CN116321722A - Lamination method for reinforcing flexible circuit board with different thicknesses - Google Patents

Lamination method for reinforcing flexible circuit board with different thicknesses Download PDF

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Publication number
CN116321722A
CN116321722A CN202310052668.XA CN202310052668A CN116321722A CN 116321722 A CN116321722 A CN 116321722A CN 202310052668 A CN202310052668 A CN 202310052668A CN 116321722 A CN116321722 A CN 116321722A
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CN
China
Prior art keywords
flexible circuit
circuit board
steel sheet
thickness
semi
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Pending
Application number
CN202310052668.XA
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Chinese (zh)
Inventor
叶华
杨贤伟
吴邦华
陈清福
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Fujian Shizhuo Electronic Technology Co ltd
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Fujian Shizhuo Electronic Technology Co ltd
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Priority to CN202310052668.XA priority Critical patent/CN116321722A/en
Publication of CN116321722A publication Critical patent/CN116321722A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention provides a laminating method for reinforcing flexible circuit boards with different thicknesses, which is characterized by comprising the following steps of: copper foil on the flexible circuit board is etched to obtain a plurality of groups of alignment mark lines; attaching a plurality of pure adhesives to the alignment mark line range of the flexible circuit board; attaching the reinforcement on the pure adhesive to obtain a semi-finished product; designing a plurality of grb files, wherein each grb file corresponds to one thickness reinforcement; selecting a steel sheet, wherein the thickness of the steel sheet is larger than the thickness of the maximum thickness reinforcement, and adopting a method of pasting a photosensitive dry film, exposing, developing and etching in a divided manner to obtain a lamination auxiliary steel sheet; overlapping and sleeving the semi-finished product and the pressing auxiliary steel sheet for checking; the positioning strip is stuck on the silicon rubber of the laminating machine by using a high-temperature adhesive tape; placing the superposition into a check; placing the semi-finished product according to the positioning of the laminating machine silicone rubber, and stacking the lamination auxiliary steel sheet on the semi-finished product; and then pressing. The invention attaches reinforcements with different thicknesses to different parts of the flexible circuit board, and adopts a one-time lamination process method.

