CN115942622A - Flexible circuit board steel sheet reinforcing half-etching half-punching process - Google Patents
Flexible circuit board steel sheet reinforcing half-etching half-punching process Download PDFInfo
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- CN115942622A CN115942622A CN202310061373.9A CN202310061373A CN115942622A CN 115942622 A CN115942622 A CN 115942622A CN 202310061373 A CN202310061373 A CN 202310061373A CN 115942622 A CN115942622 A CN 115942622A
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Abstract
The invention provides a steel sheet reinforcing half-etching half-punching process of a flexible circuit board, which comprises the following steps of: cutting the steel sheet into design dimensions; after the steel sheet is subjected to surface treatment of oil removal and micro-etching, the front side and the back side are respectively pasted with photosensitive dry films; exposing and developing the steel sheet to obtain exposed shapes, positioning holes and parts needing half etching; etching and stripping the developed steel sheet to obtain a positioning hole penetrating through the steel sheet and a half-etched layer; sticking thermosetting adhesive on a semi-finished product made of a polyimide copper-clad plate, and drilling a positioning hole; placing the semi-finished flexible circuit board on a release plate; etching the steel sheet after film stripping, and placing the steel sheet on the flexible circuit board semi-finished product; sticking the steel sheet and the semi-finished flexible circuit board; separating the separation plate on the jig from the jig, taking out the flexible circuit board semi-finished product attached with the steel sheet, pressing, and baking to obtain a flexible circuit board semi-finished product with the steel sheet; and sleeving the semi-finished product of the flexible circuit board into a die for punching to obtain a finished product. The invention reduces the tonnage of the punch press and the abrasion of the die.
Description
Technical Field
The invention relates to a flexible circuit board, in particular to a steel sheet reinforced half-etching half-punching process of the flexible circuit board.
Background
The flexible circuit board (FPC for short) is very thin, and some parts need to support components or fix some devices, and must be thickened and hardened, so that some reinforcement needs to be added at the parts, generally, PI, FR4, steel sheets and the like are adhered for reinforcement, the steel sheet with the best hardness for reinforcement is a steel sheet, the thin steel sheet can reach certain hardness, the steel sheet with the hardness being less than 0.3mm is etched or punched to obtain the required size, and then the steel sheets are adhered at the required parts of the flexible circuit board. However, for some parts, steel sheets with the thickness of more than 0.3mm are needed, the appearance of the steel sheets is accurately superposed with the FPC, or local concave surfaces of some parts are needed, the steel sheets are not easy to process by etching and punching, and the steel sheets are difficult to align with the FPC accurately.
Disclosure of Invention
The invention provides a steel sheet reinforcing half-etching half-punching process for a flexible circuit board, and aims to overcome the defects in the prior art, ensure that a die is easy to punch a steel sheet, reduce the tonnage of a punch and the abrasion of the die and prolong the service life of the die.
The technical scheme adopted by the invention for solving the technical problem is as follows:
the flexible circuit board steel sheet reinforcement half-etching half-punching process is characterized in that: the method comprises the following steps:
step 1: cutting the steel sheet into a designed size;
step 2: after the steel sheet is subjected to surface treatment of oil removal and micro-etching, a film sticking machine is used for sticking a photosensitive dry film of 25-50um on the front surface and the back surface respectively;
and step 3: exposing and developing the steel sheet to obtain exposed shapes, positioning holes and parts needing half etching;
and 4, step 4: etching the developed steel sheet by using a horizontal transmission double-sided spraying mode device through an etching solution, and removing the film by using a 3-5% sodium hydroxide solution to obtain a positioning hole penetrating through the steel sheet and a semi-etching layer;
and 5: sticking thermosetting adhesive on a semi-finished product made of a polyimide copper-clad plate, bonding the semi-finished product by a laminator at 100-110 ℃, and drilling a positioning hole by a numerical control drilling machine according to a design file to obtain a flexible circuit board semi-finished product with the positioning hole;
step 6: the jig bottom plate is fixed on the desktop; sleeving the semi-finished flexible circuit board product obtained in the step 5 into a positioning nail of a jig according to a positioning hole, and placing the flexible circuit board product on a release plate; sleeving a jig positioning nail into the steel sheet subjected to the etching film stripping in the step 4 according to the positioning hole, and placing the steel sheet on the flexible circuit board semi-finished product; then the steel sheet is stuck with the semi-finished product of the flexible circuit board;
and 7: lifting the two sides of the separation plate on the jig to separate the separation plate from the jig, taking out the semi-finished flexible circuit board attached with the steel sheet, laminating by using a laminating machine, and baking to obtain the semi-finished flexible circuit board with the steel sheet;
and 8: sleeving the semi-finished flexible circuit board with the steel sheet into a die, and punching to obtain a finished product.
