CN116021101A - Laser electrochemical machining method for copper microstructure machining - Google Patents
Laser electrochemical machining method for copper microstructure machining Download PDFInfo
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- CN116021101A CN116021101A CN202310144453.0A CN202310144453A CN116021101A CN 116021101 A CN116021101 A CN 116021101A CN 202310144453 A CN202310144453 A CN 202310144453A CN 116021101 A CN116021101 A CN 116021101A
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Abstract
Compared with LIGA technology electroplating additive processing, the invention discloses a laser electrochemical processing method for copper microstructures, which avoids the defect of loose texture of electroplating materials, and has shorter processing period than LIGA electroplating processing and good mechanical property of processed workpieces. The invention adopts laser electrochemical composite machining, belongs to stress-free machining, uses a high-precision triaxial moving platform, uses a laser electrochemical machining device as a special cutter, and realizes high-precision and high-surface-quality copper microstructure machining by coupling laser power with electrolyte flow rate and machining voltage through platform movement. The milling device has the advantages of high milling efficiency and high precision, and avoids metal plastic flow caused by milling, and the edges of the notch are free of burrs and bulges. The invention introduces the laser beam into the processing area from the upper part of the cathode of the pipe electrode, ensures the efficient combination of two energies, improves the energy density of the processing area and accelerates the material removal rate.
Description
Technical Field
The invention belongs to the technical field of precise and superfine special processing, and particularly relates to a laser electrochemical processing method for a copper microstructure.
Background
Copper materials have good electrical and thermal conductivity properties and, when processed into specific microstructures, have certain specific physical and chemical properties. Copper microstructure devices are increasingly used in precision machinery, aerospace, national defense, communications, medicine, and other fields due to their functionality. Copper micro-grooves are used, for example, in cooling and heat dissipating systems to improve heat dissipation. The traveling wave tube is used for amplifying microwave signals by virtue of the internal periodic micro-groove structure. In addition, copper is widely applied to various aspects such as a cavity of a speed regulating tube, an anode block of a magnetron, a high-energy laser, a microwave accelerator, a miniature direct current commutator, a miniature electronic packaging shell and the like.
At present, the main processing methods of copper microstructures can be divided into the following four types:
one is micro milling technology. Micro milling is the application of a conventional milling technology in the micro-nano field, and a workpiece material is removed by using a milling cutter with a submillimeter size rotating at a high speed, so that a three-dimensional microstructure with a micron-sized characteristic size is obtained. Due to low processing cost and high efficiency, the micro-milling technology is becoming the most commonly used processing means for copper microstructures. However, as the processing scale is reduced to the micron level, the rounding radius of the tool nose cannot be ignored, the micromechanics performance of the material is different from that of the macroscopic mechanics, and the size effect cannot be ignored. Copper has the processing characteristics of low hardness, large plastic deformation, easiness in temperature influence, high adhesiveness, easiness in abrasion, easiness in clamping and deformation, easiness in surface scratching and the like, so that the processing quality and the processing precision of precise micro-cutting cannot be ensured, and the copper is a great difficulty in precise micro-cutting processing of copper. At present, the roughness of the copper microstructure processed by the micro milling technology at home and abroad is about 100 nm.
And II, LIGA technology, which is derived from the word Lithogram, galvanoformung und Abformung, means photolithography, electroforming and forming. A layer of photoresist is first coated on a substrate and then exposed using a reticle with a microstructured two-dimensional pattern. And developing after exposure to obtain a corresponding pattern structure. And after exposure, electroplating and depositing the substrate with the pattern structure serving as a cathode. And (3) depositing the metal copper on the substrate, and demolding to obtain the metal copper workpiece with the corresponding microstructure. Through research by Ruilin Zheng at university of oslo, norway 2011, copper microstructures with RMS roughness of 70nm were prepared using SU-8 based LIGA technology. However, LIGA technology has limitations in that the exposure time in the photolithography stage is difficult to adjust, the electroplated metal is relatively loose, the mechanical properties are poor, and the processing period is long.
