106896883A (en) | A kind of electronic equipment cooling system | |
| Yueh et al. | Active fluidic cooling on energy constrained system-on-chip systems | |
| EP0766308A3 (en) | Reduced thermal cycling of water cooled power electronic devices | |
| CN210129217U (en) | Refrigerating system capable of monitoring power consumption immediately | |
| JP4325026B2 (en) | Cooling device and electronic equipment | |
| CN103488266A (en) | Thin sheet type CPU heat dissipation device and machining method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |