CN116046226A - MEMS pressure sensor for depth-to-width ratio etching - Google Patents
MEMS pressure sensor for depth-to-width ratio etching Download PDFInfo
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- CN116046226A CN116046226A CN202310021589.2A CN202310021589A CN116046226A CN 116046226 A CN116046226 A CN 116046226A CN 202310021589 A CN202310021589 A CN 202310021589A CN 116046226 A CN116046226 A CN 116046226A
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- 238000005530 etching Methods 0.000 title claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 61
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims description 13
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
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- 238000009530 blood pressure measurement Methods 0.000 abstract description 2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/225—Measuring circuits therefor
- G01L1/2262—Measuring circuits therefor involving simple electrical bridges
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/40—Engine management systems
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The utility model is applicable to the technical field of pressure monitoring, and provides an MEMS pressure sensor for depth-to-width ratio etching, which comprises a packaging shell, wherein a fixing hole is formed in the outer wall of one side of the packaging shell, a detection cylinder is fixed in the fixing hole, and the MEMS pressure sensor further comprises: the switching mechanism is arranged in the packaging shell and comprises a rotating disc, a driven disc and a plurality of detection columns, a notch is formed in the outer wall of the packaging shell, the rotating disc is rotatably arranged in the notch, the driven disc is rotatably arranged on the inner wall of the packaging shell, a plurality of connecting pieces used for the rotating disc and the driven disc are arranged between the rotating disc and the driven disc, a plurality of first round holes are formed in the round surface of the rotating disc, and a plurality of second round holes are formed in the round surface of the driven disc. The utility model can measure two or more pressure ranges, greatly reduces the size area of a chip, improves the integration level of a sensor, and simultaneously satisfies the sensitivity and the measuring range during low-pressure measurement.
Description
Technical Field
The utility model belongs to the technical field of pressure monitoring, and particularly relates to an MEMS pressure sensor for depth-to-width ratio etching.
Background
With the development of micro-electromechanical technology, due to the piezoresistive effect of the second-generation semiconductor material monocrystalline silicon and the good mechanical structure characteristics thereof, the MEMS silicon piezoresistive pressure sensor manufactured by the micro-electromechanical technology gradually becomes the main stream of the market. The device has the advantages of small volume, high precision, low cost and strong stability, and is widely applied to the fields of aerospace, petroleum, electric power and the like. The silicon piezoresistance type pressure sensor mainly comprises a sensitive diaphragm and piezoresistor strips, and the working principle is that when the sensitive diaphragm is subjected to the action of external pressure, the sensitive diaphragm is subjected to deflection deformation, and piezoresistors on the diaphragm change the resistivity of the sensitive diaphragm through the piezoresistance effect under the action of the deflection stress of the diaphragm, and a Wheatstone bridge circuit formed by the four piezoresistor strips converts the change of the resistivity into the change of output voltage.
The publication number is CN211205616U, china patent discloses a MEMS pressure sensor device, the device includes the sensor housing, be connected with a apron at the top of sensor housing, be equipped with a signal processing circuit board in the sensor housing, be equipped with an electric connector between signal processing circuit board and apron, electric connector extends the surface of apron through signal pin that draws forth, upper surface at signal processing circuit board is equipped with a MEMS pressure chip subassembly, electric connection between MEMS pressure chip subassembly and the signal processing circuit board, MEMS pressure chip is used for the pressure of the external medium of surveying of perception. The MEMS pressure sensor device provided by the utility model is easy to integrate circuits, small in structure, capable of meeting the detection requirement of a large range and high in data output precision.
The conventional MEMS pressure sensor has a deep cavity etched to form a sensitive diaphragm and 2 pairs of piezoresistors formed on the sensitive diaphragm by diffusion or ion implantation processes, and a wheatstone bridge connection is formed by a metal deposition process. For the traditional silicon piezoresistive pressure sensor, the measurement range and the structural sensitivity are closely related, and in structural design, in order to increase the measurement range or reduce the measurement range, the film thickness and the area of the sensitive film are required to be changed, so that the traditional pressure sensor chip is used for measuring a plurality of pressure ranges, a chip with a large range is often adopted to replace a chip with a small range so as to detect the pressure range with the small range, or the pressure chip with different structures is reprocessed through an MEMS technology so as to ensure. When the pressure chip with a large measuring range measures the micro pressure, the sensitivity of the whole sensor is very low, and the burden of a rear end interface circuit is increased.
