CN113764356A - Display module and display device - Google Patents
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- CN113764356A CN113764356A CN202111049143.8A CN202111049143A CN113764356A CN 113764356 A CN113764356 A CN 113764356A CN 202111049143 A CN202111049143 A CN 202111049143A CN 113764356 A CN113764356 A CN 113764356A
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- 230000003014 reinforcing effect Effects 0.000 claims abstract description 112
- 230000017525 heat dissipation Effects 0.000 claims abstract description 94
- 239000002131 composite material Substances 0.000 claims abstract description 56
- 238000005452 bending Methods 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims description 325
- 239000000463 material Substances 0.000 claims description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 23
- 238000003825 pressing Methods 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 51
- 238000010586 diagram Methods 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 229910001294 Reinforcing steel Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a display module and a display device, wherein the display module comprises a display panel and a supporting component; the display panel comprises a display part, a bending part and a binding part; one side of the supporting component is attached to the display part, and the other side of the supporting component is attached to the binding part and comprises a buffer layer, a composite film layer and a reinforcing layer; the composite film layer comprises a heat dissipation layer and a reinforcing layer arranged on the same layer as the heat dissipation layer, the hardness of the reinforcing layer is greater than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is superposed with the orthographic projection of the reinforcing layer on the display panel; according to the invention, the reinforcing layer and the heat dissipation layer are arranged on the same layer, the hardness of the reinforcing layer is greater than that of the heat dissipation layer, the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel, the reinforcing layer can provide better supporting force in the bending process, the pressing deformation between the reinforcing layer and the heat dissipation layer is avoided, and the impression problem caused in the bending process is improved on the premise of not increasing the thickness.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a display device.
Background
An existing OLED (Organic Light Emitting Diode) display panel usually adopts a Pad bonding technology to achieve a narrow frame effect, that is, a glass substrate is coated with yellow PI (polyimide) as a flexible substrate, a TFT (Thin Film Transistor) device is manufactured on the flexible substrate, an integral flexible Film layer is peeled off from the glass substrate after a module manufacturing process is completed, then Pad bonding is performed, and metal wiring in a bonding area is bent to the back of the display panel. Usually, the outermost layer of the back surface of the display panel is a SCF (Super Clean Foam) module, which is a laminated structure of Foam and copper, and the copper on the outer side is soft, so that the display panel is pressed during the bonding process to generate marks.
For improving and produce the impression at binding in-process display panel pressurized, generally can adopt to add the reinforcement steel sheet at the back of SCF subassembly and improve because of the material of copper is softer, the problem of the easy impression that produces of in-process of buckling, nevertheless add the whole thickness increase that the reinforcement steel sheet can make display module assembly, be unfavorable for realizing the module frivolousization. Therefore, it is necessary to improve this defect.
Disclosure of Invention
The embodiment of the invention provides a display module, which is used for solving the technical problems that the display module in the prior art is not beneficial to realizing the light and thin of the module because the reinforcing steel sheet is additionally arranged on the outer side of copper to improve the impression generated by the pressing of a display panel in the bending process, but the integral thickness of the display module is increased.
The embodiment of the invention provides a display module, which comprises a display panel and a supporting component, wherein the display panel is arranged on the supporting component; the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side of the display part far away from the light emitting side through the bending part; one side of the supporting component is attached to the display part, the other side of the supporting component is attached to the binding part, and the supporting component comprises a buffer layer located on one side, away from the light emitting side, of the display part, a composite film layer located on one side, away from the display part, of the buffer layer and a reinforcing layer located between the composite film layer and the binding part; the composite film layer comprises a heat dissipation layer and a reinforcing layer arranged on the same layer as the heat dissipation layer, the hardness of the reinforcing layer is larger than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is coincided with that of the reinforcing layer on the display panel.
In the display module provided by the embodiment of the invention, a notch is formed at one end of the heat dissipation layer close to the bending part, and the reinforcing layer is positioned in the notch.
