CN116009367A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN116009367A
CN116009367A CN202211276682.XA CN202211276682A CN116009367A CN 116009367 A CN116009367 A CN 116009367A CN 202211276682 A CN202211276682 A CN 202211276682A CN 116009367 A CN116009367 A CN 116009367A
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CN
China
Prior art keywords
substrate
conveying
roller
contact
processing apparatus
Prior art date
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Pending
Application number
CN202211276682.XA
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Chinese (zh)
Inventor
芳川典生
山下永二
铃木启悟
秋冈知辉
伊吹征也
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN116009367A publication Critical patent/CN116009367A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G39/00—Rollers, e.g. drive rollers, or arrangements thereof incorporated in roller-ways or other types of mechanical conveyors 
    • B65G39/02—Adaptations of individual rollers and supports therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a substrate processing device, which can reduce the streak-shaped processing caused by a conveying roller, and also can hardly cause the problem that a part of processing liquid forming accumulated liquid on the upper surface of a substrate flows out to the surface of the conveying roller or bubbles attached to the conveying roller rise to the upper surface of the substrate. The conveying mechanism (20) has a plurality of conveying rollers (21). The conveying roller conveys the substrate by rotating the contact part (53) partially formed on the outer peripheral surface while making contact with the lower surface of the substrate (9). The contact position of the contact part (53) with the lower surface of the substrate changes along the width direction along with the rotation of the conveying roller. This can reduce streaks of processing due to the conveying roller. Further, since the contact area between the transfer roller and the lower surface of the substrate is small, it is difficult to cause a problem that a part of the processing liquid that forms a liquid product on the upper surface of the substrate flows out to the surface of the transfer roller or bubbles adhering to the transfer roller rise to the upper surface of the substrate.

Description

Substrate processing apparatus
Technical Field
The present invention relates to a substrate processing apparatus that performs processing with a processing liquid while conveying a substrate.
Background
Conventionally, in a process for manufacturing a substrate such as an organic EL panel, a substrate processing apparatus is used that performs a process of supplying a processing liquid to the substrate while conveying the substrate. A conventional substrate processing apparatus is described in patent document 1, for example. The substrate processing apparatus of patent document 1 conveys a substrate while supporting the substrate in a horizontal posture by a plurality of rollers. Then, by supplying the developer to the upper surface of the conveyed substrate, a liquid product (pump) of the developer is formed on the upper surface of the substrate.
Patent document 1: japanese patent application laid-open No. 2016-167475.
In this substrate processing apparatus, a plurality of rollers provided on the roller are in contact with the lower surface of the substrate. The plurality of rollers are arranged at intervals in the width direction (the direction orthogonal to the conveyance direction of the substrate and horizontal). Therefore, a portion in contact with the roller and a portion not in contact are generated on the lower surface of the substrate. Thereby, a local temperature difference and a local flow of the developer occur on the substrate. As a result, streaks may be generated on the upper surface of the substrate, the streaks extending in the conveying direction.
In order to suppress such process unevenness, for example, a cylindrical solid roller extending in the width direction is considered. If a solid roller is used, the entire width direction of the lower surface of the substrate is in contact with the roller. Therefore, the streaks of the processing extending in the conveying direction can be reduced.
However, when a solid roller is used, the contact area of the substrate with the roller increases. Therefore, a part of the processing liquid that forms the liquid pool on the upper surface of the substrate easily flows out to the surface of the roller due to the surface tension. By doing so, there may be the following situations: the liquid pool of the processing liquid formed on the upper surface of the substrate becomes thin, and the development processing becomes uniform.
In addition, bubbles of the developer may adhere to the surface of the roller, but in the case of using a solid roller, the bubbles easily rise from the roller to the upper surface of the substrate because the contact area between the substrate and the roller is large. Thus, there are also the following problems: a process stain caused by bubbles may be generated on the upper surface of the substrate.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus that can reduce streaks caused by a transfer roller, and that is also less likely to cause a problem that a part of a processing liquid that forms a liquid product on an upper surface of a substrate flows out to the surface of the transfer roller or bubbles that adhere to the transfer roller rise to the upper surface of the substrate.
