CN116114125A - Conductive particle and connector for electrical connection comprising same - Google Patents
Conductive particle and connector for electrical connection comprising same Download PDFInfo
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- CN116114125A CN116114125A CN202180055825.1A CN202180055825A CN116114125A CN 116114125 A CN116114125 A CN 116114125A CN 202180055825 A CN202180055825 A CN 202180055825A CN 116114125 A CN116114125 A CN 116114125A
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- Prior art keywords
- conductive
- conductive particles
- surface contact
- contact portion
- contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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- Manufacturing & Machinery (AREA)
- Measuring Leads Or Probes (AREA)
- Multi-Conductor Connections (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides conductive particles for electrically connecting an inspection device and a conductive part of a connector of an inspected device. The conductive particles include: a bottom surface contact portion; and a plurality of side surface contact portions, wherein the bottom surface contact portion and the plurality of side surface contact portions form surfaces of the conductive particles, and the bottom surface contact portion has a plurality of sides. The plurality of side surface contact portions are respectively contacted with the plurality of edges of the bottom surface contact portion, and gradually narrow along a first direction perpendicular to the bottom surface contact portion. Adjacent side contact portions among the plurality of side contact portions are in contact along a second direction which is a circumferential direction of the first direction.
Description
Technical Field
The present invention relates to conductive particles used for conductive parts of connectors for electrical connection. The present invention also relates to a connector having a conductive portion composed of conductive particles for electrically connecting an inspection device and an inspected apparatus.
Background
For the electrical inspection of the test devices, connectors for electrically connecting the test devices to the inspection apparatus are used in the technical field. The connector is disposed between the inspection apparatus and the inspected device. As an example of such a connector, a conductive rubber sheet (conductive rubber sheet) that is elastically deformed by a pressure applied to a device under test is used in the art.
The conductive rubber sheet includes: a conductive part for transmitting a signal; and an insulating portion for insulating the conductive portion. The plurality of conductive particles are formed in a conductive manner so as to be aggregated in the vertical direction. A portion of the conductive portion and the insulating portion are made of the same elastic material, for example, silicone rubber.
The conductive portion and the insulating portion may be molded together from a liquid-phase molding material in which a plurality of metal particles are mixed in a liquid-phase silicone rubber. The conductive particles are aggregated into a conductive portion shape by applying a magnetic field to the liquid-phase molding material, whereby the conductive portion can be formed. As an example of the conductive particles, spherical conductive particles and conductive particles having a specific character shape known in the art can be used.
In the conductive portion composed of spherical conductive particles, adjacent conductive particles are in point contact due to the spherical shape. Since the conductive particles in point contact have a small contact area, the current density of the conductive portion is low.
In the spherical conductive particles in point contact, the binding force between the conductive particles and the elastic material is low due to the small specific surface area of the spherical conductive particles. When the test device is inspected, if pressure is repeatedly applied to the conductive portion, the contact points between the conductive particles in point contact may become easily separated and the bonding between the conductive particles and the elastic material may be easily released, which may cause the conductive particles to be detached from the in-situ position. As a result, the electrical connection between the conductive particles becomes unstable and the service life of the connector is shortened.
When a conductive portion composed of spherical conductive particles is used in a high-temperature environment, the space between the conductive particles increases due to expansion of the elastic material, and the contact resistance increases. In order to increase the current density of the conductive portion, although spherical conductive particles can be aggregated at a high density, the high-density aggregated spherical conductive particles may reduce the workability of the conductive portion.
As one means for increasing the contact area between conductive particles, conductive particles having a specific character shape, for example, C-type, H-type, V-type, have been proposed. When aligned by magnetic force, the conductive particles of letter shape can be combined along one direction. The contact area between particles of the character-shaped conductive particles is limited to the area of bonding between particles, and the character-shaped conductive particles cannot be electrically connected in the unbonded direction. Therefore, the character-shaped conductive particles may reduce workability of the conductive portion in the unbonded direction. Further, the conductive portion composed of the conductive particles having a letter shape has a low particle density due to a large number of spaces between the particles, resulting in a low current density of the conductive portion.
Since the character-shaped conductive particles can be coupled in one direction by magnetic force, the conductive portion can be composed of the character-shaped conductive particles in order to improve the yield of the connector. Since the character-shaped conductive particles realize the workability of the conductive portion in only one direction, it is conceivable to dispose spherical conductive particles in the upper and lower regions of the conductive portion and dispose character-shaped conductive particles in the middle region of the conductive portion receiving a load of a small pressure. However, when two kinds of conductive particles having different shapes are used for the conductive portion, the contact area between the conductive particles can be reduced in the interfaces between the upper and middle sections and between the middle and lower sections, thereby reducing the conductivity of the conductive portion.
Prior art literature
Patent literature
Patent document 0001: korean patent publication No. 10-1525520
Patent document 0002: korean laid-open patent publication No. 10-2017-0127321
Disclosure of Invention
Problems to be solved by the invention
An embodiment of the present invention provides conductive particles capable of increasing a contact area between particles and achieving surface contact in a front direction. An embodiment of the present invention provides conductive particles capable of constituting conductive portions in a dense distribution and increasing the conductivity and current density of the conductive portions. An embodiment of the present invention provides conductive particles capable of improving workability of a conductive portion, dispersing pressure applied to the conductive portion, and preventing damage due to the pressure. An embodiment of the present invention provides a connector including a conductive portion composed of the conductive particles.
Solution for solving the problem
An embodiment of the present invention relates to conductive particles for electrically connecting an inspection device and a conductive part of a connector of an inspection apparatus. The conductive particles of an embodiment include a bottom surface contact; and a plurality of side surface contact portions, wherein the bottom surface contact portion and the plurality of side surface contact portions form surfaces of the conductive particles. The bottom surface contact portion has a plurality of sides. The plurality of side surface contact portions are respectively contacted with the plurality of edges of the bottom surface contact portion, and gradually narrow along a first direction perpendicular to the bottom surface contact portion. Adjacent side contact portions among the plurality of side contact portions are in contact along a second direction which is a circumferential direction of the first direction.
According to one embodiment, the conductive particles include: a plurality of apex contact portions formed at positions where the bottom contact portion contacts two side contact portions of the plurality of side contact portions, respectively; a plurality of corner contact portions formed at positions where the bottom contact portion contacts one of the plurality of side contact portions, respectively; and a plurality of corner contact portions formed at positions where adjacent side contact portions among the plurality of side contact portions are contacted along the second direction, respectively.
According to one embodiment, the conductive particles include upper apex contact portions formed at positions where all of the plurality of side contact portions contact in the first direction. The ratio between the length of one side of the bottom surface contact portion and the height from the bottom surface contact portion to the upper side apex contact portion may be 1:0.71.
according to one embodiment, the conductive particles include: an upper surface contact portion spaced apart from the bottom surface contact portion along the first direction and contacting the plurality of side surface contact portions; and a plurality of apex contact portions formed at positions where the upper face contact portion contacts two side face contact portions of the plurality of side face contact portions, respectively.