In the display module provided by the embodiment of the invention, in the direction of the light emergent side of the display panel, the depth of the notch is less than or equal to the thickness of the heat dissipation layer.
In the display module provided by the embodiment of the invention, at least one first groove is formed in one side, away from the buffer layer, of the heat dissipation layer, and the reinforcing layer is located in the first groove.
In the display module provided by the embodiment of the invention, at least one second groove is formed in one side, close to the buffer layer, of the heat dissipation layer, and the reinforcing layer is located in the second groove.
In the display module provided by the embodiment of the invention, the heat dissipation layer is provided with at least one through hole, and the reinforcing layer is positioned in the through hole.
In the display module provided by the embodiment of the invention, the material of the reinforcing layer is stainless steel or aluminum alloy.
In the display module provided by the embodiment of the invention, an air layer is arranged between the reinforcing layer and the heat dissipation layer, and the composite film layer is adhered to the buffer layer through the pressure-sensitive adhesive layer.
In the display module provided by the embodiment of the invention, the reinforcing layer is welded with the heat dissipation layer.
The embodiment of the invention also provides a display device, which comprises the display module and a drive chip electrically connected with the binding part of the display module.
Has the advantages that: the embodiment of the invention provides a display module, which comprises a display panel and a supporting component, wherein the display panel is arranged on the supporting component; the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side of the display part far away from the light emitting side through the bending part; one side of the supporting component is attached to the display part, the other side of the supporting component is attached to the binding part, and the supporting component comprises a buffer layer positioned on one side of the display part far away from the light emitting side, a composite film layer positioned on one side of the buffer layer far away from the display part, and a reinforcing layer positioned between the composite film layer and the binding part; the composite film layer comprises a heat dissipation layer and a reinforcing layer arranged on the same layer as the heat dissipation layer, the hardness of the reinforcing layer is greater than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is superposed with the orthographic projection of the reinforcing layer on the display panel; according to the invention, the reinforcing layer and the heat dissipation layer are arranged on the same layer, the hardness of the reinforcing layer is greater than that of the heat dissipation layer, the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel, the reinforcing layer can provide better supporting force in the bending process, the pressing deformation between the reinforcing layer and the heat dissipation layer is avoided, and the impression problem caused in the bending process is improved on the premise of not increasing the thickness.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a schematic diagram of a basic structure of a display module according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a basic structure of a buffer layer and a composite film layer according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a basic structure of a buffer layer and another composite film layer according to an embodiment of the present invention.
Fig. 4a to 4c are schematic diagrams of basic structures of components in a process flow for preparing the composite film layer in fig. 1.
Fig. 5a and 5b are schematic diagrams of basic structures of components in another manufacturing process flow of the composite film layer in fig. 1.
Fig. 6 is a schematic diagram of a basic structure of a buffer layer and another composite film layer according to an embodiment of the present invention.
Fig. 7 is a schematic diagram of a basic structure of a buffer layer and a further composite film layer according to an embodiment of the invention.
Fig. 8 is a schematic diagram of a basic structure of a buffer layer and a composite film layer provided in an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. In the drawings, the size and thickness of components illustrated in the drawings are not to scale for clarity and ease of understanding and description.
As shown in fig. 1, which is a schematic view of a basic structure of a display module according to an embodiment of the present invention, the display module includes a display panel 10 and a supporting assembly 20; the display panel 10 includes a display portion 101, a bending portion 102, and a binding portion 103, wherein the binding portion 103 is bent to a side of the display portion 101 away from a light emitting side by the bending portion 102; one side of the support member 20 is attached to the display portion 101, and the other side is attached to the binding portion 103, the support member 20 includes a buffer layer 203 located on a side of the display portion 101 away from the light-emitting side, a composite film layer 204 located on a side of the buffer layer 203 away from the display portion 101, and a reinforcing layer 205 located between the composite film layer 204 and the binding portion 103; wherein, compound rete 204 include heat dissipation layer 2041 and with heat dissipation layer 2041 is with reinforcing layer 2042 of layer setting, the hardness of reinforcing layer 2042 is greater than heat dissipation layer 2041's hardness, reinforcing layer 2042 is in orthographic projection on display panel 10 with enhancement layer 205 is in orthographic projection on display panel 10 has the coincidence.
