CN106896883A - A kind of electronic equipment cooling system - Google Patents

Abstract

The embodiment of the present invention discloses a heat dissipation system for electronic equipment, including: a heat absorption module, a heat dissipation module, and a drive module; The medium absorbs the heat of the heat source; the heat absorption module and the heat dissipation module are connected through a conduit; the drive module is used to drive the heat conduction medium through the conduit between the heat absorption module and the heat dissipation circulation between modules; the heat dissipation module is used to reduce the temperature of the heat conduction medium; the heat conduction medium is liquid metal. Because liquid metal has excellent thermal conductivity, and its properties are stable and not volatile, it can ensure that the heat-absorbing module has a good heat-absorbing effect for a long time, and maintain the cooling performance of the heat dissipation system on the heat source.

Description

A cooling system for electronic equipment

technical field

The invention relates to the technical field of heat dissipation, in particular to a heat dissipation system for electronic equipment.

Background technique

As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The heat that causes high temperatures does not come from outside but from inside. Inside the server, the processor (Central Processing Unit, CPU) and the graphics card (GPU, Graphic Processing Unit) are major heat generators. When the temperature of the CPU or GPU is too high, it will directly affect its processing performance. Therefore, a heat sink module is required. The group dissipates heat for the CPU and GPU to ensure that the temperature of the internal components is normal.

However, when the existing water-cooled radiator or thermal conductive silicone grease is used to dissipate heat from the CPU and GPU, the cooling effect on the CPU or GPU will become worse and worse as time goes by.

Contents of the invention

In order to solve the problem that the cooling effect of the radiator in the prior art is getting worse and worse, the present invention provides a cooling system for electronic equipment.

The electronic device cooling system provided by the embodiment of the present invention includes: a heat absorbing module, a cooling module and a driving module;

The heat-absorbing module is arranged close to the heat source, and the heat-absorbing module includes a heat-conducting medium for absorbing the heat of the heat source through the heat-conducting medium;

The heat-absorbing module and the heat-dissipating module are connected through conduits;

The driving module is used to drive the heat-conducting medium to circulate between the heat-absorbing module and the heat-dissipating module through the conduit;

The heat dissipation module is used to reduce the temperature of the heat transfer medium;

The heat conducting medium is liquid metal.

Optionally, the heat absorbing module includes a hollow metal plate;

The cavity metal plate is provided with a first hole and a second hole;

The heat conducting medium flows into the inner cavity of the cavity metal plate through the first hole, and flows out of the inner cavity of the cavity metal plate through the second hole.

Optionally, the conduit is made of metal.

Optionally, the heat dissipation module includes a heat dissipation box;

The conduits are distributed inside the heat dissipation box in an S shape.

Optionally, the heat-absorbing module also includes a pressing device;

The pressing device is used to fix the cavity metal plate on the heat source.

Optionally, the pressing device includes a metal reed;

One end of the metal reed is fixed on the cavity metal plate;

The other end of the metal reed is provided with a screw for fixing the other end of the metal reed on the heat source.

Optionally, the heat dissipation module also includes a fan;

The fan is used to dissipate heat from the S-shaped duct inside the heat dissipation box.

Optionally, the heat dissipation module also includes a temperature sensing device and a controller;

The temperature sensing device is used to sense the temperature of the cooling box;

The controller is used to control the fan according to the temperature of the cooling box.

Compared with the prior art, the present invention has at least the following advantages:

In the heat dissipation system for electronic equipment provided by the embodiments of the present invention, the heat absorbing module is arranged close to the heat source, and the heat of the heat source is absorbed by the liquid metal in the heat absorbing module. The driving module (such as driving a pump) drives the liquid metal to flow, so that the liquid metal that has absorbed heat in the heat-absorbing module flows to the heat-dissipating module through the connected conduit. The liquid metal flows into the heat-absorbing module through the conduit after being lowered in temperature by the heat-dissipating module. Because liquid metal has excellent thermal conductivity, and its properties are stable and not volatile, it can ensure that the heat-absorbing module has a good heat-absorbing effect for a long time, and maintain the cooling performance of the heat dissipation system on the heat source.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in this application. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic structural view of Embodiment 1 of the heat dissipation system for electronic equipment provided by the present invention;

2 is a schematic structural diagram of Embodiment 2 of the heat dissipation system for electronic equipment provided by the present invention;

3 is a schematic structural diagram of a heat absorbing device in a heat dissipation system of an electronic device provided by an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a heat dissipation device in a heat dissipation system for electronic equipment provided by an embodiment of the present invention.

detailed description

In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Embodiment one:

Referring to FIG. 1 , this figure is a schematic structural diagram of Embodiment 1 of the heat dissipation system for electronic equipment provided by the present invention.

