CN1161846C - 热电装置 - Google Patents
热电装置 Download PDFInfo
- Publication number
- CN1161846C CN1161846C CNB971912203A CN97191220A CN1161846C CN 1161846 C CN1161846 C CN 1161846C CN B971912203 A CNB971912203 A CN B971912203A CN 97191220 A CN97191220 A CN 97191220A CN 1161846 C CN1161846 C CN 1161846C
- Authority
- CN
- China
- Prior art keywords
- heat
- substrate
- side substrate
- heat radiation
- radiation side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 154
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims description 79
- 239000007921 spray Substances 0.000 claims description 32
- 208000002925 dental caries Diseases 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 abstract description 13
- 238000006243 chemical reaction Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 44
- 230000005540 biological transmission Effects 0.000 description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 230000009102 absorption Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000002048 anodisation reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010291 electrical method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP237939/96 | 1996-09-09 | ||
JP237939/1996 | 1996-09-09 | ||
JP8237939A JPH1084139A (ja) | 1996-09-09 | 1996-09-09 | 熱電変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1200841A CN1200841A (zh) | 1998-12-02 |
CN1161846C true CN1161846C (zh) | 2004-08-11 |
Family
ID=17022706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB971912203A Expired - Lifetime CN1161846C (zh) | 1996-09-09 | 1997-09-05 | 热电装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6105373A (zh) |
EP (1) | EP0878852A4 (zh) |
JP (1) | JPH1084139A (zh) |
CN (1) | CN1161846C (zh) |
AU (1) | AU716635B2 (zh) |
WO (1) | WO1998010474A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105814705A (zh) * | 2013-12-19 | 2016-07-27 | 罗伯特·博世有限公司 | 热电设备和用于制造热电设备的方法 |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3238114B2 (ja) | 1997-12-25 | 2001-12-10 | 株式会社エコ・トゥエンティーワン | 熱電変換装置 |
JP4141613B2 (ja) * | 2000-03-09 | 2008-08-27 | 富士通株式会社 | 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器 |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US6988535B2 (en) | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Channeled flat plate fin heat exchange system, device and method |
US20050211418A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US20040112571A1 (en) * | 2002-11-01 | 2004-06-17 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US7836597B2 (en) | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US20040233639A1 (en) * | 2003-01-31 | 2004-11-25 | Cooligy, Inc. | Removeable heat spreader support mechanism and method of manufacturing thereof |
US7201012B2 (en) * | 2003-01-31 | 2007-04-10 | Cooligy, Inc. | Remedies to prevent cracking in a liquid system |
US7044196B2 (en) * | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
DE202005003832U1 (de) * | 2004-03-26 | 2005-05-12 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Wärmeaufnehmer |
US7549460B2 (en) * | 2004-04-02 | 2009-06-23 | Adaptivenergy, Llc | Thermal transfer devices with fluid-porous thermally conductive core |
DE102004018144B4 (de) * | 2004-04-08 | 2006-02-16 | Alphacool Gmbh | Kühler für ein elektrisches oder elektronisches Bauteil |
CN2701074Y (zh) * | 2004-04-29 | 2005-05-18 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热装置 |
US7616444B2 (en) * | 2004-06-04 | 2009-11-10 | Cooligy Inc. | Gimballed attachment for multiple heat exchangers |
US20060162365A1 (en) * | 2004-10-26 | 2006-07-27 | Hoang Triem T | Cooling electronics via two-phase tangential jet impingement in a semi-toroidal channel |
US7587901B2 (en) | 2004-12-20 | 2009-09-15 | Amerigon Incorporated | Control system for thermal module in vehicle |
US7213636B2 (en) * | 2005-03-15 | 2007-05-08 | Delphi Technologies, Inc. | Cooling assembly with impingement cooled heat sink |
US7717162B2 (en) * | 2005-12-22 | 2010-05-18 | Isothermal Systems Research, Inc. | Passive fluid recovery system |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
US7597135B2 (en) * | 2006-05-23 | 2009-10-06 | Coolit Systems Inc. | Impingement cooled heat sink with low pressure drop |
US20080087316A1 (en) | 2006-10-12 | 2008-04-17 | Masa Inaba | Thermoelectric device with internal sensor |