It can be understood, prior art is for realizing the narrow frame, can will bind the back that the portion buckled to display panel usually, account for than with the screen that improves display panel, however at the in-process of buckling, because the heat dissipation layer is located display panel's the outside, and the heat dissipation layer generally adopts copper, and the material of copper is softer, when binding portion and display portion pressfitting, produce pressfitting deformation easily between enhancement layer and the copper, lead to display panel to appear the impression, lead to user experience to descend, prior art generally adopts and adds one deck reinforcement steel sheet in the outside on heat dissipation layer, with the holding power that improves the heat dissipation layer, but the reinforcement steel sheet that additionally adds can lead to the holistic thickness increase of display module, be unfavorable for realizing the module frivolousization. The invention provides a composite film layer 204, which comprises a heat dissipation layer 2041 and a reinforcing layer 2042, wherein the reinforcing layer 2042 and the heat dissipation layer 2041 are arranged on the same layer, the hardness of the reinforcing layer 2042 is greater than that of the heat dissipation layer 2041, the orthographic projection of the reinforcing layer 2042 on a display panel 10 is overlapped with the orthographic projection of the reinforcing layer 205 on the display panel 10, compared with the heat dissipation layer 2041, the reinforcing layer 2042 can provide better supporting force in the bending process, the phenomenon that the reinforcing layer 205 and the heat dissipation layer 2041 are pressed and deformed is avoided, and the problem of marks caused in the bending process is solved on the premise of not increasing the thickness.
In an embodiment, the support member 20 further includes a first support layer 201 and a second support layer 202, the first support layer 201 is located on a side surface of the display portion 101 away from the light emitting side, the buffer layer 203 is located on a side surface of the first support layer 201 away from the display portion 101, the second support layer 202 is located on a side surface of the binding portion 103 close to the support member 20, and the reinforcing layer 205 is located on a side surface of the second support layer 202 away from the binding portion 103.
It should be noted that the first supporting layer 201 and the second supporting layer 202 are respectively used for supporting the display portion 101 and the binding portion 103 of the display panel 10, the reinforcing layer 205 is used for fixing the binding portion 103, during the bending process, i.e. the binding portion 103 and the display portion 101 are pressed, since the orthographic projection of the reinforcing layer 2042 on the display panel 10 is overlapped with the orthographic projection of the reinforcing layer 205 on the display panel 10, i.e. the reinforcing layer 2042 can improve the hardness of the composite film layer 204 corresponding to the reinforcing layer 205 region, i.e. the supporting force of the composite film layer 204 is improved, the pressing deformation during the bending process is avoided, and the impression of the display panel 10 is avoided. Moreover, the reinforcing layer 2042 and the heat dissipation layer 2041 are disposed on the same layer, so that the overall thickness of the display module is not increased.
In one embodiment, a notch 80 is formed at an end of the heat dissipation layer 2041 close to the bending portion 102, and the stiffening layer 2042 is located in the notch 80. It can be understood that, since the binding portion 103 is fixed at the end of the heat dissipation layer 2041 close to the bending portion 102, in this embodiment, the notch 80 is disposed at the end of the heat dissipation layer 2041 close to the bending portion 102, and the reinforcing layer 2042 is disposed in the notch 80, so as to improve the supporting force of the composite film 204 corresponding to the reinforcing layer 205 region, avoid pressing deformation during the bending process, and avoid the display panel 10 from generating impressions. Moreover, the reinforcing layer 2042 and the heat dissipation layer 2041 are disposed on the same layer, so that the overall thickness of the display module is not increased.
In an embodiment, in the direction of the light emitting side of the display panel 10, the depth of the notch 80 is less than or equal to the thickness of the heat dissipation layer 2041. Fig. 1 shows an embodiment in which the depth of the notch 80 is equal to the thickness of the heat sink layer 2041, i.e., the thickness of the stiffening layer 2042 in fig. 1 is equal to the thickness of the heat sink layer 2041.