The heat dissipation system for electronic equipment provided in this embodiment includes: a heat absorption module 100, a heat dissipation module 200 and a drive module 300;

The heat absorbing module 100 is arranged close to the heat source 400, and the heat absorbing module 100 includes a heat conducting medium for absorbing the heat of the heat source 400 through the heat conducting medium.

It can be understood that the heat source 400 may be any device that needs to be cooled, such as CPU and GPU in servers and integrated circuit boards, which is not limited in this embodiment.

It should be noted that the heat conducting medium is liquid metal. Liquid metal is a low-melting-point alloy that is liquid at room temperature, has excellent thermal conductivity, and is stable in nature, non-volatile, safe and non-toxic.

The heat absorption module 100 and the heat dissipation module 200 are connected through a conduit 500 .

It can be understood that in order to circulate the liquid metal between the heat absorption module 100 and the heat dissipation module 200 , at least two conduits 500 are needed to connect the heat absorption module 100 and the heat dissipation module 200 together. The liquid metal flows out of the heat-absorbing module 100 into the heat-dissipating module 200 through a conduit 500 , and flows out of the heat-dissipating module 200 into the heat-absorbing module 100 through another conduit 500 .

It should be noted that, in order to ensure the heat dissipation effect of the heat dissipation system of the electronic device, in some possible implementation manners of this embodiment, the conduit 500 is made of a metal material, such as a copper conduit. In this way, not only will the heat dissipation effect of the liquid metal flow in the conduit 500 be good due to the good thermal conductivity of the metal, thereby improving the overall heat dissipation performance of the heat dissipation system of the electronic equipment, but also because the metal is less likely to age than the rubber tube, ensuring The service life of the cooling system of electronic equipment as a whole.

The heat dissipation module 200 is used to reduce the temperature of the heat conduction medium.

The driving module 300 is used to drive the heat conducting medium to circulate between the heat absorbing module 100 and the heat dissipating module 200 through the conduit 500 .

Driven by the drive module 300 (such as a pump), the liquid metal circulates between the heat-absorbing module 100 and the heat-dissipating module 200 through the conduit 50, first absorbs the heat emitted by the heat source 400 at the heat-absorbing module 100 and then heats up, then flows through the conduit 500 to The heat dissipation module 200. During the flow and inside the heat dissipation module 200, the temperature of the liquid metal decreases. Then, it flows into the heat-absorbing module 100 again and continues to absorb the heat of the heat source 400 , continuously reducing the temperature of the heat source 400 .

In the heat dissipation system for electronic equipment provided in this embodiment, the heat absorbing module is arranged close to the heat source, and the heat of the heat source is absorbed by the liquid metal in the heat absorbing module. The driving module drives the liquid metal to flow, so that the liquid metal that has absorbed heat in the heat-absorbing module flows to the heat-dissipating module through the connected conduit. The liquid metal flows into the heat-absorbing module through the conduit after being lowered in temperature by the heat-dissipating module. Because liquid metal has excellent thermal conductivity, and its properties are stable and not volatile, it can ensure that the heat-absorbing module has a good heat-absorbing effect for a long time, maintain the cooling performance of the heat dissipation system of the electronic equipment, and solve the problem of industrial-grade server CPU and GPU. Persistent thermal issues.

Embodiment two:

Refer to FIG. 2 , which is a schematic structural diagram of Embodiment 2 of the heat dissipation system for electronic equipment provided by the present invention. Compared with FIG. 1 , this embodiment provides a more specific cooling system for electronic equipment.

In this embodiment, the heat absorbing module includes a hollow metal plate 101 , and FIG. 3 illustrates the structure of the hollow metal plate 101 .

The cavity metal plate 101 is provided with a first hole 101a and a second hole 101b; the heat transfer medium flows into the cavity of the cavity metal plate 101 through the first hole 101a, and passes through the second hole 101b flows out of the cavity of the cavity metal plate 101 .

It can be understood that the positions of the first hole 101 a and the second hole 101 b on the cavity metal plate 101 can be set according to actual conditions, and details will not be repeated here.

The heat absorbing module also includes a pressing device 102 (not shown in FIG. 3 ); the pressing device is used to fix the cavity metal plate 101 on the heat source 400 .

For example, when the cavity metal plate 101 is square, a pressing device 102 can be provided at each of its four corners so that it can be tightly fixed on the heat source.

As an example, the pressing device 102 includes a metal reed;

One end of the metal reed is fixed on the hollow metal plate 101; the other end of the metal reed is provided with a screw for fixing the other end of the metal reed on the circuit substrate of the heat source. In this way, the cavity metal plate 101 can be tightly attached to the CPU or GPU.

In this embodiment, the heat dissipation module includes a heat dissipation box 201 , and FIG. 4 exemplifies the structure of the heat dissipation module.

