CN112040630A - Processing method of super-thick special-shaped reinforcing sheet of flexible circuit - Google Patents

Processing method of super-thick special-shaped reinforcing sheet of flexible circuit Download PDF

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Publication number
CN112040630A
CN112040630A CN202010738574.4A CN202010738574A CN112040630A CN 112040630 A CN112040630 A CN 112040630A CN 202010738574 A CN202010738574 A CN 202010738574A CN 112040630 A CN112040630 A CN 112040630A
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Prior art keywords
layer
reinforcing
sheet
pet
base layer
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Pending
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CN202010738574.4A
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杜庆东
黄栋
黄庆
彭媛
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Shenzhen Xindahui Flex Circuit Technology Co ltd
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Shenzhen Xindahui Flex Circuit Technology Co ltd
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Priority to CN202010738574.4A priority Critical patent/CN112040630A/en
Publication of CN112040630A publication Critical patent/CN112040630A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a processing method of an ultra-thick special-shaped reinforcing sheet of a flexible circuit, which comprises the following steps: a, cutting a reinforcing sheet raw material into small reinforcing sheets, routing grooves and/or routing holes on the cut reinforcing sheets according to design requirements by using a slot cutter, wherein the routing grooves and the routing holes comprise functional holes and positioning holes, the reinforcing sheets comprise reinforcing base layers, adhesive layers and release paper layers, the thickness of each reinforcing base layer is more than or equal to 0.35mm, and the thickness is defined as an ultra-thick reinforcing sheet; removing the release paper layer, bonding the reinforcing base layer after the release paper layer is removed on a PET sheet, coating an acrylic acid adhesive layer on a PET substrate layer of the PET sheet, and leaving a blank of the acrylic acid adhesive layer which is not bonded with the reinforcing base layer on the part of the PET substrate layer; and D, adhering the PET sheets adhered with the reinforcing base layer on the rolled protective film one by one according to a set rule, adhering the protective film to the blank of the acrylic adhesive layer, and combining the PET bearing single sheet with the adhesive and the reinforcing sheet in a crossed manner to realize the purpose of automatic lamination of the rolled material.

Description

Processing method of super-thick special-shaped reinforcing sheet of flexible circuit
Technical Field
The invention relates to the technical field of flexible circuit board processing, in particular to a processing method of an ultra-thick special-shaped reinforcing sheet of a flexible circuit.
Background
A Flexible Printed Circuit (FPC), also called a Flexible Printed Circuit (FPC), has been widely used because of its excellent characteristics such as light weight, thin thickness, and free bending and folding.
The flexible circuit board is thinned, so that the quality requirement of the product is continuously improved, the local part of the product needs to be reinforced, and the thickness of the reinforced part is also continuously increased. For the special-shaped reinforcing sheet with the thickness of more than 0.35mm and the small hole and the slotted hole, the reinforcing sheet can be made of polyimide PI, glass cloth substrate FR4 or other materials, various problems can be caused in the manufacturing process of the FPC of the thick reinforcing sheet, and finally, the thick reinforcing sheet can only be manually attached by a single PCS (printed Circuit Board), so that the attaching progress and efficiency can not be ensured during batch production.
Disclosure of Invention
In view of the above, the invention provides a processing method of an ultra-thick special-shaped reinforcing sheet of a flexible circuit, which changes a material preparation mode to solve the problem and realizes the purpose of automatic coil material laminating by cross-bonding of a PET bearing single sheet with glue and the reinforcing sheet.