Next, referring to fig. 2 and fig. 3, which are respectively a schematic basic structure diagram of a buffer layer and a composite film layer provided by an embodiment of the present invention and a schematic basic structure diagram of a buffer layer and another composite film layer provided by an embodiment of the present invention, both fig. 2 and fig. 3 show an implementation manner that a depth T1 of the notch 80 is smaller than a thickness T2 of the heat dissipation layer 2041, specifically, the notch 80 in fig. 2 is located on a side of the heat dissipation layer 2041 away from the buffer layer 203, and the notch 80 in fig. 3 is located on a side of the heat dissipation layer 2041 close to the buffer layer 203. It can be understood that, in the present embodiment, by setting the depth T1 of the notch 80 to be smaller than the thickness T2 of the heat dissipation layer 2041, not only the reinforcing layer 2042 but also a portion of the heat dissipation layer 2041 are disposed in the area corresponding to the reinforcing layer 205 (as shown in fig. 1), so that the composite film 204 in the area corresponding to the reinforcing layer 205 can both enhance the rigidity and have the heat dissipation function.
It should be noted that, in the direction perpendicular to the light-emitting side of the display panel, the width of the gap 80 may be greater than the width of the reinforcing layer 205, that is, the orthographic projection of the reinforcing layer 205 on the display panel falls within the orthographic projection range of the reinforcing layer 2042 on the display panel, that is, in the bending process, the reinforcing layer 2042 is disposed in the laminating area between the reinforcing layer 205 and the composite film layer 204, so as to avoid pressing deformation and avoid the display panel from generating impressions. Moreover, the reinforcing layer 2042 and the heat dissipation layer 2041 are disposed on the same layer, so that the overall thickness of the display module is not increased.
With reference to fig. 1, in an embodiment, the display module further includes a polarizing layer 30 located on the light emitting side of the display portion 101, a cover plate 50 located on a side of the polarizing layer 30 away from the display portion 101, and a protective layer 60 located on a side of the display panel 10 away from the supporting component 20. The cover plate 50 is attached to the polarizing layer 30 through the optical adhesive layer 40, and light shielding adhesives 70 are further arranged on the periphery of one side, close to the polarizing layer 30, of the cover plate 50 to prevent lateral light leakage of the display module.
In one embodiment, the material of the reinforcing layer 2042 is stainless steel or aluminum alloy. It can be understood that the heat dissipation layer 2041 generally uses copper, the material of copper is softer, and this embodiment is prepared by using stainless steel or aluminum alloy as the reinforcing layer 2042, and the hardness of stainless steel and aluminum alloy is much greater than that of copper, so that the supporting force of the composite film 204 can be improved.
Next, referring to fig. 4a to 4c, which are schematic diagrams of basic structures of components in the process flow of preparing the composite film in fig. 1, the thickness of the reinforcing layer 2042 in fig. 1 is equal to the thickness of the heat dissipation layer 2041, and the composite film 204 can be prepared by splicing and adhering. Specifically, as shown in fig. 4a, the heat dissipation layer 2041 is cut by a die cutting process to form a notch, and then the heat dissipation layer 2041 is attached to a corresponding position on the buffer layer 203 through the pressure sensitive adhesive layer 21; next, as shown in fig. 4b, attaching a pressure sensitive adhesive layer 21 to one side of the reinforcing layer 2042, and aligning and attaching the side of the reinforcing layer 2042 attached with the pressure sensitive adhesive layer 21 to the notch of the heat dissipation layer 2041 by a roller process; finally, as shown in fig. 4c, the side of the reinforcing layer 2042 to which the pressure sensitive adhesive layer 21 is attached to the buffer layer 203 exposed from the gap of the heat dissipation layer 2041, so as to obtain a composite film 204. Wherein, the strengthening layer 2042 with the air layer has between the heat dissipation layer 2041, compound rete 204 through pressure sensitive adhesive layer 21 with the buffer layer 203 adhesion.