Disclosure of Invention
The utility model provides an MEMS pressure sensor for depth-to-width ratio etching, which aims to solve the problem that one sensor can only detect one measuring range.
The utility model is realized in such a way, a MEMS pressure sensor for depth-to-width ratio etching comprises an encapsulation shell, wherein a fixing hole is formed in the outer wall of one side of the encapsulation shell, a detection cylinder is fixed in the fixing hole, and the MEMS pressure sensor further comprises:
the conversion mechanism is arranged in the packaging shell and comprises a rotating disc, a driven disc and a plurality of detection columns, the outer wall of the packaging shell is provided with a notch, the rotating disc is rotatably arranged in the notch, the driven disc is rotatably arranged on the inner wall of the packaging shell, a plurality of connecting pieces for the rotating disc and the driven disc are arranged between the rotating disc and the driven disc, a plurality of first round holes are formed in the round surface of the rotating disc, a plurality of second round holes are formed in the round surface of the driven disc, the first round holes are aligned with the second round holes one by one, the detection columns are uniformly arranged in the first round holes, the detection columns are of hollow structures, cavities are formed in the detection columns, sensitive membranes are arranged in the cavities, a plurality of first guide grooves are formed in the first round holes, a plurality of first guide strips which are integrated with the first guide strips are uniformly arranged in the first guide grooves, the detection columns are provided with reset components, and the reset components are arranged between the reset components and the driven disc;
the pushing assembly is arranged in the packaging shell and used for pushing the alignment detection column into the detection cylinder.
Furthermore, one side of the measuring range sensitive membrane, which faces the detection cylinder, is provided with silica gel.
Furthermore, one end of the detection column is a conical end, and an inner conical surface matched with the conical end is arranged in the detection cylinder.
Still further, be provided with on the conical end of detection post rather than the snap ring of integral structure and coaxial setting, set up rather than the annular groove of coaxial setting in the detection section of thick bamboo, annular groove and snap ring looks adaptation, be provided with O shape circle in the annular groove.
Still further, be provided with positioning mechanism in the encapsulation shell, positioning mechanism includes locating lever, second spring and two first fixed plates, two first fixed plates are upper and lower distribution and fix on the one side inner wall of encapsulation shell, two the slide opening has been seted up to first fixed plate, the locating lever sets up in the slide opening, the locating lever be fixed with rather than coaxial the being provided with the spacing ring, the second spring cover is established on the locating lever, the both ends of second spring are contacted with spacing ring and the first fixed plate that is located the bottom respectively, a plurality of hemisphere grooves have been seted up to the lateral wall of driven plate, and each hemisphere groove aligns one to one with each second round hole, the top of locating lever is dome structure.
Still further, reset assembly includes a plurality of positioning barrels, a plurality of solid fixed ring and first spring, the positioning barrel is fixed on the driven plate, and is individual the positioning barrel sets up with each second round hole is coaxial one to one, the positioning barrel cover is established on detecting the post, first spring cover is established on detecting the post, the both ends of first spring contact with positioning barrel and rolling disc respectively.
Still further, be provided with the circuit board in the encapsulation shell, be provided with chip, metal pin and data receiving terminal on the circuit board, metal pin and data receiving terminal all set up outside the encapsulation shell.
Still further, the promotion subassembly includes the second fixed plate, the both ends of second fixed plate are all fixed in the encapsulation shell, the through-hole has been seted up to the lateral wall of second fixed plate, the through-hole slides and is provided with the dwang, two rotation holes have been seted up to the both sides outer wall roll of encapsulation shell, rotate through the bearing in the rotation hole and install the dwang, two the dwang is fixed with a bent axle, be provided with the connecting rod between bent axle and the dwang, the both ends of connecting rod form normal running fit with bent axle and dwang respectively.
Further, the pushing rod and the detection cylinder are coaxially arranged.
Still further, one of them the cover is equipped with the dwang on the dwang, be equipped with a plurality of second guide bars rather than integrated into one piece structure on the dwang, the second guide way has been seted up to the dwang, second guide bar slidable mounting is in the second guide way, the one end of dwang is fixed with the limiting plate, the dwang cover is equipped with the third spring, the both ends of third spring contact with limiting plate and dwang respectively, the locating hole has been seted up on the dwang, be fixed with the locking lever with the locating hole adaptation on the encapsulation shell.