A processing method of an ultra-thick special-shaped reinforcing sheet of a flexible circuit comprises the following steps:
a, cutting a reinforcing sheet raw material into small reinforcing sheets, and routing grooves and/or routing holes on the cut reinforcing sheets according to design requirements by using a slot cutter, wherein the reinforcing sheets comprise a reinforcing base layer, an adhesive layer and a release paper layer, and the thickness of the reinforcing base layer is more than or equal to 0.35 mm;
the raw material of the reinforcing sheet can be in a roll shape or a sheet shape, the reinforcing sheet with the thickness of more than or equal to 0.35mm is defined as an ultra-thick reinforcing sheet, the shape of the reinforcing sheet with the special-shaped finger is special, irregular or non-rectangular, and the technical scheme provided by the invention can be used for processing the reinforcing sheet with the conventional shape;
removing the release paper layer, bonding the reinforcing base layer after the release paper layer is removed on a PET sheet, coating an acrylic acid adhesive layer on a PET substrate layer of the PET sheet, and leaving a blank of the acrylic acid adhesive layer which is not bonded with the reinforcing base layer on the part of the PET substrate layer;
the raw material of the PET sheet can also be sheet-shaped or rolled, an acrylic adhesive with strong strength can be coated before the step B, or the PET sheet can also be coated with the acrylic adhesive, a release sheet-shaped material is arranged on the surface of the PET sheet, and the release sheet-shaped material is removed before the step B.
And D, adhering the PET sheets adhered with the reinforcing base layer to the rolled protective film one by one according to a set rule, and adhering the protective film to the blank of the acrylic acid adhesive layer.
The Polyethylene terephthalate (PET) in the PET is the most main variety in thermoplastic polyester, and is called PET or PEIT (hereinafter referred to as PET) in English, and is commonly called polyester resin. It is a polycondensate of terephthalic acid and ethylene glycol, together with PBT, generally referred to as thermoplastic polyester, or saturated polyester.
The acrylic adhesive can be replaced by other adhesive materials.
The release paper layer is a consumable material commonly used in FPC production, and has an important function of isolating, filling and protecting finished products, semi-finished products and raw materials. During FPC processing, the raw materials or semi-finished products are often required to be filmed, and during another procedure, the film is required to be torn.
Preferably, in the step B, the bonding the reinforcing base layer from which the release paper layer is removed to the PET sheet includes:
B1. manually pre-sticking, namely sticking the adhesive layer of the reinforcing plate and the acrylic acid adhesive layer of the PET sheet together at least on one edge of the reinforcing base layer and the PET sheet;
B2. stripping a part of the PET substrate layer from the reinforcing base layer, and leaving a local bonding part of more than 10-20 MM;
sending the local bonding part into a roller press, and placing the reinforcing base layer below;
through last gyro wheel and gyro wheel roll-in down and drive effect, realize that PET substrate layer and reinforcement basic unit closely laminate.
Cutting the polyimide reinforcing sheet coil material by a cutter cutting machine, cutting by a fixed size, and quickly and sequentially cutting off the polyimide reinforcing sheet and the intermolecular connection of the release paper material by utilizing the pressure of a metal cutting edge. The reinforcing sheet is larger than 0.35mm in theoretical thickness, large in cross section area and high in shearing strength due to large cohesive force, the release paper peeling phenomenon is easy to occur, and the reinforcing sheet is not suitable for special-shaped processing, groove routing or drilling. The rapid cutting alleviates the peeling phenomenon caused by the weaker adhesive during cutting. Have under the polyimide coil stock to leave type paper, it is poor from type paper pliability, and the polyimide reinforcement piece has certain pliability, because the pulling force is uneven, the reinforcement piece produces elastic deformation and is different from the elastic deformation who leaves type paper, arouses easily to peel off the phenomenon.
Preferably, in the step B, the linear speed of the upper roller and the lower roller is 20-50 m/h, the rolling pressure of the upper roller and the lower roller is 0.2-0.4 MPa, and the rolling temperature is 90-110 ℃;
in the roll-in process, the reinforcement basic unit is at the level setting down, and the PET substrate layer of peeling off becomes 35 ~ 50 jiaos with the reinforcement basic unit and gradually sends into between last gyro wheel and the lower gyro wheel, sends into the in-process and applys 0.3 ~ 0.7 KN's traction force to the PET substrate layer.
In the rolling process, the PCT substrate layer is kept in a certain tension state, so that the crimping is avoided, and no air bubble, no layering and no warping are needed after rolling.