According to an embodiment, the angle between the bottom surface contact portion and one of the plurality of side surface contact portions may be 54.7 degrees.
According to an embodiment, the bottom surface contact and the plurality of side surface contacts may have a porosity.
Another implementation of the embodiments of the present invention relates to a connector for electrically connecting an inspection device with a device under inspection. The connector of an embodiment includes: a conductive part having the conductive particles in contact with each other in the vertical direction in a conductive manner; and an insulating portion made of an elastic material for maintaining the plurality of conductive particles as a conductive portion.
According to an embodiment, among the plurality of conductive particles, two adjacent conductive particles may be in contact with each other by surface contact between the bottom surface contact portion of any one of the conductive particles and the bottom surface contact portion of the other conductive particle, surface contact between the bottom surface contact portion of any one of the conductive particles and one of the plurality of side surface contact portions of the other conductive particle, or surface contact between one of the plurality of side surface contact portions of any one of the conductive particles and one of the plurality of side surface portions of the other conductive particle.
According to an embodiment, among the plurality of conductive particles, two adjacent conductive particles may be contacted in such a manner as to be slidable along one of the plurality of side contact portions.
According to an embodiment, a part of the plurality of conductive particles and another part of the plurality of conductive particles may have different sizes from each other.
Effects of the invention
The conductive particles according to one embodiment are three-dimensionally shaped conductive solid objects having a plurality of surface contact portions. According to an embodiment, since the bottom surface contact portion and the plurality of side surface contact portions that are tapered along the first direction perpendicular to the bottom surface contact portion form the surface of the conductive particle, the conductive particle can be made to easily make surface contact with another conductive particle in the front direction. Thus, if the conductive particles of one embodiment are used to form the conductive portion of the connector, the conductive portion having no particle contact direction is formed due to the dense arrangement of the conductive particles, thereby increasing the contact area between the particles in the conductive portion and increasing the current density of the conductive portion. Therefore, the conductive portion having further improved conductivity and current density can be realized as compared with a conductive portion composed of conventional spherical conductive particles or conductive particles having a letter shape.
According to the shape characteristics of the three-dimensional object provided by the conductive particles according to one embodiment, when the conductive portion is subjected to pressure, the conductive particles according to one embodiment in the conductive portion can slide relatively in the front direction. Thus, when the conductive portion receives pressure, workability in the up-down direction and workability in the horizontal direction can be improved, thereby improving the service life of the connector.
According to the shape characteristics of the three-dimensional object provided by the conductive particles according to the embodiment, since all the conductive particles constituting the conductive portion have an increased specific surface area and form one bond with each other, it is possible to prevent the conductive particles from being detached and to increase the durability of the conductive portion.
The conductive particles of an embodiment can have an increased contact area and a dense distribution structure and contact in an up-down direction in a manner capable of conducting electricity, and thus, a conductive portion having increased conductivity and a stable contact structure between particles can be realized. Further, since the conductive particles are in contact in a conductive manner and have an increased contact area and a dense distribution structure, a connector having a conductive portion in which electrical connection between the conductive particles is stable and having an excellent yield can be manufactured.
Drawings
Fig. 1 is an explanatory diagram schematically showing a connector to which an embodiment is applied.
Fig. 2 is a perspective view showing conductive particles according to an embodiment.
Fig. 3 is a front view of the conductive particles shown in fig. 2.
Fig. 4 is a perspective view schematically showing conductive particles having various sizes.
Fig. 5a is a schematic view showing a longitudinal cross-sectional shape of conductive particles according to an embodiment.
Fig. 5b is a view schematically showing another longitudinal cross-sectional shape of the conductive particles according to an embodiment.
Fig. 6 is a perspective view showing conductive particles according to still another embodiment.
Fig. 7 is a perspective view showing conductive particles according to another embodiment.
Fig. 8 is a perspective view schematically showing an example in which conductive particles of one embodiment are in contact with each other in a conductive portion of a connector of one embodiment in a conductive manner.
Fig. 9 is an explanatory view showing relative sliding movement of conductive particles of one embodiment within a conductive portion of a connector of one embodiment.
Fig. 10a is a cross-sectional view schematically showing a molded substrate for manufacturing a conductive substrate according to an embodiment.
Fig. 10b is a cross-sectional view schematically showing formation of molding holes for molding conductive particles in the molding substrate shown in fig. 10 a.
Fig. 10c is a cross-sectional view schematically showing filling of the molding holes shown in fig. 10b with a metal material powder for constituting the conductive particles.
Fig. 10d is a cross-sectional view schematically showing the conductive particles molded in the molding holes of the molding substrate by the powder metallurgy process.
Fig. 10e is a diagram schematically illustrating separation of sintered conductive particles from a molding substrate.
Fig. 11 is a perspective view showing conductive particles according to still another embodiment.
Detailed Description
An example of an embodiment of the present invention is intended to explain the technical idea of the present invention. The scope of the claims of the present invention is not limited to the following specific description of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. All terms used in the present invention are used only for further clarifying the present invention and are not intended to limit the scope of the invention claims.
Unless a sentence or article specifically refers to a corresponding expression, the expression "comprising," "having," etc. as used in the present invention is to be understood as open-ended terms, with the possibility of including other embodiments.
The singular expressions described in the present invention include plural meanings unless otherwise indicated, which are equally applicable to the singular expressions in the invention claims.
The expressions "first", "second", and the like used in the present invention are used only for distinguishing a plurality of structural elements from each other, and do not limit the order or importance of the respective structural elements.
In the present invention, when a certain component is "connected" or "combined" with another component, the certain component may be directly connected or combined with the other component, but it is also understood that the certain component is connected or combined with a new other component as a medium in the middle.
The dimensions and values described in the present invention are not limited to the dimensions or values described. Unless otherwise indicated, the above dimensions or values are to be understood to have the stated values and include the equivalent ranges thereof.
The term "upper" as used in the present invention means a direction based on the position of the connector with respect to the inspection device, and the term "lower" means a direction opposite to the upper direction. Although the direction indicator "up-down direction" used in the present invention includes an upper direction and a lower direction, it should be understood that it does not designate one of the upper direction and the lower direction.
The embodiments are described below with reference to a number of examples shown in the drawings. In the drawings, the same or corresponding constituent elements are given the same reference numerals. In the following description of the embodiments, repeated descriptions of the same or corresponding components are omitted. However, even if the technology of the relevant structural elements is omitted, it is not meant that such structural elements can be excluded from a certain embodiment.
The embodiments described below and examples shown in the drawings relate to a connector for electrically connecting an inspection device and an inspected apparatus, and conductive particles used for forming a conductive portion of the connector. In the case of electrically inspecting a device under inspection, the connector of the embodiment may be used for electrical connection of an inspection apparatus and the device under inspection. As an example, in the latter half of the manufacturing process of the semiconductor device, the connector of the embodiment is used for final electrical inspection of the semiconductor device, but the example of applying the connector of the embodiment is not limited thereto.