A first aspect of the present invention provides a substrate processing apparatus for processing a substrate with a processing liquid while conveying the substrate, comprising: a conveying mechanism for conveying the substrate along a conveying direction which is a horizontal direction while supporting the substrate in a horizontal posture; and a processing liquid supply unit configured to supply the processing liquid to an upper surface of the substrate conveyed by the conveyance mechanism, thereby forming a liquid pool of the processing liquid on the upper surface of the substrate, wherein the conveyance mechanism includes a plurality of conveyance rollers arranged at intervals in the conveyance direction, and the conveyance rollers rotate around an axis extending in a horizontal width direction orthogonal to the conveyance direction while bringing a contact portion formed partially on an outer peripheral surface thereof into contact with a lower surface of the substrate, thereby conveying the substrate downstream in the conveyance direction, and a position of the contact portion in the width direction on an outer peripheral surface of the conveyance rollers changes according to a position in a circumferential direction around the axis.
A second aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein the contact portion is spiral around the shaft.
A third aspect of the present invention is the substrate processing apparatus according to the second aspect, wherein the plurality of conveying rollers include: the contact part is a plurality of right-handed carrying rollers in a right-handed spiral shape; and a plurality of left-hand conveying rollers having left-hand spiral contact portions, wherein the right-hand conveying rollers and the left-hand conveying rollers are alternately arranged in the conveying direction.
A fourth aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein the conveyance roller has a plurality of contact portions aligned in the width direction, and each of the plurality of contact portions has an elliptical shape inclined with respect to the axis.
A fifth aspect of the present invention is the substrate processing apparatus according to the fourth aspect, wherein the conveyance roller includes: a rotation shaft extending along the shaft; and a plurality of roller members fixed to the rotating shaft, each of the plurality of roller members having the contact portion.
A sixth aspect of the present invention is the substrate processing apparatus according to the fourth or fifth aspect, wherein the plurality of conveying rollers include: a plurality of first conveying rollers; and a plurality of second conveying rollers, the first conveying rollers and the second conveying rollers being alternately arranged along the conveying direction, the contact portions of the first conveying rollers and the contact portions of the second conveying rollers being alternately arranged in the width direction.
A seventh aspect of the present invention provides the substrate processing apparatus according to any one of the first to sixth aspects, wherein the processing liquid supply section includes a nozzle that ejects the processing liquid, and the conveying mechanism further includes one or more cylindrical rollers disposed downstream of an ejection position where the nozzle ejects the processing liquid, the cylindrical rollers having one cylindrical surface extending in the width direction, the cylindrical rollers conveying the substrate to the downstream side in the conveying direction by rotating the cylindrical surface about an axis extending in the width direction while bringing the cylindrical surface into contact with the lower surface of the substrate.
An eighth aspect of the present invention is the substrate processing apparatus according to any one of the first to seventh aspects, further comprising a guide roller that contacts an end portion of the substrate in the width direction.
A ninth aspect of the present invention provides the substrate processing apparatus according to any one of the first to eighth aspects, wherein the processing liquid is a developing liquid for developing a resist film formed on an upper surface of the substrate.
According to a first to ninth aspects of the present invention, the contact position between the conveyance roller and the lower surface of the substrate varies in the width direction according to the rotation of the conveyance roller. This can reduce streaks of processing due to the conveying roller. Further, a contact portion for contacting the substrate is partially formed on the outer peripheral surface of the conveying roller. This can reduce the contact area between the conveyance roller and the lower surface of the substrate. Therefore, it is also difficult to cause a problem that a part of the processing liquid that forms a liquid pool on the upper surface of the substrate flows out to the surface of the transport roller or bubbles adhering to the transport roller rise to the upper surface of the substrate.
In particular, according to the second aspect of the present invention, the contact portion can be formed seamlessly in the width direction. This can reduce the number of positions where the contact portion does not exist in the width direction. As a result, streaks of processing due to the conveying roller can be further suppressed.
In particular, according to the third aspect of the present invention, the contact position between the conveyance roller and the lower surface of the substrate can be made more uniform. Therefore, the streaks of the processing due to the conveying roller can be further suppressed.
In particular, according to a fourth aspect of the present invention, the contact portion is made in a closed elliptical shape instead of a spiral shape. This makes it possible to easily form the contact portion on the outer peripheral surface of the conveying roller.