Preferably, after step B, before step D, the method further comprises:
c, performing shape cutting on the PET substrate layer and the reinforcing base layer which are bonded together in a laser cutting mode, and positioning through the routing groove or/and the routing hole formed in the step A in the shape cutting process; cutting two sides of the PET substrate layer in the length direction into saw-toothed edges;
in the step D: every piece of PET substrate layer after the cutting bonds in proper order on the rolled-up protection film, and the cockscomb structure limit of one side of every piece of PET substrate layer can laminate with the cockscomb structure limit of another piece of PET substrate layer of adjacent side.
The special-shaped structure is processed after the PCT substrate layer is adhered, so that the separation of release paper and the reinforcing sheet can be avoided, and the yield is improved.
Preferably, in step C: when the PET substrate layer and the reinforcing base layer are cut by laser to carry out shape cutting, the reinforcing base layer is arranged on the upper side;
in the step A: the reinforcing sheet which cuts the raw material of the reinforcing sheet into small pieces is punched in a fast punching mode.
Preferably, in the step a, routing and/or routing the groove and/or the hole on the cut reinforcing sheet by using a groove cutter according to design requirements includes:
overlapping the reinforcing sheets to be cut together, and using a phenolic aldehyde plate as a drilling plate at the bottom layer and the uppermost layer respectively;
and then the four corners are stuck by using adhesive paper, the groove and the hole are milled by using the adhesive paper for fixing on the peripheral side of the phenolic aldehyde plate, one side of the adhesive paper is stuck on the edge of the phenolic aldehyde plate, and the other side of the adhesive paper is stuck on the table top of the drilling machine.
Preferably, step B further comprises:
and manufacturing an array blind hole on one surface of the PET substrate layer, which is far away from the acrylic adhesive layer, wherein the depth of the blind hole is less than or equal to 30% of that of the PCT substrate layer, and the total area of the array blind hole is 20% -40% of the surface area of the PCT substrate layer. The purpose of making the array blind holes is to improve the flexibility of the PET substrate and facilitate the making of coiled materials.
Preferably, in the step B, before the reinforcing base layer from which the release paper layer is removed is bonded to the PET sheet, the method further includes:
and (3) viscosity reduction treatment, namely adhering and removing the adhesive layer on the surface of the reinforcing base layer after the release paper layer by using a clean release sheet, wherein a micro synapse is arranged on the surface of the release sheet, a nano brush is arranged on the surface of the micro synapse, the height of the micro synapse is 10-50 mu m, the length of the nano brush is 50-300 nm, and the diameter of bristles of the nano brush is 100-300 nm. The bonding force can be ensured by only depending on the acrylic acid adhesive, the adhesive layer of the reinforcing base layer is removed, the bonding force between the acrylic acid adhesive and the reinforcing base layer is enhanced, and the yield is improved.
Preferably, the tack reducing treatment is performed 2 or more times, the first tack reducing treatment and the second tack reducing treatment are performed in a staggered manner, and 50% to 75% of the surface area of the adhesive layer is subjected to the tack reducing treatment.
Preferably, the acrylic adhesive layer coated on the PET substrate layer is coated in a non-uniform manner;
the acrylic acid adhesive layer coated on the positions corresponding to the routing grooves and the routing holes is blank, so that the acrylic acid adhesive is prevented from adhering dust;
the thickness of the part, not pasted with the reinforcing base layer, of the acrylic adhesive layer is 1.1-1.3 times that of the part pasted with the reinforcing base layer, so that the binding force of the acrylic adhesive and the protective film can be improved.