And thirdly, a micro electric spark machining technology, which is to machine by utilizing an electrochemical reaction of anodic dissolution, and belongs to non-contact machining and stress-free machining, and the machining material range is wide. However, the direct processing of high-precision microstructures using the micro-spark technique has not been reported. The current limitation of micro electro discharge machining copper microstructure is mainly focused on the following aspects: poor localization, high roughness and poor groove bottom morphology.
And fourthly, a laser processing technology, which is to realize material removal by melting and gasifying materials at high temperature, belongs to non-contact processing and stress-free processing, and has wide processing material range. But copper has high reflectivity, high density and high laser processing difficulty. Although the LuX Z of the university of Huaqiao uses a method of water-induced laser to restrict the laser beam, the processing quality is improved, a surface heat affected zone and a recast layer are still unavoidable after laser processing, and the surface of a workpiece has a coking phenomenon.
In summary, the current methods for processing copper microstructures have advantages and limitations. So no processing method for the unstressed, stable and high-processing-precision copper microstructure exists at present.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a stress-free, stable, high-processing-precision and low-roughness laser electrochemical processing method for copper microstructures.
In order to achieve the above object, the technical scheme of the present invention is as follows: a laser electrochemical machining method for copper microstructures comprises the following technical steps:
A. preparing a phosphoric acid-based electrolyte for electrochemical processing of copper materials, wherein the electrolyte preparation method comprises the following steps: weighing ammonium salt solid and corrosion inhibitor solid with certain mass, placing the ammonium salt solid and the corrosion inhibitor solid into a beaker, sequentially adding a certain volume of ethanol, phosphoric acid and lactic acid, stirring for 0.5-1 hour at the temperature of 20-25 ℃, and standing for 0.5-1 hour to eliminate bubbles in the solution.
B. And (3) clamping the copper workpiece anode by a clamp, and fixing the copper workpiece anode on a high-precision triaxial moving platform with the motion precision of micrometers.
C. The method comprises the steps of connecting a copper workpiece anode with a pulse power supply anode, connecting a tube electrode cathode with the pulse power supply cathode, arranging the tube electrode cathode above the copper workpiece anode, opening an electrolyte supply pump switch, and conveying phosphoric acid-based electrolyte between the copper workpiece anode and the tube electrode cathode.
D. And adjusting the electrolyte injection port of the cathode of the tube electrode to the focal position of the laser, so that laser enters the electrolyte injection port after focusing, and a polytetrafluoroethylene thin-wall tube is sleeved in the cathode of the tube electrode.
E. And (3) switching on a pulse power switch and a laser switch, adjusting voltage parameters and laser power, running a G code program, moving a high-precision triaxial mobile platform and starting processing.
Further, the phosphoric acid-based electrolyte in the step A comprises the following components in percentage by weight: 85 percent of phosphoric acid, 9 percent of absolute ethyl alcohol, 6 percent of lactic acid, 0.03 to 0.4mol/L of ammonium salt solid and 0.04 to 0.05mol/L of corrosion inhibitor.
Further, the phosphoric acid-based electrolyte used in the step C is kept at a constant temperature by using a thermostatic vessel, and is maintained at 20 to 25 ℃.
Further, the electrolyte supply pump used in the step C is a diaphragm pump, the stable conveying of the phosphate electrolyte is realized by the fluid damper connected in series, and the flow rate of the electrolyte is monitored by the flowmeter connected in series.
Furthermore, the tube electrode cathode used in the step C is integrated on the laser electrochemical composite spray head and is connected with the polytetrafluoroethylene through cutting sleeve, so that the quick replacement of the tube electrode cathode is realized.
Further, the processing voltage used in step E selects the passivation voltage of copper in the phosphoric acid-based electrolyte.
Further, in step E, the percentage of laser output power is adjusted so that the electrochemical machining of the tube electrode is the same as the removal rate of the laser machining material.