In particular, according to a fifth aspect of the present invention, a conveying roller can be manufactured by manufacturing a plurality of roller members having contact portions and fixing the roller members to a rotating shaft. This makes it possible to easily manufacture a conveying roller having a plurality of contact portions.
In particular, according to the sixth aspect of the present invention, the contact position between the conveyance roller and the lower surface of the substrate can be made more uniform. Therefore, the streaks of the processing due to the conveying roller can be further suppressed.
In particular, according to a seventh aspect of the present invention, the cylindrical roller is disposed immediately behind the discharge position of the treatment liquid. The cylindrical roller can accurately support the substrate horizontally and form a liquid product of the processing liquid on the upper surface of the substrate.
In particular, according to the eighth aspect of the present invention, the substrate can be prevented from moving obliquely with respect to the conveying direction.
Drawings
Fig. 1 is a side view of a developing device.
Fig. 2 is a top view of the developing device.
Fig. 3 is a partial top view of the transport mechanism.
Fig. 4 is a partial plan view of the conveying mechanism of the second embodiment.
Fig. 5 is a partial plan view of the conveying mechanism of the third embodiment.
Fig. 6 is a partial plan view of the conveying mechanism of the fourth embodiment.
Fig. 7 is a partial plan view of the conveying mechanism of the fifth embodiment.
Fig. 8 is a partial plan view of a conveying mechanism of a sixth embodiment.
Fig. 9 is a plan view of a developing device of a seventh embodiment.
Description of the reference numerals:
1. developing device
9. Substrate board
10. Chamber chamber
13. Liquid discharge hole
20. Conveying mechanism
21. Conveying roller
21A right-hand carrying roller
21B left-hand carrying roller
21C first carrying roller
21D second carrying roller
22. Roller driving mechanism
23. Guide roller
24. Cylinder roller
30. Treatment liquid supply unit
31. Nozzle
40. Control unit
51. Rotating shaft
52. Roller component
53. Contact portion
54. Non-contact portion
Axis A
L developing solution
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<1 > first embodiment
<1-1. Structure of substrate processing apparatus >
Fig. 1 is a side view of a developing device 1 which is an example of a substrate processing apparatus of the present invention. Fig. 2 is a top view of the developing device 1. The developing device 1 is a device for performing a developing process on a rectangular substrate 9 in a process of manufacturing an organic EL panel. The developing device 1 is used as a part of a so-called coating and developing apparatus that continuously performs processes such as cleaning, coating of a resist solution, drying, exposure, and development. However, the developing device 1 may be used separately from the coating device and the exposure device constituting the coating and developing apparatus.
A resist film (photoresist film) is formed on the upper surface of the substrate 9 carried into the developing device 1. In addition, the resist film is partially exposed in the exposure apparatus of the preceding stage. The developing device 1 supplies the developer L to the upper surface of the substrate 9 while conveying the substrate 9. Thereby, the exposed portion of the resist film is dissolved (developed).
As shown in fig. 1 and 2, the developing device 1 includes a chamber 10, a conveying mechanism 20, a processing liquid supply section 30, and a control section 40. Hereinafter, the upstream side of the conveyance mechanism 20 in the conveyance direction of the substrate 9 will be simply referred to as "upstream side", and the downstream side thereof will be simply referred to as "downstream side".
The chamber 10 is a substantially rectangular parallelepiped frame extending in the transport direction of the substrate 9. Inside the chamber 10, there is a space for performing a developing process on the substrate 9. In order to explain the internal structure of the chamber 10, the chamber 10 is shown in a cross-sectional state in fig. 1 and 2. A carry-in port 11 for carrying in the substrate 9 is provided at an upstream end of the chamber 10. A carry-out port 12 for carrying out the substrate 9 is provided at the downstream end of the chamber 10. Further, a drain hole 13 for discharging the developer L used in the chamber 10 to the outside is provided in the bottom surface of the chamber 10.
The conveyance mechanism 20 conveys the substrate 9 in the chamber 10. The conveyance mechanism 20 conveys the substrate 9 in a conveyance direction that is a horizontal direction while supporting the substrate 9 in a horizontal posture. As shown in fig. 1 and 2, the conveying mechanism 20 has a plurality of conveying rollers 21. The plurality of conveying rollers 21 are arranged at intervals in the conveying direction. The plurality of conveying rollers 21 are connected to a roller driving mechanism 22 constituted by a motor or the like. When the roller driving mechanism 22 is operated, each of the conveying rollers 21 rotates about an axis extending in the width direction (the direction orthogonal to and horizontal to the conveying direction of the substrate 9).