The invention has the beneficial effects that: the invention discloses a processing method of an ultra-thick special-shaped reinforcing sheet of a flexible circuit, which comprises the following steps: a, cutting a reinforcing sheet raw material into small reinforcing sheets, routing grooves and/or routing holes on the cut reinforcing sheets according to design requirements by using a slot cutter, wherein the routing grooves and the routing holes comprise functional holes and positioning holes, the reinforcing sheets comprise reinforcing base layers, adhesive layers and release paper layers, the thickness of each reinforcing base layer is more than or equal to 0.35mm, and the thickness is defined as an ultra-thick reinforcing sheet; removing the release paper layer, bonding the reinforcing base layer after the release paper layer is removed on a PET sheet, coating an acrylic acid adhesive layer on a PET substrate layer of the PET sheet, and leaving a blank of the acrylic acid adhesive layer which is not bonded with the reinforcing base layer on the part of the PET substrate layer; b, performing shape cutting on the PET substrate layer and the reinforcing base layer which are bonded together in a laser cutting mode, and positioning through the routing groove or/and routing hole formed in the step A in the shape cutting process; cutting two sides of the PET substrate layer in the length direction into saw-toothed edges; in the step D: every piece PET substrate layer after the cutting bonds in proper order on web-like protection film, and the cockscomb structure limit of one side of every piece PET substrate layer can laminate with the cockscomb structure limit of another piece PET substrate layer of adjacent side, and the protection film bonds with acrylic acid gluing agent layer blank, and the area is glued PET and is born monolithic and reinforcement piece cross bonding, realizes the purpose of the automatic laminating of coil stock.
Drawings
The following describes the processing method of the ultra-thick special-shaped reinforcing sheet of the flexible circuit in the invention with reference to the attached drawings.
FIG. 1 is a schematic flow chart of a method for processing an ultra-thick profiled reinforcing sheet for a flexible circuit according to the present invention.
FIG. 2 is a schematic structural diagram of a reinforcing sheet material punched by the method for processing an ultra-thick profiled reinforcing sheet for a flexible circuit according to the present invention.
FIG. 3 is a schematic structural diagram of a PET sheet material for a method of manufacturing an ultra-thick profiled reinforcing sheet for a flexible circuit according to the present invention.
Fig. 4 is a schematic structural diagram of a rolling process of the method for processing the ultra-thick profiled reinforcing sheet of the flexible circuit.
FIG. 5 is a partial enlarged view of the reinforcing sheet roll after being unwound, wherein the reinforcing sheet roll is manufactured by the method for processing the ultra-thick special-shaped reinforcing sheet of the flexible circuit.
FIG. 6 is a schematic diagram of the structure of the extra-thick special-shaped reinforcing sheet of the flexible circuit after the reinforcing sheet roll material manufactured by the method for processing the extra-thick special-shaped reinforcing sheet is unfolded.
FIG. 7 is a cross-sectional view of a reinforcing plate manufactured by the method for manufacturing an ultra-thick special-shaped reinforcing plate for a flexible circuit according to the present invention.
In the figure:
1-a reinforcing sheet; 11-a reinforcing base layer; 12-an adhesive layer; 13-a release paper layer; the PET substrate layer 21 of the 2-PET sheet 2 is coated with an acrylic adhesive layer 22.
Detailed Description
The following describes a method for processing an ultra-thick special-shaped reinforcing sheet of a flexible circuit according to the present invention with reference to fig. 1 to 7.
A processing method of an ultra-thick special-shaped reinforcing sheet of a flexible circuit comprises the following steps:
a, cutting a reinforcing sheet raw material into small reinforcing sheets 1, routing grooves and/or routing holes on the cut reinforcing sheets 1 by using a slot cutter according to design requirements, wherein each reinforcing sheet 1 comprises a reinforcing base layer 11, an adhesive layer 12 and a release paper layer 13, and the thickness of the reinforcing base layer 11 is more than or equal to 0.35 mm;
step B, removing the release paper layer 13, bonding the reinforcing base layer 11 after the release paper layer 13 is removed on the PET sheet 2, coating an acrylic acid adhesive layer 22 on a PET substrate layer 21 of the PET sheet 2, and leaving a blank of the acrylic acid adhesive layer 22 which is not bonded with the reinforcing base layer 11 on part of the PET substrate layer 21;
and D, adhering the PET sheets 2 adhered with the reinforcing base layer 11 on the rolled protective film 5 one by one according to a set rule, and adhering the protective film 5 to the blank of the acrylic acid adhesive layer 22.