US20080142068A1 (en) * | 2006-12-18 | 2008-06-19 | American Power Conversion Corporation | Direct Thermoelectric chiller assembly |
FR2911247B1 (fr) * | 2007-01-08 | 2009-02-27 | Sames Technologies Soc Par Act | Carte electronique et plaque froide pour cette carte. |
EP2102564B1 (en) * | 2007-01-10 | 2015-09-02 | Gentherm Incorporated | Thermoelectric device |
DE102007003920A1 (de) | 2007-01-21 | 2008-07-24 | Alphacool Gmbh | Kühler für ein elektrisches oder elektronisches Bauteil |
US9743563B2 (en) | 2007-03-20 | 2017-08-22 | Conti Temic Microelectronic Gmbh | Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance |
DE112008000230A5 (de) * | 2007-03-20 | 2009-10-15 | Conti Temic Microelectronic Gmbh | Steuergerät zum Einsatz im Motorraum oder im Getriebe eines Kraftfahrzeugs sowie Kühlanordnung für ein derartiges Steuergerät |
TW200934352A (en) | 2007-08-07 | 2009-08-01 | Cooligy Inc | Internal access mechanism for a server rack |
US20090178705A1 (en) * | 2007-08-30 | 2009-07-16 | Hoda Globe Corporation | Multi-cores stack solar thermal electric generator |
WO2009036077A1 (en) | 2007-09-10 | 2009-03-19 | Amerigon, Inc. | Operational control schemes for ventilated seat or bed assemblies |
KR101779870B1 (ko) | 2008-02-01 | 2017-10-10 | 젠썸 인코포레이티드 | 열전 소자용 응결 센서 및 습도 센서 |
US8944151B2 (en) | 2008-05-28 | 2015-02-03 | International Business Machines Corporation | Method and apparatus for chip cooling |
EP2341800B8 (en) | 2008-07-18 | 2012-12-26 | Gentherm Incorporated | Climate controlled bed assembly |
WO2010017327A1 (en) | 2008-08-05 | 2010-02-11 | Cooligy Inc. | A microheat exchanger for laser diode cooling |
DE102008058032A1 (de) | 2008-11-18 | 2010-05-20 | Aquatuning Gmbh | Mikrostrukturkühler für ein elektrisches oder elektronisches Bauteil |
DE102010040107B4 (de) * | 2010-09-01 | 2013-05-16 | Micropelt Gmbh | Thermoelektrische Vorrichtung zum Erzeugen von elektrischer Energie |
US20120118345A1 (en) * | 2010-11-15 | 2012-05-17 | The Boeing Company | Thermal integration of thermoelectronic device |
US8671697B2 (en) | 2010-12-07 | 2014-03-18 | Parker-Hannifin Corporation | Pumping system resistant to cavitation |
US9494370B2 (en) * | 2010-12-09 | 2016-11-15 | GeramTec GmbH | Homogeneous liquid cooling of LED array |
US9685599B2 (en) | 2011-10-07 | 2017-06-20 | Gentherm Incorporated | Method and system for controlling an operation of a thermoelectric device |
US9989267B2 (en) | 2012-02-10 | 2018-06-05 | Gentherm Incorporated | Moisture abatement in heating operation of climate controlled systems |
DE102012010919B4 (de) | 2012-06-04 | 2016-01-21 | Aquatuning Gmbh | Mikrostrukturkühler zur Wasserkühlung für ein elektrisches oder elektronisches Bauteil |
CN104662657A (zh) * | 2012-07-26 | 2015-05-27 | 酷技术解决方案有限公司 | 用于传热的换热设备和方法 |
DE102013006436B3 (de) * | 2013-04-15 | 2014-10-30 | Aquatuning Gmbh | Flüssigkeitskühler für auf Leiterkarten angeordnete elektrische Bauteile, Herstellungsverfahren dafür und Kühlanordnung mit einem solchen |
US9662962B2 (en) | 2013-11-05 | 2017-05-30 | Gentherm Incorporated | Vehicle headliner assembly for zonal comfort |
WO2015123585A1 (en) | 2014-02-14 | 2015-08-20 | Gentherm Incorporated | Conductive convective climate controlled seat |
US11033058B2 (en) | 2014-11-14 | 2021-06-15 | Gentherm Incorporated | Heating and cooling technologies |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
DE102017001378A1 (de) | 2016-08-24 | 2018-03-01 | Aquatuning Gmbh | Rückwärts durchflossener Mikrostrukturkühler mit integrierter Pumpe zur Wasserkühlung für ein elektrisches oder elektronisches Bauteil |
DE112017005525T5 (de) | 2016-11-01 | 2019-08-08 | Massachusetts Institute Of Technology | Wärmemanagement von HF-Vorrichtungen unter Verwendung eingebetteter Mikrojet-Anordnungen |
DE102016013736A1 (de) | 2016-11-17 | 2018-05-17 | Aquatuning Gmbh | Mikrostrukturkühler zu Wasserkühlung für ein elektrisches oder elektronisches Bauteil mit einem Strömungsumlenker und einem Stömungsverteiler |
US20180139865A1 (en) * | 2016-11-17 | 2018-05-17 | Nathanael Draht | Microstructure water cooling unit for cooling of an electrical or electronic component that already includes a flow diverter and a flow distributor |