Compared with the existing processing mode, the invention has the outstanding advantages that:
1. compared with LIGA technology electroplating additive processing, the invention avoids the defect of loose texture of the electroplating material, has shorter processing period than LIGA electroplating processing, and has good mechanical properties of the processed workpiece.
2. The invention adopts laser electrochemical composite machining, belongs to stress-free machining, uses a high-precision triaxial moving platform, uses a laser electrochemical machining device as a special cutter, and realizes high-precision and high-surface-quality copper microstructure machining by coupling laser power with electrolyte flow rate and machining voltage through platform movement. The milling device has the advantages of high milling efficiency and high precision, and avoids metal plastic flow caused by milling, and the edges of the notch are free of burrs and bulges.
3. The present invention directs a laser beam into the processing region from above the cathode of the tube electrode. By utilizing the principle of total reflection, the laser energy is guided to the processing area while the cathode of the electrode of the tube is protected from being damaged by the laser, thereby ensuring the efficient combination of the two energies, improving the energy density of the processing area and accelerating the material removal rate. And the introduction of laser improves the temperature of a processing area and can adopt smaller voltage for processing, thereby reducing stray corrosion in electrochemical processing and improving the localization of processing. On the side wall, pure chemical processing is adopted between the cathode side wall of the tube electrode and the side wall of the workpiece, and good electrochemical polishing effect can be obtained in a passivation potential area, so that a smooth side wall is obtained.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of a laser electrochemical composite showerhead;
fig. 3 is a schematic diagram of laser electrochemical composite energy field processing.
In the figure: the device comprises a computer, a 2-laser controller, a 3-pulse power supply, a 4-laser, a 5-laser beam, a 6-reflecting mirror, a 7-focusing lens, an 8-laser electrochemical composite processing spray head, 81-plane glass, 82-spray head bodies, 83-cathode clamps, 84-tube electrode cathodes, 85-polytetrafluoroethylene coatings, 86-clamping nuts, 87-tube electrode jackets, 9-electrolyte suction pumps, 10-flowmeter, 11-liquid damper, 12-electrolyte supply pump, 13-electrolyte storage tank, 14-electrolyte, 15-constant temperature water bath tank, 16-constant temperature equipment, 17-electrolytic tank, 18-triaxial lathe bed, 19-high precision triaxial guide rail, 20-workpiece support, 21-copper workpiece anode and 22-triaxial guide rail control box.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings, but the scope of the present invention is not limited thereto.
Figures 1-3 show a processing device used in the present invention, including an electrochemical processing system, a laser electrochemical composite spray head, and a motion control system.
In the electrochemical machining system, a pulse power source 3 is controlled by a computer 1 to provide a voltage required for electrochemical machining. The stable supply of the phosphoric acid based electrolyte 14 is achieved by the electrolyte supply pump 12 in series with the liquid damper 11, and the series flow meter 10 detects the flow rate of the phosphoric acid based electrolyte, and an electrochemical machining discharge circuit is formed when the electrolyte is fed between the copper workpiece anode 21 and the cathode tool 84. The electrolyte 14 is thermostated by a thermostat device 16 thermostat water bath 15. The excess electrolyte 14 is pumped from the electrolytic tank 17 back to the electrolyte reservoir 13 by the electrolyte suction pump 9 for recycling.
In the laser processing system, a laser controller 2 is connected through a computer 1, and a laser 4 is controlled to emit a laser beam 5, and the laser beam is incident on a tube electrode cathode 84 through a reflecting mirror 6, a focusing lens 7 and a planar glass 81. Since the polytetrafluoroethylene coating 85 on the inner wall of the tube electrode cathode 84 has a lower refractive index than the electrolyte 14, total reflection of laser light can be achieved, and the laser beam 5 is guided to the surface of the copper workpiece anode 21 while protecting the tube electrode cathode 84.