In this embodiment, in the step B, bonding the reinforcing base layer 11 after removing the release paper layer 13 to the PET sheet 2 includes:
B1. manually pre-sticking, namely sticking the adhesive layer 12 of the reinforcing plate and the acrylic acid adhesive layer 22 of the PET sheet 2 to at least one edge of the reinforcing base layer 11 and the PET sheet 2;
B2. stripping a part of the PET substrate layer 21 from the reinforcing base layer 11, and leaving a partial bonding part of more than 10-20 MM, wherein the partial bonding part is a non-functional part and can be cut off finally;
sending the local bonding part into a roller press with the reinforcing base layer 11 below;
through the roll-in and drive effect of last gyro wheel 31 and lower gyro wheel 32, realize that PET substrate layer 21 and reinforcement basic unit 11 closely laminate.
In the embodiment, in the step B, the linear speed of the upper roller 31 and the lower roller 32 is 20-50 m/h, the rolling pressure of the upper roller 31 and the lower roller 32 is 0.2-0.4 MPa, and the rolling temperature is 90-110 ℃;
in the rolling process, the reinforcing base layer 11 is horizontally arranged below, the peeled PET base layer 21 and the reinforcing base layer 11 are gradually sent into a position between the upper roller 31 and the lower roller 32 at an angle of 35-50 degrees, and the PET base layer 21 is applied with a traction force of 0.3-0.7 KN in the sending process.
In this embodiment, after step B, before step D, the method further includes:
step C, performing shape cutting on the PET substrate layer 21 and the reinforcement base layer 11 which are bonded together in a laser cutting mode, wherein the shape cutting can also comprise cutting and processing of a special-shaped hole or a special-shaped groove, and positioning through the gong groove or/and the gong hole formed in the step A in the shape cutting process; both sides of the PET substrate layer 21 in the longitudinal direction are cut into serrated edges 211;
in the step D: each cut PET substrate layer 21 is sequentially bonded to the roll-shaped protective film 5, and the serrated edge 211 of one side of each PET substrate layer 21 can be bonded to the serrated edge 211 of the other adjacent side of the PET substrate layer 21.
In this embodiment, in step C: when the PET substrate layer 21 and the reinforcing base layer 11 are cut by laser to perform shape cutting, the reinforcing base layer 11 is arranged on the upper side;
in the step A: the reinforcing sheet 1 is cut into small pieces from the raw material of the reinforcing sheet 1 by punching.
In this embodiment, in step a, routing a groove and/or a hole on the cut reinforcing sheet 1 according to design requirements by using a groove cutter includes:
overlapping the reinforcing pieces 1 to be cut together, and using a phenolic aldehyde plate as a drilling plate at the bottom layer and the uppermost layer respectively;
and then the four corners are stuck by using adhesive paper, the groove and the hole are milled by using the adhesive paper for fixing on the peripheral side of the phenolic aldehyde plate, one side of the adhesive paper is stuck on the edge of the phenolic aldehyde plate, and the other side of the adhesive paper is stuck on the table top of the drilling machine.
In this embodiment, before the step B, the method further includes:
an array blind hole is manufactured on one surface of the PET substrate layer 21, which is far away from the acrylic adhesive layer 22, the depth of the blind hole is less than or equal to 30% of that of the PCT substrate layer, and the total area of the array blind hole is 20% -40% of the surface area of the PCT substrate layer.
In this embodiment, in the step B, before bonding the reinforcing base layer 11 after removing the release paper layer 13 to the PET sheet 2, the method further includes:
and (3) viscosity reduction treatment, namely adhering and removing the adhesive layer 12 on the surface of the reinforcing base layer 11 after the release paper layer 13 is removed by using a clean release sheet, wherein the surface of the release sheet is provided with a micro synapse, the surface of the micro synapse is provided with a nano brush, the height of the micro synapse is 10-50 micrometers, the length of the nano brush is 50-300 nm, and the diameter of bristles of the nano brush is 100-300 nm.
