JPWO2022019311A1 - - Google Patents

Info

Publication number
JPWO2022019311A1
JPWO2022019311A1 JP2022538028A JP2022538028A JPWO2022019311A1 JP WO2022019311 A1 JPWO2022019311 A1 JP WO2022019311A1 JP 2022538028 A JP2022538028 A JP 2022538028A JP 2022538028 A JP2022538028 A JP 2022538028A JP WO2022019311 A1 JPWO2022019311 A1 JP WO2022019311A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022538028A
Other languages
Japanese (ja)
Other versions
JPWO2022019311A5 (https=
JP7328456B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022019311A1 publication Critical patent/JPWO2022019311A1/ja
Publication of JPWO2022019311A5 publication Critical patent/JPWO2022019311A5/ja
Application granted granted Critical
Publication of JP7328456B2 publication Critical patent/JP7328456B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
JP2022538028A 2020-07-20 2021-07-20 金属箔のレーザ切断方法 Active JP7328456B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020123947 2020-07-20
JP2020123947 2020-07-20
PCT/JP2021/027216 WO2022019311A1 (ja) 2020-07-20 2021-07-20 金属箔のレーザ切断方法

Publications (3)

Publication Number Publication Date
JPWO2022019311A1 true JPWO2022019311A1 (https=) 2022-01-27
JPWO2022019311A5 JPWO2022019311A5 (https=) 2023-03-10
JP7328456B2 JP7328456B2 (ja) 2023-08-16

Family

ID=79729173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022538028A Active JP7328456B2 (ja) 2020-07-20 2021-07-20 金属箔のレーザ切断方法

Country Status (6)

Country Link
US (1) US20230150057A1 (https=)
EP (1) EP4183516B1 (https=)
JP (1) JP7328456B2 (https=)
KR (1) KR102846492B1 (https=)
CN (1) CN116157228A (https=)
WO (1) WO2022019311A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024235475A1 (en) * 2023-05-18 2024-11-21 Corelase Oy Metal foil cutting with pulsed fiber laser beam
JP2025143128A (ja) * 2024-03-18 2025-10-01 プライムプラネットエナジー＆ソリューションズ株式会社 電極板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005511314A (ja) * 2001-12-04 2005-04-28 ジェネラル アトミックス レーザ加工における材料除去レートを増大する方法および装置
JP2013094838A (ja) * 2011-11-02 2013-05-20 Nissan Tanaka Corp レーザ切断方法及びレーザ切断装置
JP2017084691A (ja) * 2015-10-30 2017-05-18 株式会社豊田自動織機 電極シートの製造方法、及び電極シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007014993A (ja) * 2005-07-08 2007-01-25 Toyota Motor Corp レーザを用いたワーク切断方法とレーザ加工装置
JP2007059431A (ja) * 2005-08-22 2007-03-08 Mitsubishi Electric Corp 半導体装置の製造方法及びレーザ加工装置
GB2445771A (en) * 2007-01-19 2008-07-23 Gsi Group Ltd A diode pumped CW laser
CA2688771A1 (en) * 2007-05-18 2008-11-27 Gsi Group Corporation Laser processing of conductive links
JP5240272B2 (ja) * 2010-10-15 2013-07-17 三星ダイヤモンド工業株式会社 レーザー加工装置、被加工物の加工方法および被加工物の分割方法
WO2016208686A1 (ja) * 2015-06-24 2016-12-29 株式会社豊田自動織機 切断装置
US11362234B2 (en) * 2018-04-06 2022-06-14 Sunpower Corporation Local patterning and metallization of semiconductor structures using a laser beam

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005511314A (ja) * 2001-12-04 2005-04-28 ジェネラル アトミックス レーザ加工における材料除去レートを増大する方法および装置
JP2013094838A (ja) * 2011-11-02 2013-05-20 Nissan Tanaka Corp レーザ切断方法及びレーザ切断装置
JP2017084691A (ja) * 2015-10-30 2017-05-18 株式会社豊田自動織機 電極シートの製造方法、及び電極シート

Also Published As

Publication number Publication date
WO2022019311A1 (ja) 2022-01-27
CN116157228A (zh) 2023-05-23
US20230150057A1 (en) 2023-05-18
KR20230027199A (ko) 2023-02-27
EP4183516B1 (en) 2026-01-28
KR102846492B1 (ko) 2025-08-14
EP4183516A1 (en) 2023-05-24
JP7328456B2 (ja) 2023-08-16
EP4183516A4 (en) 2024-12-18

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