The main body of the laser electrochemical composite spray head 8 is a spray head body 82, and focused laser is incident into a tube electrode cathode 84 through a planar glass 81. The tube electrode cathode 84 is an interference fit with the tube electrode clamp 83. The clamping nut 86 is screwed, and the tube electrode holder 87 is elastically deformed to clamp the tube electrode holder 83. Coating polytetrafluoroethylene coating 85 on tube electrode cathode 84
In the motion control system, the copper workpiece anode 21 is fixed to the workpiece holder 20, the workpiece holder 20 is placed in the electrolytic bath 17, and the electrolytic bath 17 is fixed to the triaxial bed 18. The computer 1 is connected with the triaxial guide rail control box 22 to control the high-precision triaxial guide rail 19 to move according to a programmed route, so as to process the microstructure.
First, preparing a phosphoric acid-based electrolyte and measuring passivation potential
(1) Firstly, 3g of BTA corrosion inhibitor and 1.5g of ammonium acetate solid are weighed into a beaker, 45ml of ethanol is weighed and stirred into the beaker, at the moment, the solid in the beaker can be observed to start to dissolve, and 425ml of phosphoric acid and 30ml of lactic acid are sequentially added. And (3) in a room temperature environment at 25 ℃, placing the mixture on a magnetic stirrer to stir for half an hour, uniformly stirring the solution, and standing the solution for half an hour to eliminate bubbles in the solution.
(2) And placing the stirred solution and the oxygen-free copper sample in an electrolytic tank to measure a polarization curve. In this example, the final machining potential was chosen to be 5.844V (vs MSE).
Second, preparation before processing
(1) After the copper workpiece anode 21 and the laser electrochemical composite processing nozzle 8 are fixed, the electrode spacing is adjusted to be 0.6mm. The constant temperature equipment 14 is opened, when the temperature of the electrolyte 14 in the electrolyte storage tank 11 is constant to 20-25 ℃, the electrolyte supply pump 12 is opened, so that the electrolyte 14 is supplied to the laser electrochemical composite processing spray head 8, the inner cavity of the spray head is observed to be filled with the electrolyte 14, the electrolyte 14 is stably contacted with the planar glass 81 without bubbles, and the electrolyte suction pump 9 is opened. The two pumps are adjusted to maintain electrolyte 14 to fill the showerhead lumen.
(2) The laser 4 is turned on and the focusing lens 7 is adjusted so that the laser beam 5 is focused and then made incident from just the upper end of the tube electrode cathode 84. It is observed that a stable laser beam is emitted from the electrolyte beam at the lower end of the cathode 84 of the pipe electrode, a laser spot is formed on the surface of the anode 21 of the copper workpiece, the pulse power supply 3 is turned on, and parameters of the pulse power supply 3 and the output power of the laser 4 are regulated, so that the processed pit bottom is flat.
Third step, formally processing
The computer 1 is used for inputting a processing program, controlling the high-precision triaxial guide rail 19 to move, carrying out movement and feeding of a certain track, and realizing the processing of the copper microstructure with high precision and high surface quality. In the processing process, processing current data and electrolyte 14 flow data are detected in real time, and whether the electrolyte 14 in the inner cavity of the spray head is stable or not is observed.
Fourth, cleaning after processing
After the machining is completed, the laser power supply, the pulse power supply 3, the high-precision triaxial guide 19, the electrolyte supply pump 12 and the electrolyte suction pump 9 are sequentially turned off. And taking out the workpiece, flushing the workpiece by alcohol, and then placing the workpiece in the alcohol for ultrasonic cleaning for 5 minutes.
The present invention is not limited to the present embodiment, and any equivalent concept or modification within the technical scope of the present invention is listed as the protection scope of the present invention.
