CN116031196A - Substrate leveling structure and leveling device - Google Patents

Abstract

The invention provides a substrate leveling structure and a leveling device, wherein the substrate leveling structure comprises a fixing component, a leveling plate and a positioning component, the fixing component is provided with a first abutting surface, the leveling plate is provided with a second abutting surface, the first abutting surface and/or the second abutting surface are/is provided with a spherical surface, the second abutting surface abuts against the first abutting surface, the leveling plate is rotatably arranged on the fixing component through the second abutting surface and the first abutting surface, one end of the positioning component is fixedly arranged on the fixing component, the other end of the positioning component is movably arranged on the leveling plate, and the positioning component is used for fixing the leveling plate. According to the substrate leveling structure, the leveling plate is rotatably arranged on the fixing assembly through the first abutting surface and the second abutting surface, so that the leveling plate can be adjusted in the spherical surface range, the full-range adjustment can be realized, the rotation angle and the azimuth limitation degree are small, and the leveling plate can keep a fixed angle through the positioning assembly.

Description

Substrate leveling structure and leveling device

Technical Field

The invention relates to the technical field of semiconductor processing, in particular to a substrate leveling structure and a leveling device.

Background

Semiconductor substrate processing apparatus is used to process semiconductors by techniques including: physical Vapor Deposition (PVD), chemical Vapor Deposition (CVD), plasma Enhanced Chemical Vapor Deposition (PECVD), atomic Layer Deposition (ALD), plasma Enhanced Atomic Layer Deposition (PEALD), pulse Deposition Layer (PDL), molecular Layer Deposition (MLD), plasma Enhanced Pulse Deposition Layer (PEPDL) processing, etching, resist removal, and the like. The products after technical treatment are often found to have deposition or etching non-uniformities. Currently, the non-uniformity is usually improved by rotating the susceptor or equalizing the heater, but this problem is not effectively solved.

Chinese patent application publication No. CN110997976a discloses a showerhead tilting mechanism that provides coarse and fine adjustments by differential bolts to adjust the tilt and gap of the faceplate of the showerhead module compared to the faceplate in the semiconductor substrate processing apparatus. Under the condition of the same gap, the angle adjustment in the mode takes the position of the differential bolt in the space as a rotating point, and the rotating point is deviated from the axis of the panel of the spray head module, so that the limited degree of the rotatable angle and the rotatable azimuth is larger, and the use requirement of all-dimensional adjustment cannot be met.

Disclosure of Invention

The invention aims to provide a substrate leveling structure and a leveling device, which are used for solving the problems that the rotation angle and the azimuth are limited to a large extent and cannot be adjusted in all directions.

In order to achieve the above object, the present invention provides a substrate leveling structure, including a fixing assembly, a leveling plate and a positioning assembly; the fixing assembly is provided with a first abutting surface, the leveling plate is provided with a second abutting surface, the first abutting surface and/or the second abutting surface are/is provided with a spherical surface, the second abutting surface abuts against the first abutting surface, and the leveling plate is rotatably arranged on the fixing assembly through the second abutting surface and the first abutting surface; one end of the positioning component is fixedly arranged on the fixing component, the other end of the positioning component is movably arranged on the leveling plate, and the positioning component is used for fixing the leveling plate.

The substrate leveling structure has the beneficial effects that: the fixed subassembly is equipped with first butt face, the setting plate is equipped with the second butt face, through first butt face with the second butt face makes the setting plate rotatable set up in the fixed subassembly, just first butt face and/or the second butt face sets up to the sphere, makes the setting plate can adjust in the scope of sphere, can all-round adjustment, rotation angle and the limited degree in position are little, the one end of locating component is fixed set up in fixed subassembly, the other end activity of locating component set up in the setting plate, through locating component makes the setting plate is fixed to on the locating component, make the setting plate can keep fixed angle.

In one possible solution, the fixing assembly comprises a fixing plate and a plurality of rollers; the rollers are arranged on the fixed plate in a sliding or rotating mode, and the tangent planes of the rollers form the first abutting surface. The beneficial effects are that: the first abutting surface is formed by the tangential surfaces of the rollers, so that the first abutting surface is spherical, the occupied space during adjustment is convenient to reduce, and the processing is easy.