When the substrate 9 is carried into the chamber 10, the plurality of carrying rollers 21 rotate while being in contact with the lower surface of the substrate 9. Thus, the substrate is conveyed downstream while being supported in a horizontal posture.
The processing liquid supply unit 30 is a mechanism for supplying the developer L as the processing liquid to the upper surface of the substrate 9 conveyed by the conveying mechanism 20. As shown in fig. 1, the treatment liquid supply section 30 includes a nozzle 31, a liquid supply pipe 32, and a liquid supply tank 33. The nozzle 31 is disposed in the chamber 10. The nozzle 31 is disposed above the conveyance path of the substrate 9 by the conveyance mechanism 20. The nozzle 31 has a slit-shaped discharge port extending in the width direction at the lower end portion thereof. The ejection port is opposed to the upper surface of the substrate 9 conveyed by the conveying mechanism 20 in the vertical direction via a minute gap.
The downstream end of the liquid supply pipe 32 is connected to the nozzle 31. An upstream end of the liquid supply pipe 32 is connected to a liquid supply tank 33. A valve 34 and a pump 35 are provided in the path of the liquid supply pipe 32. The liquid supply tank 33 stores the developer L before supply. The developer L is, for example, tetramethylammonium hydroxide (TMAH) at normal temperature. However, the developer L may be a liquid other than TMAH.
When the valve 34 is opened and the pump 35 is operated, the developer L is supplied from the liquid supply tank 33 to the nozzle 31 through the liquid supply pipe 32. Further, the developer L is discharged downward from the discharge port of the nozzle 31. The substrate 9 passes under the nozzle 31 that ejects the developer L. Thereby, a liquid product (pump) of the developer L is formed on the upper surface of the substrate 9. The developer L is held on the upper surface of the substrate 9 by its surface tension.
The control unit 40 is a unit for controlling the operations of the respective units of the developing device 1. The control unit 40 is configured by a computer having a processor such as a CPU, a memory such as a RAM, and a storage unit such as a hard disk drive. The storage section stores therein a computer program for executing development processing and various data. As indicated by the broken-line arrows in fig. 1 and 2, the control unit 40 is electrically connected to the roller driving mechanism 22, the valve 34, and the pump 35. The control unit 40 operates and controls the above-described respective units by operating according to a computer program. Thereby, the substrate 9 in the developing device 1 is conveyed and developed.
<1-2 > regarding the handling mechanism
Next, the above-described conveying mechanism 20 will be described in more detail.
Fig. 3 is a partial plan view of the conveyance mechanism 20. As described above, the conveying mechanism 20 has a plurality of conveying rollers 21. As shown in fig. 3, each conveying roller 21 has a rotation shaft 51 and a roller member 52 fixed to the rotation shaft 51.
The rotating shaft 51 is a columnar member disposed along an axis a extending in the width direction. The rotation shaft 51 is formed of a metal having higher rigidity than the roller member 52. Both ends of the rotating shaft 51 are rotatably supported by a frame stationary with respect to the chamber 10 via bearings. The rotation shaft 51 is connected to the roller driving mechanism 22. When the roller driving mechanism 22 is operated, the plurality of rotating shafts 51 rotate about the axis a extending in the width direction, respectively.
The roller member 52 is a cylindrical member extending in the width direction along the axis a. For example, the roller member 52 is formed of a resin having lower rigidity than the rotation shaft 51. The rotation shaft 51 is inserted inside the roller member 52. The roller member 52 is fixed to the outer peripheral surface of the rotating shaft 51. Therefore, when the roller driving mechanism 22 is operated, the roller member 52 rotates together with the rotating shaft 51 about the axis a extending in the width direction.
The roller member 52 has a contact portion 53 and a non-contact portion 54 on its outer peripheral surface. The contact portion 53 constitutes the outermost diameter of the roller member 52. Therefore, the contact portion 53 is in contact with the lower surface of the substrate 9 when the substrate 9 is conveyed. The contact portion 53 of the present embodiment is spiral around the axis a. The contact portion 53 may have a single spiral shape or a plurality of spiral shapes. The contact portion 53 is a part of a cylindrical surface centered on the axis a.