After adopting the structure, compared with the prior art, the utility model has the following advantages:
in the utility model, when the device is replaced, the rotating plate is pulled outwards, the third spring compresses, the rotating plate is separated from the locking rod, then the rotating plate is rotated, the rotating plate drives the rotating rod to rotate through the second guide bar, the rotating rod drives the crankshaft to rotate, the crankshaft drives the pushing rod to move backwards through the connecting rod, at the moment, the pushing rod cannot separate the aligned detection column, the first spring sleeved on the detection column resets, the first spring applies an acting force to the fixed ring, the detection column is separated from the detection cylinder, then the rotating disc is stirred, the rotating disc drives the driven disc to rotate through the connecting piece, the hemispherical groove on the driven disc pushes out the positioning rod, at the moment, the second spring is compressed, each second round hole is replaced, the second spring resets, the positioning rod is clamped into the hemispherical groove aligned with the second round hole after replacement, thus obvious click feeling can be judged, whether the positioning rod is aligned or not, the rotating plate is pulled outwards, the third spring compresses, the rotating plate is separated from the locking rod, then the rotating plate drives the rotating rod to rotate through the second guide bar, the rotating rod drives the rotating rod to rotate, the positioning rod to push the positioning rod to the positioning rod, and the positioning rod pushes the positioning rod to the positioning rod, and the positioning rod to move forward through the second round hole, and the positioning rod is compressed, and the positioning rod is aligned with the second round hole, and the positioning rod.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic diagram of the overall structure of the present utility model.
Fig. 2 is a first perspective internal perspective view of the present utility model.
Fig. 3 is a second perspective internal perspective view of the present utility model.
FIG. 4 is a perspective view of a test column according to the present utility model.
Fig. 5 is an internal side view schematic of the present utility model.
Fig. 6 is a cross-sectional view of the interior perspective A-A of fig. 5 from a first perspective in accordance with the present utility model.
FIG. 7 is a schematic diagram of a side cross-sectional structure of a cartridge and a cartridge of the present utility model.
Fig. 8 is a schematic perspective view of a circuit board according to the present utility model.
Fig. 9 is a schematic perspective view of a pushing assembly according to the present utility model.
Fig. 10 is a perspective view of a rotating plate according to the present utility model.
Reference numerals:
1. packaging the shell;
2. a data receiving end;
3. a conversion mechanism; 301. a rotating disc; 302. a connecting piece; 303. a positioning mechanism; 304. a driven plate; 305. a positioning cylinder; 306. a detection column; 307. a first spring; 308. a first guide bar; 309. a fixing ring; 310. a conical end; 311. a clasp; 312. hemispherical grooves; 313. a positioning rod; 314. a first fixing plate; 315. a limiting ring; 316. a second spring; 317. a range sensitive membrane; 318. silica gel;
4. a detection cylinder;
5. a circuit board;
6. a pushing assembly; 601. a push rod; 602. a second fixing plate; 603. a connecting rod; 604. a crankshaft; 605. a rotating lever; 606. a rotating plate; 607. positioning holes; 608. a third spring; 609. a second guide bar; 610. a limiting plate;
7. a metal pin;
8. a chip;
9. an O-ring.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
In order to effectively explain the embodiments of the present utility model, the embodiments of the present application are explained in detail below with reference to the figures.
Referring to fig. 1-10, an MEMS pressure sensor for etching with an aspect ratio includes an encapsulation shell 1, a fixing hole is provided on an outer wall of one side of the encapsulation shell 1, and a detection cylinder 4 is fixed in the fixing hole, and further includes:
the conversion mechanism 3, the conversion mechanism 3 is arranged in the packaging shell 1, the conversion mechanism 3 comprises a rotating disc 301, a driven disc 304 and a plurality of detection columns 306, the outer wall of the packaging shell 1 is provided with a notch, the rotating disc 301 is rotatably arranged in the notch, the driven disc 304 is rotatably arranged on the inner wall of the packaging shell 1, a plurality of connecting pieces 302 for the rotating disc 301 and the driven disc 304 are arranged between the rotating disc 301 and the driven disc 304, a plurality of first round holes are formed in the round surface of the rotating disc 301, a plurality of second round holes are formed in the round surface of the driven disc 304, each first round hole is aligned with each second round hole one to one, each detection column 306 is uniformly arranged in each first round hole, the detection columns 306 are of hollow structures, cavities are formed in the detection columns 306, range sensitive membranes 317 are arranged in the cavities, supplementary explanation is carried out here, and the specifications of each range sensitive membrane 317 are inconsistent;
a plurality of first guide grooves are formed in the first round hole, a plurality of first guide strips 308 which are integrated with the first guide grooves are formed in the outer side wall of the detection column 306, each first guide strip 308 is uniformly arranged in each first guide groove, a reset component is arranged on the detection column 306, and the reset component is positioned between the rotating disc 301 and the driven disc 304;
the pushing component 6, the pushing component 6 is arranged in the packaging shell 1, and the pushing component 6 is used for pushing the alignment detection column 306 into the detection barrel 4.