In one possible solution, at least one of the fixing plate and the leveling plate is provided with a plurality of sliding grooves, and each roller is correspondingly arranged on each sliding groove. The beneficial effects are that: the sliding groove is arranged to limit or fix the roller, so that dislocation of the roller is avoided, and stability is improved.

In one possible scheme, the fixing plate is arranged on a first plane, and the sections of the sliding grooves pass through the sphere center of the spherical surface and are perpendicular to the first plane. The beneficial effects are that: through the section that the spout place all passes through the sphere center of sphere, and with first plane sets up perpendicularly, makes the leveling board can only be followed the direction that the spout prescribes a limit to can not produce the removal component in the direction that is on a parallel with first plane, avoid the leveling board with take place distortion, dislocation between the fixed subassembly.

In one possible solution, the positioning assembly comprises a fixing piece and a plurality of ejector rods; the fixing piece comprises a fixing part, a connecting part and a supporting part; the fixing part is fixedly arranged on the fixing assembly, the connecting part is fixedly arranged on the fixing part, the supporting part is fixedly arranged on the connecting part, the supporting part extends to one side of the leveling plate, and the supporting part is provided with a plurality of guide holes; each ejector rod is respectively and adjustably arranged in each guide hole, and one end of each ejector rod is abutted to the leveling plate. The beneficial effects are that: the fixing part is used for fixing the connecting part, the supporting part is used for fixing the supporting part, a plurality of guide holes are formed in the supporting part, the supporting part extends to one side of the leveling plate, the supporting rods are respectively arranged in the guide holes in an adjustable mode, one ends of the supporting rods are respectively abutted to the leveling plate, and therefore the leveling plate is fixed in position and angle after adjustment and convenient to use.

In one possible solution, the guide hole is a threaded hole, and the ejector rod is a jackscrew. The beneficial effects are that: through the jackscrew set up in threaded hole, along with the rotation of jackscrew can be adjusted the jackscrew is apart from the distance of leveling board, through a plurality of the combined action of jackscrew is to the leveling board is fixed, is convenient for adjust.

In one possible solution, the device further comprises a bellows; the two ends of the corrugated pipe are fixedly arranged on the fixing assembly and the leveling plate respectively. The beneficial effects are that: the corrugated pipe is arranged to enable the leveling plate and the fixing assembly to be in a sealing state, so that other structures can be fixed conveniently.

The invention also provides a leveling device, which comprises a spraying assembly and the substrate leveling structure in any one of the feasible schemes; the spraying assembly is arranged on the substrate leveling structure, the substrate leveling structure is used for adjusting the angle of the spraying assembly, and the spraying assembly is used for coating. The beneficial effects are that: the angle of the spraying assembly is adjusted through the substrate leveling structure, so that the angle of the spraying assembly can be adjusted conveniently according to the requirement, and the flatness of the coating can be controlled conveniently.

In one possible solution, the centre of sphere of the sphere is located at the side of the spray assembly remote from the fixed assembly. The beneficial effects are that: the arrangement is such that the rotational center of the spray assembly is located on the side of the spray assembly so that the space occupied when the spray assembly is adjusted is minimized.

In one possible solution, the spray assembly is detachably disposed on the substrate leveling structure. The beneficial effects are that: the arrangement is convenient for replacing the spraying assembly and adjusting the relative position of the spraying assembly compared with the substrate leveling structure.

Drawings

FIG. 1 is a schematic perspective view of a substrate leveling structure according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of FIG. 1;

FIG. 3 is an enlarged schematic view of a portion of the roller, fixed plate and leveling plate of FIG. 2;

FIG. 4 is a schematic perspective view of the fixing plate in FIG. 1;

FIG. 5 is a schematic perspective view of the leveling plate of FIG. 1;

FIG. 6 is a schematic cross-sectional view of a leveling structure according to another embodiment of the present invention;

fig. 7 is a schematic view of the location structure of the center of sphere and the spray assembly of fig. 6.

Reference numerals in the drawings:

1. a fixing assembly; 101. a fixing plate; 102. a roller; 103. a chute;

2. leveling plates;

3. a positioning assembly; 301. a fixing member; 302. a push rod;

4. a bellows;

5. a target structure;

6. a spray assembly;

7. and a substrate leveling structure.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.