Referring to fig. 1, a structure of a connector of an embodiment and an example of applying the connector are described. Fig. 1 schematically shows a connector and an electronic device connected to the connector, and the shape shown in fig. 1 is merely an example selected for understanding the embodiment.
The connector 10 of one embodiment is a sheet-shaped structure. The connector 10 is arranged between two electronic devices. In the example shown in fig. 1, one of the two electronic devices may be the inspection apparatus 20, and the other may be the inspected device 30 inspected by the inspection apparatus 20.
As an example, the connector 10 is replaceably fixed to the test socket 40, and is positioned above the inspection device 20 through the test socket 40. The test socket 40 is mounted to the inspection device 20 in a manner that can be eliminated. The test socket 40 accommodates therein the device under test 30 that is manually or by a handling apparatus to be handled by the inspection apparatus 20, and can align the device under test 30 with the connector 10. When inspecting the inspected apparatus 30, the connector 10 is brought into contact with the inspection device 20 and the inspected apparatus 30 in the up-down direction VD, so that the inspection device 20 and the inspected apparatus 30 are electrically connected to each other.
The test device 30 may be a semiconductor device formed by packaging a semiconductor IC chip and a plurality of terminals in a square shape using a resin material. The subject apparatus 30 has a plurality of terminals 31 on its lower side. The terminals 31 may be ball (ball) type terminals. The subject apparatus 30 may also have a ground (land) type terminal with a lower height than a ball type terminal.
The inspection apparatus 20 can inspect various operation characteristics of the inspected device 30. The inspection device 20 may have a board for inspection, and an inspection circuit 21 for inspecting the inspected apparatus may be provided on the board. The inspection circuit 21 has a plurality of terminals 22 that contact the conductive portions of the connector 10. Terminal 22 of inspection device 20 may transmit an electrical test signal and receive a reply signal.
When inspecting the inspected device 30, the connector 10 electrically connects the terminal 22 of the inspection apparatus and the terminal 31 of the inspected device corresponding thereto in the up-down direction VD, and the inspection apparatus 20 is caused to perform inspection of the inspected device 30 by the connector 10.
At least a portion of the connector 10 may be composed of an elastic substance. In order to inspect the inspection apparatus 30, the pressure P may be applied to the connector 10 through the inspection apparatus 30 along the lower side of the up-down direction VD by mechanical means or manually. The terminal 31 of the test device can be brought into close contact with the connector 10 in the up-down direction VD by the pressure P, and the connector 10 and the terminal 22 of the inspection apparatus can be brought into close contact in the up-down direction VD. Further, a part of the components of the connector 10 can be elastically deformed in the downward direction and the horizontal direction HD by the pressure P. When the pressure P is removed, the above-described part of the components of the connector 10 can be restored to the original shape.
Referring to fig. 1, a connector 10 of an embodiment includes a conductive portion 11 and an insulating portion 12. The conductive portion 11 is provided along the vertical direction VD and is formed so as to be conductive along the vertical direction VD. The insulating portion 12 surrounds the conductive portion 11 and insulates the conductive portion 11. The connector 10 may include a plurality of conductive parts 11, and the insulating part 12 may be formed as one elastic body capable of insulating the plurality of conductive parts 11 from each other, with the plurality of conductive parts 11 being spaced apart in the horizontal direction HD.
When inspecting the inspection apparatus, the lower end of the conductive portion 11 is in contact with the terminal 22 of the inspection device, and the upper end is in contact with the terminal 31 of the inspection apparatus. Accordingly, a conductive path in the vertical direction using the conductive portion 11 as a medium is formed between the terminal 22 and the terminal 31 corresponding to one conductive portion 11. The test signal of the inspection device may be transferred from the terminal 22 to the terminal 31 of the device under test 30 through the conductive portion 11, and the response signal of the device under test 30 may be transferred from the terminal 31 to the terminal 22 of the inspection device 20 through the conductive portion 11.
In the connector 10, the conductive portion 11 may be formed in a substantially cylindrical shape. In the cylindrical shape of the conductive portion 11, the upper and lower ends may have a larger size than the middle. That is, the conductive portion 11 may be formed in a cylindrical shape in which a middle portion in the up-down direction is narrower than upper and lower ends.
Fig. 1 shows an example in which the upper end of the conductive portion 11 does not protrude from the upper face of the insulating portion 12 and the lower end of the conductive portion 11 does not protrude from the lower face of the insulating portion 12. As another example, the conductive portion 11 may be formed such that an upper end of the conductive portion 11 protrudes from an upper face of the insulating portion 12. The conductive portion 11 may be formed such that the lower end of the conductive portion 11 protrudes from the lower surface of the insulating portion 12.
The parallel arrangement of the conductive parts 11 may be variously changed according to the arrangement of the terminals 31 of the test device 30. For example, in the connector 10, the insulating portion 12 may be formed as a quadrangular region, and the conductive portions 11 may be arranged in a row or a pair of rows within the insulating portion 12. Alternatively, the conductive portions 11 may be arranged in a row and column along each side of the quadrangular region of the insulating portion 12.
The conductive portion 11 includes a plurality of conductive particles. The plurality of conductive particles are in contact with each other in the vertical direction VD so as to be conductive, thereby forming the conductive portion 11. A conductive path is formed in the vertical direction VD in the conductive portion 11 by a plurality of conductive particles that are in contact with each other in the vertical direction VD in a conductive manner. Among the plurality of conductive particles, adjacent conductive particles may be contacted in the up-down direction VD by a surface-to-surface contact method, a surface-to-line or line-to-line contact method, or a surface-to-point contact method, and adjacent conductive particles may be contacted in the up-down direction VD or in the horizontal direction HD or in an oblique direction between the up-down direction and the horizontal direction. By the above exemplary contact method, a plurality of conductive particles are brought into contact in a conductive manner along the up-down direction VD and form a densely distributed structure, whereby the conductive portion 11 can be constituted.
The insulating portion 12 is made of an elastic material having insulating properties. Although the elastic material forming the insulating portion 12 may include silicone rubber, it is not limited thereto. The insulating portion 12 maintains the plurality of conductive particles, which are in contact with each other in the vertical direction VD in a conductive manner, as the conductive portion 11. The elastic material forming the insulating portion 12 may fill the space between the plurality of conductive particles of the conductive portion 11. That is, the conductive portion 11 includes a part of the elastic material forming the insulating portion 12, and the elastic material of such a conductive portion may exist from the lower end to the upper end of the conductive portion.
The conductive portion 11 including an elastic material and the insulating portion 12 formed of an elastic material have elasticity in the up-down direction VD and the horizontal direction HD. When the terminal 31 of the device under test presses the upper end of the conductive part 11 downward by the pressure P, the conductive part 11 may expand slightly in the horizontal direction HD and elastically deform in such a manner as to compress along the lower direction, and the insulating part 12 may elastically deform to allow expansion of the conductive part 11. When the pressure P is removed, the conductive portion 11 and the insulating portion 12 can be elastically restored to the original state.