The non-contact portion 54 is a portion other than the contact portion 53 in the outer peripheral surface of the roller member 52. The non-contact portion 54 is recessed inward (radially inward about the axis a) than the contact portion 53. Therefore, even when the substrate 9 is conveyed, the non-contact portion 54 does not contact the lower surface of the substrate 9. That is, the conveyance roller 21 rotates while bringing only the contact portion 53 formed in a part of the outer peripheral surface thereof into contact with the lower surface of the substrate 9, thereby conveying the substrate 9 downstream.
The position of the contact portion 53 in the width direction in the outer peripheral surface of the roller member 52 changes according to the circumferential angular position centered on the axis a. Therefore, the contact position of the roller member 52 with the lower surface of the substrate 9 varies in the width direction with the rotation of the conveying roller 21. By so doing, the conveying roller 21 can be prevented from contacting only a specific position in the width direction in the lower surface of the substrate 9. This can suppress the temperature change of the developer L or the concentration of the flow of the developer L at a specific position in the width direction. As a result, streaks, which are streaks due to contact with the conveying roller 21, can be suppressed from being generated in the resist film formed on the upper surface of the substrate 9.
In addition, a contact portion 53 is partially formed on the outer peripheral surface of the roller member 52. Therefore, the contact area with the substrate 9 can be reduced as compared with the case where the entire outer peripheral surface of the roller member 52 is a cylindrical contact portion. Therefore, a part of the developer L that forms a liquid pool on the upper surface of the substrate 9 flows out to the surface of the roller member 52 due to the surface tension, and thus, there is a problem that the thickness of the liquid pool is less likely to be reduced. In addition, the bubbles adhering to the outer peripheral surface of the roller member 52 are less likely to rise to the upper surface of the substrate 9. Therefore, the resist film can be uniformly developed while maintaining the liquid accumulation of the developer L formed on the upper surface of the substrate 9 at an appropriate thickness.
In particular, as in the present embodiment, when the contact portion 53 is spiral, the contact portion 53 can be formed seamlessly in the width direction. Therefore, the position where the contact portion 53 does not exist in the width direction can be reduced. This can further suppress the occurrence of streaks in the resist film on the upper surface of the substrate 9, which are caused by contact with the conveying roller 21.
As shown in fig. 3, the conveying mechanism 20 of the present embodiment includes a plurality of guide rollers 23. Each guide roller 23 is rotatable about an axis extending in the up-down direction. The guide roller 23 disposed on the right side of the conveyance path among the plurality of guide rollers 23 is in contact with the right end edge of the substrate 9. The guide roller 23 disposed on the left side of the conveyance path among the plurality of guide rollers 23 is in contact with the left end edge of the substrate 9. In this way, the guide roller 23 is in contact with both end edges of the substrate 9 in the width direction, so that movement of the substrate 9 in the width direction can be suppressed. In particular, in the present embodiment, since the contact portion 53 of the conveying roller 21 is spiral, the conveying roller 21 easily applies a force in an oblique direction to the substrate 9. However, by providing the guide roller 23, the substrate 9 can be restrained from moving in the oblique direction, and the substrate 9 can be conveyed with high accuracy in the conveying direction.
<2 > second embodiment
Next, a second embodiment of the present invention will be described. In the following, differences from the above-described embodiments will be mainly described. The same parts as those of the above embodiments will not be described repeatedly.
Fig. 4 is a partial plan view of the conveying mechanism 20 of the second embodiment. As shown in fig. 4, in the present embodiment, the plurality of conveying rollers 21 includes a plurality of right-handed conveying rollers 21A and a plurality of left-handed conveying rollers 21B. The contact portion 53 of the right-handed conveying roller 21A has a right-handed spiral shape. That is, in the right-handed conveying roller 21A, the contact portion 53 extends in a clockwise spiral shape from one end toward the other end in the width direction. The contact portion 53 of the left-hand conveying roller 21B is in a left-hand spiral shape. That is, in the left-handed conveying roller 21B, the contact portion 53 extends in a counterclockwise spiral shape from one end toward the other end in the width direction.