Aiming at the problems existing in the prior art, the embodiment of the invention provides a substrate leveling structure.

Fig. 1 is a schematic perspective view of a substrate leveling structure according to an embodiment of the present invention, fig. 2 is a schematic cross-sectional structure of fig. 1, fig. 3 is a schematic enlarged partial structure of the roller, the fixing plate and the leveling plate of fig. 2, fig. 4 is a schematic perspective view of the fixing plate of fig. 1, and fig. 5 is a schematic perspective view of the leveling plate of fig. 1.

In some embodiments of the present invention, referring to fig. 1, 4 and 5, the fixing assembly 1 includes a fixing assembly 1, a leveling plate 2 and a positioning assembly 3, the fixing assembly 1 is provided with a first abutting surface, the leveling plate 2 is provided with a second abutting surface, the first abutting surface and/or the second abutting surface are/is provided with a spherical surface, the second abutting surface abuts against the first abutting surface, the leveling plate 2 is rotatably arranged on the fixing assembly 1 through the second abutting surface and the first abutting surface, one end of the positioning assembly 3 is fixedly arranged on the fixing assembly 1, the other end of the positioning assembly 3 is movably arranged on the leveling plate 2, and the positioning assembly 3 is used for fixing the leveling plate 2.

In some embodiments of the present invention, the fixing component 1 is horizontally disposed, the fixing component 1 is disposed in a circular shape, the upper side surface of the fixing component 1 is provided with a protrusion, the first abutment surface is disposed on the outer side surface of the protrusion, the leveling plate 2 is disposed on the upper side of the fixing component 1 through the positioning component 3, the outer edge of the leveling plate 2 extends to the outer side of the protrusion, the inner surface of the outer edge of the leveling plate 2 is the second abutment surface, the first abutment surface and/or the second abutment surface are/is disposed in a spherical surface, and the first abutment surface and the second abutment surface are mutually abutted. When in use, the adjusting plate 2 is in an adjustable state by adjusting the fixing component 1, and then the adjusting plate can be manually rotated to achieve the purpose of angle adjustment, and the rotation can comprise: rotation in the direction in the horizontal plane, rotation in the vertical plane, and rotation in the superimposed vertical in-plane direction and in-plane direction. By the arrangement, the fixing assembly 1 and the leveling plate 2 form a ball cage type universal joint structure, and direction adjustment is facilitated.

Furthermore, the fixing member 1 may be provided in a square, a rectangle, a polygon, or other shapes. Normally, the fixing component 1 is provided with a first through hole, the leveling plate 2 is provided with a second through hole, the first through hole is used for avoiding a target structure 5 acted by the substrate leveling structure, the second through hole is used for enabling the target structure 5 to extend to the upper side of the leveling plate 2, and the target structure 5 is fixed on the leveling plate 2, so that the positioning component 3 can fix the angle of the leveling plate 2 by acting on the target structure 5, and the positioning component 3 and the leveling plate 2 do not need to act directly.

The first through hole and the second through hole may be provided in a central region of the fixing unit 1 and the leveling plate 2, or may be provided in a region of the fixing unit 1 and the leveling plate 2 that is offset from the center.

The leveling plate 2 is set to petal shape, each petal circumference of the leveling plate 2 evenly sets up, the medial surface of each petal outer edge forms the second butt face, sets up like this and is convenient for provide the installation space of locating component 3, wholly reduces the size of base plate leveling structure, also be convenient for simultaneously reduce the weight of locating component 3.

It should be noted that the leveling plate 2 may also be configured as a disc, where the outer edge of the disc extends downward to the protrusion of the fixing component 1, and the inner surface of the outer edge of the disc is the second abutment surface. The leveling plates may also be provided in other shapes.

In addition, the periphery side of the fixing component 1 is provided with a plurality of bolts for fixing, so that the substrate leveling structure and the external structure can be conveniently fixed.