As an example, the conductive portion 11 and the insulating portion 12 may be molded together from a liquid-phase molding material in which a plurality of conductive particles are mixed in a liquid-phase elastic material. The liquid-phase elastic material is a material in a liquid state of an elastic material forming the insulating portion 12. A liquid phase molding material may be injected into the molding die and a magnetic field may be applied to each position where the conductive portion is formed in the up-down direction. Thus, the conductive particles are gathered in the region of the conductive portion to which the magnetic field is applied and are in contact with each other in the vertical direction. Subsequently, the conductive portion 11 and the insulating portion 12 are simultaneously formed by curing the liquid phase molding material, whereby the connector of an embodiment can be molded. As another example, first, the insulating portion 12 is formed of the elastic material in a solid state, and a through hole is formed in the insulating portion 12 at a position corresponding to the conductive portion 11. The liquid phase molding material injected into the through-holes is solidified by injecting the liquid phase molding material into the through-holes and applying a magnetic field in the vertical direction so that the conductive particles are gathered in the vertical direction and contact each other.
The conductive particles according to the embodiment will be described with reference to fig. 2 to 9. Fig. 2 to 9 schematically show the shape of the conductive particles and the contact pattern of the conductive particles. The contact patterns shown in fig. 2 to 9 are only examples selected for understanding the embodiments.
Fig. 2 is a perspective view showing conductive particles according to an embodiment, and fig. 3 is a front view of the conductive particles shown in fig. 2. The structure of the conductive particles according to an embodiment will be described below with reference to fig. 2 and 3.
The conductive particles 100 are used to form the conductive portion of the connector, and are made of a metal material. The conductive particles 100 according to one embodiment are three-dimensional objects. The conductive particles 100 have a shape that gradually narrows in a direction perpendicular to the bottom surface of the solid object, and due to the shape characteristics of such conductive particles, a plurality of conductive particles are densely distributed inside the conductive portion and the contact area increases.
The conductive particle 100 is in contact with another conductive particle in a conductive manner at a surface portion thereof or a dot portion formed between surfaces thereof or a line portion formed between surfaces thereof. That is, the surface portion, the line portion, and the dot portion of the conductive particle 100 are contact portions that are in contact with another conductive particle in a conductive manner. In the following description, the contact portion of the surface portion refers to the surface contact portion, the contact portion of the line portion refers to the corner contact portion, and the contact portion of the point portion refers to the apex contact portion. The conductive particles of the embodiments may include four or more surface contacts, 6 or more corner contacts, and four or more apex contacts.
As shown in fig. 2, the conductive particle 100 includes 5 surface contact portions forming the surface of the conductive particle. The 5 surface contact portions of the conductive particle 100 are a bottom surface contact portion 111 and a plurality of side surface contact portions 112, 113, 114, 115, respectively. The bottom surface contact portion 111 may correspond to the bottom surface of the conductive particle as a solid object. The conductive particles shown in fig. 2 may have a quadrangular pyramid shape, and the plurality of side surface contact portions may correspond to four side surfaces of the conductive particles as a solid object. Accordingly, the plurality of side contact portions of the conductive particle 100 means a first side contact portion 112, a second side contact portion 113, a third side contact portion 114, and a fourth side contact portion 115.
The bottom surface contact portion 111 may be formed in a quadrangular shape. Although the quadrangle of the bottom surface contact portion 111 may be square, the bottom surface contact portion 111 may be formed in a rectangular shape. The bottom surface contact portion 111 of the quadrangle has a plurality of sides. The first side contact portion 112, the second side contact portion 113, the third side contact portion 114, and the fourth side contact portion 115, which are the same in number as the sides of the bottom surface contact portion 111, are respectively in contact with the four sides of the bottom surface contact portion 111.
A part or the whole of the first side contact portion 112, the second side contact portion 113, the third side contact portion 114, and the fourth side contact portion 115 may have a shape corresponding to an isosceles triangle, respectively. Accordingly, when it is assumed that the first direction AD passes through the center of the bottom surface contact portion 111 and is perpendicular to the bottom surface contact portion 111, the first, second, third, and fourth side surface contact portions 112, 113, 114, and 115 may be gradually narrowed along the first direction AD. When the second direction CD is assumed to be the circumferential direction of the first direction AD, the adjacent side surface contact portions along the second direction CD among the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115 are in contact. That is, the first side contact portion 112 is in contact with the second side contact portion 113, the second side contact portion 113 is in contact with the third side contact portion 114, the third side contact portion 114 is in contact with the fourth side contact portion 115, and the fourth side contact portion 115 is in contact with the first side contact portion 112.
The conductive particles 100 may have a quadrangular pyramid shape or a shape similar to a quadrangular frustum of a pyramid according to the shape characteristics of the bottom surface contact portion and the first to fourth side surface contact portions. Since the conductive particles 100 have a shape characteristic that becomes gradually narrower along the first direction AD, one of the bottom surface contact portion or the side surface contact portion of the conductive particles 100 can easily make surface contact with one of the bottom surface contact portion or the side surface contact portion of the other conductive particle. Thus, the conductive particles of an embodiment can constitute the conductive portion while having a dense distribution structure and an increased contact area.
The apexes and corners formed at the positions where the bottom surface contact portion 111 contacts the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115 form the apex contact portion and the corner contact portion. Accordingly, the conductive particles of the embodiment include a plurality of apex contact portions and a plurality of corner contact portions, which are formed at positions where the bottom surface contact portions and the side surface contact portions are in contact, respectively. When the conductive particles constitute the conductive portion, one vertex contact portion of the conductive particles may be in contact with one of the surface contact portions of the other conductive particles, and one corner contact portion of the conductive particles may be in contact with one of the surface contact portions or one of the corner contact portions of the other conductive particles.
The conductive particle 100 of one embodiment includes a first apex contact portion 121, a second apex contact portion 122, a third apex contact portion 123, and a fourth apex contact portion 124, which are formed at positions where the bottom surface contact portion 111 contacts two of the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115, respectively. As shown in fig. 2 and 3, the quadrangular pyramid-shaped conductive particles 100 include a fifth vertex contact portion 125 located at the uppermost end. The fifth apex contact portion 125 is an upper apex contact portion of the conductive particles 100. The fifth apex contact portion 125 is formed at a position where all of the first side contact portion 112, the second side contact portion 113, the third side contact portion 114, and the fourth side contact portion 115 are in contact along the first direction AD.