Further: in the step 4, the etching solution comprises 35-40% of ferric trichloride, 0.25-0.30% of ferric dichloride and 10-20% of hydrochloric acid by mass percent.
Further: in the step 4, when the thickness of the half etching layer 8 is 0.05-0.15mm, the positioning hole is just etched through, and the aperture at the minimum diameter position of the positioning hole is 2.0-2.2mm.
Further, the method comprises the following steps: the method for sticking the steel sheet and the semi-finished product of the flexible circuit board in the step 6 comprises the following steps: the periphery and the middle of the steel sheet are pressed by hands, and then a flat head electric iron is used for lightly pressing the periphery of the steel sheet for 2-4 seconds.
Further: the mould in the step 8 is sleeved with a mould made of ASP60 high-speed steel material.
The invention has the advantages that:
according to the invention, firstly, a wire groove or a local concave surface with a certain depth is etched according to the required external dimension after the plate splicing, the thickness of the wire groove or the local concave surface is 0.05-0.15mm is reserved, then, a jig is used for attaching an etched steel sheet to a Flexible Printed Circuit (FPC) according to an alignment hole, after the pressing and the baking, the steel sheet surface is upwards punched according to a positioning hole, and because the steel sheet thickness is only 0.05-0.15mm, a die made of a material with proper hardness is selected for punching, so that the simultaneous punching of the semi-etched steel sheet and the FPC is realized, the die is easy to punch a thinner steel sheet, the tonnage of a punch and the abrasion of the die are reduced, the service life of the die is prolonged, meanwhile, a finished product with the completely consistent steel sheet and the FPC is obtained, and the purpose of accurately coinciding the appearance of the thicker reinforced steel sheet and the FPC is achieved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural view of a steel sheet according to the present invention;
FIG. 2 is a schematic structural view of the steel sheet of FIG. 1 after being pasted with a photosensitive dry film;
FIG. 3 is a schematic view of the structure of FIG. 2 after exposure and development;
FIG. 4 is a schematic diagram of a steel sheet structure after etching and stripping of the structure of FIG. 3;
FIG. 5 is a semi-finished flexible circuit board of the present invention;
FIG. 6 is a schematic view of an alignment fixture according to the present invention;
FIG. 7 is a schematic structural view showing that the semi-finished flexible circuit board of FIG. 5 and the etched and film-removed steel sheet of FIG. 4 are sleeved into a jig;
FIG. 8 is a schematic structural view of a semi-finished product after pressing and baking by the separation jig;
FIG. 9 is a schematic view of the blank structure of FIG. 8 after profile blanking;
FIG. 10 is a schematic structural diagram of another embodiment;
fig. 11 is a schematic view of the finished product of fig. 10 after being subjected to outline die cutting.
Detailed Description
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained according to the drawings without inventive labor. In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. As used in this specification, the terms "upper," "lower," "inner," "outer," "bottom," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The invention comprises the following steps:
step 1: a steel sheet 1 having a predetermined thickness is selected and cut to a desired design size as shown in FIG. 1.