It should be noted that, in actual setting, an elongated tubular structure may be directly disposed at the second through hole, the top end of the positioning component 3 is directly disposed on the elongated tubular structure, and the target structure 5 is disposed in the elongated tubular structure, so as to facilitate adjustment of the height of the target structure 5 on the leveling board 2.

In practical use, the top of the leveling plate 2 is horizontally arranged and can be quantitatively adjusted by a level gauge or other measuring instruments.

In some embodiments of the invention, referring to fig. 1 to 3, the fixing assembly 1 comprises a fixing plate 101 and a plurality of rollers 102; the rollers 102 are slidably or rotatably disposed on the fixed plate 101, and tangential surfaces of the rollers 102 form the first contact surface.

In some embodiments of the present invention, the fixing plate 101 is horizontally disposed, the rollers 102 are spherical or columnar, the number of the rollers 102 is equal to the number of petals, each roller 102 is uniformly distributed between the leveling plate 2 and the fixing plate 101, the rollers 102 are fixed by the clamping force of the leveling plate 2 and the fixing plate 101, and the outer tangential surface of each roller 102 forms the first abutting surface.

The outer side surface of the protrusion of the fixing plate 101 is configured to be a spherical surface, so that the position of the center of the sphere where the spherical surface is located does not move even if the position of the roller 102 moves during adjustment.

Here, the first abutment surface is formed by the outer surfaces of the rollers 102, it is worth mentioning that the above-mentioned spherical adjustment effect can be achieved by merely providing the fixing plate 101 and the leveling plate 2, and setting one of the first abutment surface and the second abutment surface as a spherical surface and the other as a conical surface, or setting both the first abutment surface and the second abutment surface as a spherical surface.

In some embodiments of the present invention, referring to fig. 1 to 4, at least one of the fixing plate 101 and the leveling plate 2 is provided with a plurality of sliding grooves 103, and each of the rollers 102 is correspondingly disposed to each of the sliding grooves 103. The fixing plate 101 is disposed on a first plane, and the cross section of each chute 103 passes through the center of the sphere and is perpendicular to the first plane.

In some embodiments of the present invention, the fixed plate 101 and the leveling plate 2 are provided with sliding grooves 103, the number of the sliding grooves 103 is equal to that of the rollers 102, the sliding grooves 103 on the fixed plate 101 are slightly larger than that of the rollers 102, the sliding grooves 103 on the fixed plate 101 enable the rollers 102 to rotate and/or slightly move substantially therein, the sliding grooves 103 on the leveling plate 2 extend from the bottom surface to the inner top surface of the leveling plate 2, the sliding grooves 103 on the leveling plate 2 are located on the second abutting surface, the first plane is the horizontal plane, the sections of the sliding grooves 103 on the leveling plates 2 are respectively located on different vertical planes, and the sliding grooves 103 on the leveling plate 2 are arranged obliquely in space compared with the horizontal plane. The roller 102 is limited by the sliding groove 103 on the fixing plate 101, and the rotation of the leveling plate 2 is limited by the interaction of the sliding groove 103 on the leveling plate 2 and the roller 102, so that the normal use of the substrate leveling structure is ensured.

It should be noted that, when the roller 102 is spherical, the leveling plate 2 is initially disposed parallel to the fixing component 1, and after the angle of the leveling plate 2 is adjusted, the plane of the leveling plate 2 is not parallel to the plane of the fixing component 1, and at this time, the leveling plate 2 and the fixing component 1 can be relatively rotated by adjusting the leveling plate along any direction parallel to the plane of the leveling plate 2.

In some embodiments, the profile of the chute 103 may be inclined, that is, when the roller 102 moves relatively in the chute 103, the leveling plate 2 and the fixing assembly 1 rotate relatively vertically and horizontally at the same time.

In some embodiments, the chute 103 may be disposed on the leveling plate 2, the fixing plate 101, and the chute 103 may be disposed on both the leveling plate 2 and the fixing plate 101.

It should be noted that, in general, the fixing assembly 1 and the leveling plate 2 are disposed generally vertically, the cross section of the chute at the first abutment surface or/and the second abutment surface is also disposed generally vertically, and the length of the chute on the fixing plate 101 does not need to be too long due to the gravity action of the roller 102, so that the downward deflection of the roller 102 can be avoided.