The conductive particle 100 of one embodiment includes the above-described plurality of corner contacts, i.e., the first corner contact 131, the second corner contact 132, the third corner contact 133, the fourth corner contact 134, the fifth corner contact 135, the sixth corner contact 136, the seventh corner contact 137, and the eighth corner contact 138. The first, second, third and fourth corner contacts 131, 132, 133 and 134 are formed at positions where the bottom surface contact 111 contacts one of the first, second, third and fourth side contacts 112, 113, 114 and 115, respectively. The fifth, sixth, seventh and eighth corner contacts 135, 136, 137, 138 are formed at positions where adjacent ones of the first, second, third and fourth side contacts 112, 113, 114, 115 contact in the second direction CD, respectively.
The conductive particles 100 of one embodiment are made of a metal material, and can be produced by molding a metal powder into a sintered body through a powder metallurgy process. The metal material of the metal powder may be iron, nickel, gold, silver, copper, palladium, rhodium, tungsten, platinum, titanium, cobalt. The sintered body may be a partial solid solution. As an example, conductive particles can be prepared by sintering and molding a powder of silver (Ag) for conductivity, a metal powder of copper (Cu), and a powder of cobalt (Co) for imparting magnetism.
A plurality of micro-pores formed by mixing open pores or closed pores may be formed on the surface and inside of the conductive particles 100 molded into a sintered body. That is, the bottom surface contact portion and the side surface contact portion forming the surface of the conductive particle 100 have porosity. Thus, the bottom surface contact portion 111 and the first, second, third, and fourth side surface contact portions 112, 113, 114, and 115 have a large surface roughness (surface roughness) and a large specific surface area (specific surface area). Accordingly, the contact area between the elastic material forming the insulating portion of the connector and the surface of the conductive particle 100 or the contact area between the elastic material in the conductive portion of the connector and the surface of the conductive particle 100 is increased, so that the conductive particle 100 can be maintained in the conductive portion by a strong binding force.
According to one embodiment, conductive particles having various sizes may constitute the conductive portion of the connector. Fig. 4 is a perspective view schematically showing conductive particles having various sizes according to an embodiment.
Referring to fig. 4, the conductive particles 101, 102, 103 may have various sizes. In the conductive particles 101, 102, 103, the length L of one side of the bottom surface contact portion 111 and the height H from the bottom surface contact portion 111 to the fifth apex contact portion (upper apex contact portion) 125 may be different from each other. However, the ratio of the length L of one side of the bottom surface contact portion 111 to the height H from the bottom surface contact portion to the fifth vertex contact portion 125 of 111 among the conductive particles 101, 102, 103 of various sizes may be the same. As an example, the ratio of the one side length L of the bottom surface contact portion 111 to the height H from the bottom surface contact portion 111 to the fifth vertex contact portion 125 may be about 1:0.71. and, the side length L of the bottom surface contact portion 111 may be 20 μm to 60 μm.
As illustrated in fig. 4, conductive particles of various sizes may be used to make up the conductive portion of the connector of an embodiment. Therefore, one part of the conductive particles and the other part of the conductive particles in the plurality of conductive particles constituting the conductive portion of the connector may have different sizes from each other. By composing the conductive portion with conductive particles having various sizes, the particle density in the conductive portion can be further increased.
In the conductive particle of an embodiment, an included angle between one of the bottom surface contact portion and the side surface contact portion may be a specific angle. Fig. 5a and 5b are schematic views showing the longitudinal sectional shape of the conductive particles according to an embodiment. Referring to fig. 5a and 5b, the angle IA between the bottom surface contact portion 111 and one of the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115 may be about 54.7 degrees. As shown in fig. 5a, the angle IA between the bottom surface contact portion 111 and the first side surface contact portion 112 and the angle IA between the bottom surface contact portion 111 and the third side surface contact portion 114 may be about 54.7 degrees. As shown in fig. 5b, the angle IA between the bottom surface contact portion 111 and the fourth side surface contact portion 115 may be about 54.7 degrees. In addition, among the conductive particles having various sizes, the above-described angle IA may be formed between one of the bottom surface contact portion and the side surface contact portion.
Fig. 6 is a perspective view showing conductive particles according to still another embodiment. Fig. 6 shows conductive particles having a quadrangular frustum shape.
Referring to fig. 6, the conductive particle 100A includes: the bottom surface contact part; the first to fourth side contact portions; the first to fourth apex contact portions; the first to eighth angular contact portions. The conductive particle 100A shown in fig. 6 includes an upper surface contact portion 116 which has a quadrangular shape and a smaller area than the bottom surface contact portion 111. The upper face contact 116 is spaced apart from the bottom face contact 111 along the first direction AD, and the upper face contact 116 may be parallel to the bottom face contact 111. The upper surface contact portion 116 is in contact with the first side contact portion 112, the second side contact portion 113, the third side contact portion 114, and the fourth side contact portion 115, respectively, in four sides thereof. In this way, the conductive particles 100A including the upper surface contact portion 116 may have a quadrangular frustum shape. The conductive particles 100A do not include the fifth vertex contact portion. The conductive particle 100A includes a sixth apex contact portion 126, a seventh apex contact portion 127, an eighth apex contact portion 128, and a ninth apex contact portion 129, which are formed at positions where the upper surface contact portion 116 contacts two of the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115, respectively. Further, corner contact portions may be formed at positions where the upper surface contact portion 116 contacts one of the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115, respectively.
As with the conductive particles of the above embodiments, the conductive particles 100A may be formed in various sizes. In the conductive particle 100A, the angle between the bottom surface contact portion 111 and one of the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115 may be about 54.7 degrees. In the conductive particle 100A, the upper surface contact portion 216 may have an angle of 125.3 degrees with one of the first side surface contact portion 112, the second side surface contact portion 113, the third side surface contact portion 114, and the fourth side surface contact portion 115.
Fig. 7 is a perspective view showing conductive particles according to another embodiment. The conductive particles shown in fig. 7 may have a quadrangular pyramid shape with a rectangular bottom surface. That is, the bottom surface contact portion 111 of the conductive particle 100B shown in fig. 7 is rectangular. The conductive particles 100B may be formed in a quadrangular frustum shape similar to the conductive particles shown in fig. 6.
When a magnetic field is applied to each position of the conductive part in the up-down direction to a liquid phase molding material formed by mixing a liquid phase substance of an elastic material of the insulating part and a plurality of conductive particles, the plurality of conductive particles are concentrated in a magnetic field region and are closely contacted in the up-down direction. Thus, the conductive portion of the connector can be composed of a plurality of conductive particles. According to the shape characteristics of the conductive particles, the conductive particles can be closely contacted in the magnetic field region so as not to generate a gap therebetween. Accordingly, the conductive particles can be densely distributed in the up-down direction within the conductive portion of the connector. Therefore, the conductive portion of the connector may exhibit improved conductivity and current density due to the increased particle density and contact area between particles.
Fig. 8 is a perspective view schematically showing an example in which conductive particles of one embodiment are in contact with each other in a conductive portion of a connector of one embodiment in a conductive manner.