Description

Lamination method for reinforcing flexible circuit board with different thicknesses
Technical Field
The invention relates to a flexible circuit board structure, in particular to a lamination method for reinforcing flexible circuit boards with different thicknesses.
Background
The flexible circuit board is mainly characterized by softness, but certain thickness and hardness are required at certain parts due to the requirements of structures, mounting devices, connecting golden fingers and the like, and reinforcement with different thickness is attached to different parts of the flexible circuit board to meet the requirements of thickness and hardness. The technology adopted at present is that the thin reinforcement is firstly pasted and pressed firstly, the thick reinforcement is then pasted and pressed later, if more than 2 reinforcements with different thicknesses are arranged, the pressing is needed for more than 2 times, thus the production efficiency is lower, the time is wasted, the electric energy is increased, and the cost is higher. If one method is adopted to press the reinforcement with different thickness at one time, the production efficiency is greatly improved.
Disclosure of Invention
The invention provides a lamination method for reinforcing flexible circuit boards with different thicknesses, which aims to solve the defects in the prior art, and the lamination method is characterized in that reinforcements with different thicknesses are laminated on different parts of the flexible circuit boards, and the defect that the reinforcements with different thicknesses need to be laminated from thin to thick in a plurality of times is overcome by adopting a one-time lamination process.
The technical scheme adopted for solving the technical problems is as follows:
the laminating method for reinforcing the flexible circuit board with different thicknesses is characterized by comprising the following steps of:
step 1: etching the copper foil of the flexible copper-clad plate according to the positions, needing to be pasted with reinforcements with different thicknesses, of the flexible circuit board to obtain a plurality of groups of alignment mark lines;
step 2: attaching a plurality of pure adhesives to the alignment mark line range of the flexible circuit board;
step 3: attaching reinforcements with different thicknesses to the corresponding pure adhesive; or an automatic reinforcing machine is adopted to attach on the corresponding pure adhesive to obtain a semi-finished product;
step 4: manufacturing of pressing auxiliary steel sheets: designing a plurality of grb files, wherein each grb file corresponds to one thickness reinforcement;
selecting a steel sheet, wherein the thickness of the steel sheet is larger than the thickness of the reinforcement with the maximum thickness, and adopting a method of sticking a photosensitive dry film, exposing, developing and etching in a divided manner:
pasting a dry film for the first time, exposing, developing, etching and stripping the film by using a first grb file to obtain the thickness of a first area;
a dry film is pasted for the second time, and a second grb file is used for exposing, developing, etching and film stripping to obtain the thickness of a second area;
repeating the above steps; thereby obtaining the pressing auxiliary steel sheet which is abdied at the reinforcing parts with different thicknesses of the flexible circuit board;
step 5: overlapping and checking the semi-finished product obtained in the step 3 and the lamination auxiliary steel sheet manufactured in the step 4;
step 6: the positioning strips are stuck on three sides of the silicon rubber of the laminating machine by using a high-temperature adhesive tape according to the makeup size, and the positioning strips are U-shaped; and putting the superposition in the step 5 into inspection;
step 7: placing the semi-finished product obtained in the step 3 according to the positioning of the silicone rubber of the laminating machine, and stacking the lamination auxiliary steel sheet on the semi-finished product; and then pressing.
Further: in step 2: the pure glue is attached in the alignment mark line range of the flexible circuit board by a manual attaching or automatic attaching machine.
Further: in step 3: the reinforcement is attached to the pure rubber by a manual or automatic reinforcing machine.
Further: in step 4: and manufacturing the pressing auxiliary steel sheet, processing by adopting a laser or plasma cutting mode according to the design file, and carrying out microetching treatment to obtain the areas with various thicknesses.
Further: step 6: the positioning strip adopts an FR-4 glass fiber board, the width is 10mm, and the thickness is 0.15mm lower than the height of the semi-finished product and the auxiliary steel sheet after being overlapped;
step 7: firstly, placing a semi-finished product according to the positioning of a silicon rubber of a laminating machine in a trilateral positioning mode, and then stacking a lamination auxiliary steel sheet on the semi-finished product in the trilateral positioning mode; and then pressing.
Further: in step 7: the lamination parameters are as follows: the temperature is 180 ℃; prepressing: the pressure is 3-4Mpa and the time is 15-30S; and (3) forming: the pressure is 2-3Mpa and the time is 150-200S.
The invention has the advantages that:
the invention adopts the abdication mode of pressing auxiliary steel sheets on the reinforcing parts with different thicknesses of the flexible circuit board, and the positioning mode of arranging the three-side positioning strips on the silicon rubber buffer pad of the laminating machine according to the area of the flexible circuit board, and sets proper lamination parameters, so that the reinforcing parts with different thicknesses on the flexible circuit board are pressed at one time, the defect that the reinforcing parts with different thicknesses need to be pressed separately is overcome, the production efficiency is improved, and the cost is reduced.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a cross-sectional view of a flexible circuit board of the present invention;
FIG. 2 is a cross-sectional view of the flexible circuit board of the present invention after being coated with a pure adhesive;
FIG. 3 is a cross-sectional view of the flexible circuit board of the invention after being bonded with pure glue and reinforced with different thickness;
FIG. 4 is a press-fit auxiliary steel sheet of the present invention;
FIG. 5 is a schematic diagram of a flexible circuit board of the present invention after lamination of semi-finished products with different thicknesses and steel sheets;
FIG. 6 is a schematic plan view of an open table top positioning strip of the laminator of the invention;
FIG. 7 is a schematic diagram of the lamination of the present invention in a laminator.
Detailed Description