Preferably, the side of the range sensitive membrane 317 facing the detection cylinder 4 is provided with a silica gel 318 for protecting the range sensitive membrane 317.
Preferably, one end of the detecting post 306 is a conical end 310, and an inner conical surface matched with the conical end 310 is arranged in the detecting cylinder 4, so that the detecting post 306 is conveniently inserted into the detecting cylinder 4 to perform auxiliary positioning.
Preferably, the conical end 310 of the detection column 306 is provided with a clamping ring 311 which is of an integrated structure and is coaxially arranged, the detection cylinder 4 is internally provided with a circular ring groove which is coaxially arranged with the detection cylinder, the circular ring groove is matched with the clamping ring 311, an O-shaped ring 9 is arranged in the circular ring groove, when the detection column 306 is inserted into the detection cylinder 4, the clamping ring 311 is clamped into the circular ring groove, the O-shaped ring 9 is extruded and deformed, and a gap is filled, so that sealing is realized.
Preferably, the positioning mechanism 303 is disposed in the package 1, the positioning mechanism 303 includes a positioning rod 313, a second spring 316 and two first fixing plates 314, the two first fixing plates 314 are vertically distributed and fixed on an inner wall of one side of the package 1, the two first fixing plates 314 are provided with sliding holes, the positioning rod 313 is disposed in the sliding holes, a limiting ring 315 is coaxially disposed on the positioning rod 313, the second spring 316 is sleeved on the positioning rod 313, two ends of the second spring 316 are respectively contacted with the limiting ring 315 and the first fixing plates 314 disposed at the bottom, a plurality of hemispherical grooves 312 are disposed on an outer side wall of the driven plate 304, each hemispherical groove 312 is aligned with each second round hole, the top of the positioning rod 313 is in a dome structure, the hemispherical grooves 312 on the driven plate 304 are pushed out of the positioning rod 313, at this time, the second spring 316 is compressed, each second round hole is replaced, the second spring 316 is reset, and the positioning rod 313 is clamped into the hemispherical grooves 312 aligned with the replaced second round holes, so that a clear click feeling can be obtained, and whether alignment can be judged.
Preferably, the reset assembly comprises a plurality of positioning cylinders 305, a plurality of fixing rings 309 and a first spring 307, wherein the positioning cylinders 305 are fixed on the driven plate 304, each positioning cylinder 305 and each second round hole are coaxially arranged one by one, the positioning cylinders 305 are sleeved on the detection column 306, the first spring 307 is sleeved on the detection column 306, and two ends of the first spring 307 are respectively contacted with the positioning cylinders 305 and the rotating plate 301.
Preferably, a circuit board 5 is arranged in the package 1, a chip 8, a metal pin 7 and a data receiving end 2 are arranged on the circuit board 5, and the metal pin 7 and the data receiving end 2 are all arranged outside the package 1.