It should be noted that the preparation method of splicing and pasting can be applied not only to the composite film layer shown in fig. 1, but also to the composite film layers shown in fig. 2 and 3. Specifically, the side of the reinforcing layer 2042 to which the pressure sensitive adhesive layer 21 is attached to the exposed portion of the notch of the heat dissipation layer 2041.
Referring to fig. 5a and 5b, which are schematic diagrams of basic structures of components in another process flow of manufacturing the composite film 204 in fig. 1, the thickness of the reinforcing layer 2042 in fig. 1 is equal to the thickness of the heat dissipation layer 2041, and the composite film 204 can be manufactured by laser thermal welding. Specifically, as shown in fig. 5a, firstly, the reinforcing layer 2042 and the heat dissipation layer 2041 are welded to obtain a spliced coil material, wherein the length of the spliced coil material may be infinitely long, and the width of the spliced coil material corresponds to the length of the composite film layer 204 in the direction perpendicular to the light exit side of the display panel; next, as shown in fig. 5b, the above-mentioned splicing roll is cut according to the thickness of the composite film layer 204 in the direction of the light-emitting side of the display panel, and then the cut composite film layer 204 is bonded to the buffer layer 203 by a grid adhesive (not shown).
Next, referring to fig. 6, which is a schematic diagram of a basic structure of a buffer layer and another composite film layer according to an embodiment of the present invention, a support assembly includes a buffer layer 203 and a composite film layer 204 located on a side of the buffer layer 203 away from the display portion 101 (as shown in fig. 1); the composite film layer 204 includes a heat dissipation layer 2041 and a reinforcing layer 2042 disposed on the same layer as the heat dissipation layer 2041, the hardness of the reinforcing layer 2042 is greater than the hardness of the heat dissipation layer 2041, and an orthographic projection of the reinforcing layer 2042 on the display panel 10 (as shown in fig. 1) coincides with an orthographic projection of the reinforcing layer 205 (as shown in fig. 1) on the display panel 10. At least one first groove 91 is formed in one side, away from the buffer layer 203, of the heat dissipation layer 2041, and the reinforcing layer 2042 is located in the first groove 91. It can be understood that, different from the composite film layer of fig. 2, the heat dissipation layers 2041 are disposed on both sides of the reinforcing layer 2042 of the present embodiment, so as to further improve the heat dissipation effect of the region corresponding to the reinforcing layer 205. In fig. 6, only one side of the heat dissipation layer 2041 away from the buffer layer 203 is provided with 3 first grooves 91 for illustration, and other embodiments are not repeated.
Next, referring to fig. 7, which is a schematic diagram of a basic structure of a buffer layer and another composite film layer provided in an embodiment of the present invention, a support assembly includes a buffer layer 203 and a composite film layer 204 located on a side of the buffer layer 203 away from the display portion 101 (as shown in fig. 1); the composite film layer 204 includes a heat dissipation layer 2041 and a reinforcing layer 2042 disposed on the same layer as the heat dissipation layer 2041, the hardness of the reinforcing layer 2042 is greater than the hardness of the heat dissipation layer 2041, and an orthographic projection of the reinforcing layer 2042 on the display panel 10 (as shown in fig. 1) coincides with an orthographic projection of the reinforcing layer 205 (as shown in fig. 1) on the display panel 10. At least one second groove 92 is formed in one side of the heat dissipation layer 2041 close to the buffer layer 203, and the reinforcing layer 2042 is located in the second groove 92. It can be understood that, unlike the composite film layer of fig. 3, the heat dissipation layer 2041 is disposed on both sides of the reinforcing layer 2042 of the present embodiment, so as to further improve the heat dissipation effect in the region corresponding to the reinforcing layer 205. In fig. 7, only one side of the heat dissipation layer 2041 close to the buffer layer 203 is provided with 3 second grooves 92 for illustration, and further description is omitted for further embodiments.
