CN116082056A - 一种取向石墨制备的均热板界面焊接金属块的传热结构及样件制造方法 - Google Patents
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Abstract
本发明提供了一种取向石墨制备的均热板界面焊接金属块的传热结构及样件制造方法。首先将利用热压法制备取向石墨板，然后将取向石墨板纵向打孔并将金属块嵌入到孔内。接着将钎料加入到金属块与取向石墨之间进行异质焊接，得到传热构建。石墨板的取向性及金属块和石墨之间良好的界面相互作用使得整体构建的界面热阻降低，传热效率明显提高。
Description
技术领域
本发明属于均热板制造技术领域，具体来书涉及一种取向石墨制备的均热板界面焊接金属块的传热结构及样件制造方法。
背景技术
随着5G技术的不断发展，器件的功率密度不断提高，表面的积聚了大量的热量。高的热量使得器件的安全系数、使用寿命大大降低。同时，当今设备朝着微型化的方向发展，各元器件高度集成，因此构造一种可以集成元器件且可以实现高效散热的传热结构非常重要。石墨是一种无污染，高度稳定，加工性能优异且成本低的材料。其理论导热系数高达129W/(m·K)，将石墨进行剥离，单片石墨的理论面内导热系数可高达5300W/(m·K)。因此，利用单层石墨的面内导热是未来均热板制备的首选对象。
除了均热板的设计，器件与均热板的结构属于嵌入性结构，器件下方含有一块金属块嵌入到石墨的均热板内。现有的均热板与金属的构建方式大都选择嵌入的方式获得，但是由于两者结构不同，材料不同，两者之间的界面接触较差，界面热阻较高，严重降低了均热板及器件的传热效率。因此，如何将含有金属的元器件嵌入均热板内，实现两者的完全界面接触是获得高效均热板的另一重要影响因素。高导热的石墨均热板结合完美的界面接触，是未来电子设备高效发展的一个重要途径和方法。
发明内容
为了克服现有技术的不足，本发明的目的在于提供一种取向石墨制备的均热板界面焊接金属块的传热结构及样件制造方法，利用取向石墨构建带孔的均热板，利用钎料实现均热板与嵌入金属的界面相互作用，提升器件在均热板上的传热效率。本发明采用以下技术方案：
本发明关于一种取向石墨制备的均热板界面焊接金属块的传热结构及样件制造方法，其特征步骤如下：
1)取向石墨的制备：在烧杯中加入氧化石墨烯和水的混合溶液，室温超声2h。然后在室温下，利用砂芯漏斗抽滤获得氧化石墨烯膜。然后，将多个石墨烯膜进行重叠且界面之间填充高导热介质材料。接着在800℃，氩气的环境下进行热压，获得取向的石墨块。接着根绝器件的需求在石墨块上打孔并打磨。
2)金属块与取向石墨的焊接：选取合适尺寸的金属块，嵌入到石墨均热板内。将含有铝镁等合金的钎料加到取向石墨与金属块之间。然后，在氩气环境下，300-600℃高温煅烧，冷却，获得金属嵌入到取向石墨的均热板。
优选地，步骤1)热压升温速率5-10℃/min。
优选地，步骤2)煅烧升温速率为5-10℃/min。
优选地，步骤2)煅烧冷却速率为1-5℃/min。
本发明通过制备取向石墨材料，然后将利用取向石墨构建带孔的均热板，接着利用钎料实现均热板与嵌入金属的界面相互作用，实现器件在均热板上的高传热效率。
附图说明
图1为均热板的设计图；
图2为取向石墨的扫描电镜图；
具体实施方式
下面给出本发明的3个实施例，是对本发明的进一步说明，而不是限制本发明的范围。
实施例1
1)取向石墨的制备：在烧杯中加入氧化石墨烯和水的混合溶液，室温超声2h。然后在室温下，利用砂芯漏斗抽滤获得氧化石墨烯膜。然后，将多个石墨烯膜进行重叠且界面之间填充沥青材料。接着在800-1000℃，氩气的环境下进行热压，获得取向的石墨块。接着根绝器件的需求在石墨块上打孔并打磨。
2)金属块与取向石墨的焊接：选取合适尺寸的金属块，嵌入到石墨均热板内。将含有铝镁等合金的钎料加到取向石墨与金属块之间。然后，在氩气环境下，800-1000℃高温煅烧，冷却，获得金属嵌入到取向石墨的均热板。
实施例2
1)取向石墨的制备：在烧杯中加入氧化石墨烯和水的混合溶液，室温超声2h。然后在室温下，利用砂芯漏斗抽滤获得氧化石墨烯膜。然后，将多个石墨烯膜进行重叠且界面之间填充银粉材料。接着在1300-1500℃，氩气的环境下进行热压，获得取向的石墨块。接着根绝器件的需求在石墨块上打孔并打磨。
2)金属块与取向石墨的焊接：选取合适尺寸的金属块，嵌入到石墨均热板内。将含有铝镁等合金的钎料加到取向石墨与金属块之间。然后，在氩气环境下，800℃高温煅烧，冷却，获得金属嵌入到取向石墨的均热板。
实施例3
1)取向石墨的制备：在烧杯中加入氧化石墨烯和水的混合溶液，室温超声2h。然后在室温下，利用砂芯漏斗抽滤获得氧化石墨烯膜。然后，将多个石墨烯膜进行重叠且界面之间填充高导热铝镁合金材料。接着在800℃，氩气的环境下进行热压，获得取向的石墨块。接着根绝器件的需求在石墨块上打孔并打磨。
2)金属块与取向石墨的焊接：选取合适尺寸的金属块，嵌入到石墨均热板内。将含有铝镁等合金的钎料加到取向石墨与金属块之间。然后，在氩气环境下，300-600℃高温煅烧，冷却，获得金属嵌入到取向石墨的均热板。
以上对本发明做了示例性的描述，应该说明的是，在不脱离本发明的核心的情况下，任何简单的变形、修改或者其他本领域技术人员能够不花费创造性劳动的等同替换均落入本发明的保护范围。
Claims (8)
1.一种取向石墨制备的均热板界面焊接金属块的传热结构及样件制造方法，其结构式如附图1。
2.取向石墨的制备，其特征是：
在烧杯中加入氧化石墨烯和水的混合溶液，室温超声2h。然后在室温下，利用砂芯漏斗抽滤获得氧化石墨烯膜。然后，将多个石墨烯膜进行重叠且界面之间填充高导热介质材料。接着在800-1000℃，氩气的环境下进行热压，获得取向的石墨块。接着根绝器件的需求在石墨块上打孔并打磨。
3.金属块与取向石墨的焊接方法，其特征是：
选取合适尺寸的金属块，嵌入到石墨均热板内。将含有铝镁等合金的钎料加到取向石墨与金属块之间。然后，在氩气环境下，800-1000℃高温煅烧，冷却，获得金属嵌入到取向石墨的均热板。
4.根据权利要求2中所述的制备方法，其特征在于，所述热液热压升温速率为5-10℃/min，降温速率为1-5℃/min。
5.根据权利要求2中所述的制备方法，其特征在于，所述高导热介质材料的粒度尺寸小于1μm。
6.根据权利要求3中所述的制备方法，其特征在于，所述铝镁等合金的粒度尺寸小于1μm。
7.根据权利要求3中所述的制备方法，其特征在于，所述高温煅烧的升温速率为5-10℃/min。
8.根据权利要求3中所述的制备方法，其特征在于，所述高温煅烧的降温速率为1-5℃/min。
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