The conduits 500 are distributed inside the heat dissipation box 201 in an S shape. In this way, not only can the volume of the heat dissipation box 201 be reduced, but also the heat dissipation amount per unit area can be increased, and the heat dissipation performance of the heat dissipation system of the electronic equipment can be improved.

In order to reduce the problem of liquid metal faster, in some possible implementations of this embodiment, the heat dissipation module further includes a fan 202; 500 for cooling.

What needs to be explained here is that due to the better heat dissipation characteristics of the liquid metal, the power loss of the fan 202 is greatly reduced, saving energy and cost.

Further, the heat dissipation module also includes a temperature sensing device 203 (not shown in FIG. 4 ) and a controller (not shown in the figure);

The temperature sensing device 203 is used for sensing the temperature of the heat dissipation box 201 . For example, the temperature sensing device 203 can be a temperature sensor whose model can be DS18B20 or PT100.

The controller is used for controlling the fan 202 according to the temperature of the cooling box 201 . For example, the controller may be a PID controller. The PID controller detects and dynamically controls the rotation speed of the fan 202 according to the signal of the temperature sensor, so that the temperature of the heat source after cooling is controllable.

In one example, the cavity metal plate 101 is installed close to the server CPU (or GPU). The inner cavity of the cavity metal plate 101 is closely connected with the conduit 500 through two holes (the first hole 101 a and the second hole 101 b ). The pump (that is, the driving module) makes liquid metal enter the cavity metal plate 101 through a conduit 500 , absorb the heat generated by the CPU, flow out from another conduit 500 , and enter the cooling box 201 . The fan 202 dissipates heat from the liquid metal in the cooling box 201, so that the liquid metal recools and flows into the pump for repeated cycles of heat absorption and heat dissipation.

It should be noted that, for example, in order to keep the server CPU at a stable temperature so as to achieve stable and excellent working performance, it is necessary to continuously detect the temperature of the server CPU, compare the actual temperature of the server CPU with the set temperature, and PID (proportional, integral, differential control) regulation is performed on the temperature. When the temperature sensing device 203 senses that the temperature of the CPU becomes high, the controller increases the wind power of the fan; Stop the circulation of liquid metal and keep the temperature of CPU at the optimal working temperature, thus greatly improving the performance of server CPU.

It should be noted that each embodiment in this specification is described in a progressive manner, each embodiment focuses on the differences from other embodiments, and the same and similar parts of each embodiment can be referred to each other.

The above descriptions are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person familiar with the art, without departing from the scope of the technical solution of the present invention, can use the methods and technical content disclosed above to make many possible changes and modifications to the technical solution of the present invention, or modify it into an equivalent of equivalent change Example. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention, which do not deviate from the technical solution of the present invention, still fall within the protection scope of the technical solution of the present invention.

Claims (8)

1. a kind of electronic equipment cooling system, it is characterised in that including：Heat-absorbing model, radiating module and drive module；

The heat-absorbing model is close to thermal source setting, and the heat-absorbing model includes heat-conducting medium, for being inhaled by the heat-conducting medium Receive the heat of the thermal source；

Connected by conduit between the heat-absorbing model and the radiating module；

The drive module, for drive the heat-conducting medium through the conduit the heat-absorbing model and the radiating module it Between circulate；

The radiating module, the temperature for reducing the heat-conducting medium；

The heat-conducting medium is liquid metal.

2. electronic equipment dissipating heat system according to claim 1, it is characterised in that the heat-absorbing model includes cavity metal Plate；

The first hole and the second hole are provided with the cavity metallic plate；

The heat-conducting medium flows into the inner chamber of the cavity metallic plate by first hole, and flows out institute by second hole State the inner chamber of cavity metallic plate.

3. electronic equipment dissipating heat system according to claim 1, it is characterised in that the conduit is metal material.

4. electronic equipment dissipating heat system according to claim 1, it is characterised in that the radiating module includes heat dissipation tank；

The conduit is S-shaped to be distributed in inside the heat dissipation tank.

5. electronic equipment dissipating heat system according to claim 2, it is characterised in that the heat-absorbing model also includes compressing filling Put；

The hold-down gear, for the cavity metallic plate to be fixed on into the thermal source.

6. electronic equipment dissipating heat system according to claim 5, it is characterised in that the hold-down gear includes medal spring Piece；

Described metal spring leaf one end is fixed on the cavity metallic plate；

The other end of the metal spring leaf is provided with screw, for the other end of the metal spring leaf to be fixed on into the thermal source On.

7. electronic equipment dissipating heat system according to claim 4, it is characterised in that the radiating module also includes fan；

The fan, for being radiated to the S-shaped conduit inside the heat dissipation tank.

8. electronic equipment dissipating heat system according to claim 7, it is characterised in that the radiating module also includes temperature sense Answer device and controller；

The temperature sensing device, the temperature for sensing the heat dissipation tank；

The controller, for fan described in the temperature control according to the heat dissipation tank.