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the description will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other embodiments may be obtained according to these drawings without inventive effort for a person skilled in the art. In order that the invention may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "upper," "lower," "inner," "outer," "bottom," and the like as used in this specification are used in an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Step 1: according to the positions of the flexible circuit board 1, which are required to be pasted with reinforcements with different thicknesses, pasting the alignment mark lines, wherein the alignment mark lines can be etched by adopting an etching method, so that a plurality of groups of alignment mark lines 2-1 and 2-2, alignment mark lines 3-1 and 3-2, and alignment mark lines 4-1 and 4-2 are obtained. As shown in fig. 1.
Step 2: the method comprises the steps of bonding pure glue 5-1 (corresponding to the alignment mark line 2-1 and the alignment mark line 2-2), pure glue 5-2 (corresponding to the alignment mark line 3-1 and the alignment mark line 3-2) and pure glue 5-3 (corresponding to the alignment mark line 4-1 and the alignment mark line 4-2) which are in a preset size in a corresponding group of alignment mark line ranges by a manual alignment mode; or using an automatic rubberizing machine to laminate the pure glue in the range of the alignment mark line of the flexible circuit board, wherein the alignment mark line is used for checking the laminating accuracy. As shown in fig. 2.
Step 3: the reinforcement 6-1 (corresponding to the pure glue 5-1), the reinforcement 6-2 (corresponding to the pure glue 5-2) and the reinforcement 6-3 (corresponding to the pure glue 5-3) which are processed in advance and have different thicknesses (the reinforcement of steel sheets, FR-4, PI and the like can be realized), and the reinforcement is attached to the corresponding pure glue at a specified position according to an alignment mark line by adopting a manual alignment mode; or bonding the adhesive on the corresponding pure adhesive at the specified position by adopting an automatic reinforcing machine, and checking the accuracy by using a para-position marking line to obtain a semi-finished product. As shown in fig. 3.
Step 4: manufacturing of pressing auxiliary steel sheets: according to typesetting size of the flexible circuit board, different thickness reinforcement types, positions and numbers are adopted, a plurality of grb files are designed for different thickness, and each grb file corresponds to one thickness reinforcement.
The corresponding area A-1 of the first grb file, namely the area A-1 is not exposed when exposed, other areas are exposed, the part which is not exposed when developed is developed, the exposed steel sheet is removed by development, and the etching depth is controlled by adopting proper etching parameters;
the corresponding area A-3 of the second grb file, namely the area A-3 is not exposed when exposed, other areas are exposed, the part which is not exposed when developed is developed, the exposed steel sheet is removed by development, and the etching depth is controlled by adopting proper etching parameters;
selecting a steel sheet with the thickness being 0.15mm thicker than the maximum thickness reinforcement, namely, the thickness of the steel sheet=the thickness of the maximum thickness reinforcement +0.15mm, cutting the steel sheet into the same size as the typesetting of the flexible circuit board, and adopting a method of sticking a photosensitive dry film, exposing, developing and etching in a separated manner:
firstly pasting a dry film, selecting a photosensitive dry film with the thickness of 25um, and exposing, developing, etching and stripping the film by using a first grb file to obtain the thickness of the area A-1;
a second dry film is pasted, and as the steel sheet has steps after the first etching, a photosensitive dry film with the thickness of 50um is selected, and the second grb file is used for exposure, development, etching and film stripping to obtain the thickness of the area A-3;
the reinforcement corresponding to the location of region A-2 is thinnest, so region A-2 does not require etching, i.e., region A-2 is as thick as region A.
As shown above in fig. 4.
If there are more reinforcements of different thickness, the process is repeated as described above and so on. Thereby obtaining the pressing auxiliary steel sheet A which is abdied at the reinforcing parts with different thicknesses of the flexible circuit board 1.
In addition, the manufacturing of the pressing auxiliary steel sheet A can also adopt a laser or plasma cutting mode to process according to a design file, and microetching treatment is carried out to obtain the areas with various thicknesses.
Step 5: and (3) performing overlapping sleeve check on the semi-finished product obtained in the step (3) and the lamination auxiliary steel sheet A manufactured in the step (4), and mainly checking whether the positions of the semi-finished product and the lamination auxiliary steel sheet A are deviated, whether the thickness is seamless and the like. As shown in fig. 5.
Step 6: and (3) carrying out strip pasting and positioning on the silicon rubber of the laminating machine according to the size of the jointed board of the flexible circuit board, wherein the positioning strips are FR-4 glass fiber boards, the width is 10mm, and the thickness is 0.15mm lower than the height of the semi-finished product and the auxiliary steel sheet after being overlapped. And the high-temperature adhesive tape is stuck on three sides of silicon rubber B2-2 of the laminating machine to form a U-shaped trilateral positioning mode of the positioning strip: side C-1, side C-2, side C-3. And putting the superposition in the step 5 into a check according to a three-side positioning mode to check whether a certain margin exists on three sides or not and whether a gap is proper or not. As shown in the plan view of fig. 6.
Step 7: the operation method comprises the steps of firstly pasting the semi-finished products of the step 3 with different thickness for reinforcement, putting the semi-finished products into the laminating machine according to the positioning of the silicon rubber B2-2 of the laminating machine in a three-side positioning mode, and stacking the lamination auxiliary steel sheet A on the semi-finished products in the three-side positioning mode. And then pressing according to the following parameters:
the temperature is 180 ℃; prepressing: the pressure is 3-4Mpa and the time is 15-30S; and (3) forming: the pressure is 2-3Mpa and the time is 150-200S.
Because the pressing method of the patent is provided with one more auxiliary pressing steel sheet A, the pressing parameter is smaller in pressure and longer in time than normal pressing parameter.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (6)