The right-hand conveying rollers 21A and the left-hand conveying rollers 21B are alternately arranged in the conveying direction. By doing so, the contact position of the conveyance roller 21 with the lower surface of the substrate 9 can be made more uniform. Therefore, the occurrence of streaks, which are streaks due to contact with the conveying roller 21, on the resist film on the upper surface of the substrate 9 can be further suppressed.
<3 > third embodiment
Next, a third embodiment of the present invention will be described. In the following, differences from the above-described embodiments will be mainly described. The duplicate explanation is omitted for the portions equivalent to the above embodiments.
Fig. 5 is a partial plan view of the conveying mechanism 20 according to the third embodiment. As shown in fig. 5, in the present embodiment, the roller member 52 has a plurality of independent contact portions 53 instead of the continuous spiral contact portions 53. The plurality of contact portions 53 are arranged at equal intervals in the width direction. Each contact portion 53 has an elliptical shape inclined with respect to the axis a extending in the width direction.
Even in such a manner, the position in the width direction of the contact portion 53 in the outer peripheral surface of the roller member 52 varies according to the angular position in the circumferential direction around the axis a. Therefore, the contact position of the roller member 52 with the lower surface of the substrate 9 varies in the width direction with the rotation of the conveying roller 21. Therefore, the conveying roller 21 can be prevented from contacting only a specific position in the width direction in the lower surface of the substrate 9. This can suppress the occurrence of streaks on the resist film on the upper surface of the substrate 9, which are caused by contact with the conveying roller 21.
In addition, by making the contact portion 53 in a closed elliptical shape, processing of the contact portion 53 becomes easier than in the case of a spiral shape. That is, the contact portion 53 can be easily formed on the outer peripheral surface of the roller member 52. Therefore, the roller member 52 having the plurality of contact portions 53 can be easily manufactured.
<4 > fourth embodiment
Next, a fourth embodiment of the present invention will be described. In the following, differences from the above-described embodiments will be mainly described. The duplicate explanation is omitted for the portions equivalent to the above embodiments.
Fig. 6 is a partial plan view of the conveying mechanism 20 according to the fourth embodiment. As shown in fig. 6, the conveying roller 21 of the present embodiment has a plurality of roller members 52 instead of one cylindrical roller member 52. The plurality of roller members 52 are arranged at equal intervals in the width direction. Each roller member 52 is fixed to the outer peripheral surface of the rotary shaft 51. Further, each roller member 52 has an elliptical contact portion 53 inclined with respect to the axis a extending in the width direction.
In the structure of the present embodiment, the conveying roller 21 can be manufactured by mass-producing small-sized roller members 52 having the contact portions 53 and fixing these roller members 52 to the rotating shaft 51. Thereby, the conveying roller 21 having the plurality of contact portions 53 can be manufactured more easily.
In the example of fig. 6, one roller member 52 has one elliptical contact portion 53. However, one roller member 52 may have a plurality of elliptical contact portions 53. Each roller member 52 may have a spiral contact portion 53.
<5 > fifth embodiment
Next, a fifth embodiment of the present invention will be described. In the following, differences from the above-described embodiments will be mainly described. The duplicate explanation is omitted for the portions equivalent to the above embodiments.
Fig. 7 is a partial plan view of the conveying mechanism 20 of the fifth embodiment. As shown in fig. 7, in the present embodiment, the plurality of conveying rollers 21 includes a plurality of first conveying rollers 21C and a plurality of second conveying rollers 21D. The first conveying roller 21C and the second conveying roller 21D have a plurality of roller members 52, respectively, in the same manner as in the fourth embodiment. The plurality of roller members 52 are arranged at equal intervals in the width direction. Each roller member 52 has an elliptical contact portion 53 inclined with respect to the axis a extending in the width direction.
However, in the present embodiment, the contact portions 53 of the first conveying roller 21C and the contact portions 53 of the second conveying roller 21D are alternately arranged in the width direction. In other words, the contact portions 53 of the second conveying roller 21D are arranged at positions corresponding to between adjacent contact portions 53 of the first conveying roller 21C in the width direction. Therefore, the widthwise center position of the contact portion 53 of the first conveying roller 21C and the widthwise center position of the contact portion 53 of the second conveying roller 21D do not overlap in the axial direction.