In this example, the tack reducing treatment was performed 2 times or more, the first tack reducing treatment and the second tack reducing treatment were performed in a staggered manner, and 50% to 75% of the surface area of the adhesive layer 12 was subjected to the tack reducing treatment.
The acrylic adhesive layer subjected to viscosity reducing treatment is bonded with the reinforcing base layer as tightly as possible, so that the yield of the reinforcing base layer is improved.
In this embodiment, the acrylic adhesive layer 22 coated on the PET substrate layer 21 is coated non-uniformly;
the acrylic acid adhesive layer 22 coated on the positions corresponding to the routing grooves and the routing holes is blank;
the thickness of the acrylic adhesive layer 22 at the position where the reinforcing base layer 11 is not attached is 1.1 to 1.3 times that of the position where the reinforcing base layer 11 is attached.
The foregoing is only a preferred embodiment of this invention and it should be noted that modifications can be made by those skilled in the art without departing from the principle of the invention and these modifications should also be considered as the protection scope of the invention.

Claims (10)

1. A processing method of an ultra-thick special-shaped reinforcing sheet of a flexible circuit is characterized by comprising the following steps:
a, cutting a reinforcing sheet raw material into small reinforcing sheets, and routing grooves and/or routing holes on the cut reinforcing sheets according to design requirements by using a slot cutter, wherein the reinforcing sheets comprise a reinforcing base layer, an adhesive layer and a release paper layer, and the thickness of the reinforcing base layer is more than or equal to 0.35 mm;
removing the release paper layer, bonding the reinforcing base layer after the release paper layer is removed on a PET sheet, coating an acrylic acid adhesive layer on a PET substrate layer of the PET sheet, and leaving a blank of the acrylic acid adhesive layer which is not bonded with the reinforcing base layer on the part of the PET substrate layer;
and D, bonding the PET sheets bonded with the reinforcing base layer on a rolled protective film one by one according to a set rule, wherein the protective film is bonded with the blank of the acrylic acid adhesive layer.
2. The method of manufacturing an extra thick profiled reinforcing sheet for flexible circuits as defined in claim 1, wherein said step B of bonding the reinforcing base layer with the release paper layer removed to the PET sheet includes:
B1. manually pre-sticking, namely sticking the adhesive layer of the reinforcing plate and the acrylic acid adhesive layer of the PET sheet together at least on one edge of the reinforcing base layer and one edge of the PET sheet;
B2. stripping a part of the PET substrate layer from the reinforcing base layer, and leaving a partial bonding part of more than 10-20 MM;
sending the local bonding part into a roller press, and placing the reinforcing base layer below;
through last gyro wheel and gyro wheel roll-in down and drive effect, realize that PET substrate layer and reinforcement basic unit closely laminate.
3. The method for processing the ultra-thick profiled reinforcing sheet of the flexible circuit according to claim 2, wherein in the step B, the linear speed of the upper roller and the lower roller is 20 to 50m/h, the rolling pressure of the upper roller and the lower roller is 0.2 to 0.4MPa, and the rolling temperature is 90 to 110 ℃;
in the roll-in process, the reinforcement basic unit is at the level setting down, and the PET substrate layer of peeling off becomes 35 ~ 50 jiaos with the reinforcement basic unit and gradually sends into between last gyro wheel and the lower gyro wheel, sends into the in-process and applys 0.3 ~ 0.7 KN's traction force to the PET substrate layer.
4. The method of manufacturing an ultra-thick profiled stiffener for a flexible circuit according to claim 3, wherein after step B and before step D further comprises:
c, performing shape cutting on the PET substrate layer and the reinforcing base layer which are bonded together in a laser cutting mode, and positioning through the routing groove or/and the routing hole formed in the step A in the shape cutting process; two sides of the PET substrate layer in the length direction are cut into saw-toothed edges;
in the step D: every piece of PET substrate layer after the cutting bonds in proper order on the rolled-up protection film, and the cockscomb structure limit of one side of every piece of PET substrate layer can laminate with the cockscomb structure limit of another piece of PET substrate layer of adjacent side.