Although fig. 8 shows an example of the conductive portion composed of the quadrangular pyramid-shaped conductive particles, the conductive portion may be composed of the conductive particles shown in fig. 6 and 7. The conductive particles shown in fig. 2, 6 and 7 may be mixed to form the conductive portion.
The plurality of conductive particles of one embodiment are brought into contact in the vertical direction VD in a manner capable of conducting electricity, thereby constituting the conductive portion 11 of the connector. The conductive portion 11 may include conductive particles 104, 105 of the same size. The plurality of conductive particles 104, 105 are densely contacted in the conductive portion 11 in a disordered orientation. A first direction AD perpendicular to the bottom surface contact is positioned within the conductive portion 11 in a disordered orientation. For example, the first direction AD of the conductive particles is positioned in the vertical direction VD, the horizontal direction HD, or any oblique direction between the vertical direction VD and the horizontal direction HD, and the conductive particles may be densely distributed in the vertical direction and the horizontal direction in the conductive portion 11. Further, the fifth vertex contact portions 125 of the respective conductive particles can be oriented in the vertical direction VD, the horizontal direction HD, or any oblique direction between the vertical direction VD and the horizontal direction HD by densely arranging the conductive particles in the conductive portion 11.
Adjacent conductive particles 104 and 105 in the conductive portion 11 can be contacted by a surface contact method, a surface-to-line contact method, or a surface-to-point contact method. In this connection, the surface contact means that one of the bottom surface contact portion or the side surface contact portion of one conductive particle 104 is in contact with one of the bottom surface contact portion or the side surface contact portion of the other conductive particle 105. The surface-to-line contact means that one of the bottom surface contact portion or the side surface contact portion of one conductive particle 104 is in contact with one of the corner contact portions of the other conductive particle 105. The surface-to-point contact means that one of the bottom surface contact portion or the side surface contact portion of one conductive particle 104 is in contact with one of the apex contact portions of the other conductive particle 105.
Specifically, the surface contact may include a surface contact between the bottom surface contact portion and the bottom surface contact portion, a surface contact between the bottom surface contact portion and the side surface contact portion, and a surface contact between the side surface contact portion and the side surface contact portion. That is, in the conductive portion 11, the adjacent two conductive particles 104, 105 may be contacted by surface contact between the bottom surface contact portion of one conductive particle 104 and the bottom surface contact portion of the other conductive particle 105, surface contact between the bottom surface contact portion of one conductive particle 104 and one of the side surface contact portions of the other conductive particle 105, or surface contact between one of the side surface contact portions of one conductive particle 104 and one of the side surface contact portions of the other conductive particle 105.
As described above, the adjacent two conductive particles 104, 105 cause the plurality of conductive particles constituting the conductive portion 11 to exhibit contact in the front direction by surface contact in any direction of the surface contact portion. The first directions AD of the adjacent two conductive particles 104 and 105 are not parallel and overlap or intersect each other by the surface contact portion that is in contact with each other. As a result, as shown in fig. 8, adjacent conductive particles 104 and 105 can be densely distributed and contact each other in the vertical direction VD and the horizontal direction HD. Therefore, the plurality of conductive particles constituting the conductive portion 11 can be in contact with each other in the up-down direction in a very high density and in a conductive manner in the conductive portion 11.
The adjacent conductive particles 104 and 105 in the conductive portion 11 can be in contact with each other by a contact method such as line contact. In this connection, the line contact means that one of the corner contact portions of one conductive particle 104 is in contact with one of the corner contact portions of the other conductive particle 105.
As described above, the conductive particles 104, 105 arranged in a disordered orientation and in close contact with each other can greatly increase the contact area between particles in the conductive portion 11. When the conductive portion 11 is composed of quadrangular pyramid-shaped conductive particles composed of the bottom surface contact portion and the side surface contact portion, surface contact between adjacent conductive particles can be easily guided. In the above contact method, the plurality of conductive particles are mainly contacted by a surface contact method. Therefore, the plurality of conductive particles constituting the conductive portion 11 have no direction of low contact, and the plurality of conductive particles have a greatly increased contact area. Further, since a plurality of conductive particles are combined into one structure in the conductive portion 11, the conductive particles can be prevented from being separated from the conductive portion, and the durability of the conductive portion can be increased. Further, since the plurality of conductive particles are distributed in the conductive portion 11 at a high density, the current density of the conductive portion can be increased.
As another example, the conductive portion 11 may include conductive particles having various sizes. As shown in fig. 4, conductive particles of various sizes may constitute the conductive portion 11 and be mixed in the conductive portion 11. In this example, some of the plurality of conductive particles constituting the conductive portion 11 and another of the plurality of conductive particles may have different sizes from each other. The conductive portion 11 may be formed by mixing two or more kinds of conductive particles among the conductive particles shown in fig. 2 and 4, the conductive particles shown in fig. 6, and the conductive particles shown in fig. 7. In this example, conductive particles of various sizes can be used for the conductive portion 11.
Conductive particles composed of three-dimensional objects which gradually narrow from the bottom surface are contacted by surface contact, and the conductive particles can slide through the respective surface contact parts. Therefore, when the test apparatus is inspected, the whole conductive particles in the conductive portion relatively slide in response to the applied pressure, thereby improving workability corresponding to the pressure. Further, when the conductive particles are collected in the magnetic field so as to constitute the conductive portion, the sliding property of the surface contact portion can facilitate movement of the conductive particles. Referring to fig. 9, a relative sliding movement of conductive particles of an embodiment within a conductive portion of a connector of an embodiment is illustrated.
Adjacent two conductive particles 104 and 105 are in contact with each other by surface contact between the side contact portions. Therefore, among the plurality of conductive particles constituting the conductive portion, two adjacent conductive particles 104, 105 are in contact so as to be slidable along one of the side contact portions. In addition, in a state where the adjacent two conductive particles are brought into surface contact with each other by the bottom surface contact portion, the adjacent two conductive particles can slide along the bottom surface contact portion.
When inspecting the inspection apparatus, the pressure P is applied to the conductive portion 11 along the lower side in the up-down direction VD. One of the side contact portions of one conductive particle 104 of the adjacent two conductive particles and one of the side contact portions of the other conductive particle 105 are brought into contact by surface contact. The one conductive particle 104 and the other conductive particle 105 are guided by the side contact portion in surface contact in response to the pressure P, and can slide in the sliding direction SD. The sliding direction SD may be a direction of the pressure P, a direction perpendicular to the pressure P, or a direction oblique to the pressure P.
In the conductive portion 11, two conductive particles that are slidable can respond to the pressure P and easily move in a direction inclined to the horizontal direction HD or the horizontal direction HD. Accordingly, the conductive portion of the connector can be expanded in the horizontal direction by the pressure P, and in the process, the conductive particles can slide. The conductive particles that slide by pressure can improve the workability of the conductive portion in the up-down direction and the horizontal direction. Further, the conductive particles that move by pressure sliding can disperse the pressure P applied to the conductive portion and reduce damage caused by the pressure P.