Next, referring to fig. 8, which is a schematic diagram of a basic structure of a buffer layer and a composite film layer provided in an embodiment of the present invention, a support assembly includes a buffer layer 203 and a composite film layer 204 located on a side of the buffer layer 203 away from the display portion 101 (as shown in fig. 1); the composite film layer 204 includes a heat dissipation layer 2041 and a reinforcing layer 2042 disposed on the same layer as the heat dissipation layer 2041, the hardness of the reinforcing layer 2042 is greater than the hardness of the heat dissipation layer 2041, and an orthographic projection of the reinforcing layer 2042 on the display panel 10 (as shown in fig. 1) coincides with an orthographic projection of the reinforcing layer 205 (as shown in fig. 1) on the display panel 10. At least one through hole 93 is formed in the heat dissipation layer 2041, and the reinforcing layer 2042 is located in the through hole 93. It can be understood that, unlike the composite film layer of fig. 1, the heat dissipation layer 2041 is disposed on both sides of the reinforcing layer 2042 of the present embodiment, so as to further improve the heat dissipation effect in the region corresponding to the reinforcing layer 205. Fig. 8 only illustrates that 3 through holes 93 are formed in the heat dissipation layer 2041, and other embodiments are not repeated.
The embodiment of the invention also provides a display device, which comprises the display module and a drive chip electrically connected with the binding part of the display module. Specifically, please refer to fig. 1 to 8 and the related description for the structure and the manufacturing process of the display module, which are not repeated herein. The display device provided by the embodiment of the invention can be as follows: products or components with display functions such as mobile phones, tablet computers, notebook computers, digital cameras, navigators and the like.
In summary, the display module provided in the embodiments of the present invention includes a display panel and a supporting assembly; the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side of the display part far away from the light emitting side through the bending part; one side of the supporting component is attached to the display part, the other side of the supporting component is attached to the binding part, and the supporting component comprises a buffer layer positioned on one side of the display part far away from the light emitting side, a composite film layer positioned on one side of the buffer layer far away from the display part, and a reinforcing layer positioned between the composite film layer and the binding part; the composite film layer comprises a heat dissipation layer and a reinforcing layer arranged on the same layer as the heat dissipation layer, the hardness of the reinforcing layer is greater than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is superposed with the orthographic projection of the reinforcing layer on the display panel; according to the invention, the reinforcing layer and the heat dissipation layer are arranged on the same layer, the hardness of the reinforcing layer is greater than that of the heat dissipation layer, the orthographic projection of the reinforcing layer on the display panel coincides with the orthographic projection of the reinforcing layer on the display panel, the reinforcing layer can provide better supporting force in the bending process, the phenomenon that the reinforcing layer and the heat dissipation layer are pressed to deform is avoided, on the premise of not increasing the thickness, the impression problem caused by the bending process is improved, the problem that the display module in the prior art generates impressions when the display panel is pressed by improving the bending process by additionally arranging the reinforcing steel sheet on the outer side of copper is solved, but the integral thickness of the display module is increased, and the technical problem that the module is not favorable for realizing the lightness and thinness is solved.
The display module and the display device provided by the embodiment of the invention are described in detail above. It should be understood that the exemplary embodiments described herein should be considered merely illustrative for facilitating understanding of the method of the present invention and its core ideas, and not restrictive.
Claims (10)
1. A display module, comprising:
the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side of the display part far away from the light emitting side through the bending part;
the supporting component is attached to one side of the display part and the binding part, and comprises a buffer layer positioned on one side of the display part far away from the light emitting side, a composite film layer positioned on one side of the buffer layer far away from the display part and a reinforcing layer positioned between the composite film layer and the binding part;
the composite film layer comprises a heat dissipation layer and a reinforcing layer arranged on the same layer as the heat dissipation layer, the hardness of the reinforcing layer is larger than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is coincided with that of the reinforcing layer on the display panel.
2. The display module of claim 1, wherein the heat dissipation layer has a notch at an end thereof adjacent to the bending portion, and the reinforcing layer is disposed in the notch.