Preferably, the pushing component 6 comprises a second fixed plate 602, two ends of the second fixed plate 602 are fixed in the packaging shell 1, a through hole is formed in the outer side wall of the second fixed plate 602, a pushing rod 601 is arranged in the through hole in a sliding mode, two rotating holes are formed in the outer wall of two sides of the packaging shell 1 in a rolling mode, a rotating rod 605 is rotatably installed in the rotating holes through bearings, a crankshaft 604 is fixed to the two rotating rods 605, a connecting rod 603 is arranged between the crankshaft 604 and the pushing rod 601, two ends of the connecting rod 603 are respectively in rotary fit with the crankshaft 604 and the pushing rod 601, the pushing rod 601 and the detecting cylinder 4 are coaxially arranged, a rotating plate 606 is sleeved on one rotating rod 605, a plurality of second guide strips 609 which are integrally formed with the rotating rod 605 are arranged on the rotating rod 605, a second guide groove is formed in the rotating rod 606, the second guide strips 609 are slidably installed in the second guide groove, a limiting plate 610 is fixed to one end of the rotating rod 605, a third spring 608 is sleeved on the rotating rod, two ends of the third spring 605 are respectively in contact with the limiting plate 610 and the rotating plate 606, a locating hole 607 is formed in the rotating plate 606, the rotating rod 606 is respectively, the packaging shell 1 is sleeved on the rotating rod 606 and the locating plate 607, the rotating rod 606 is in rotary rod is in rotary fit with the rotating rod 606, the locating plate 606 is separated from the rotating rod 606, the rotating rod 606 is located in the rotating rod 606, and the rotating rod 606 is separated from the rotating rod 606, and the rotating rod 606 is in the rotating rod 606, and the rotating rod 606 is separated from the rotating rod by the rotating rod, and the rotating rod 606 and the rotating rod 601.
In summary, by means of the above technical solution of the present utility model: when the rotating plate 606 is replaced, the third spring 608 is pulled outwards to compress, the rotating plate 606 is separated from the locking rod, then the rotating plate 606 is rotated, the rotating plate 606 drives the rotating rod 605 to rotate through the second guide strip 609, the rotating rod 605 drives the crankshaft 604 to rotate, the crankshaft 604 drives the pushing rod 601 to move backwards through the connecting rod 603, at the moment, the pushing rod 601 cannot separate the aligned detection post 306, the first spring 307 sleeved on the detection post 306 is reset, the first spring 307 applies force to the fixing ring 309 to separate the detection post 306 from the detection cylinder 4, then the rotating disc 301 is stirred, the rotating disc 301 drives the driven disc 304 to rotate through the connecting piece 302, the hemispherical groove 312 on the driven disc 304 pushes out the positioning rod 313, at the moment, the second spring 316 is compressed, each second round hole is replaced, the second spring 316 is reset, the positioning rod 313 is clamped into the hemispherical groove 312 aligned with the replaced second round hole, so that obvious clamping feeling can be achieved, whether the positioning rod is aligned or not can be judged, the rotating plate 606 is pulled outwards, the third spring 608 is compressed, the rotating plate 606 is separated from the locking rod, then the rotating plate 606 is rotated, the rotating plate 606 drives the rotating rod 605 to rotate through the second guide strip 609, the rotating rod 605 drives the crankshaft 604 to rotate, the crankshaft 604 drives the pushing rod 601 to move forwards through the connecting rod 603, the detection column 306 is pushed into the detection cylinder 4, replacement is completed, when the detection column 306 is inserted into the detection cylinder 4, the clamping ring 311 is clamped into the annular groove, the O-shaped ring 9 is extruded and deformed, the gap is filled, sealing is achieved, two or more pressure range measurements are conducted, the chip size area is greatly reduced, the integration degree of the sensor is improved, and the sensitivity and the measuring range during low-pressure measurement are met.
The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," "fixed," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;
secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. The MEMS pressure sensor for depth-to-width ratio etching comprises an encapsulation shell (1), and is characterized in that a fixing hole is formed in the outer wall of one side of the encapsulation shell (1), a detection cylinder (4) is fixed in the fixing hole, and the MEMS pressure sensor further comprises:
the switching mechanism (3), the switching mechanism (3) is arranged in the packaging shell (1), the switching mechanism (3) comprises a rotating disc (301), a driven disc (304) and a plurality of detection columns (306), the outer wall of the packaging shell (1) is provided with a notch, the rotating disc (301) is rotatably arranged in the notch, the driven disc (304) is rotatably arranged on the inner wall of the packaging shell (1), a plurality of connecting pieces (302) for the rotating disc (301) and the driven disc (304) are arranged between the rotating disc (301) and the driven disc (304), the circular surface of the rotating disc (301) is provided with a plurality of first circular holes, the circular surface of the driven disc (304) is provided with a plurality of second circular holes, each first circular hole is aligned with each second circular hole one to one, each detection column (306) is uniformly arranged in each first circular hole, the detection columns (306) are hollow structures, cavities are arranged in the detection columns (306), sensitive membranes (317) are arranged in the cavities, a plurality of first guide strips (306) are arranged in the cavities, a plurality of guide strips (308) are arranged in the first guide strips (308), and a reset assembly (308) is arranged on the outer side of the guide strips, and the guide strips (308) are arranged on the first guide strips and are arranged on the first guide strips;
the pushing assembly (6) is arranged in the packaging shell (1), and the pushing assembly (6) is used for pushing the alignment detection column (306) into the detection barrel (4).
