CN116157228A - 金属箔的激光切断方法 - Google Patents

金属箔的激光切断方法 Download PDF

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Publication number
CN116157228A
CN116157228A CN202180060357.7A CN202180060357A CN116157228A CN 116157228 A CN116157228 A CN 116157228A CN 202180060357 A CN202180060357 A CN 202180060357A CN 116157228 A CN116157228 A CN 116157228A
Authority
CN
China
Prior art keywords
laser
metal foil
cutting method
laser cutting
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180060357.7A
Other languages
English (en)
Chinese (zh)
Inventor
松永启伍
村山太郎
酒井俊明
茅原崇
繁松孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN116157228A publication Critical patent/CN116157228A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
CN202180060357.7A 2020-07-20 2021-07-20 金属箔的激光切断方法 Pending CN116157228A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020123947 2020-07-20
JP2020-123947 2020-07-20
PCT/JP2021/027216 WO2022019311A1 (ja) 2020-07-20 2021-07-20 金属箔のレーザ切断方法

Publications (1)

Publication Number Publication Date
CN116157228A true CN116157228A (zh) 2023-05-23

Family

ID=79729173

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180060357.7A Pending CN116157228A (zh) 2020-07-20 2021-07-20 金属箔的激光切断方法

Country Status (6)

Country Link
US (1) US20230150057A1 (https=)
EP (1) EP4183516B1 (https=)
JP (1) JP7328456B2 (https=)
KR (1) KR102846492B1 (https=)
CN (1) CN116157228A (https=)
WO (1) WO2022019311A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024235475A1 (en) * 2023-05-18 2024-11-21 Corelase Oy Metal foil cutting with pulsed fiber laser beam
JP2025143128A (ja) * 2024-03-18 2025-10-01 プライムプラネットエナジー＆ソリューションズ株式会社 電極板の製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005511314A (ja) * 2001-12-04 2005-04-28 ジェネラル アトミックス レーザ加工における材料除去レートを増大する方法および装置
JP2007014993A (ja) * 2005-07-08 2007-01-25 Toyota Motor Corp レーザを用いたワーク切断方法とレーザ加工装置
JP2007059431A (ja) * 2005-08-22 2007-03-08 Mitsubishi Electric Corp 半導体装置の製造方法及びレーザ加工装置
US20090016388A1 (en) * 2007-05-18 2009-01-15 Gsi Lumonics Corporation Laser processing of conductive links
JP2012086226A (ja) * 2010-10-15 2012-05-10 Mitsuboshi Diamond Industrial Co Ltd レーザー加工装置、被加工物の加工方法および被加工物の分割方法
JP2013094838A (ja) * 2011-11-02 2013-05-20 Nissan Tanaka Corp レーザ切断方法及びレーザ切断装置
WO2016208686A1 (ja) * 2015-06-24 2016-12-29 株式会社豊田自動織機 切断装置
JP2017084691A (ja) * 2015-10-30 2017-05-18 株式会社豊田自動織機 電極シートの製造方法、及び電極シート
US20190312173A1 (en) * 2018-04-06 2019-10-10 Sunpower Corporation Local patterning and metallization of semiconductor structures using a laser beam

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2445771A (en) * 2007-01-19 2008-07-23 Gsi Group Ltd A diode pumped CW laser

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005511314A (ja) * 2001-12-04 2005-04-28 ジェネラル アトミックス レーザ加工における材料除去レートを増大する方法および装置
JP2007014993A (ja) * 2005-07-08 2007-01-25 Toyota Motor Corp レーザを用いたワーク切断方法とレーザ加工装置
JP2007059431A (ja) * 2005-08-22 2007-03-08 Mitsubishi Electric Corp 半導体装置の製造方法及びレーザ加工装置
US20090016388A1 (en) * 2007-05-18 2009-01-15 Gsi Lumonics Corporation Laser processing of conductive links
JP2012086226A (ja) * 2010-10-15 2012-05-10 Mitsuboshi Diamond Industrial Co Ltd レーザー加工装置、被加工物の加工方法および被加工物の分割方法
JP2013094838A (ja) * 2011-11-02 2013-05-20 Nissan Tanaka Corp レーザ切断方法及びレーザ切断装置
WO2016208686A1 (ja) * 2015-06-24 2016-12-29 株式会社豊田自動織機 切断装置
JP2017084691A (ja) * 2015-10-30 2017-05-18 株式会社豊田自動織機 電極シートの製造方法、及び電極シート
US20190312173A1 (en) * 2018-04-06 2019-10-10 Sunpower Corporation Local patterning and metallization of semiconductor structures using a laser beam

Also Published As

Publication number Publication date
WO2022019311A1 (ja) 2022-01-27
US20230150057A1 (en) 2023-05-18
KR20230027199A (ko) 2023-02-27
EP4183516B1 (en) 2026-01-28
KR102846492B1 (ko) 2025-08-14
EP4183516A1 (en) 2023-05-24
JPWO2022019311A1 (https=) 2022-01-27
JP7328456B2 (ja) 2023-08-16
EP4183516A4 (en) 2024-12-18

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