Claims (7)
1. A laser electrochemical machining method for copper microstructures is characterized by comprising the following steps of: the method comprises the following technical steps:
A. a phosphoric acid-based electrolyte for electrochemical processing of copper materials is prepared, and the electrolyte (14) is prepared by the following steps: weighing ammonium salt solid and corrosion inhibitor solid with certain mass, placing the ammonium salt solid and the corrosion inhibitor solid into a beaker, sequentially adding a certain volume of ethanol, phosphoric acid and lactic acid, stirring for 0.5-1 hour at the temperature of 20-25 ℃, and standing for 0.5-1 hour to eliminate bubbles in the solution;
B. clamping a copper workpiece anode (21) by a clamp, and fixing the copper workpiece anode on a high-precision triaxial moving platform with the motion precision of micrometers;
C. connecting the copper workpiece anode (21) with the anode of the pulse power supply (3), connecting the pipe electrode cathode (84) with the cathode of the pulse power supply (3), arranging the pipe electrode cathode (84) above the copper workpiece anode (21), opening an electrolyte (14) supply pump switch, and conveying the phosphoric acid-based electrolyte between the copper workpiece anode (21) and the pipe electrode cathode (84);
D. an electrolyte (14) inlet of a tube electrode cathode (84) is adjusted to the focal position of the laser (4), so that laser is focused and then enters the electrolyte (14) inlet, and a polytetrafluoroethylene thin-wall tube is sleeved in the tube electrode cathode (84);
E. and (3) switching on a pulse power supply (3) switch and a laser (4) switch, adjusting voltage parameters and laser power, running a G code program, moving a high-precision triaxial moving platform and starting processing.
2. A method of laser electrochemical machining of copper microstructures in the gaseous state according to claim 1, wherein: the phosphate-based electrolyte (14) in the step A comprises the following components in percentage by weight: 85 percent of phosphoric acid, 9 percent of absolute ethyl alcohol, 6 percent of lactic acid, 0.03 to 0.4mol/L of ammonium salt solid and 0.04 to 0.05mol/L of corrosion inhibitor.
3. A method of laser electrochemical machining of copper microstructures in the gaseous state according to claim 1, wherein: the phosphoric acid-based electrolyte (14) used in the step C is kept at a constant temperature by using a constant temperature container, and is maintained at 20-25 ℃.
4. A method of laser electrochemical machining of copper microstructures in the gaseous state according to claim 1, wherein: and C, the electrolyte (14) supply pump is a diaphragm pump, the stable conveying of the phosphate electrolyte (14) is realized by the series fluid damper, and the flow of the electrolyte (14) is monitored by the series flowmeter.
5. A method of laser electrochemical machining of copper microstructures in the gaseous state according to claim 1, wherein: and C, integrating the tube electrode cathode (84) on the laser electrochemical composite spray head, and connecting with a polytetrafluoroethylene straight-through cutting sleeve to realize quick replacement of the tube electrode cathode (84).
6. A method of laser electrochemical machining of copper microstructures in the gaseous state according to claim 1, wherein: the process voltage used in step E is selected from the passivation voltage of copper in the phosphoric acid based electrolyte (14).
7. A method of laser electrochemical machining of copper microstructures in the gaseous state according to claim 1, wherein: in step E, the output power percentage of the laser (4) is adjusted so that the electrochemical machining of the tube electrode is the same as the removal rate of the laser machining material.
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| CN202310144453.0A CN116021101A (en) | 2023-02-21 | 2023-02-21 | Laser electrochemical machining method for copper microstructure machining |
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| CN202310144453.0A CN116021101A (en) | 2023-02-21 | 2023-02-21 | Laser electrochemical machining method for copper microstructure machining |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116967596A (en) * | 2023-09-25 | 2023-10-31 | 应急管理部上海消防研究所 | Device and method for processing micro-texture on surface of water lubrication bearing of submersible pump for fire control |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116967596A (en) * | 2023-09-25 | 2023-10-31 | 应急管理部上海消防研究所 | Device and method for processing micro-texture on surface of water lubrication bearing of submersible pump for fire control |
| CN116967596B (en) * | 2023-09-25 | 2023-11-28 | 应急管理部上海消防研究所 | Device and method for processing micro-texture on surface of water lubrication bearing of submersible pump for fire control |
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