DE202017002095U1 (de) | 2017-04-21 | 2017-05-09 | Aquatuning Gmbh | Beleuchtungsring zur Beleuchtung von Rohren eines Kühlkreislaufs |
US10665529B2 (en) | 2017-07-21 | 2020-05-26 | Massachusetts Institute Of Technology | Modular microjet cooling of packaged electronic components |
KR101981629B1 (ko) * | 2018-01-23 | 2019-05-24 | 엘지이노텍 주식회사 | 열전소자 및 그의 제조 방법 |
US11223004B2 (en) | 2018-07-30 | 2022-01-11 | Gentherm Incorporated | Thermoelectric device having a polymeric coating |
CN113167510A (zh) | 2018-11-30 | 2021-07-23 | 金瑟姆股份公司 | 热电调节系统和方法 |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
KR20210001074A (ko) * | 2019-06-26 | 2021-01-06 | 엘지전자 주식회사 | 열전 모듈 및 이를 구비한 냉장고 |
KR102082243B1 (ko) * | 2019-07-22 | 2020-02-27 | 주식회사 성하에너지 | 열전소자 열교환 모듈 |
US11963341B2 (en) | 2020-09-15 | 2024-04-16 | Jetcool Technologies Inc. | High temperature electronic device thermal management system |
CN114449830A (zh) * | 2020-10-31 | 2022-05-06 | 华为技术有限公司 | 冷却装置及电子设备 |
TW202407925A (zh) * | 2022-03-04 | 2024-02-16 | 美商捷控技術有限公司 | 用於電腦處理器及處理器組件之主動冷卻散熱蓋 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1165050B (de) * | 1958-12-04 | 1964-03-12 | Siemens Elektrogeraete Gmbh | Kuehlgeraet mit zwei elektrothermischen Kuehleinrichtungen |
US5183104A (en) * | 1989-06-16 | 1993-02-02 | Digital Equipment Corporation | Closed-cycle expansion-valve impingement cooling system |
CA2053055C (en) * | 1990-10-11 | 1997-02-25 | Tsukasa Mizuno | Liquid cooling system for lsi packages |
JPH05315389A (ja) * | 1991-03-22 | 1993-11-26 | Shinkawa Ltd | ワイヤボンデイング装置のボンデイング座標データ入力方法及び装置 |
JPH05136305A (ja) * | 1991-11-08 | 1993-06-01 | Hitachi Ltd | 発熱体の冷却装置 |
JPH0629580A (ja) * | 1992-07-08 | 1994-02-04 | Nippon Buroaa Kk | サーモモジュール |
JPH0629434A (ja) * | 1992-07-09 | 1994-02-04 | Matsumoto Kokan Kk | 放熱装置 |
US5653111A (en) * | 1993-07-07 | 1997-08-05 | Hydrocool Pty. Ltd. | Thermoelectric refrigeration with liquid heat exchange |
JPH07235588A (ja) * | 1994-02-24 | 1995-09-05 | Hitachi Ltd | ウエハチャック及びそれを用いたプローブ検査方法 |
JPH07260287A (ja) * | 1994-03-23 | 1995-10-13 | Aisin Seiki Co Ltd | 熱電素子の冷却構造 |
US5687577A (en) * | 1996-04-10 | 1997-11-18 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
-
1996
- 1996-09-09 JP JP8237939A patent/JPH1084139A/ja active Pending
-
1997
- 1997-09-05 US US09/068,444 patent/US6105373A/en not_active Expired - Lifetime
- 1997-09-05 CN CNB971912203A patent/CN1161846C/zh not_active Expired - Lifetime
- 1997-09-05 WO PCT/JP1997/003136 patent/WO1998010474A1/ja not_active Application Discontinuation
- 1997-09-05 EP EP97939199A patent/EP0878852A4/en not_active Withdrawn
- 1997-09-05 AU AU41357/97A patent/AU716635B2/en not_active Ceased
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105814705A (zh) * | 2013-12-19 | 2016-07-27 | 罗伯特·博世有限公司 | 热电设备和用于制造热电设备的方法 |
Also Published As
Publication number | Publication date |
---|---|
US6105373A (en) | 2000-08-22 |
WO1998010474A1 (fr) | 1998-03-12 |
EP0878852A1 (en) | 1998-11-18 |
EP0878852A4 (en) | 1999-03-31 |
AU716635B2 (en) | 2000-03-02 |
JPH1084139A (ja) | 1998-03-31 |
CN1200841A (zh) | 1998-12-02 |
AU4135797A (en) | 1998-03-26 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: THERMOELECTRIC DEVICES DEVELOPMENT CO. Free format text: FORMER OWNER: CO., LTD. TECUNVA Effective date: 20080104 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20080104 Address after: Tokyo, Japan Patentee after: Thermoelectric Device Develop Co., Ltd. Address before: Tokyo, Japan Patentee before: Technova Inc. |
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ASS | Succession or assignment of patent right |
Owner name: THERMOELECTRIC DEVICE INC. Free format text: FORMER OWNER: THERMOELECTRIC DEVICE DEVELOP CO., LTD. Effective date: 20150812 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150812 Address after: Hokkaido Japan Patentee after: Thermoelectric components Corp Address before: Tokyo, Japan Patentee before: Thermoelectric Device Develop Co., Ltd. |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160126 Address after: Seoul, South Kerean Patentee after: IG Innotek Co., Ltd. Address before: Hokkaido Japan Patentee before: Thermoelectric components Corp |
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CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20040811 |