The contact method of the conductive particles shown in fig. 9 is merely an example. Adjacent conductive particles may be contacted by surface contact between the bottom surface contact portions, or may be contacted by surface contact between the bottom surface contact portion and one of the side surface contact portions, or may be contacted by contact between the bottom surface contact portion or the side surface contact portion and the corner contact portion. The contact may be positioned in various directions relative to the up-down direction VD. Accordingly, the plurality of conductive particles in the conductive portion can relatively slide in the front direction in response to the pressure P.
As described above, conductive particles that are distributed at a high density and realize a relative sliding movement may be distributed from the lower end to the upper end in the conductive portion of the connector. That is, in the conductive portion of the connector of an embodiment, conductive particles having the same or different sizes and having a quadrangular pyramid or quadrangular frustum shape are distributed at high density in an upper section of the conductive portion, a middle section of the conductive portion, and a lower section of the conductive portion. Therefore, the conductive portion of the connector of an embodiment can eliminate problems caused by the use of two types of particles, such as unstable binding force and contact area. As another example, spherical conductive particles may be disposed in the upper and lower sections of the conductive portion, or conductive particles of the example may be disposed in the middle section of the conductive portion. In this example, since the conductive particles of the embodiment are densely distributed, the contact area between the particles in the interface between the conductive particles of the embodiment and the spherical conductive particles can be stably ensured.
The conductive particles according to one embodiment are produced by molding a metal powder into a sintered body through a powder metallurgy process. Fig. 10a to 10e are explanatory views schematically showing the manufacture of conductive particles of an embodiment, and the shapes shown in fig. 10a to 10e are only examples selected for understanding the embodiment.
Referring to fig. 10a, a molding substrate 310 for molding conductive particles is prepared. As an example, the molding substrate may be a silicon wafer substrate. A mask (not shown) penetrating through the upper surface 311 of the molding substrate 310 may be attached. The opening of the mask may correspond to a shape of the bottom surface contact portion of the conductive particle.
Fig. 10b is a diagram schematically showing formation of molding holes for molding conductive particles in a molding substrate. The molding substrate 310 is wet etched (wet-etching) by an aqueous KOH solution. The molding substrate 310 is etched by the wet etching from the upper surface 311 provided with the opening of the mask, and molding holes 321, 322, 323 are formed. The shape of the molding holes 321, 322, 323 corresponds to the shape of the conductive particles of the embodiment. As an example, the molding holes 321 and 322 may have a quadrangular pyramid shape that is inverted vertically, and the molding hole 323 may have a quadrangular frustum shape that is inverted vertically. The angle formed by the sidewall surface 331 of the shaped holes 321, 322, 323 and the upper face 311 may be about 54.7 degrees. The etching degree of wet etching will vary along the crystallization direction of the molding substrate 310 as a silicon wafer. Thereby, the sidewall surface 331 of the molded hole inclined at about 54.7 degrees with respect to the upper face 311 and gradually narrowing from the upper face 311 downward can be etched. The shaping holes 321, 322 may be provided with apexes 332 by adjusting the size of the area of wet etching or the time of wet etching, and the shaping hole 323 may be provided with a bottom surface 333. The apex 332 may correspond to the fifth apex contact described above, and the bottom surface 333 may correspond to the upper surface contact.
Fig. 10c is a diagram schematically showing filling of metal material powder for constituting conductive particles in molding holes of a molding substrate. The metal powder 341 put into the molding holes 321, 322, 323 is made of a metal material constituting the conductive particles of one embodiment, and may be made of the above-mentioned metal material, for example. The metal powder 341 may be a powder of one kind of the above-described metal materials, or may be a powder of two or more kinds of metal materials. As an example, silver (Ag) powder, copper (Cu) powder, and cobalt (Co) powder may be charged into the molding holes 321, 322, 323.
Fig. 10d is a view schematically showing the conductive particles molded in the molding holes of the molding substrate by the powder metallurgy process. As shown in fig. 10c, after filling the molding holes 321, 322, 323 with the metal powder 341, the metal powder is heated at a sintering temperature to perform sintering. The metal powder 341 may also be compressed prior to sintering the metal powder 341. As shown in fig. 10d, as the sintered bodies 351, 352, 353 corresponding to the shapes of the molding holes 321, 322, 323 are formed by sintering the metal powder, finally, the sintered bodies 351, 352, 353 will become conductive particles of an embodiment.
Fig. 10e is a diagram schematically illustrating separation of sintered conductive particles from a molding substrate. After sintering of the metal powder is completed, the conductive particles 101, 102, 100A are separated from the molding holes 321, 322, 323. The conductive particles 101 and 102 may have a quadrangular pyramid shape corresponding to the shape of the molding holes 321 and 322, and the conductive particles 100A may have a quadrangular frustum shape corresponding to the shape of the molding hole 323. Each of the conductive particles 101, 102, 100A includes a bottom surface contact portion, and is formed by filling the upper surface of the metal powder in the molding holes 321, 322, 323. Each of the conductive particles 101, 102, 200 includes a first side contact portion, a second side contact portion, a third side contact portion, and a fourth side contact portion, and has a shape corresponding to the shape of the side wall surface 331 of the molding hole. The conductive particles 100A include an upper surface contact portion, and have a shape corresponding to the shape of the bottom surface 333 of the molding hole 323. The surface contact portions of the conductive particles 101, 102, and 100A formed by sintering have porosity.
Fig. 11 is a perspective view showing conductive particles according to still another embodiment. The conductive particles 200 shown in fig. 11 are formed as a three-dimensional object such as a quadrangular pyramid.
The constituent material of the conductive particles 200 may be the same as that of the conductive particles of the above-described embodiment. The conductive particles 200 can be produced by molding a metal powder into a sintered body in a powder metallurgy process.
The conductive particles 200 have a shape that gradually narrows in a direction perpendicular to the bottom surface of the solid object. The conductive particles 200 may include four surface contact portions forming the surfaces of the conductive particles. The four surface contact portions of the conductive particles 200 include a bottom surface contact portion 211 and a plurality of side surface contact portions, i.e., a first side surface contact portion 212, a second side surface contact portion 213, and a third side surface contact portion 214.
The bottom surface contact portion 211 has three sides, and may be formed in a triangle, for example, a regular triangle. The first side contact portion 212, the second side contact portion 213, and the third side contact portion 214 are in contact with three sides of the bottom surface contact portion 211, respectively. The first, second and third side contact portions 212, 213 and 214 may be tapered along the first direction AD. Among the first side contact portion 212, the second side contact portion 213, and the third side contact portion 214, adjacent side contact portions along the second direction CD are in contact. Depending on the shape characteristics of the bottom surface contact portion and the first, second, and third side surface contact portions, one of the bottom surface contact portion or the side surface contact portion of the conductive particle 200 is easily in surface contact with one of the bottom surface contact portion or the side surface contact portion of the other conductive particle 200. Accordingly, the conductive particles can constitute the conductive portion while having a dense distribution structure and an increased contact area. The conductive particles can slide relatively in the front direction by pressure applied to the conductive portion.