2. A MEMS pressure sensor for aspect ratio etching according to claim 1, characterized in that the side of the span-sensitive membrane (317) facing the detection cylinder (4) is provided with a silica gel (318).
3. A MEMS pressure sensor for aspect ratio etching according to claim 1, wherein the detection post (306) has a conical end (310) at one end, and the detection cylinder (4) has an inner conical surface configured with the conical end (310).
4. A MEMS pressure sensor for etching an aspect ratio according to claim 3, wherein a conical end (310) of the detecting column (306) is provided with a snap ring (311) which is integrally and coaxially arranged with the conical end, a circular ring groove coaxially arranged with the detecting column is arranged in the detecting cylinder (4), the circular ring groove is matched with the snap ring (311), and an O-ring (9) is arranged in the circular ring groove.
5. The MEMS pressure sensor for etching of the aspect ratio of claim 1, wherein a positioning mechanism (303) is disposed in the package (1), the positioning mechanism (303) includes a positioning rod (313), a second spring (316) and two first fixing plates (314), the two first fixing plates (314) are fixed on an inner wall of one side of the package (1) in an up-down distribution manner, sliding holes are formed in the two first fixing plates (314), the positioning rod (313) is disposed in the sliding holes, a limiting ring (315) is coaxially disposed on the positioning rod (313) and is sleeved on the positioning rod (313), two ends of the second spring (316) are respectively contacted with the limiting ring (315) and the first fixing plates (314) located at the bottom, a plurality of hemispherical grooves (312) are formed in an outer side wall of the driven plate (304), each hemispherical groove (312) is aligned with each second round hole, and the top of the positioning rod (313) is of a one-to-one dome structure.
6. The MEMS pressure sensor for aspect ratio etching as recited in claim 1, wherein the reset assembly comprises a plurality of positioning cylinders (305), a plurality of fixing rings (309), and first springs (307), the positioning cylinders (305) are fixed on the driven plate (304), each positioning cylinder (305) is coaxially arranged one-to-one with each second round hole, the positioning cylinders (305) are sleeved on the detection posts (306), the first springs (307) are sleeved on the detection posts (306), and two ends of each first spring (307) are respectively contacted with the positioning cylinders (305) and the rotating plate (301).
7. The MEMS pressure sensor for etching of the aspect ratio of claim 1, wherein a circuit board (5) is disposed in the package (1), a chip (8), a metal pin (7) and a data receiving end (2) are disposed on the circuit board (5), and the metal pin (7) and the data receiving end (2) are disposed outside the package (1).
8. The MEMS pressure sensor for depth-to-width ratio etching according to claim 1, wherein the pushing component (6) comprises a second fixing plate (602), two ends of the second fixing plate (602) are both fixed in the packaging shell (1), through holes are formed in the outer side walls of the second fixing plate (602), pushing rods (601) are slidably arranged in the through holes, two rotating holes are formed in two side outer wall rolls of the packaging shell (1), a rotating rod (605) is rotatably arranged in each rotating hole through a bearing, a crankshaft (604) is fixed to two rotating rods (605), a connecting rod (603) is arranged between each crankshaft (604) and each pushing rod (601), and two ends of each connecting rod (603) are respectively in rotating fit with the corresponding crankshaft (604) and each pushing rod (601).
9. MEMS pressure sensor for etching according to claim 8, characterized in that the push rod (601) is arranged coaxially to the detection cylinder (4).
10. The MEMS pressure sensor for etching the depth-to-width ratio according to claim 8, wherein one rotating rod (605) is sleeved with a rotating plate (606), a plurality of second guide strips (609) which are integrated with the rotating rod (605) are arranged on the rotating rod (605), the rotating plate (606) is provided with a second guide groove, the second guide strips (609) are slidably arranged in the second guide groove, one end of the rotating rod (605) is fixedly provided with a limiting plate (610), the rotating rod (605) is sleeved with a third spring (608), two ends of the third spring (608) are respectively contacted with the limiting plate (610) and the rotating plate (606), the rotating plate (606) is provided with a positioning hole (607), and the packaging shell (1) is fixedly provided with a locking rod which is matched with the positioning hole (607).
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