In some embodiments of the present invention, referring to fig. 1 to 3, the positioning assembly 3 includes a fixing member 301 and a plurality of push rods 302; the fixing member 301 includes a fixing portion, a connecting portion, and a supporting portion; the fixing part is fixedly arranged on the fixing assembly 1, the connecting part is fixedly arranged on the fixing part, the supporting part is fixedly arranged on the connecting part, the supporting part extends to one side of the leveling plate 2, and the supporting part is provided with a plurality of guide holes; each ejector rod 302 is respectively and adjustably disposed in each guide hole, and one end of each ejector rod 302 abuts against the leveling plate 2. The guide hole is a threaded hole, and the ejector rod 302 is a jackscrew.

In some embodiments of the present invention, the fixing portion of the fixing element 301 is fixedly disposed on the upper surface of the fixing plate 101, the connecting portion is fixedly disposed on the fixing portion, the supporting portion is fixedly disposed on the connecting portion, the supporting portion is circular and extends to the upper side of the second through hole, the supporting portion and the second through hole are coaxially disposed, the supporting portion is provided with a plurality of guide holes, the plurality of ejector pins 302 are respectively disposed in the guide holes, the guide holes are threaded holes, the ejector pins 302 are ejector pins, one end of each ejector pin is initially abutted against a side wall of the leveling plate 2 or the target structure 5, so that the leveling plate 2 maintains a current angle, when adjustment is required, each ejector pin is rotated to enable the leveling plate 2 to be in an adjustable state, and then each ejector pin is adjusted to enable the ejector pin to abut against the side wall of the leveling plate 2 or the target structure 5 to be fixed again after the leveling plate 2 is adjusted to a required angle.

It is worth to say that, the direction of guiding hole can be vertical or level setting, and the inboard end of jackscrew with target structure 5 butt realizes fixing when the level setting, the bottom of jackscrew with the upside butt of leveling board 2 realizes fixing when vertical setting.

In addition, the ejector rod 302 may be a combination of a sliding rod and a locking structure, and may be capable of adjusting the front-rear position and fixing at a certain position.

In some embodiments, the fixing assembly 3 may also be provided in the form of: the bottom end fixing of mounting set up in on the fixed plate 101, the top of mounting extends to the second through-hole upside, just the top of mounting sets up to hollow globular structure, be in simultaneously the top of the extension pipe portion structure of leveling board set up in the globular structure of the cavity globular structure adaptation of mounting sets up locking structure on the cavity globular structure of mounting simultaneously and is used for the location, like this can the real phase the angular adjustment and the location of leveling board 2.

In some embodiments of the invention, referring to fig. 1 and 2, further comprising a bellows 4; the two ends of the corrugated pipe 4 are respectively fixedly arranged on the fixing assembly 1 and the leveling plate 2.

In some embodiments of the present invention, two ends of the bellows 4 are respectively fixed on the upper side surface of the fixing plate 101 and the lower side surface of the leveling plate 2, so that a sealing structure is formed at the first through hole and the second through hole through the bellows 4, and sealing is facilitated when the substrate leveling structure is used for installing an external structure.

Fig. 6 is a schematic cross-sectional view of a leveling structure according to another embodiment of the present invention, and fig. 7 is a schematic view of the position of the center of sphere and the spray assembly of fig. 6.

In some embodiments of the present invention, referring to fig. 6 and 7, a substrate leveling structure as described in any of the embodiments above and including a spray assembly 6; the spraying assembly 6 is arranged on the substrate leveling structure, the substrate leveling structure is used for adjusting the angle of the spraying assembly 6, and the spraying assembly 6 is used for coating.

In some embodiments of the present invention, the target structure is the spray assembly 6, the spray assembly 6 is fixed on the leveling plate through the first through hole, the spray assembly 6 at the second through hole is provided with a stepped surface, the spray assembly 6 is fixed on the leveling plate through a bolt arranged at the stepped surface, and the spray assembly 6 is used for coating a wafer. When the leveling device is used, a wafer is placed on the lower side of the spraying assembly 6 by fixing the leveling device on an external structure, then the spraying assembly 6 is started to carry out film coating, and the angle of the spraying assembly 6 compared with the wafer can be adjusted as required before film coating, so that the flatness of the film coating is ensured.