The conductive particle 200 includes a first apex contact portion 221, a second apex contact portion 222, and a third apex contact portion 223, which are formed at positions where the bottom surface contact portion 211 contacts two of the first side contact portion 212, the second side contact portion 213, and the third side contact portion 214, respectively. The conductive particles 200 include an upper apex contact portion 225 located at the uppermost end. The upper apex contact portion 225 is formed at a position where the first side contact portion 212, the second side contact portion 213, and the third side contact portion 214 all contact along the first direction AD. The conductive particles 200 include: corner contact portions 231, 232, 233 formed at positions where the bottom contact portion 211 contacts one of the first side contact portion 212, the second side contact portion 213, and the third side contact portion 214, respectively; and corner contact portions 235, 236, 237 formed at positions where adjacent side contact portions among the first side contact portion 212, the second side contact portion 213, and the third side contact portion 214 are in contact along the second direction CD, respectively.
While the technical idea of the present invention has been described above by way of some embodiments and the accompanying drawings, it should be understood that various changes, modifications and alterations can be made by those skilled in the art to which the present invention pertains without departing from the technical idea and scope of the present invention. And such changes, modifications and variations are intended to be included within the scope of the appended claims.
Claims (11)
1. A conductive particle for a conductive part of a connector for electrical connection, wherein,
comprising the following steps:
a bottom surface contact portion having a plurality of sides; and
a plurality of side contact portions which are respectively contacted with a plurality of sides of the bottom contact portion, gradually narrow along a first direction which is respectively perpendicular to the bottom contact portion, and a plurality of adjacent side contact portions are contacted along a second direction which is a surrounding direction of the first direction,
the bottom surface contact portion and the plurality of side surface contact portions form a surface.
2. The conductive particle according to claim 1, comprising:
a plurality of apex contact portions formed at positions where the bottom contact portion contacts two side contact portions of the plurality of side contact portions, respectively;
a plurality of corner contact portions formed at positions where the bottom contact portion contacts one of the plurality of side contact portions; and
and a plurality of corner contact portions formed at positions where adjacent side contact portions among the plurality of side contact portions are in contact with each other along the second direction.
3. The conductive particle according to claim 2, further comprising an upper apex contact portion formed at a position where all of the plurality of side contact portions are in contact along the first direction.
4. The conductive particle according to claim 3, wherein a ratio between a length of one side of the bottom surface contact portion and a height from the bottom surface contact portion to the upper apex contact portion is 1:0.71.
5. the conductive particle according to claim 2, comprising:
an upper surface contact portion spaced apart from the bottom surface contact portion along the first direction and contacting the plurality of side surface contact portions; and
and a plurality of apex contact portions formed at positions where the upper surface contact portion contacts two side surface contact portions of the plurality of side surface contact portions, respectively.
6. The conductive particle of claim 1, wherein an angle between said bottom surface contact portion and one of said plurality of side surface contact portions is 54.7 degrees.
7. The conductive particle according to claim 1, wherein the bottom surface contact portion and the plurality of side surface contact portions have a porous property.
8. A connector for electrical connection, comprising:
a conductive portion having a plurality of conductive particles according to any one of claims 1 to 7 in contact in an up-down direction in a conductive manner; and
and an insulating part made of an elastic material for maintaining the plurality of conductive particles as the conductive part.
9. The connector according to claim 8, wherein, among the plurality of conductive particles, two adjacent conductive particles are in contact with each other by surface contact between a bottom surface contact portion of any one of the conductive particles and a bottom surface contact portion of another conductive particle, surface contact between a bottom surface contact portion of any one of the conductive particles and one of a plurality of side surface contact portions of another conductive particle, or surface contact between one of a plurality of side surface contact portions of any one of the conductive particles and one of a plurality of side surface portions of another conductive particle.
10. The connector according to claim 8, wherein two adjacent conductive particles among the plurality of conductive particles are in contact with each other so as to be slidable along one of the plurality of side contact portions.
11. The connector of claim 8, wherein a part of the plurality of conductive particles and another part of the plurality of conductive particles have different sizes from each other.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200109065A KR102474337B1 (en) | 2020-08-28 | 2020-08-28 | Connector for electrical connection |
| KR10-2020-0109065 | 2020-08-28 | ||
| PCT/KR2021/011415 WO2022045787A1 (en) | 2020-08-28 | 2021-08-26 | Conductive particle and electrical connection connector including same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116114125A true CN116114125A (en) | 2023-05-12 |
Family
ID=80353670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180055825.1A Pending CN116114125A (en) | 2020-08-28 | 2021-08-26 | Conductive particle and connector for electrical connection comprising same |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR102474337B1 (en) |
| CN (1) | CN116114125A (en) |
| TW (1) | TWI806138B (en) |
| WO (1) | WO2022045787A1 (en) |
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|---|---|---|---|---|
| KR20240036325A (en) * | 2022-09-13 | 2024-03-20 | 주식회사 아이에스시 | Method of manufacturing conductive particles with magnetic particles aligned inside, conductive particles, and sheet-form connector |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140109102A (en) * | 2013-03-05 | 2014-09-15 | 삼성디스플레이 주식회사 | Anisotropic Conductive Film And Display Apparatus Having The Same |
| WO2015073346A1 (en) * | 2013-11-15 | 2015-05-21 | 3M Innovative Properties Company | An electrically conductive article containing shaped particles and methods of making same |
| KR101525520B1 (en) | 2015-02-03 | 2015-06-03 | (주)티에스이 | Testing socket including conductive particles having combinable shape |
| KR101805834B1 (en) | 2016-05-11 | 2017-12-07 | 주식회사 아이에스시 | Test socket and conductive particle |
| KR20170017951A (en) * | 2017-01-20 | 2017-02-15 | 주식회사 아이에스시 | anisotropic conductive sheet |
| KR101973609B1 (en) * | 2018-02-19 | 2019-04-29 | (주)티에스이 | Rubber socket for semiconductor test including conductive part mixed regular conductive particles and irregular conductive particles |
| KR102444643B1 (en) * | 2018-11-06 | 2022-09-19 | (주)티에스이 | Conductive particle and data signal transmission connector having the same |
-
2020
- 2020-08-28 KR KR1020200109065A patent/KR102474337B1/en active IP Right Grant
-
2021
- 2021-08-26 WO PCT/KR2021/011415 patent/WO2022045787A1/en active Application Filing
- 2021-08-26 CN CN202180055825.1A patent/CN116114125A/en active Pending
- 2021-08-27 TW TW110131790A patent/TWI806138B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220028280A (en) | 2022-03-08 |
| TW202211260A (en) | 2022-03-16 |
| KR102474337B1 (en) | 2022-12-07 |
| TWI806138B (en) | 2023-06-21 |
| WO2022045787A1 (en) | 2022-03-03 |
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