The first conveying rollers 21C and the second conveying rollers 21D are alternately arranged in the conveying direction. By doing so, the contact position between the conveyance roller 21 and the lower surface of the substrate 9 can be made more uniform. Therefore, the occurrence of streaks in the resist film on the upper surface of the substrate 9 due to contact with the conveying roller 21 can be further suppressed.
<6 > sixth embodiment
Next, a sixth embodiment of the present invention will be described. In the following, differences from the above-described embodiments will be mainly described. The duplicate explanation is omitted for the portions equivalent to the above embodiments.
Fig. 8 is a partial plan view of the conveying mechanism 20 of the sixth embodiment. The conveying roller 21 of the present embodiment has a plurality of roller members 52, similar to the fourth and fifth embodiments described above. However, in the present embodiment, each roller member 52 is an elliptical plate having no portion corresponding to the non-contact portion 54. By doing so, the shape of each roller member 52 can be further simplified. Therefore, the plurality of roller members 52 can be manufactured more easily.
<7 > seventh embodiment
Next, a seventh embodiment of the present invention will be described. In the following, differences from the above-described embodiments will be mainly described. The duplicate explanation is omitted for the portions equivalent to the above embodiments.
Fig. 9 is a plan view of a developing device 1 of a seventh embodiment. As shown in fig. 9, the conveying mechanism 20 of the present embodiment includes a plurality of conveying rollers 21 and a plurality of cylindrical rollers (solid rollers) 24. A plurality of cylindrical rollers 24 are arranged at intervals in the conveying direction in a region of a predetermined range downstream of the discharge position of the developer L from the nozzle 31. The plurality of conveying rollers 21 are disposed in a region other than the region in which the cylindrical roller 24 is disposed in the conveying path of the substrate 9. The plurality of conveying rollers 21 and the plurality of cylindrical rollers 24 are connected to a roller driving mechanism 22. Therefore, when the roller driving mechanism 22 is operated, the plurality of conveying rollers 21 and the plurality of cylindrical rollers 24 rotate about the axis a extending in the width direction, respectively.
The outer circumferential surface of the roller member of each cylindrical roller 24 is one cylindrical surface extending in the width direction. The cylindrical roller 24 rotates while bringing its cylindrical surface into contact with the lower surface of the substrate 9, thereby conveying the substrate 9 downstream.
The cylindrical roller 24 can accurately support the substrate 9 horizontally, as compared with the conveying roller 21 having a smaller contact area with the substrate 9. In the present embodiment, by disposing such a cylindrical roller 24 immediately behind the discharge position of the processing liquid, it is possible to form a liquid pool of the processing liquid on the upper surface of the substrate 9 while supporting the substrate 9 to be horizontal with high accuracy.
In the example of fig. 9, three cylindrical rollers 24 are disposed immediately behind the discharge position where the developer L is discharged from the nozzle 31. However, the number of the cylindrical rollers 24 may be 1 to 2 or 4 or more.
<8 > modification example
In the above embodiment, the developing device 1 that supplies the developer L as the processing liquid to the upper surface of the substrate 9 is described. However, the substrate processing apparatus of the present invention is not limited to the developing apparatus 1. For example, the substrate processing apparatus may be a coating apparatus that coats a resist solution as a processing solution on the upper surface of a substrate. The substrate processing apparatus may be an etching apparatus that supplies a resist solution as a processing solution to the upper surface of the substrate. The substrate processing apparatus may be a cleaning apparatus that supplies a cleaning liquid as a processing liquid to the upper surface of the substrate.
In the above embodiment, the substrate 9 to be processed is a substrate for an organic EL panel. However, in the substrate processing apparatus of the present invention, the substrate to be processed may be another substrate such as a substrate for a liquid crystal panel, a substrate for a plasma display, a substrate for a solar cell panel, a substrate for an optical disk, or a semiconductor wafer.
In addition, the components in the above embodiments and modifications may be appropriately combined within a range where no contradiction occurs.