In addition, the device can be fixed in a hoisting mode in real time, and can also be used in any hoisting structure needing leveling.

The spray assembly 6 may be a physical vapor deposition device, a chemical vapor deposition device, a plasma enhanced pulse deposition device, or the like. The shower assembly 6 may also be a lithographic apparatus, an etching apparatus, a cleaning apparatus, an ion implantation apparatus, or the like.

In some embodiments of the invention, referring to fig. 6 and 7, the center of the sphere is located on the side of the spray assembly 6 remote from the fixed assembly.

In some embodiments of the present invention, the spherical center of the spherical surface is located at the lower side surface of the spray assembly 6, so that the distance between the center of the spray assembly 6 and the wafer is not changed when the spray assembly 6 is adjusted, and it is ensured that the spray effect before and after adjustment is the same without changing other conditions.

It is worth to say that, when guaranteeing that spray assembly 6 with the relative height of leveling board does not change, the sphere center of sphere set up in spray assembly 6 is kept away from fixed subassembly's side, can not change in the position of sphere center when rotating.

In addition, the position of the sphere center can be arranged in any plane of the spray assembly 6 in actual arrangement, and the space required in rotation can be correspondingly changed according to different arrangement positions.

In some embodiments of the invention, referring to fig. 6 and 7, the spray assembly 6 is removably disposed in the substrate leveling structure. In some embodiments of the present invention, this arrangement facilitates maintenance, replacement of the spray assembly 6, and adjustment of the height of the spray assembly 6.

While embodiments of the present invention have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (10)

1. The substrate leveling structure is characterized by comprising a fixing assembly, a leveling plate and a positioning assembly;

the fixing assembly is provided with a first abutting surface, the leveling plate is provided with a second abutting surface, the first abutting surface and/or the second abutting surface are/is provided with a spherical surface, the second abutting surface abuts against the first abutting surface, and the leveling plate is rotatably arranged on the fixing assembly through the second abutting surface and the first abutting surface;

one end of the positioning component is fixedly arranged on the fixing component, the other end of the positioning component is movably arranged on the leveling plate, and the positioning component is used for fixing the leveling plate.

2. The substrate leveling structure of claim 1, wherein the securing assembly comprises a securing plate and a plurality of rollers;

the rollers are arranged on the fixed plate in a sliding or rotating mode, and the tangent planes of the rollers form the first abutting surface.

3. The base plate leveling structure according to claim 2, wherein at least one of the fixing plate and the leveling plate is provided with a plurality of sliding grooves, and each roller is correspondingly arranged on each sliding groove.

4. The substrate leveling structure according to claim 3, wherein the fixing plate is disposed on a first plane, and the cross section of each chute passes through the center of the sphere and is perpendicular to the first plane.

5. The substrate leveling structure of claim 1 or 2, wherein the positioning assembly comprises a fixture and a plurality of lift pins;

the fixing piece comprises a fixing part, a connecting part and a supporting part;

the fixing part is fixedly arranged on the fixing assembly, the connecting part is fixedly arranged on the fixing part, the supporting part is fixedly arranged on the connecting part, the supporting part extends to one side of the leveling plate, and the supporting part is provided with a plurality of guide holes;

each ejector rod is respectively and adjustably arranged in each guide hole, and one end of each ejector rod is abutted to the leveling plate.

6. The substrate leveling structure of claim 5, wherein the guide holes are threaded holes and the ejector pins are jackscrews.

7. The substrate leveling structure of claim 1 or 2, further comprising a bellows;

the two ends of the corrugated pipe are fixedly arranged on the fixing assembly and the leveling plate respectively.

8. A leveling device comprising a spray assembly and the substrate leveling structure of any one of claims 1 to 7;

the spraying assembly is arranged on the substrate leveling structure, the substrate leveling structure is used for adjusting the angle of the spraying assembly, and the spraying assembly is used for coating.

9. The leveling device of claim 8, wherein a center of the sphere is located on a side of the spray assembly remote from the fixed assembly.

10. The leveling device of claim 8 or 9, wherein the spray assembly is removably disposed to the base plate leveling structure.

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