5. The method for processing the ultra-thick profiled reinforcing sheet of the flexible circuit as claimed in claim 4, wherein in the step C: when the PET substrate layer and the reinforcing base layer are cut by laser to carry out shape cutting, the reinforcing base layer is arranged on the upper side;
in the step A: the reinforcing sheet is cut into small pieces by punching.
6. The method for processing the ultra-thick special-shaped reinforcing sheet of the flexible circuit according to claim 5, wherein in the step A, the step of routing the groove and/or the hole on the cut reinforcing sheet by using a groove cutter according to the design requirement comprises the following steps:
overlapping the reinforcing sheets to be cut together, and using a phenolic aldehyde plate as a drilling plate at the bottom layer and the uppermost layer respectively;
and then sticking the four corners with adhesive paper, fixing the groove and the hole on the periphery of the phenolic plate by using the adhesive paper when the groove and the hole are milled, sticking one side of the adhesive paper on the edge of the phenolic plate, and sticking the other side of the adhesive paper on the table top of the drilling machine.
7. The method of manufacturing an ultra-thick profiled stiffener for a flexible circuit of claim 6, wherein step B is preceded by the steps of:
and manufacturing an array blind hole on one surface of the PET substrate layer, which is far away from the acrylic acid adhesive layer, wherein the depth of the blind hole is less than or equal to 30% of that of the PCT substrate layer, and the total area of the array blind hole is 20% -40% of the surface area of the PCT substrate layer.
8. The method of manufacturing an extra thick profiled reinforcing sheet for flexible circuits as defined in claim 7, wherein said step B further comprises, before bonding the reinforcing base layer with the release paper layer removed to the PET sheet, the steps of:
and (3) viscosity reduction treatment, namely bonding the adhesive layer on the surface of the reinforcing base layer with the release paper layer removed by using a clean release sheet, wherein a micro synapse is arranged on the surface of the release sheet, a nano brush is arranged on the surface of the micro synapse, the height of the micro synapse is 10-50 mu m, the length of the nano brush is 50-300 nm, and the diameter of bristles of the nano brush is 100-300 nm.
9. The method of manufacturing an extra thick profiled reinforcing sheet for flexible circuits according to claim 8,
the visbreaking treatment is carried out for more than 2 times, the first visbreaking treatment and the second visbreaking treatment are carried out in a staggered mode, and 50% -75% of the surface area of the adhesive layer is subjected to the visbreaking treatment.
10. The method of manufacturing an ultra-thick profiled stiffener for a flexible circuit of claim 9 wherein said PET substrate layer is coated with an acrylic adhesive layer that is non-uniformly coated;
the acrylic acid adhesive layer coated on the positions corresponding to the gong groove and the gong hole is blank;
the thickness of the part, not pasted with the reinforcing base layer, of the acrylic adhesive layer is 1.1-1.3 times that of the part pasted with the reinforcing base layer.
CN202010738574.4A 2020-07-28 2020-07-28 Processing method of super-thick special-shaped reinforcing sheet of flexible circuit Pending CN112040630A (en)

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CN202010738574.4A CN112040630A (en) 2020-07-28 2020-07-28 Processing method of super-thick special-shaped reinforcing sheet of flexible circuit

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Application Number Priority Date Filing Date Title
CN202010738574.4A CN112040630A (en) 2020-07-28 2020-07-28 Processing method of super-thick special-shaped reinforcing sheet of flexible circuit

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113923874A (en) * 2021-10-22 2022-01-11 恒赫鼎富(苏州)电子有限公司 FPC auxiliary material secondary multiple laminating method
CN114126199A (en) * 2021-11-29 2022-03-01 上海温良昌平电器科技股份有限公司 Bending reinforced aluminum-copper substrate and manufacturing process thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113923874A (en) * 2021-10-22 2022-01-11 恒赫鼎富(苏州)电子有限公司 FPC auxiliary material secondary multiple laminating method
CN114126199A (en) * 2021-11-29 2022-03-01 上海温良昌平电器科技股份有限公司 Bending reinforced aluminum-copper substrate and manufacturing process thereof

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