1. The laminating method for reinforcing the flexible circuit board with different thicknesses is characterized by comprising the following steps of:
step 1: etching the copper foil of the flexible copper-clad plate according to the positions, needing to be pasted with reinforcements with different thicknesses, of the flexible circuit board to obtain a plurality of groups of alignment mark lines;
step 2: attaching a plurality of pure adhesives to the alignment mark line range of the flexible circuit board;
step 3: attaching reinforcements with different thicknesses to the corresponding pure adhesive; or an automatic reinforcing machine is adopted to attach on the corresponding pure adhesive to obtain a semi-finished product;
step 4: manufacturing of pressing auxiliary steel sheets: designing a plurality of grb files, wherein each grb file corresponds to one thickness reinforcement;
selecting a steel sheet, wherein the thickness of the steel sheet is larger than the thickness of the reinforcement with the maximum thickness, and adopting a method of sticking a photosensitive dry film, exposing, developing and etching in a divided manner:
pasting a dry film for the first time, exposing, developing, etching and stripping the film by using a first grb file to obtain the thickness of a first area;
a dry film is pasted for the second time, and a second grb file is used for exposing, developing, etching and film stripping to obtain the thickness of a second area;
repeating the above steps; thereby obtaining the pressing auxiliary steel sheet which is abdied at the reinforcing parts with different thicknesses of the flexible circuit board;
step 5: overlapping and checking the semi-finished product obtained in the step 3 and the lamination auxiliary steel sheet manufactured in the step 4;
step 6: the positioning strips are stuck on three sides of the silicon rubber of the laminating machine by using a high-temperature adhesive tape according to the makeup size, and the positioning strips are U-shaped; and putting the superposition in the step 5 into inspection;
step 7: placing the semi-finished product obtained in the step 3 according to the positioning of the silicone rubber of the laminating machine, and stacking the lamination auxiliary steel sheet on the semi-finished product; and then pressing.
2. The method for laminating the flexible circuit board with different thickness reinforcements according to claim 1, wherein: in step 2: the pure glue is attached in the alignment mark line range of the flexible circuit board by a manual attaching or automatic attaching machine.
3. The method for laminating the flexible circuit board with different thickness reinforcements according to claim 1, wherein: in step 3: the reinforcement is attached to the pure rubber by a manual or automatic reinforcing machine.
4. The method for laminating the flexible circuit board with different thickness reinforcements according to claim 1, wherein: in step 4: and manufacturing the pressing auxiliary steel sheet, processing by adopting a laser or plasma cutting mode according to the design file, and carrying out microetching treatment to obtain the areas with various thicknesses.
5. The method for laminating the flexible circuit board with different thickness reinforcements according to claim 1, wherein: step 6: the positioning strip adopts an FR-4 glass fiber board, the width is 10mm, and the thickness is 0.15mm lower than the height of the semi-finished product and the auxiliary steel sheet after being overlapped;
step 7: firstly, placing a semi-finished product according to the positioning of a silicon rubber of a laminating machine in a trilateral positioning mode, and then stacking a lamination auxiliary steel sheet on the semi-finished product in the trilateral positioning mode; and then pressing.
6. The method for laminating the flexible circuit board with different thickness reinforcements according to claim 1, wherein: in step 7: the lamination parameters are as follows: the temperature is 180 ℃; prepressing: the pressure is 3-4Mpa and the time is 15-30S; and (3) forming: the pressure is 2-3Mpa and the time is 150-200S.
CN202310052668.XA 2023-02-02 2023-02-02 Lamination method for reinforcing flexible circuit board with different thicknesses Pending CN116321722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310052668.XA CN116321722A (en) 2023-02-02 2023-02-02 Lamination method for reinforcing flexible circuit board with different thicknesses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310052668.XA CN116321722A (en) 2023-02-02 2023-02-02 Lamination method for reinforcing flexible circuit board with different thicknesses

Publications (1)

Publication Number Publication Date
CN116321722A true CN116321722A (en) 2023-06-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

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CN (1) CN116321722A (en)

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