Step 2: after the steel sheet 1 is subjected to surface treatment such as oil removal and micro-etching, a photosensitive dry film 2 and a photosensitive dry film 3 with the thickness of 25-50 microns are attached to the front and back sides of the steel sheet by a film sticking machine, as shown in figure 2.
And step 3: according to the design requirements, after exposure and development, the exposed outline 4 and the exposed outline 5, the positioning hole 6 and the positioning hole 7, and the part 8' needing half etching are obtained, as shown in fig. 3.
And 4, step 4: etching the developed steel sheet 1 by using a horizontal transmission double-sided spraying mode device through an etching solution consisting of 35-40% of ferric trichloride, 0.25-0.30% of ferric dichloride and 10-20% of hydrochloric acid, and then stripping by using 3-5% of sodium hydroxide solution to obtain a positioning hole 6 and a positioning hole 7 penetrating through the steel sheet 1 and a half-etching layer 8, as shown in figure 4.
If the steel sheet is thick, the pressure of the upper and lower spraying is required to be adjusted, so that when the half-etching layer 8 reaches the required thickness of 0.05-0.15mm, the positioning hole 6 and the positioning hole 7 are just etched and penetrated, and the minimum diameter of the positioning hole 6 and the positioning hole 7 is 2.0-2.2mm, thereby facilitating the nesting of the positioning nail in the subsequent process.
And 5: adhering thermosetting adhesive 22 to a semi-finished product 11 made of a polyimide copper-clad plate, adhering the semi-finished product with the thermosetting adhesive at the temperature of 100-110 ℃ by using a laminator, and drilling a positioning hole 66 and a positioning hole 77 by using a numerical control drilling machine according to a design file to obtain a flexible circuit board semi-finished product with the positioning hole, wherein the flexible circuit board semi-finished product is shown in figure 5.
Step 6: the jig base plate a of fig. 6 is fixed to a table top. The semi-finished flexible circuit board of fig. 5 is put on the releasing plate C by inserting the positioning nails B of the jig of fig. 6 into the positioning holes 66 and 77. Sleeving the etched and film-removed steel sheet 1 in the jig positioning nail B according to the positioning hole 6 and the positioning hole 7, and placing the steel sheet on the flexible circuit board semi-finished product; then, the periphery and the middle of the steel sheet 1 are pressed by hands, and then a 35W flat head electric iron is used for lightly pressing the periphery of the steel sheet 1 for 2-4 seconds, because the glue 22 on the semi-finished product of the flexible circuit board is semi-cured glue, the heat of the steel sheet 1 is conducted to the glue surface after being heated, the semi-cured glue is softened, and the steel sheet 1 at the position is stuck with the semi-finished product of the flexible circuit board to play a role of pre-fixing, as shown in figure 7.
And 7: lifting the two sides of the separation plate C on the jig by two hands to separate the two sides from the jig, taking out the semi-finished flexible circuit board attached with the steel sheet 1, laminating by using a laminating machine, and baking at 160 ℃ for 1 hour to obtain the semi-finished flexible circuit board with the steel sheet, as shown in fig. 8.
And 8: sleeving the semi-finished product of the flexible circuit board with the steel sheet in a die made of ASP60 high-speed steel material, and punching to obtain a finished product. The die has certain hardness and toughness, and can punch and cut the steel sheet and the FPC at the same time.
The process firstly half-etches the half-etched layer 8 for 0.05-0.15mm, so that the thickness of the steel sheet in the region of the half-etched layer 8 is reduced, punching is facilitated, the tonnage of a punch press and the abrasion of a die are reduced, and the service life of the die is prolonged.
The half-etching layer 8 can be partially extended according to the structural design requirement by adopting the above process, as shown in fig. 10. Then, a product having the step 81 of the steel sheet 1 can be produced as shown in fig. 11.