3. The display module of claim 2, wherein the depth of the notch is less than or equal to the thickness of the heat dissipation layer in the direction of the light exit side of the display panel.
4. The display module of claim 1, wherein the heat dissipation layer has at least one first recess on a side thereof away from the buffer layer, and the stiffening layer is disposed in the first recess.
5. The display module of claim 1, wherein the heat dissipation layer has at least one second recess on a side thereof adjacent to the buffer layer, and the stiffening layer is disposed in the second recess.
6. The display module of claim 1, wherein the heat dissipation layer has at least one through hole, and the stiffening layer is disposed in the through hole.
7. The display module according to claim 1, wherein the material of the stiffening layer is stainless steel or aluminum alloy.
8. The display module according to claim 1, wherein an air layer is provided between the reinforcing layer and the heat dissipation layer, and the composite film layer is adhered to the buffer layer through a pressure sensitive adhesive layer.
9. The display module of claim 1, wherein the stiffening layer is welded to the heat dissipation layer.
10. A display device, comprising the display module according to any one of claims 1 to 9 and a driving chip electrically connected to the bonding portion of the display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111049143.8A CN113764356B (en) | 2021-09-08 | 2021-09-08 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111049143.8A CN113764356B (en) | 2021-09-08 | 2021-09-08 | Display module and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113764356A true CN113764356A (en) | 2021-12-07 |
| CN113764356B CN113764356B (en) | 2023-10-31 |
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| CN114038339A (en) * | 2021-12-09 | 2022-02-11 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114203048A (en) * | 2021-12-22 | 2022-03-18 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114203050A (en) * | 2021-12-28 | 2022-03-18 | 武汉华星光电半导体显示技术有限公司 | Display module and display terminal |
| CN114495741A (en) * | 2022-02-10 | 2022-05-13 | 武汉华星光电半导体显示技术有限公司 | Display module and terminal equipment |
| CN114666997A (en) * | 2022-03-29 | 2022-06-24 | 京东方科技集团股份有限公司 | Manufacturing method of display module, equipment for manufacturing display module and display module |
| CN114783309A (en) * | 2022-04-12 | 2022-07-22 | 武汉华星光电半导体显示技术有限公司 | Composite functional film, preparation method thereof and display device |
| CN115240550A (en) * | 2022-07-22 | 2022-10-25 | 湖北长江新型显示产业创新中心有限公司 | Display device |
| WO2023133718A1 (en) * | 2022-01-12 | 2023-07-20 | 厦门市芯颖显示科技有限公司 | Display panel and tiled display screen |
| WO2024011995A1 (en) * | 2022-07-11 | 2024-01-18 | 武汉华星光电半导体显示技术有限公司 | Display device and display terminal |
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| WO2023133718A1 (en) * | 2022-01-12 | 2023-07-20 | 厦门市芯颖显示科技有限公司 | Display panel and tiled display screen |
| CN114495741A (en) * | 2022-02-10 | 2022-05-13 | 武汉华星光电半导体显示技术有限公司 | Display module and terminal equipment |
| CN114666997A (en) * | 2022-03-29 | 2022-06-24 | 京东方科技集团股份有限公司 | Manufacturing method of display module, equipment for manufacturing display module and display module |
| WO2023197380A1 (en) * | 2022-04-12 | 2023-10-19 | 武汉华星光电半导体显示技术有限公司 | Composite functional film, manufacturing method therefor, and display device |
| CN114783309B (en) * | 2022-04-12 | 2023-11-28 | 武汉华星光电半导体显示技术有限公司 | Composite functional film, preparation method thereof and display device |
| CN114783309A (en) * | 2022-04-12 | 2022-07-22 | 武汉华星光电半导体显示技术有限公司 | Composite functional film, preparation method thereof and display device |
| WO2024011995A1 (en) * | 2022-07-11 | 2024-01-18 | 武汉华星光电半导体显示技术有限公司 | Display device and display terminal |
| CN115240550A (en) * | 2022-07-22 | 2022-10-25 | 湖北长江新型显示产业创新中心有限公司 | Display device |
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