Claims (9)

1. A substrate processing apparatus for processing a substrate by a processing liquid while conveying the substrate,
the device comprises:
a conveying mechanism for conveying the substrate along a conveying direction which is a horizontal direction while supporting the substrate in a horizontal posture; and
a processing liquid supply unit configured to supply the processing liquid to an upper surface of the substrate conveyed by the conveyance mechanism, thereby forming a liquid product of the processing liquid on the upper surface of the substrate,
the carrying mechanism has a plurality of carrying rollers arranged at intervals in the carrying direction,
the transfer roller transfers the substrate to the downstream side in the transfer direction by rotating the transfer roller about an axis extending in the width direction, which is the horizontal direction and is orthogonal to the transfer direction, while bringing a contact portion partially formed on the outer peripheral surface into contact with the lower surface of the substrate,
the position of the contact portion in the width direction on the outer peripheral surface of the conveying roller changes according to the position in the circumferential direction around the shaft.
2. The substrate processing apparatus according to claim 1, wherein,
the contact portion is spiral around the shaft.
3. The substrate processing apparatus according to claim 2, wherein,
the plurality of carrying rollers include:
the contact part is a plurality of right-handed carrying rollers in a right-handed spiral shape; and
the contact part is a plurality of left-handed carrying rollers in a left-handed spiral shape,
the right-hand conveying rollers and the left-hand conveying rollers are alternately arranged along the conveying direction.
4. The substrate processing apparatus according to claim 1, wherein,
the carrying roller has a plurality of the contact portions arranged in the width direction,
the plurality of contact portions are each elliptical inclined with respect to the axis.
5. The substrate processing apparatus according to claim 4, wherein,
the carrying roller has:
a rotation shaft extending along the shaft; and
a plurality of roller members fixed to the rotating shaft,
the plurality of roller members have the contact portions, respectively.
6. The substrate processing apparatus according to claim 4 or 5, wherein,
the plurality of carrying rollers include:
a plurality of first conveying rollers; and
a plurality of second carrying rollers are arranged on the upper surface of the frame,
the first conveying rollers and the second conveying rollers are alternately arranged in the conveying direction,
in the width direction, the contact portions of the first conveying roller and the contact portions of the second conveying roller are alternately arranged.
7. The substrate processing apparatus according to any one of claims 1 to 6, wherein,
the treatment liquid supply part is provided with a nozzle for ejecting the treatment liquid,
the transport mechanism further includes at least one cylindrical roller disposed downstream of a discharge position at which the nozzle discharges the treatment liquid,
the cylindrical roller has one cylindrical surface extending in the width direction, and conveys the substrate to the downstream side in the conveying direction by rotating the cylindrical surface about an axis extending in the width direction while bringing the cylindrical surface into contact with the lower surface of the substrate.
8. The substrate processing apparatus according to any one of claims 1 to 7, wherein,
the substrate processing apparatus further has a guide roller that contacts the end portion of the substrate in the width direction.
9. The substrate processing apparatus according to any one of claims 1 to 8, wherein,
the processing liquid is a developing liquid for developing a resist film formed on the upper surface of the substrate.
CN202211276682.XA 2021-10-21 2022-10-18 Substrate processing apparatus Pending CN116009367A (en)

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Application Number Priority Date Filing Date Title
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JP2021172123A JP7408612B2 (en) 2021-10-21 2021-10-21 developing device

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JP (1) JP7408612B2 (en)
KR (1) KR20230057266A (en)
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008174361A (en) * 2007-01-19 2008-07-31 Tokyo Electron Ltd Substrate conveying device
KR20130006987A (en) * 2011-06-28 2013-01-18 삼성전기주식회사 Roller for transferring a substrate
CN205264681U (en) * 2015-03-09 2016-05-25 株式会社思可林集团 Substrate processing apparatus
JP2017100861A (en) * 2015-12-03 2017-06-08 有限会社栗原工業所 Transport device and transport roller

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010232472A (en) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd Substrate transfer device and substrate processing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008174361A (en) * 2007-01-19 2008-07-31 Tokyo Electron Ltd Substrate conveying device
KR20130006987A (en) * 2011-06-28 2013-01-18 삼성전기주식회사 Roller for transferring a substrate
CN205264681U (en) * 2015-03-09 2016-05-25 株式会社思可林集团 Substrate processing apparatus
JP2017100861A (en) * 2015-12-03 2017-06-08 有限会社栗原工業所 Transport device and transport roller

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