The process is also suitable for local steel sheet thinning, firstly, etching a part needing thinning and a concave surface with a certain depth on the appearance of a certain area reinforced by the steel sheet by an etching method, then, attaching the part to be thinned and the concave surface with the certain depth to an FPC (flexible printed circuit), pressing, baking and then punching to obtain an FPC product with the steel sheet having a thin local area and a thick local area.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. The flexible circuit board steel sheet reinforcement half-etching half-punching process is characterized in that: the method comprises the following steps:
step 1: cutting the steel sheet into a designed size;
and 2, step: after the steel sheet is subjected to surface treatment of oil removal and micro-etching, a photosensitive dry film of 25-50um is respectively stuck to the front surface and the back surface by a film sticking machine;
and 3, step 3: exposing and developing the steel sheet to obtain exposed shapes, positioning holes and parts needing half etching;
and 4, step 4: etching the developed steel sheet by using a horizontal transmission double-sided spraying mode device through an etching solution, and then removing the film by using a 3-5% sodium hydroxide solution to obtain a positioning hole penetrating through the steel sheet and a semi-etching layer;
and 5: sticking thermosetting adhesive on a semi-finished product made of a polyimide copper-clad plate, bonding the semi-finished product by a laminator at 100-110 ℃, and drilling a positioning hole by a numerical control drilling machine according to a design file to obtain a flexible circuit board semi-finished product with the positioning hole;
and 6: the jig bottom plate is fixed on the desktop; sleeving the semi-finished flexible circuit board in the step 5 into a positioning nail of a jig according to the positioning hole, and placing the semi-finished flexible circuit board on a release plate; sleeving a jig positioning nail into the steel sheet subjected to the etching film stripping in the step 4 according to the positioning hole, and placing the steel sheet on the flexible circuit board semi-finished product; then the steel sheet is stuck with the semi-finished product of the flexible circuit board;
and 7: lifting the two sides of the separation plate on the jig to separate the separation plate from the jig, taking out the semi-finished product of the flexible circuit board attached with the steel sheet, pressing the semi-finished product of the flexible circuit board by using a laminating machine, and baking to obtain the semi-finished product of the flexible circuit board with the steel sheet;
and 8: sleeving the semi-finished product of the flexible circuit board with the steel sheet into a die, and punching to obtain a finished product.
2. The flexible circuit board steel sheet reinforcement half-etching half-punching process of claim 1, wherein: in the step 4, the etching solution comprises 35-40% of ferric trichloride, 0.25-0.30% of ferric dichloride and 10-20% of hydrochloric acid by mass percent.
3. The flexible circuit board steel sheet reinforcement half-etching half-punching process of claim 1, wherein: in the step 4, when the thickness of the half etching layer 8 is 0.05-0.15mm, the positioning hole is just etched through, and the aperture at the minimum diameter position of the positioning hole is 2.0-2.2mm.
4. The flexible circuit board steel sheet reinforcement half-etching half-punching process of claim 1, wherein: the method for sticking the steel sheet and the semi-finished product of the flexible circuit board in the step 6 comprises the following steps: the periphery and the middle of the steel sheet are pressed by hands, and then the flat head electric soldering iron is used for lightly pressing the periphery of the steel sheet for 2-4 seconds.
5. The flexible circuit board steel sheet reinforcement half-etching half-punching process of claim 1, wherein: the mould in the step 8 is sleeved with a mould made of ASP60 high-speed steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310061373.9A CN115942622A (en) | 2023-01-18 | 2023-01-18 | Flexible circuit board steel sheet reinforcing half-etching half-punching process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310061373.9A CN115942622A (en) | 2023-01-18 | 2023-01-18 | Flexible circuit board steel sheet reinforcing half-etching half-punching process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115942622A true CN115942622A (en) | 2023-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310061373.9A Pending CN115942622A (en) | 2023-01-18 | 2023-01-18 | Flexible circuit board steel sheet reinforcing half-etching half-punching process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115942622A (en) |
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2023
- 2023-01-18 CN CN202310061373.9A patent/CN115942622A/en active Pending
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